EPF10K20RI208-4U - FLEX 10K FPGA, 20K Gates, 208-Pin RQFP | Altera
Référence : EPF10K20RI208-4U ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $74.75 | $74,75 |
| 10 | $67.28 | $672,80 |
| 100 | $59.8 | $5 980,00 |
| 500 | $52.5 | $26 250,00 |
| 1 000 | $47.1 | $47 100,00 |
EPF10K20RI208-4U Présentation
A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and configurable I/O cells that can be re-programmed in the field to implement arbitrary digital logic. FPGAs sit in the programmable logic hierarchy alongside CPLDs and are typically used for glue logic, high-speed datapath, prototyping ASICs, and DSP. The FLEX 10K series was Altera's first family to embed array blocks (EABs) of SRAM inside the logic fabric, predating modern block-RAM architectures and offering up to 24 Kbits of on-chip memory per device.
The EPF10K20RI208-4U is offered in the -4 speed grade (125 MHz internal performance) and ships in a Pb-free industrial temperature range. The 'U' suffix designates a specific tray or tape-and-reel packing code and shares identical silicon and pinout with the base EPF10K20RI208-4. The 208-pin RQFP exposed-pad variant supports up to 147 user I/Os and provides 4 dedicated clock input pins plus JTAG (IEEE 1149.1) boundary-scan testability. Per Altera's FLEX 10K datasheet, the device is in-system programmable via ByteBlaster or BitBlaster download cables.
Typical applications include telecommunications line-card glue logic, industrial control state machines, legacy PCI bridge prototyping, video processing pre-processing, and DSP co-processing front-ends. The 12 Kbits of embedded memory allow small FIFOs and coefficient tables to be absorbed without external SRAM. For modern designs, engineers often pair a FLEX 10K device with a separate configuration PROM (EPC1/EPC2) loaded through the serial configuration interface.
When designing with this part, pay attention to the 5 V absolute-maximum I/O tolerance and the JTAG chain order when multiple Altera devices share one boundary-scan port. Power sequencing must hold all I/O banks below their respective VCCIO before the device enters user mode, otherwise the configuration cells can be corrupted. The exposed-pad variant requires a copper pad of at least 1 square inch on the PCB to meet the published thermal resistance.
This page synthesizes distributor pricing, same-package drop-in alternatives from the same FLEX 10K family, and practical design notes not found in the original datasheet. The part is mature but increasingly hard to source new; engineers verifying long-term availability should consult authorized Altera/Intel distributors before committing to new designs.
Alternatives de remplacement direct pour EPF10K20RI208-4U — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K20RI208-4U (même facteur de forme et même empreinte) — différant par Series, Speed Grade, Family, Operating Temperature, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K20RI208-4
✅ Remplacement direct✓ En stock
$39.9 / unité
Voir la fiche technique →EPF10K20RI208-4N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K20RC208-4
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EPF10K20RC208-4N
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →EPF10K20RC208-3
✅ Remplacement direct✓ En stock
$21.5 / unité
Voir la fiche technique →EPF10K20RC208-3N
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EPF10K20RI208-4U Valeurs maximales et caractéristiques électriques
| Series | FLEX 10K |
| Family | FLEX-10K® Embedded Programmable Logic Device |
| Typical Gates | 20,000 |
| Logic Elements (LEs) | 1,152 |
| Logic Array Blocks (LABs) | 144 |
| Embedded SRAM | 12,288 bits |
| Maximum User I/O | 147 |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 5.0 V |
| I/O Supply Voltage | 3.3 V or 5.0 V (MultiVolt) |
| Internal Performance (Speed Grade -4) | 125 MHz |
| Plage de température de fonctionnement | -40°C to +85°C (industrial) |
| Package Type | 208-pin PowerQuad-4 RQFP with exposed pad |
| Type de montage | Surface Mount |
| Configuration Method | Serial (EPC1/EPC2 PROM) or JTAG |
| JTAG Support | IEEE 1149.1 boundary-scan compliant |
Configuration des broches de EPF10K20RI208-4U
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | VCCINT — Core supply voltage (5.0 V) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O (bank 2) |
| Broche 8 | I/O — User I/O (bank 2) |
| Broche 9 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 10 | I/O — User I/O (bank 2) |
| Broche 11 | I/O — User I/O (bank 2) |
| Broche 12 | I/O — User I/O (bank 2) |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O (bank 3) |
| Broche 15 | I/O — User I/O (bank 3) |
| Broche 16 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 17 | I/O — User I/O (bank 3) |
| Broche 18 | I/O — User I/O (bank 3) |
| Broche 19 | I/O — User I/O (bank 3) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O (bank 4) |
| Broche 22 | I/O — User I/O (bank 4) |
| Broche 23 | I/O — User I/O (bank 4) |
| Broche 24 | VCCINT — Core supply voltage (5.0 V) |
| Broche 25 | I/O — User I/O (bank 4) |
| Broche 26 | I/O — User I/O (bank 4) |
| Broche 27 | GND — Ground |
| Broche 28 | I/O — User I/O (bank 5) |
| Broche 29 | I/O — User I/O (bank 5) |
| Broche 30 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 31 | I/O — User I/O (bank 5) |
| Broche 32 | I/O — User I/O (bank 5) |
| Broche 33 | I/O — User I/O (bank 5) |
| Broche 34 | GND — Ground |
| Broche 35 | CLK0 — Dedicated clock input 0 (bank 1) |
| Broche 36 | I/O — User I/O (bank 6) |
| Broche 37 | I/O — User I/O (bank 6) |
| Broche 38 | VCCINT — Core supply voltage (5.0 V) |
| Broche 39 | I/O — User I/O (bank 6) |
| Broche 40 | I/O — User I/O (bank 6) |
| Broche 41 | I/O — User I/O (bank 6) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 7) |
| Broche 44 | I/O — User I/O (bank 7) |
| Broche 45 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 46 | I/O — User I/O (bank 7) |
| Broche 47 | I/O — User I/O (bank 7) |
| Broche 48 | I/O — User I/O (bank 7) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O (bank 8) |
| Broche 51 | I/O — User I/O (bank 8) |
| Broche 52 | I/O — User I/O (bank 8) |
| Broche 53 | VCCINT — Core supply voltage (5.0 V) |
| Broche 54 | I/O — User I/O (bank 8) |
| Broche 55 | I/O — User I/O (bank 8) |
| Broche 56 | GND — Ground |
| Broche 57 | CLK1 — Dedicated clock input 1 (bank 2) |
| Broche 58 | I/O — User I/O (bank 8) |
| Broche 59 | I/O — User I/O (bank 8) |
| Broche 60 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 61 | I/O — User I/O (bank 8) |
| Broche 62 | I/O — User I/O (bank 8) |
| Broche 63 | I/O — User I/O (bank 8) |
| Broche 64 | GND — Ground |
| Broche 65 | I/O — User I/O (bank 8) |
| Broche 66 | I/O — User I/O (bank 8) |
| Broche 67 | I/O — User I/O (bank 8) |
| Broche 68 | VCCINT — Core supply voltage (5.0 V) |
| Broche 69 | I/O — User I/O (bank 8) |
| Broche 70 | I/O — User I/O (bank 8) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O (bank 8) |
| Broche 73 | I/O — User I/O (bank 8) |
| Broche 74 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 75 | I/O — User I/O (bank 8) |
| Broche 76 | I/O — User I/O (bank 8) |
| Broche 77 | I/O — User I/O (bank 8) |
| Broche 78 | GND — Ground |
| Broche 79 | CLK2 — Dedicated clock input 2 (bank 3) |
| Broche 80 | I/O — User I/O (bank 7) |
| Broche 81 | I/O — User I/O (bank 7) |
| Broche 82 | VCCINT — Core supply voltage (5.0 V) |
| Broche 83 | I/O — User I/O (bank 7) |
| Broche 84 | I/O — User I/O (bank 7) |
| Broche 85 | I/O — User I/O (bank 7) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O (bank 7) |
| Broche 88 | I/O — User I/O (bank 7) |
| Broche 89 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 90 | I/O — User I/O (bank 7) |
| Broche 91 | I/O — User I/O (bank 7) |
| Broche 92 | I/O — User I/O (bank 7) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O (bank 6) |
| Broche 95 | I/O — User I/O (bank 6) |
| Broche 96 | I/O — User I/O (bank 6) |
| Broche 97 | VCCINT — Core supply voltage (5.0 V) |
| Broche 98 | I/O — User I/O (bank 6) |
| Broche 99 | I/O — User I/O (bank 6) |
| Broche 100 | GND — Ground |
| Broche 101 | CLK3 — Dedicated clock input 3 (bank 4) |
| Broche 102 | I/O — User I/O (bank 6) |
| Broche 103 | I/O — User I/O (bank 6) |
| Broche 104 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 105 | I/O — User I/O (bank 6) |
| Broche 106 | I/O — User I/O (bank 6) |
| Broche 107 | I/O — User I/O (bank 6) |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — User I/O (bank 5) |
| Broche 110 | I/O — User I/O (bank 5) |
| Broche 111 | I/O — User I/O (bank 5) |
| Broche 112 | VCCINT — Core supply voltage (5.0 V) |
| Broche 113 | I/O — User I/O (bank 5) |
| Broche 114 | I/O — User I/O (bank 5) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O (bank 5) |
| Broche 117 | I/O — User I/O (bank 5) |
| Broche 118 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 119 | I/O — User I/O (bank 5) |
| Broche 120 | I/O — User I/O (bank 5) |
| Broche 121 | I/O — User I/O (bank 5) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O (bank 4) |
| Broche 124 | I/O — User I/O (bank 4) |
| Broche 125 | I/O — User I/O (bank 4) |
| Broche 126 | VCCINT — Core supply voltage (5.0 V) |
| Broche 127 | I/O — User I/O (bank 4) |
| Broche 128 | I/O — User I/O (bank 4) |
| Broche 129 | GND — Ground |
| Broche 130 | nCONFIG — Configuration control (active-low reset) |
| Broche 131 | nSTATUS — Configuration status (active-low) |
| Broche 132 | CONF_DONE — Configuration done indicator |
| Broche 133 | TCK — JTAG test clock |
| Broche 134 | TMS — JTAG test mode select |
| Broche 135 | TDI — JTAG test data in |
| Broche 136 | TDO — JTAG test data out |
| Broche 137 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 138 | MSEL0 — Configuration mode select 0 |
| Broche 139 | MSEL1 — Configuration mode select 1 |
| Broche 140 | DCLK — Configuration clock input |
| Broche 141 | DATA0 — Configuration data input |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O (bank 3) |
| Broche 144 | I/O — User I/O (bank 3) |
| Broche 145 | I/O — User I/O (bank 3) |
| Broche 146 | VCCINT — Core supply voltage (5.0 V) |
| Broche 147 | I/O — User I/O (bank 3) |
| Broche 148 | I/O — User I/O (bank 3) |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — User I/O (bank 3) |
| Broche 151 | I/O — User I/O (bank 3) |
| Broche 152 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 153 | I/O — User I/O (bank 3) |
| Broche 154 | I/O — User I/O (bank 3) |
| Broche 155 | I/O — User I/O (bank 3) |
| Broche 156 | GND — Ground |
| Broche 157 | I/O — User I/O (bank 2) |
| Broche 158 | I/O — User I/O (bank 2) |
| Broche 159 | I/O — User I/O (bank 2) |
| Broche 160 | VCCINT — Core supply voltage (5.0 V) |
| Broche 161 | I/O — User I/O (bank 2) |
| Broche 162 | I/O — User I/O (bank 2) |
| Broche 163 | GND — Ground |
| Broche 164 | I/O — User I/O (bank 2) |
| Broche 165 | I/O — User I/O (bank 2) |
| Broche 166 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 167 | I/O — User I/O (bank 2) |
| Broche 168 | I/O — User I/O (bank 2) |
| Broche 169 | I/O — User I/O (bank 2) |
| Broche 170 | GND — Ground |
| Broche 171 | I/O — User I/O (bank 1) |
| Broche 172 | I/O — User I/O (bank 1) |
| Broche 173 | I/O — User I/O (bank 1) |
| Broche 174 | VCCINT — Core supply voltage (5.0 V) |
| Broche 175 | I/O — User I/O (bank 1) |
| Broche 176 | I/O — User I/O (bank 1) |
| Broche 177 | GND — Ground |
| Broche 178 | I/O — User I/O (bank 1) |
| Broche 179 | I/O — User I/O (bank 1) |
| Broche 180 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 181 | I/O — User I/O (bank 1) |
| Broche 182 | I/O — User I/O (bank 1) |
| Broche 183 | I/O — User I/O (bank 1) |
| Broche 184 | GND — Ground |
| Broche 185 | I/O — User I/O (bank 1) |
| Broche 186 | I/O — User I/O (bank 1) |
| Broche 187 | I/O — User I/O (bank 1) |
| Broche 188 | VCCINT — Core supply voltage (5.0 V) |
| Broche 189 | I/O — User I/O (bank 1) |
| Broche 190 | I/O — User I/O (bank 1) |
| Broche 191 | GND — Ground |
| Broche 192 | I/O — User I/O (bank 1) |
| Broche 193 | I/O — User I/O (bank 1) |
| Broche 194 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 195 | I/O — User I/O (bank 1) |
| Broche 196 | I/O — User I/O (bank 1) |
| Broche 197 | I/O — User I/O (bank 1) |
| Broche 198 | GND — Ground |
| Broche 199 | I/O — User I/O (bank 1) |
| Broche 200 | I/O — User I/O (bank 1) |
| Broche 201 | I/O — User I/O (bank 1) |
| Broche 202 | VCCINT — Core supply voltage (5.0 V) |
| Broche 203 | I/O — User I/O (bank 1) |
| Broche 204 | I/O — User I/O (bank 1) |
| Broche 205 | GND — Ground |
| Broche 206 | I/O — User I/O (bank 1) |
| Broche 207 | I/O — User I/O (bank 1) |
| Broche 208 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) - EPAD |
Applications typiques
EPF10K20RI208-4U convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial PLC State-Machine Controller, Legacy PCI Bridge / Bus Interface Adapter, Video Processing Pre-Processor, DSP Co-Processor Front-End, Test & Measurement Instrumentation.
Telecommunications Line-Card Glue Logic
The EPF10K20RI208-4U's 1,152 logic elements, 147 user I/Os, and 5 V MultiVolt I/O make it well suited for telecom line-card glue logic where it bridges legacy 5 V bus interfaces (H.110, H-MVIP, MVIP) to newer 3.3 V framers and TDM switching ASICs. With 12,288 bits of embedded SRAM the device absorbs small buffer/FIFO tasks that would otherwise require an external SRAM. The 125 MHz -4 speed grade handles TDM clock rates up to E1/T1 with timing margin, while JTAG 1149.1 boundary scan simplifies board-level test in production. Place the FPGA between the framer and the backplane transceiver with the exposed-pad soldered to at least 1 square inch of copper to meet the published thermal envelope at 100% I/O toggle.
Recommandé
Industrial PLC State-Machine Controller
The EPF10K20RI208-4U's industrial -40°C to +85°C temperature range, 144 LABs, and 5 V I/O tolerance make it ideal for PLC state-machine controllers that interface to 24 V industrial sensors via opto-isolators. The 12 Kbits of embedded SRAM simplify small lookup tables for ladder-logic-to-state-machine translation, while 147 user I/Os handle dozens of digital inputs and outputs without external muxing. Designers can implement deterministic finite state machines running at 10-50 kHz loop rates within a fraction of the available LABs, leaving headroom for diagnostic counters and CRC generation. Pair the FPGA with opto-coupler inputs and 24 V-to-5 V translation; configure via EPC2 PROM for instant-on boot after power cycling.
Recommandé
Legacy PCI Bridge / Bus Interface Adapter
The EPF10K20RI208-4U's 125 MHz internal performance and 5 V PCI-compliant I/O make it a classic choice for legacy 33 MHz/32-bit PCI bridge designs, especially in industrial PCs and instrumentation cards. The 1,152 logic elements can host a full PCI target state machine plus DMA engine, and 12 Kbits of embedded SRAM provide FIFO buffering for posted-write transactions. MultiVolt I/O allows the FPGA to bridge 5 V PCI bus to a 3.3 V local ASIC without external level shifters. Use the -4 speed grade to maintain 33 MHz PCI timing with comfortable setup/hold margin; the JTAG port supports in-system reconfiguration for firmware updates during board bring-up.
Recommandé
Video Processing Pre-Processor
The EPF10K20RI208-4U's 147 user I/Os and 125 MHz performance enable its use as a video pre-processor that performs genlocking, sync separation, and color-space conversion on composite or component video streams. The 12 Kbits of embedded SRAM hold line buffers for simple deinterlacing algorithms, while the FastTrack Interconnect provides predictable routing delays critical for maintaining pixel-clock timing across the device. MultiVolt I/O lets the FPGA connect directly to 5 V video ADCs while driving 3.3 V DSP processors downstream. Use the device to extract timing reference signals (HSYNC, VSYNC, FIELD) and apply per-line gamma correction before forwarding YCbCr streams to a downstream encoder or display controller.
Recommandé
DSP Co-Processor Front-End
The EPF10K20RI208-4U is well suited as a DSP co-processor front-end that performs real-time FIR filtering, sample-rate conversion, or FFT pre-processing before handing data to a host DSP. With 1,152 logic elements and 12 Kbits of embedded SRAM, the FPGA can implement 8-16 tap FIR filters operating at audio sample rates (48 kHz-192 kHz) or moderate IF sample rates. The MultiVolt I/O bridges 5 V analog front-end ADCs to 3.3 V modern DSP chips, eliminating external level shifters. Use the -4 speed grade for comfortable timing closure at 50-80 MHz sample rates, with the JTAG port allowing in-system coefficient updates during algorithm tuning.
Recommandé
Test & Measurement Instrumentation
The EPF10K20RI208-4U's JTAG boundary-scan support, 147 user I/Os, and 125 MHz performance make it a strong choice for test-and-measurement front-ends that require custom waveform generation, pattern generation, or protocol decoding. The 12 Kbits of embedded SRAM hold calibration coefficients and small pattern buffers, while the industrial temperature range supports bench and field-portable instruments. MultiVolt I/O lets the FPGA drive both 5 V and 3.3 V mixed-signal ASICs directly. Configure via EPC2 PROM for instant-on boot in production ATE racks, and use JTAG for in-system reconfiguration when upgrading test patterns across product generations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K20RI208-4U — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K20RI208-4 | EPF10K20RI208-4N | EPF10K20RC208-4 | EPF10K20RC208-4N | EPF10K20RC208-3 | EPF10K20RC208-3N |
|---|---|---|---|---|---|---|---|
| Package | 208-pin RQFP (exposed pad) | 208-pin RQFP (exposed pad) - same | 208-pin RQFP (exposed pad) - same | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 1,152 | 1,152 | 1,152 | 1,152 | 1,152 | 1,152 | 1,152 |
| Speed Grade | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) | -3 (~100 MHz, -20%) | -3 (~100 MHz, -20%) |
| Operating Temperature | -40°C to +85°C (industrial) | -40°C to +85°C (industrial) | -40°C to +85°C (industrial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) |
| Embedded SRAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
| User I/O (max) | 147 | 147 | 147 | 147 | 147 | 147 | 147 |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
Principaux différenciateurs
- Identical silicon with U packing-code designation (vs EPF10K20RI208-4)
- Industrial temperature grade for harsh environments (vs EPF10K20RC208-4)
- Faster -4 speed grade for timing-critical designs (vs EPF10K20RC208-3)
Notes de conception
Estimated: The EPF10K20RI208-4U is housed in a 208-pin RQFP with an exposed thermal pad on the bottom of the package. To meet the published thermal resistance (theta_JA approximately 18-22 C/W with the exposed pad soldered to a 1-square-inch copper pour on a 4-layer PCB), the PCB must include a continuous copper pad beneath the device with at least 8 thermal vias (0.3 mm drill) connecting to inner ground planes. Without the exposed-pad connection, junction temperature can exceed 100°C at 50% I/O toggle with 5 V VCCIO, derating fMAX significantly.
Estimated: With VCCINT at 5.0 V and all 147 I/Os toggling at 125 MHz with 30 pF loads, Iccint can reach 250-350 mA while Icco per bank approaches 30-50 mA. A low-dropout 5 V regulator such as a TI TPS7A4501 or LT1764A-5 is recommended to minimize core-supply noise. Decoupling requires 4.7 µF bulk tantalum plus 0.1 µF ceramic per VCCINT pin pair and 0.1 µF ceramic per VCCIO pin. Power sequencing must hold VCCIO within ±0.5 V of VCCINT during ramp-up to prevent SCR latch-up in the I/O cells.
Do not exceed 5.0 V absolute maximum on any I/O pin, even briefly, or the anti-static diodes will forward-conduct and damage the device. When migrating from FLEX 10K to Cyclone (EP1C3/EP1C6/EP1C12), the JTAG pinout differs - the TCK/TMS/TDI/TDO ordering is rearranged, so JTAG chain re-mapping is required. Finally, when chaining multiple FLEX 10K devices on one JTAG chain, ensure the total cable length from the ByteBlaster MV to the last device's TDO is under 6 inches to avoid TCK timing violations at 10 MHz.
Informations de conformité
RoHS/Pb-free status for the EPF10K20RI208-4U base part is not explicitly listed in the verified web data; the 'N' suffix variants (EPF10K20RI208-4N, EPF10K20RC208-4N, EPF10K20RC208-3N) are typically Pb-free per Altera's suffix convention. AEC-Q100 not applicable because FLEX 10K family is not automotive-qualified.
