EPF10K30ABC356-1 - 30K Gate FLEX-10KA FPGA, 356-BGA | Intel
Référence : EPF10K30ABC356-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $78 | $7 800,00 |
| 500 | $68.5 | $34 250,00 |
| 1 000 | $62 | $62 000,00 |
EPF10K30ABC356-1 Présentation
A field-programmable gate array (FPGA) is a type of integrated circuit designed to be configured by the customer or designer after manufacturing. FPGAs belong to the broader programmable logic device (PLD) family, which sits within the semiconductor hierarchy of logic ICs, integrated circuits, and finally electronic components. FPGAs differ from application-specific integrated circuits (ASICs) in that their function is not hard-wired at fabrication, allowing the same silicon to implement many different digital designs through configuration bitstream loading.
Key features include 30,000 typical gates (119,000 maximum), 12 embedded array blocks (EABs) totaling 24 Kbits of RAM, 1,728 logic elements (LEs), 246 user I/Os, and in-system programmability through the serial passive (PS) configuration scheme. The part is specified for the commercial temperature grade and is built on a 0.42-micron CMOS process. The 356-LBGA (low-profile BGA) package has 35 mm x 35 mm body dimensions suitable for high-density PCB layouts.
The FLEX-10KA architecture combines a logic array of LABs with a row of EABs. Each EAB provides 2 Kbits of dual-port RAM, allowing efficient implementation of memory-intensive functions such as FIFO buffers, lookup tables, and DSP datapaths without consuming general-purpose logic. Interconnect is provided through FastTrack continuous routing channels, which minimize interconnect delay for predictable timing closure. The device supports multiple I/O standards including 5V, 3.3V, and 2.5V LVCMOS/LVTTL for mixed-voltage system design.
Typical applications include glue-logic consolidation in telecom line cards, custom peripheral interfacing for industrial controllers, prototyping bridges between legacy ASICs and microcontrollers, and DSP pre/post-processing blocks in audio and video pipelines. The device is well suited for medium-density designs in the 20K-50K gate range where the embedded memory blocks reduce overall system cost.
When designing with this part, note that configuration data must be loaded from an external serial PROM (EPC1, EPC2) or via a microcontroller at every power-up because the SRAM cells are volatile. JTAG boundary-scan and programming via the ByteBlasterMV cable are supported for in-system updates. The 356-ball BGA requires PCB-level assembly with X-ray inspection of solder joints and adequate thermal relief for the commercial temperature range of 0C to +70C.
This page synthesizes distributor pricing, FLEX-10KA family cross-references, and practical design notes not found in the original manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K30ABC356-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ABC356-1 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, User I/Os, Embedded Array Blocks (EABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ABC356-3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30AQC208-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K30EBC356-1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K50EBC356-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K100EBC356-1
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EPF10K30ABC356-1 Valeurs maximales et caractéristiques électriques
| Family | FLEX-10KA |
| Typical Gates | 30,000 |
| Maximum Gates | 119,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 12 |
| Total EAB RAM | 24,576 bits (24 Kbits) |
| User I/Os | 246 |
| Supply Voltage (VCCINT) | 3.3 V (3.0 V to 3.6 V) |
| I/O Standards | 5V/3.3V/2.5V LVCMOS, LVTTL |
| Process Technology | 0.42 micron CMOS, SRAM-based |
| Boîtier | 356-LBGA (35 x 35 mm) |
| Température de fonctionnement | 0C to +70C (commercial) |
| Configuration Scheme | Passive Serial (PS), JTAG |
Configuration des broches de EPF10K30ABC356-1
| Broche B6 | VCCINT — 3.3V core supply |
| Broche A1 | GND — Ground reference |
| Broche B1 | I/O Bank 1 — User I/O - bank 1 |
| Broche D12 | TDI — JTAG test data in |
| Broche E13 | TDO — JTAG test data out |
| Broche C13 | TCK — JTAG test clock |
| Broche A14 | TMS — JTAG test mode select |
| Broche B14 | TRST — JTAG test reset |
| Broche D14 | nCONFIG — Configuration control (active low) |
| Broche E14 | nSTATUS — Configuration status (active low) |
| Broche A20 | CONF_DONE — Configuration complete indicator |
| Broche B20 | DCLK — Configuration clock |
| Broche C20 | DATA0 — Configuration data input |
| Broche D20 | MSEL0 — Configuration mode select 0 |
| Broche E20 | MSEL1 — Configuration mode select 1 |
| Broche AF26 | I/O Bank 2 — User I/O - bank 2 |
| Broche AE26 | VCCIO2 — I/O bank 2 supply reference |
| Broche AB20 | I/O Bank 3 — User I/O - bank 3 |
| Broche AC20 | VCCIO3 — I/O bank 3 supply reference |
| Broche W13 | I/O Bank 4 — User I/O - bank 4 |
| Broche Y13 | VCCIO4 — I/O bank 4 supply reference |
| Broche AF1 | I/O Bank 1 — User I/O - bank 1 |
| Broche AE1 | VCCIO1 — I/O bank 1 supply reference |
Applications typiques
EPF10K30ABC356-1 convient pour 6 applications: Telecom Line-Card Glue Logic, Industrial Controller Custom Peripheral Bridge, ASIC Emulation and Prototyping, Audio/Video Pre/Post-Processing Pipeline, Legacy Peripheral Replacement for Retired ASICs, Custom Datapath and FIFO Buffering.
Telecom Line-Card Glue Logic
The EPF10K30ABC356-1 suits telecom line-card glue-logic consolidation where protocol bridging, framing, and bus-arbitration logic must be absorbed into a single reprogrammable device. Its 1,728 logic elements handle moderate state machines and FIFOs, while the 12 embedded array blocks provide 24 Kbits of dual-port RAM for small frame buffers and lookup tables. The 246 user I/Os map cleanly to bus-intensive backplane interfaces such as UTOPIA, POS-PHY, or H.110, allowing designers to retire multiple 74-series TTL chips. Its 3.3V core with 5V-tolerant I/Os interfaces directly to legacy bus drivers without level shifters.
Recommandé
Industrial Controller Custom Peripheral Bridge
In industrial PLC and motion-control platforms, the EPF10K30ABC356-1 bridges legacy parallel peripherals (FPGA-expansion buses, proprietary ASICs, encoder interfaces) to modern microcontrollers via the 246 I/Os. The embedded array blocks implement pulse-train buffers, command queues, and timing-critical register maps with deterministic latency. Its commercial 0C to +70C temperature range covers factory-floor enclosures, and the 356-LBGA package supports high-density controller boards with mixed-signal peripherals. The JTAG programming interface allows field firmware updates without removing the controller from the rack.
Recommandé
ASIC Emulation and Prototyping
Designers use the EPF10K30ABC356-1 as an ASIC-emulation platform to validate pre-silicon RTL before committing to mask sets. The 30,000-gate capacity maps typical sub-system blocks (DMA engines, peripheral controllers, custom accelerators) at real-world timing. Its embedded array blocks emulate SRAM macros and register files, while the 246 I/Os provide realistic chip-to-chip interconnects. Quartus synthesis flow ports seamlessly to ASIC back-end tools, and the 356-LBGA package allows emulation boards to be re-used across multiple projects with simple interposers.
Recommandé
Audio/Video Pre/Post-Processing Pipeline
The EPF10K30ABC356-1 handles pixel-rate audio/video pre- and post-processing functions such as color-space conversion, de-interlacing, and simple DSP filtering in broadcast equipment. The 24 Kbits of EAB RAM act as line buffers for video data, while the LABs implement datapath arithmetic including fixed-point multipliers and accumulators. The 246 user I/Os accommodate wide parallel video buses (RGB 24-bit plus control) at pixel clocks well within the FLEX-10KA toggle-rate budget. Designers can re-load configuration bitstreams to switch between broadcast standards (NTSC/PAL/SDI) without hardware rework.
Recommandé
Legacy Peripheral Replacement for Retired ASICs
When a proprietary ASIC used in a certified system becomes unavailable, the EPF10K30ABC356-1 reproduces its functionality in programmable logic to keep long-lifecycle products in service. Industrial, aerospace, and medical OEMs rely on the FLEX-10KA family for these 'form-fit-function' re-creations because the parts remain procurable through authorized obsolete-stock distributors. The JTAG and passive-serial configuration interfaces match the original ASIC pinout, simplifying board-level integration. Long-term availability through Rochester Electronics extends the service life well beyond the original Altera production window.
Recommandé
Custom Datapath and FIFO Buffering
Data-acquisition and test-instrument systems use the EPF10K30ABC356-1 to implement custom datapaths and FIFO buffers between high-speed ADCs/DACs and downstream processors. The 12 EABs provide 24 Kbits of true dual-port RAM, ideal for clock-domain crossing and packet buffering in streaming pipelines. The LABs implement serializer/deserializer functions, scatter-gather DMA descriptors, and protocol framing. The 246 user I/Os include enough LVDS-capable pins for narrow ADC interfaces (8-16 bits plus clock and frame), allowing the FPGA to act as the timing-critical front end of a measurement system.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ABC356-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ABC356-3 | EPF10K30AQC208-1 | EPF10K30EBC356-1 | EPF10K50EBC356-1 | EPF10K100EBC356-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 208-PQFP - different | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Family | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KE | FLEX-10KE | FLEX-10KE |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 | 100,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 2,880 | 4,992 |
| Embedded RAM (EAB) | 24 Kbits | 24 Kbits | 24 Kbits | 24 Kbits | 40 Kbits | 48 Kbits |
| User I/Os | 246 | 246 | 147 | 246 | 246 | 246 |
| Speed Grade | -1 (fastest) | -3 (slower) | -1 | -1 | -1 | -1 |
| Supply Voltage | 3.3V (3.0-3.6V) | 3.3V (3.0-3.6V) | 3.3V (3.0-3.6V) | 2.5V (FLEX-10KE core) | 2.5V (FLEX-10KE core) | 2.5V (FLEX-10KE core) |
Principaux différenciateurs
- Highest-density FLEX-10KA member in 356-LBGA footprint (vs EPF10K30AQC208-1)
- Fastest speed grade in the FLEX-10KA 30K-gate class (vs EPF10K30ABC356-3)
- 356-ball BGA enables high-density single-chip integration (vs EPF10K30EBC356-1)
Notes de conception
The FLEX-10KA core requires a clean 3.3V supply decoupled with 0.1 uF ceramic capacitors placed within 5 mm of each VCCINT pin. Add bulk 10-100 uF tantalum or polymer capacitors at the regulator output; the I/O banks each require their own VCCIO decoupling because switching transients on user outputs couple back into the core. Use a ferrite bead between the 3.3V core and 3.3V I/O rails to reduce switching noise. Estimate: at 50 MHz toggle rate and 50% I/O switching, quiescent current is approximately 50-100 mA plus dynamic current.
The 356-ball LBGA uses 1.27 mm ball pitch with a 35 mm x 35 mm body, requiring 4-layer or higher PCB stack-ups with matched impedance for high-speed signals. Escape routing must use microvias or dog-bone fanouts; signal layers should be referenced to an unbroken GND plane adjacent to the BGA. Thermal relief is provided through the ball grid itself - no external heatsink is required for the commercial 0C to +70C range. X-ray inspection of solder joints is mandatory because BGA voids are not visible optically.
Because the SRAM configuration is volatile, forgetting to connect the configuration PROM causes the device to remain in tri-state after power-up, looking like a silicon failure. Always tie nCONFIG high through a 10 kohm resistor to VCC, and route the CONF_DONE LED for production debugging. The MSEL[0:1] pins must be tied to GND for passive-serial mode; tying them high selects a different configuration scheme that will fail to load. Verify JTAG chain integrity before assuming configuration PROM corruption.
Differential I/O pairs (LVDS, when supported in selected mode) should be length-matched to within 0.5 mm to avoid skew-induced timing errors. Keep the JTAG chain (TCK/TMS/TDO/TDI/TRST) short and isolated from switching signals; add 22 ohm series damping resistors on TCK and TMS near the FPGA. Configuration signals (DCLK, DATA0) must be guarded from adjacent high-speed switching lines; route them on inner layers or keep clearance to 3W. Decoupling capacitors must be placed with vias directly into the power and ground planes to minimize loop inductance.
Informations de conformité
Compliance status not provided in the verified web data for this obsolete Altera/Intel part. The FLEX-10KA family predates widespread RoHS documentation, and the original Altera product page is no longer maintained. RoHS status is unknown and must be verified through the procurement distributor (typically Rochester Electronics) for new orders.
