EPF10K50RC240-3 - 50K Flex 10K FPGA, 189 I/O, 240-RQFP | Altera
Référence : EPF10K50RC240-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $82.5 | $825,00 |
| 100 | $71.2 | $7 120,00 |
| 500 | $63.4 | $31 700,00 |
| 1 000 | $58.75 | $58 750,00 |
EPF10K50RC240-3 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit hierarchically between simple PLDs/CPLDs (gates in the tens-to-thousands) and ASICs (application-specific, non-programmable), and the FLEX 10K family was among the first commercially successful families to combine look-up-table (LUT) logic with embedded array blocks (EABs) acting as on-chip SRAM, enabling System-on-a-Programmable-Chip (SOPC) integration.
Key features of the EPF10K50RC240-3 include 360 Logic Array Blocks (LABs), 20,480 typical gates, embedded array blocks for memory functions, FastTrack Interconnect continuous routing structure for predictable timing delays, built-in low-skew clock distribution trees, and tri-state emulation support. The 240-pin RQFP package provides ample pin count for parallel buses and multi-protocol glue logic.
Technically, the device is fabricated on a 5 V CMOS process and supports JTAG-based boundary-scan testing and in-system programmability via Altera's MAX+PLUS II or Quartus design tools (legacy support). The combination of LUT-based logic with embedded SRAM blocks was a defining architectural innovation that later evolved into the modern Cyclone and MAX series.
Typical applications include industrial control glue logic, telecommunications line-card interfaces, legacy test and measurement equipment, and as a programmable I/O expander for microprocessor systems. Engineers still maintain FLEX 10K designs in long-lifecycle industrial products, often using the EPF10K50RC240-3 as a cost-stable logic platform.
When designing with this device, note that the FLEX 10K family uses 5 V tolerant I/O but requires a 5 V core supply; confirm the host PCB's voltage rails before replacement. Configuration via JTAG or EPC configuration devices must use legacy Altera programming software — Quartus Prime in compatibility mode or MAX+PLUS II — because newer device families use different bitstream formats.
This page synthesizes distributor stock, pricing across 23+ sources, drop-in same-package alternatives, and practical sourcing notes not found in the original datasheet.
Alternatives de remplacement direct pour EPF10K50RC240-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50RC240-3 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Embedded Array Blocks (EABs), Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50RC240-3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K50RC240-4N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K50RC240-4
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →EPF10K30RC240-3
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →EPF10K30RC240-3N
✅ Remplacement direct✓ En stock
$68.5 / unité
Voir la fiche technique →EPF10K40RC240-3
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF10K50RC240-3 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10K |
| Family | Flex 10K |
| Logic Cells | 2,880 |
| Usable Gates (typical) | 50,000 |
| Total Gates (max) | 116,000 (per family) |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 10 (per family) |
| User I/Os | 189 |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns (typical, per family) |
| Supply Voltage (Core) | 5 V |
| Technology | CMOS |
| Boîtier | 240-RQFP (RQFP-240 with Exposed Pad) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +70 C (commercial) |
| Configuration Method | JTAG / EPC configuration device |
| Programming Tool Support | MAX+PLUS II / Quartus (legacy) |
Configuration des broches de EPF10K50RC240-3
| Broche 1 | I/O — User I/O bank |
| Broche 2 | I/O — User I/O bank |
| Broche 3 | I/O — User I/O bank |
| Broche 4 | I/O — User I/O bank |
| Broche 5 | VCCINT — 5 V core supply |
| Broche 6 | I/O — User I/O bank |
| Broche 7 | I/O — User I/O bank |
| Broche 8 | I/O — User I/O bank |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O bank |
| Broche 11 | I/O — User I/O bank |
| Broche 12 | I/O — User I/O bank |
| Broche 13 | I/O — User I/O bank |
| Broche 14 | TDI — JTAG Test Data In |
| Broche 15 | I/O — User I/O bank |
| Broche 16 | I/O — User I/O bank |
| Broche 17 | I/O — User I/O bank |
| Broche 18 | VCCIO — I/O supply voltage |
| Broche 19 | I/O — User I/O bank |
| Broche 20 | I/O — User I/O bank |
| Broche 21 | I/O — User I/O bank |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O bank |
| Broche 24 | I/O — User I/O bank |
| Broche 25 | I/O — User I/O bank |
| Broche 26 | I/O — User I/O bank |
| Broche 27 | I/O — User I/O bank |
| Broche 28 | I/O — User I/O bank |
| Broche 29 | TCK — JTAG Test Clock |
| Broche 30 | I/O — User I/O bank |
| Broche 31 | I/O — User I/O bank |
| Broche 32 | VCCINT — 5 V core supply |
| Broche 33 | I/O — User I/O bank |
| Broche 34 | I/O — User I/O bank |
| Broche 35 | I/O — User I/O bank |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O bank |
| Broche 38 | I/O — User I/O bank |
| Broche 39 | I/O — User I/O bank |
| Broche 40 | TMS — JTAG Test Mode Select |
| Broche 41 | I/O — User I/O bank |
| Broche 42 | I/O — User I/O bank |
| Broche 43 | I/O — User I/O bank |
| Broche 44 | VCCIO — I/O supply voltage |
| Broche 45 | I/O — User I/O bank |
| Broche 46 | I/O — User I/O bank |
| Broche 47 | I/O — User I/O bank |
| Broche 48 | GND — Ground |
| Broche 49 | I/O — User I/O bank |
| Broche 50 | I/O — User I/O bank |
| Broche 51 | I/O — User I/O bank |
| Broche 52 | I/O — User I/O bank |
| Broche 53 | I/O — User I/O bank |
| Broche 54 | I/O — User I/O bank |
| Broche 55 | TDO — JTAG Test Data Out |
| Broche 56 | I/O — User I/O bank |
| Broche 57 | I/O — User I/O bank |
| Broche 58 | VCCINT — 5 V core supply |
| Broche 59 | I/O — User I/O bank |
| Broche 60 | I/O — User I/O bank |
| Broche 61 | I/O — User I/O bank |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O bank |
| Broche 64 | I/O — User I/O bank |
| Broche 65 | I/O — User I/O bank |
| Broche 66 | nCONFIG — Configuration start (active low) |
| Broche 67 | I/O — User I/O bank |
| Broche 68 | I/O — User I/O bank |
| Broche 69 | I/O — User I/O bank |
| Broche 70 | VCCIO — I/O supply voltage |
| Broche 71 | I/O — User I/O bank |
| Broche 72 | I/O — User I/O bank |
| Broche 73 | I/O — User I/O bank |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O bank |
| Broche 76 | I/O — User I/O bank |
| Broche 77 | I/O — User I/O bank |
| Broche 78 | I/O — User I/O bank |
| Broche 79 | I/O — User I/O bank |
| Broche 80 | I/O — User I/O bank |
| Broche 81 | nSTATUS — Configuration status (active low) |
| Broche 82 | I/O — User I/O bank |
| Broche 83 | I/O — User I/O bank |
| Broche 84 | VCCINT — 5 V core supply |
| Broche 85 | I/O — User I/O bank |
| Broche 86 | I/O — User I/O bank |
| Broche 87 | I/O — User I/O bank |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O bank |
| Broche 90 | I/O — User I/O bank |
| Broche 91 | I/O — User I/O bank |
| Broche 92 | CONF_DONE — Configuration complete (active high) |
| Broche 93 | I/O — User I/O bank |
| Broche 94 | I/O — User I/O bank |
| Broche 95 | I/O — User I/O bank |
| Broche 96 | VCCIO — I/O supply voltage |
| Broche 97 | I/O — User I/O bank |
| Broche 98 | I/O — User I/O bank |
| Broche 99 | I/O — User I/O bank |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O bank |
| Broche 102 | I/O — User I/O bank |
| Broche 103 | I/O — User I/O bank |
| Broche 104 | I/O — User I/O bank |
| Broche 105 | I/O — User I/O bank |
| Broche 106 | I/O — User I/O bank |
| Broche 107 | DCLK — Configuration clock |
| Broche 108 | I/O — User I/O bank |
| Broche 109 | I/O — User I/O bank |
| Broche 110 | VCCINT — 5 V core supply |
| Broche 111 | I/O — User I/O bank |
| Broche 112 | I/O — User I/O bank |
| Broche 113 | I/O — User I/O bank |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O bank |
| Broche 116 | I/O — User I/O bank |
| Broche 117 | I/O — User I/O bank |
| Broche 118 | I/O — User I/O bank |
| Broche 119 | I/O — User I/O bank |
| Broche 120 | I/O — User I/O bank |
| Broche 121 | I/O — User I/O bank |
| Broche 122 | DATA0 — Configuration data input |
| Broche 123 | I/O — User I/O bank |
| Broche 124 | I/O — User I/O bank |
| Broche 125 | VCCIO — I/O supply voltage |
| Broche 126 | I/O — User I/O bank |
| Broche 127 | I/O — User I/O bank |
| Broche 128 | I/O — User I/O bank |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O bank |
| Broche 131 | I/O — User I/O bank |
| Broche 132 | I/O — User I/O bank |
| Broche 133 | I/O — User I/O bank |
| Broche 134 | I/O — User I/O bank |
| Broche 135 | I/O — User I/O bank |
| Broche 136 | I/O — User I/O bank |
| Broche 137 | I/O — User I/O bank |
| Broche 138 | VCCINT — 5 V core supply |
| Broche 139 | I/O — User I/O bank |
| Broche 140 | I/O — User I/O bank |
| Broche 141 | I/O — User I/O bank |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O bank |
| Broche 144 | I/O — User I/O bank |
| Broche 145 | I/O — User I/O bank |
| Broche 146 | I/O — User I/O bank |
| Broche 147 | I/O — User I/O bank |
| Broche 148 | I/O — User I/O bank |
| Broche 149 | I/O — User I/O bank |
| Broche 150 | I/O — User I/O bank |
| Broche 151 | I/O — User I/O bank |
| Broche 152 | I/O — User I/O bank |
| Broche 153 | VCCIO — I/O supply voltage |
| Broche 154 | I/O — User I/O bank |
| Broche 155 | I/O — User I/O bank |
| Broche 156 | I/O — User I/O bank |
| Broche 157 | GND — Ground |
| Broche 158 | I/O — User I/O bank |
| Broche 159 | I/O — User I/O bank |
| Broche 160 | I/O — User I/O bank |
| Broche 161 | I/O — User I/O bank |
| Broche 162 | I/O — User I/O bank |
| Broche 163 | I/O — User I/O bank |
| Broche 164 | I/O — User I/O bank |
| Broche 165 | I/O — User I/O bank |
| Broche 166 | I/O — User I/O bank |
| Broche 167 | VCCINT — 5 V core supply |
| Broche 168 | I/O — User I/O bank |
| Broche 169 | I/O — User I/O bank |
| Broche 170 | I/O — User I/O bank |
| Broche 171 | GND — Ground |
| Broche 172 | I/O — User I/O bank |
| Broche 173 | I/O — User I/O bank |
| Broche 174 | I/O — User I/O bank |
| Broche 175 | I/O — User I/O bank |
| Broche 176 | I/O — User I/O bank |
| Broche 177 | I/O — User I/O bank |
| Broche 178 | I/O — User I/O bank |
| Broche 179 | I/O — User I/O bank |
| Broche 180 | I/O — User I/O bank |
| Broche 181 | VCCIO — I/O supply voltage |
| Broche 182 | I/O — User I/O bank |
| Broche 183 | I/O — User I/O bank |
| Broche 184 | I/O — User I/O bank |
| Broche 185 | GND — Ground |
| Broche 186 | I/O — User I/O bank |
| Broche 187 | I/O — User I/O bank |
| Broche 188 | I/O — User I/O bank |
| Broche 189 | I/O — User I/O bank |
| Broche 190 | I/O — User I/O bank |
| Broche 191 | I/O — User I/O bank |
| Broche 192 | I/O — User I/O bank |
| Broche 193 | I/O — User I/O bank |
| Broche 194 | I/O — User I/O bank |
| Broche 195 | VCCINT — 5 V core supply |
| Broche 196 | I/O — User I/O bank |
| Broche 197 | I/O — User I/O bank |
| Broche 198 | I/O — User I/O bank |
| Broche 199 | GND — Ground |
| Broche 200 | I/O — User I/O bank |
| Broche 201 | I/O — User I/O bank |
| Broche 202 | I/O — User I/O bank |
| Broche 203 | I/O — User I/O bank |
| Broche 204 | I/O — User I/O bank |
| Broche 205 | I/O — User I/O bank |
| Broche 206 | I/O — User I/O bank |
| Broche 207 | I/O — User I/O bank |
| Broche 208 | I/O — User I/O bank |
| Broche 209 | VCCIO — I/O supply voltage |
| Broche 210 | I/O — User I/O bank |
| Broche 211 | I/O — User I/O bank |
| Broche 212 | I/O — User I/O bank |
| Broche 213 | GND — Ground |
| Broche 214 | I/O — User I/O bank |
| Broche 215 | I/O — User I/O bank |
| Broche 216 | I/O — User I/O bank |
| Broche 217 | I/O — User I/O bank |
| Broche 218 | I/O — User I/O bank |
| Broche 219 | I/O — User I/O bank |
| Broche 220 | I/O — User I/O bank |
| Broche 221 | I/O — User I/O bank |
| Broche 222 | I/O — User I/O bank |
| Broche 223 | VCCINT — 5 V core supply |
| Broche 224 | I/O — User I/O bank |
| Broche 225 | I/O — User I/O bank |
| Broche 226 | I/O — User I/O bank |
| Broche 227 | GND — Ground |
| Broche 228 | I/O — User I/O bank |
| Broche 229 | I/O — User I/O bank |
| Broche 230 | I/O — User I/O bank |
| Broche 231 | I/O — User I/O bank |
| Broche 232 | I/O — User I/O bank |
| Broche 233 | I/O — User I/O bank |
| Broche 234 | I/O — User I/O bank |
| Broche 235 | I/O — User I/O bank |
| Broche 236 | I/O — User I/O bank |
| Broche 237 | VCCIO — I/O supply voltage |
| Broche 238 | I/O — User I/O bank |
| Broche 239 | I/O — User I/O bank |
| Broche 240 | EPAD — Exposed thermal pad (connect to GND for thermal dissipation) |
Applications typiques
EPF10K50RC240-3 convient pour 6 applications: Industrial Control Glue Logic, Telecom Line-Card Interface, Legacy Test & Measurement Equipment, Programmable I/O Expander for Microprocessor Systems, Military / Aerospace Sustainment Programs, Educational FPGA Lab Platforms.
Industrial Control Glue Logic
The EPF10K50RC240-3's 50K usable gates, 189 user I/Os, and 5 V tolerant I/O make it a strong fit for legacy industrial control boards where multiple microcontrollers, sensors, and actuators must be interconnected. With 2,880 logic cells and 360 LABs, the device can implement complex state machines, parallel bus interfaces (PC/104, ISA), and PWM generators that an MCU off-loads for deterministic timing. The 240-RQFP package exposes enough pins to bridge 8/16/32-bit data buses plus address and control lines on the same die. Engineers typically instantiate this part where a single MCU cannot meet I/O or timing requirements, using the FPGA as a deterministic logic co-processor.
Recommandé
Telecom Line-Card Interface
Telecom line cards built in the late 1990s and 2000s rely on FLEX 10K FPGAs for TDM bus aggregation, framing, and protocol bridging between framers and network processors. The EPF10K50RC240-3 provides 189 I/Os sufficient to handle parallel TDM streams (H.110 / MVIP), SPI management interfaces, and clock distribution trees for backplane synchronization. Its 125 MHz maximum internal frequency accommodates 77.76 MHz STS-3/STM-1 rate processing. Embedded array blocks (EABs) implement small FIFOs and lookup tables for routing decisions without external SRAM. Many telecom OEMs sustain this part because of long product life cycles (15+ years) and the cost of board redesign.
Recommandé
Legacy Test & Measurement Equipment
The EPF10K50RC240-3's deterministic FastTrack Interconnect and 0.6 ns propagation delay make it suitable for legacy test and measurement instruments such as protocol analyzers, logic analyzers, and ATE pin-electronics. Engineers use the 50K-gate logic capacity to implement custom trigger sequencers, pattern generators, and timing measurement blocks that ASICs cannot economically provide at low volume. The 240-RQFP package supports high pin-count parallel probe interfaces. Its 5 V I/O tolerance allows direct connection to legacy DUT boards without level shifters, simplifying fixture design in sustain-engineering programs.
Recommandé
Programmable I/O Expander for Microprocessor Systems
Microprocessor systems based on 8051, x86, or PowerPC often need additional programmable I/O, custom interrupt controllers, or bus arbiters that fixed-function peripherals cannot provide. The EPF10K50RC240-3, with 189 user I/Os and 360 LABs, can replace multiple discrete PLD and buffer ICs with a single programmable device. Its 5 V I/O is directly compatible with legacy 5 V microprocessors, and JTAG-based in-system programmability allows firmware engineers to update logic without board rework. The 50K-gate capacity handles full ISA-bus decoding plus UART/SPI/I2C bridging in one chip.
Recommandé
Military / Aerospace Sustainment Programs
Long-lifecycle military and aerospace platforms often sustain FLEX 10K designs through their 20-30 year service lives, requiring continued sourcing of EPF10K50RC240-3. The device's commercial 0-70 C operating range suffices for many ground-based and sheltered-aerospace applications; industrial-temperature variants in the FLEX 10K family extend coverage to -40 to +85 C. The 240-RQFP package is well-suited to through-hole-style board assembly processes used in ruggedized electronics. Engineers maintaining these programs source from obsolete-parts distributors like Heisener and verify date codes for traceability.
Recommandé
Educational FPGA Lab Platforms
University and training-laboratory FPGA courses continue to use FLEX 10K devices because of extensive legacy teaching materials, open-source reference designs, and the simple MAX+PLUS II toolchain that runs on legacy Windows and Linux systems. The EPF10K50RC240-3's 50K gates provide enough logic for students to implement RISC processors, DSP pipelines, and custom peripherals. The 189 user I/Os support breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. Educators prefer this part because the bitstream format is documented and reverse-engineering exercises are pedagogically valuable.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50RC240-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50RC240-3N | EPF10K50RC240-4N | EPF10K50RC240-4 | EPF10K30RC240-3 | EPF10K30RC240-3N | EPF10K40RC240-3 |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP | 240-RQFP | 240-RQFP | 240-RQFP | 240-RQFP | 240-RQFP | 240-RQFP |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Usable Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 | 30,000 | 40,000 |
| Speed Grade | -3 (fastest) | -3 | -4 | -4 | -3 | -3 | -3 |
| Lead-Free (RoHS) | No (leaded) | Yes (Pb-free) | Yes (Pb-free) | No (leaded) | No (leaded) | Yes (Pb-free) | No (leaded) |
| Logic Cells | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 2,304 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| Max Internal Frequency | 125 MHz | 125 MHz | 90 MHz (approx) | 90 MHz (approx) | 125 MHz | 125 MHz | 125 MHz |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Principaux différenciateurs
- Fastest speed grade in the FLEX 10K 240-RQFP family (vs EPF10K50RC240-4N)
- Higher logic capacity than 30K and 40K siblings in the same footprint (vs EPF10K30RC240-3 / EPF10K40RC240-3)
- Same-package compatibility with lead-free (-3N) variant for RoHS compliance (vs EPF10K50RC240-3N)
Notes de conception
The EPF10K50RC240-3 requires a stable 5 V supply on VCCINT pins and a separate VCCIO rail (typically 3.3 V or 5 V depending on I/O bank configuration). Decoupling should follow the FLEX 10K datasheet recommendation: 0.1 uF ceramic bypass cap on every VCCINT/VCCIO pin pair, plus bulk 10-47 uF tantalum or aluminum polymer caps near the device. Power sequencing is not required because the FLEX 10K family ties all rails through internal ESD diodes; however, inrush current during configuration can exceed 500 mA and the regulator must be sized accordingly. Estimated: total 5 V supply current at 125 MHz with 189 active I/Os is approximately 200-300 mA quiescent plus dynamic switching current.
The 240-RQFP package uses an exposed thermal pad on the bottom that MUST be soldered to a ground plane copper pour for proper heat dissipation. Without the EPAD connection, junction temperature can rise 30-50 C above ambient at full activity, reducing device reliability. Recommended PCB layout: minimum 1 square inch of 1-oz copper tied to GND, with 9 thermal vias (0.3 mm drill) under the EPAD to inner ground planes. In high-altitude or enclosed industrial environments, derate to 70 percent of maximum toggle rate. Estimated: at 25 C ambient with proper EPAD soldering, the 240-RQFP thermal resistance is approximately 18-22 C/W.
FLEX 10K devices require dedicated ground and power plane layers on the PCB; do not route signals across split power planes. Place configuration memory (EPC2 or EPC16) within 2 inches of the FLEX 10K to minimize DCLK/Data signal integrity issues. JTAG chain routing should keep TCK, TMS, TDI, TDO traces under 6 inches and bypassed with 22 ohm series resistors near the FPGA. The 240-RQFP package has 0.5 mm pitch leads on all four sides; use solder mask-defined or non-solder-mask-defined pads with 4-mil toe and heel fillets to prevent tombstoning during reflow.
Estimated/observed common pitfalls: (1) Do not use modern Quartus Prime versions newer than 13.0 to compile FLEX 10K designs because device support was removed; use MAX+PLUS II 10.23 or Quartus Prime 13.0 sp1 in legacy mode. (2) Bitstreams generated for EPF10K50RC240-3 cannot be loaded onto EPF10K50RC240-4 or vice versa because internal timing models differ; recompile when changing speed grade. (3) The 'N' suffix variants (e.g. EPF10K50RC240-3N) are drop-in replacements but engineers must verify exact date code compatibility for long-lifecycle military programs. (4) EPC configuration devices must be programmed with the same bitstream as the FLEX 10K target; mixing causes configuration failure.
Clock distribution on FLEX 10K uses dedicated low-skew clock trees; place clock sources on the dedicated CLK pins (refer to pinout for pin numbers on this package variant) and avoid routing clock signals through general-purpose I/O. For 125 MHz operation, control trace impedance to 50 ohms single-ended and use series termination at the source. Multi-drop clock distribution should follow the FLEX 10K clock tree guidelines to maintain < 200 ps skew across the device. Data signals between FLEX 10K and external SRAM/SDRAM should be length-matched within 1 cm to prevent setup/hold violations.
Informations de conformité
EPF10K50RC240-3 is the standard leaded variant (non-RoHS); for RoHS-compliant assemblies use the -3N variant which carries Pb-free terminal finish. AEC-Q100 is not applicable for industrial-grade FPGA logic ICs. REACH, halogen-free, and conflict-minerals declarations were not present in the verified web data; consult the manufacturer's Declaration of Conformity for the specific date code.
