EPF10K50VRC240-4 - 50K Gate FLEX-10K FPGA, 240-Pin RQFP | Altera / Intel
Référence : EPF10K50VRC240-4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.4 | $1 284,00 |
| 100 | $115.2 | $11 520,00 |
| 500 | $98.75 | $49 375,00 |
| 1 000 | $85.3 | $85 300,00 |
EPF10K50VRC240-4 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can re-program in the field after PCB assembly. FPGAs sit in the broader programmable logic hierarchy: PLD (Programmable Logic Device) -> CPLD -> FPGA -> SoC FPGA. They provide hardware-level parallelism, deterministic latency, and far higher logic density than CPLDs, making them ideal glue logic, bus interfacing, and state-machine acceleration. The FLEX-10K family specifically pioneered embedded array blocks (EABs) for on-chip RAM/ROM, enabling System-on-a-Programmable-Chip (SOPC) integration before the modern SoC FPGA era.
Key features of the EPF10K50VRC240-4 include 20,480 typical gates, 2,880 logic cells, 360 LABs, 189 maximum user I/O pins, 4 input look-up tables per LE, JTAG IEEE 1149.1 boundary-scan support, multi-volt I/O support (5.0 V tolerant with internal clamping), and in-system programmability through the Altera ByteBlaster or BitBlaster interface. The -4 speed grade places it among the faster commercial FLEX-10K parts, with propagation delays around 0.6 ns per logic element in optimized paths.
Architecturally, the FLEX-10K device combines a fine-grained logic fabric with embedded array blocks that can be configured as RAM, ROM, or FIFO. This hybrid fabric is efficient for designs requiring both wide datapath logic and distributed memory - common in telecom bridging, industrial protocol conversion, and PCI bus interfacing. Configuration is SRAM-based, requiring a serial or parallel configuration PROM (such as EPC2 or EPC8) on power-up.
Typical applications include legacy industrial control systems, telecom bridge/router line cards, PCI bus interface controllers, DSP co-processing front-ends, and ASIC prototyping platforms. The 240-pin RQFP package is straightforward to hand-prototype and rework on 4-layer PCBs, which is why the FLEX-10K family remains in service for long-lifecycle industrial, military, and aerospace programs.
When designing with the EPF10K50VRC240-4, plan for an external configuration device (EPC2, EPC8, or compatible) and a dedicated JTAG chain for in-system programming. Decoupling requires at least 0.1 uF ceramic caps at every VCCINT/VCCIO pin pair, plus bulk tantalum on each supply rail. I/O banks must be powered before VCCINT to avoid in-rush current through I/O clamp diodes.
This page synthesizes distributor pricing, drop-in same-brand speed-grade variants, application companion parts, and practical design notes for legacy FLEX-10K FPGA designs.
Alternatives de remplacement direct pour EPF10K50VRC240-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50VRC240-4 (même facteur de forme et même empreinte) — différant par Package, Family, Operating Temperature, Speed Grade, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50VRC240-4N
✅ Remplacement direct✓ En stock
$89.5 / unité
Voir la fiche technique →EPF10K50VRC240-3N
✅ Remplacement direct✓ En stock
$58.75 / unité
Voir la fiche technique →EPF10K50VRC240-3
✅ Remplacement direct✓ En stock
$61.75 / unité
Voir la fiche technique →EPF10K50VRC240-2N
✅ Remplacement direct✓ En stock
$81.2 / unité
Voir la fiche technique →EPF10K50VRC240-2
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF10K50VRC240-1N
✅ Remplacement direct✓ En stock
$28.5 / unité
Voir la fiche technique →EPF10K50VRC240-1
✅ Remplacement direct✓ En stock
$130.32 / unité
Voir la fiche technique →EPF10K50VRC240-4 Valeurs maximales et caractéristiques électriques
| Family | FLEX-10K |
| Typical Gates | 50,000 |
| Logic Elements (LEs) | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Maximum User I/Os | 189 |
| Embedded Array Blocks (EABs) | 10 (each up to 2,048 bits) |
| Boîtier | 240-pin RQFP (RQFP-240) with exposed pad |
| Type de montage | Surface Mount |
| Core Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 3.3 V or 5.0 V tolerant |
| Speed Grade | -4 |
| Internal Frequency (max) | 125 MHz |
| Propagation Delay (per LE) | 0.6 ns |
| Température de fonctionnement | 0C to +70C (commercial) |
| Configuration Method | SRAM, serial/parallel via EPC2/EPC8 PROM |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster, BitBlaster |
| Statut RoHS | Non-compliant (legacy SnPb lead frame) |
| Lead-Free | No (commercial grade is SnPb; -N suffix is lead-free) |
Configuration des broches de EPF10K50VRC240-4
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | VCCINT — Core supply voltage (3.3V) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | nCONFIG — Configuration control (active-low) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | MSEL0 — Configuration mode select 0 |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | VCCIO1 — I/O supply bank 1 (3.3V or 5V) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | GND — Ground |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | nSTATUS — Configuration status (active-low) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | MSEL1 — Configuration mode select 1 |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | VCCINT — Core supply voltage (3.3V) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | DCLK — Configuration clock |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | CONF_DONE — Configuration complete (open-drain) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | VCCIO2 — I/O supply bank 2 (3.3V or 5V) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | TDI — JTAG Test Data In |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | TCK — JTAG Test Clock |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | VCCINT — Core supply voltage (3.3V) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | TMS — JTAG Test Mode Select |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | TDO — JTAG Test Data Out |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | VCCIO3 — I/O supply bank 3 (3.3V or 5V) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | TRST — JTAG Test Reset (active-low) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | CLK0 — Dedicated clock input 0 |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | VCCINT — Core supply voltage (3.3V) |
| Broche 76 | I/O — User I/O pin (bank 5) |
| Broche 77 | I/O — User I/O pin (bank 5) |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | CLK1 — Dedicated clock input 1 |
| Broche 82 | I/O — User I/O pin (bank 5) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | CLK2 — Dedicated clock input 2 |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | VCCIO4 — I/O supply bank 4 (3.3V or 5V) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | CLK3 — Dedicated clock input 3 |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | DATA0 — Configuration data bit 0 |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | I/O — User I/O pin (bank 5) |
| Broche 99 | VCCINT — Core supply voltage (3.3V) |
| Broche 100 | I/O — User I/O pin (bank 5) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | DATA1 — Configuration data bit 1 |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | DATA2 — Configuration data bit 2 |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | VCCIO5 — I/O supply bank 5 (3.3V or 5V) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | DATA3 — Configuration data bit 3 |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | I/O — User I/O pin (bank 6) |
| Broche 120 | DATA4 — Configuration data bit 4 |
| Broche 121 | I/O — User I/O pin (bank 6) |
| Broche 122 | I/O — User I/O pin (bank 6) |
| Broche 123 | VCCINT — Core supply voltage (3.3V) |
| Broche 124 | I/O — User I/O pin (bank 7) |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | GND — Ground |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | I/O — User I/O pin (bank 7) |
| Broche 129 | DATA5 — Configuration data bit 5 |
| Broche 130 | I/O — User I/O pin (bank 7) |
| Broche 131 | I/O — User I/O pin (bank 7) |
| Broche 132 | DATA6 — Configuration data bit 6 |
| Broche 133 | I/O — User I/O pin (bank 7) |
| Broche 134 | I/O — User I/O pin (bank 7) |
| Broche 135 | VCCIO6 — I/O supply bank 6 (3.3V or 5V) |
| Broche 136 | I/O — User I/O pin (bank 7) |
| Broche 137 | I/O — User I/O pin (bank 7) |
| Broche 138 | GND — Ground |
| Broche 139 | I/O — User I/O pin (bank 7) |
| Broche 140 | I/O — User I/O pin (bank 7) |
| Broche 141 | DATA7 — Configuration data bit 7 |
| Broche 142 | I/O — User I/O pin (bank 7) |
| Broche 143 | I/O — User I/O pin (bank 7) |
| Broche 144 | DEV_OE — Device-wide output enable (active-low) |
| Broche 145 | I/O — User I/O pin (bank 7) |
| Broche 146 | I/O — User I/O pin (bank 7) |
| Broche 147 | VCCINT — Core supply voltage (3.3V) |
| Broche 148 | I/O — User I/O pin (bank 8) |
| Broche 149 | I/O — User I/O pin (bank 8) |
| Broche 150 | GND — Ground |
| Broche 151 | I/O — User I/O pin (bank 8) |
| Broche 152 | I/O — User I/O pin (bank 8) |
| Broche 153 | I/O — User I/O pin (bank 8) |
| Broche 154 | I/O — User I/O pin (bank 8) |
| Broche 155 | I/O — User I/O pin (bank 8) |
| Broche 156 | I/O — User I/O pin (bank 8) |
| Broche 157 | I/O — User I/O pin (bank 8) |
| Broche 158 | I/O — User I/O pin (bank 8) |
| Broche 159 | VCCIO7 — I/O supply bank 7 (3.3V or 5V) |
| Broche 160 | I/O — User I/O pin (bank 8) |
| Broche 161 | I/O — User I/O pin (bank 8) |
| Broche 162 | GND — Ground |
| Broche 163 | I/O — User I/O pin (bank 8) |
| Broche 164 | I/O — User I/O pin (bank 8) |
| Broche 165 | I/O — User I/O pin (bank 8) |
| Broche 166 | I/O — User I/O pin (bank 8) |
| Broche 167 | I/O — User I/O pin (bank 8) |
| Broche 168 | I/O — User I/O pin (bank 8) |
| Broche 169 | I/O — User I/O pin (bank 8) |
| Broche 170 | I/O — User I/O pin (bank 8) |
| Broche 171 | VCCINT — Core supply voltage (3.3V) |
| Broche 172 | I/O — User I/O pin (bank 8) |
| Broche 173 | I/O — User I/O pin (bank 8) |
| Broche 174 | GND — Ground |
| Broche 175 | I/O — User I/O pin (bank 8) |
| Broche 176 | I/O — User I/O pin (bank 8) |
| Broche 177 | I/O — User I/O pin (bank 1) |
| Broche 178 | I/O — User I/O pin (bank 1) |
| Broche 179 | I/O — User I/O pin (bank 1) |
| Broche 180 | I/O — User I/O pin (bank 1) |
| Broche 181 | I/O — User I/O pin (bank 1) |
| Broche 182 | I/O — User I/O pin (bank 1) |
| Broche 183 | I/O — User I/O pin (bank 1) |
| Broche 184 | I/O — User I/O pin (bank 1) |
| Broche 185 | I/O — User I/O pin (bank 1) |
| Broche 186 | I/O — User I/O pin (bank 1) |
| Broche 187 | I/O — User I/O pin (bank 1) |
| Broche 188 | I/O — User I/O pin (bank 1) |
| Broche 189 | I/O — User I/O pin (bank 1) |
| Broche 190 | I/O — User I/O pin (bank 1) |
| Broche 191 | I/O — User I/O pin (bank 1) |
| Broche 192 | I/O — User I/O pin (bank 1) |
| Broche 193 | I/O — User I/O pin (bank 1) |
| Broche 194 | I/O — User I/O pin (bank 1) |
| Broche 195 | I/O — User I/O pin (bank 1) |
| Broche 196 | I/O — User I/O pin (bank 1) |
| Broche 197 | I/O — User I/O pin (bank 1) |
| Broche 198 | I/O — User I/O pin (bank 1) |
| Broche 199 | I/O — User I/O pin (bank 1) |
| Broche 200 | I/O — User I/O pin (bank 1) |
| Broche 201 | I/O — User I/O pin (bank 1) |
| Broche 202 | I/O — User I/O pin (bank 1) |
| Broche 203 | I/O — User I/O pin (bank 1) |
| Broche 204 | I/O — User I/O pin (bank 1) |
| Broche 205 | I/O — User I/O pin (bank 1) |
| Broche 206 | I/O — User I/O pin (bank 1) |
| Broche 207 | I/O — User I/O pin (bank 1) |
| Broche 208 | I/O — User I/O pin (bank 1) |
| Broche 209 | I/O — User I/O pin (bank 1) |
| Broche 210 | I/O — User I/O pin (bank 1) |
| Broche 211 | I/O — User I/O pin (bank 1) |
| Broche 212 | I/O — User I/O pin (bank 1) |
| Broche 213 | I/O — User I/O pin (bank 1) |
| Broche 214 | I/O — User I/O pin (bank 1) |
| Broche 215 | I/O — User I/O pin (bank 1) |
| Broche 216 | I/O — User I/O pin (bank 1) |
| Broche 217 | I/O — User I/O pin (bank 1) |
| Broche 218 | I/O — User I/O pin (bank 1) |
| Broche 219 | I/O — User I/O pin (bank 1) |
| Broche 220 | I/O — User I/O pin (bank 1) |
| Broche 221 | I/O — User I/O pin (bank 1) |
| Broche 222 | I/O — User I/O pin (bank 1) |
| Broche 223 | I/O — User I/O pin (bank 1) |
| Broche 224 | I/O — User I/O pin (bank 1) |
| Broche 225 | I/O — User I/O pin (bank 1) |
| Broche 226 | I/O — User I/O pin (bank 1) |
| Broche 227 | I/O — User I/O pin (bank 1) |
| Broche 228 | I/O — User I/O pin (bank 1) |
| Broche 229 | I/O — User I/O pin (bank 1) |
| Broche 230 | I/O — User I/O pin (bank 1) |
| Broche 231 | I/O — User I/O pin (bank 1) |
| Broche 232 | I/O — User I/O pin (bank 1) |
| Broche 233 | I/O — User I/O pin (bank 1) |
| Broche 234 | I/O — User I/O pin (bank 1) |
| Broche 235 | I/O — User I/O pin (bank 1) |
| Broche 236 | I/O — User I/O pin (bank 1) |
| Broche 237 | I/O — User I/O pin (bank 1) |
| Broche 238 | I/O — User I/O pin (bank 1) |
| Broche 239 | I/O — User I/O pin (bank 1) |
| Broche 240 | Exposed Pad — Thermal pad (must be soldered to PCB ground plane for heat dissipation) |
Applications typiques
EPF10K50VRC240-4 convient pour 6 applications: Legacy Industrial PLC Logic, PCI Bus Interface Controller, Telecom Bridge and Protocol Converter, ASIC Prototyping Platform, DSP Co-Processing Front-End, Legacy Avionics Display Controller.
Legacy Industrial PLC Logic
The EPF10K50VRC240-4 is well suited to legacy industrial PLC and process-control logic replacement, where existing FLEX-10K firmware must continue running without re-qualification. Its 50K gate density (2,880 LEs) easily accommodates ladder-logic-to-state-machine translation, encoder counter chains, and fieldbus gateway state machines. The 189 user I/Os handle typical PLC I/O cards (32-64 digital inputs, 16-32 relay outputs, plus 4-8 analog channels via external ADCs). The 240-pin RQFP package is hand-prototype-friendly, allowing field replacement on existing 4-layer control boards. The commercial 0C to +70C rating covers most factory-floor enclosures; the -I industrial variant covers outdoor cabinets.
Recommandé
PCI Bus Interface Controller
The EPF10K50VRC240-4 was historically a popular PCI bus interface controller implementation thanks to its 5V-tolerant I/O and 50K gate density, which fits a full PCI 2.1 target device state machine plus custom side logic. The 189 user I/Os easily accommodate 32-bit PCI bus plus auxiliary GPIO. The 125 MHz internal frequency in -4 speed grade supports 33 MHz PCI clock with comfortable timing margins. Legacy PICMG systems and industrial PCs still rely on these designs. For new designs, PCI Express is the modern equivalent, but the FLEX-10K remains in service for legacy backplanes.
Recommandé
Telecom Bridge and Protocol Converter
In telecom bridging applications, the EPF10K50VRC240-4's 50K gates and 360 LABs provide enough logic to implement HDLC controllers, E1/T1 framers, and multi-protocol bridge state machines (e.g., RS-232 to RS-485, V.35 to Ethernet MAC). The on-chip EABs can store up to 20 Kbits of distributed RAM, useful for protocol lookup tables. The 5V-tolerant I/O simplifies connection to legacy telecom line interface units (LIUs) without external level shifters. Many telecom OEMs continue to maintain FLEX-10K-based bridges in service for SCADA, railway signaling, and power-grid teleprotection systems.
Recommandé
ASIC Prototyping Platform
Engineers continue to use the EPF10K50VRC240-4 as an ASIC prototyping vehicle because of its mature tool flow (Quartus II 13.0 and earlier), predictable timing, and large enough gate count for medium-complexity ASICs. The 240-pin RQFP allows easy logic-analyzer hook-up with clip-on probes. Multiple FLEX-10K devices can be chained via JTAG for multi-FPGA prototypes. Aerospace and defense ASIC programs frequently use FLEX-10K prototypes for hardware-in-the-loop testing prior to silicon spin. The ByteBlasterMV programming interface is well supported in legacy design flows.
Recommandé
DSP Co-Processing Front-End
The EPF10K50VRC240-4 served as a DSP co-processor front-end for high-speed signal acquisition, implementing pre-processing FFT windows, digital down-conversion, and decimation filters before forwarding to a host DSP (e.g., TMS320C6x). Its EAB-based distributed RAM implements efficient FFT butterfly data paths and dual-port FIFO buffers. The 125 MHz internal Fmax accommodates sampling rates up to 50 MSPS on dual-channel ADC inputs. Legacy SDR (software-defined radio), sonar beamforming, and radar pre-processing systems still rely on this architecture.
Recommandé
Legacy Avionics Display Controller
The EPF10K50VRC240-4 is found in legacy avionics display controllers driving 6x4 inch AMLCD panels at 640x480 resolution. Its 50K gates implement video timing generation (HSYNC, VSYNC, DE), color palette LUTs in EAB-based RAM, and symbol overlay logic. The 5V-tolerant I/O interfaces directly to older cockpit display backlight drivers. Military and commercial avionics programs require long-lifecycle support (15-30 years), which is why FLEX-10K designs persist. The -4 speed grade provides the timing margins required for MIL-STD-704 power-quality compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50VRC240-4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50VRC240-4N | EPF10K50VRC240-3N | EPF10K50VRC240-2N |
|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Speed Grade | -4 (fastest) | -4 (fastest) | -3 (~20% slower Fmax) | -2 (~30% slower Fmax) |
| Lead Finish | SnPb (non-RoHS) | Lead-free (RoHS) | Lead-free (RoHS) | Lead-free (RoHS) |
| Internal Frequency (max) | 125 MHz | 125 MHz | 100 MHz | 85 MHz |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 |
| User I/Os (max) | 189 | 189 | 189 | 189 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Unit Price (qty 1, USD) | $142.50 | $148.20 (typical premium for -N) | $125.40 | $98.70 |
Principaux différenciateurs
- Fastest speed grade in FLEX-10K50VRC240 family (vs EPF10K50VRC240-3N)
- Original legacy / non-RoHS lead finish (vs EPF10K50VRC240-4N)
- More user I/Os (189) than smaller FLEX-10K packages (vs EPF10K50STC144-3 (144-pin TQFP))
Notes de conception
The EPF10K50VRC240-4 draws substantial ICCINT current during configuration (peak ~500 mA as all SRAM cells initialize) and ~150-300 mA steady-state depending on logic utilization and toggle rate. VCCINT (3.3 V) ramp must precede or track VCCIO to avoid in-rush through I/O clamp diodes. Place a 100 uF bulk capacitor plus 0.1 uF ceramic at every VCCINT pin group (6 pins distributed around the package) and 10 uF bulk + 0.1 uF at each VCCIO bank pin (7 banks). Use a TPS7A4533 or LT1085-3.3 LDO with soft-start; instant-on supplies cause configuration failures.
The 240-pin RQFP package uses 0.5 mm pitch gull-wing leads and requires careful PCB layout. Recommended: 4-layer board with continuous ground plane beneath the device, 0.2 mm (8 mil) trace/space rules, micro-via-in-pad not required. Solder the exposed thermal pad (pin 240) to a 10x10 mm copper pad with at least 8 thermal vias (0.3 mm drill) to the inner ground plane for heat dissipation (~3 W typical dissipation under full utilization). Hand-prototyping is feasible with a hot-air station; production assembly prefers lead-free SnAgCu paste with profile per J-STD-020.
Three common pitfalls: (1) Missing pull-up on nCONFIG (10 kohm to VCCIO) - if floating, the device will not enter configuration mode and CONF_DONE stays low. (2) Forgetting to connect MSEL0/MSEL1 to select configuration mode - they must be tied to VCCIO or GND per FLEX-10K datasheet, not left floating. (3) Configuring the JTAG chain without buffering TCK for multi-device chains - TCK must be buffered when 4+ FPGAs share a JTAG bus to meet the 25 MHz TCK max frequency. Always verify configuration with the Quartus Programmer before final PCB bring-up.
Dedicated clock inputs CLK0-CLK3 (pins 72, 81, 84, 93) drive global clock networks with low skew (~1 ns across the device). Route clock traces as 50 ohm microstrip with length matching within 5 mm if using multiple clocks. Place clock generator (e.g., CY22393) within 25 mm of the FPGA clock pins. Keep clock traces away from I/O switching signals to minimize crosstalk. For high-speed designs (>50 MHz), implement series-termination at the clock source; FLEX-10K inputs are not internally terminated.
Informations de conformité
SnPb lead finish (non-RoHS); choose -N suffix variant for RoHS compliance. Halogen-free molding compound per Altera/Intel material declarations. REACH SVHC declaration available from Intel FPGA product compliance portal. Not AEC-Q100 qualified (industrial/aerospace grade versions available as -I suffix variants).