EPF81188AQC240-2 - FLEX 8000 FPGA, 12K Gates, 240-Pin PQFP | Altera
Référence : EPF81188AQC240-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $39.5 | $395,00 |
| 100 | $33.2 | $3 320,00 |
| 250 | $29.8 | $7 450,00 |
| 500 | $27.1 | $13 550,00 |
EPF81188AQC240-2 Présentation
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user programs after manufacture via a configuration bitstream stored in SRAM, EPROM, or flash. The FLEX 8000 family belongs to the broader class of programmable logic devices (PLDs) and historically bridged CPLDs and early ASICs in the 1990s mid-density market. FPGAs typically sit hierarchically between CPLDs and ASIC/ASSPs, offering higher density than CPLDs and lower NRE than ASICs.
Key features of the EPF81188AQC240-2 include a 5 V core supply with MultiVolt I/O support for 3.3 V or 5.0 V interfaces, 0.42 µm CMOS SRAM process technology, in-circuit reconfigurability (ICR) via Altera EPC1/EPC1064/EPC1213/EPC1441 configuration devices, and a -2 speed grade targeting higher internal performance. The -2 speed grade is the fastest of the FLEX 8000 family at this density.
Technically, the FLEX 8000 architecture uses a row/column LAB structure with FastTrack continuous routing interconnect and a 4-input look-up table (LUT) logic element. The 240-pin PQFP package provides 184 usable user I/Os across four I/O banks, enabling wide parallel bus interfaces. The -2 speed grade improves internal timing margin relative to the -3 and -4 grades.
Typical applications include telecommunications line cards, industrial control boards, mid-density bus bridges, and legacy replacement of discrete TTL/CMOS glue logic. It is also used in educational and prototyping systems where Quartus II (legacy) or MAX+PLUS II design tools support the FLEX 8000 family.
When designing with this device, note the 5 V supply requirement and the need for an external configuration EPROM (EPC1/EPC1441 family) for non-volatile bitstream storage. The 240-pin PQFP footprint requires careful PCB layout due to 0.5 mm pitch and exposed lead-frame thermal considerations.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 8000 family, lifecycle status (NRND/last-time-buy), and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF81188AQC240-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF81188AQC240-2 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Operating Temperature, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF81188AQC240-3
✅ Remplacement direct✓ En stock
$30 / unité
Voir la fiche technique →EPF81188AQC240-4
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →EPF81500AQC240-2
✅ Remplacement direct✓ En stock
$61.4 / unité
Voir la fiche technique →EPF8820AQC240-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF8636AQC240-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF81188AQC240-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Usable Gates | 12,000 |
| Logic Elements / Cells | 1,008 |
| Logic Array Blocks (LABs) | 126 |
| User I/Os | 184 |
| Number of I/Os (alt source) | 148 |
| Package Type | 240-BFQFP / 240-Pin PQFP |
| Nombre de broches | 240 |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| I/O Voltage Support | 3.3 V or 5.0 V (MultiVolt I/O) |
| Speed Grade | -2 |
| Logic Family | CMOS |
| In-Circuit Reconfigurability | Yes (ICR) |
| Configuration Devices | EPC1, EPC1064, EPC1213, EPC1441 |
| Température de fonctionnement | 0°C to +70°C (Commercial) |
| Type de montage | Surface Mount |
Guide de configuration des broches du EPF81188AQC240-2 240-bfqfp / 240-pin pqfp
Configuration des broches du EPF81188AQC240-2 (boîtier 240-bfqfp / 240-pin pqfp). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF81188AQC240-2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF81188AQC240-2 convient pour 6 applications: Telecommunications Line Card Glue Logic, Industrial Control Board Logic Integration, Legacy Bus Bridge and Protocol Converter, Replacement of Discrete TTL/CMOS Glue Logic, Educational FPGA Prototyping Platforms, Avionics and Defense Legacy Sustainment.
Telecommunications Line Card Glue Logic
The EPF81188AQC240-2's 12,000 usable gates and 184 user I/Os make it well-suited for telecommunications line cards requiring mid-density parallel bus interfacing, address decoding, and protocol conversion. In a typical line card, the FLEX 8000 device sits between a network processor and framer/mapper ASICs, implementing custom glue logic that would otherwise require 5-7 discrete TTL/CMOS packages. The MultiVolt I/O support allows direct interfacing with 3.3 V framers and 5 V legacy buses without level shifters. The 240-pin PQFP provides sufficient I/O for 32-bit data buses plus control, status, and timing signals. The -2 speed grade delivers internal performance suitable for 50-80 MHz glue-logic clocking in telecom backplane designs.
Recommandé
Industrial Control Board Logic Integration
In industrial PLC backplanes and motor-control boards, the EPF81188AQC240-2 replaces dozens of 74-series TTL/CMOS logic chips with a single programmable device, simplifying board layout and reducing inventory SKUs. The 184 user I/Os handle multiple encoder inputs, PWM outputs, optocoupler-isolated control lines, and parallel communication buses (parallel ADC/DAC interfaces, ISA-style bus bridges). The 5 V supply is compatible with legacy industrial 5 V backplanes, while MultiVolt I/O permits mixing 3.3 V microcontrollers. The FLEX 8000 architecture's in-circuit reconfigurability enables field firmware updates via the JTAG port, valuable for deployed industrial systems. The 0-70°C commercial temperature range suits factory-floor enclosures with controlled climate.
Recommandé
Legacy Bus Bridge and Protocol Converter
The EPF81188AQC240-2 is well matched to legacy bus bridge applications, such as ISA-to-local bus, VME bus interface, or proprietary backplane protocol conversion, where 12K gates of programmable logic plus 184 I/Os provide ample headroom for state machines and bus arbitration. The FLEX 8000 device implements master/slave state machines, address decoding, wait-state generation, and interrupt handling in a single chip. Compared to designing with discrete PALs and FPGAs from the early 1990s, the EPF81188AQC240-2 integrates logic that previously required multiple devices. The 240-pin PQFP package supports wide parallel buses (32-bit data + 32-bit address) with sufficient remaining I/Os for control signals, DMA handshaking, and status LEDs.
Recommandé
Replacement of Discrete TTL/CMOS Glue Logic
The EPF81188AQC240-2 serves as a single-chip replacement for legacy designs that use 74LS/74HC/74F-series discrete logic gates, decoders, multiplexers, and small PLDs. With 12,000 usable gates and 1,008 logic elements, it can replace 10-20 discrete packages, dramatically reducing PCB area, BOM count, and assembly cost. The 5 V supply directly replaces 5 V TTL, while MultiVolt I/O allows mixed 3.3 V interfacing where needed. Designers port existing schematics into MAX+PLUS II or Quartus II (legacy) HDL, achieving equivalent functionality with documented netlist. The 240-pin PQFP package, while larger than the discrete logic it replaces, occupies less total board area than the equivalent discrete logic footprint.
Recommandé
Educational FPGA Prototyping Platforms
Universities and training labs use the EPF81188AQC240-2 on legacy Altera/Altera development boards (e.g., FLEX 8000-based educational kits) to teach digital design, HDL programming, and FPGA architecture fundamentals. The 12K gate density is sufficient for student projects such as UART implementations, simple CPUs, video controllers, and audio processors, while the 240-pin PQFP exposes enough I/Os for breadboard-friendly daughterboard connections. The MAX+PLUS II and Quartus II (legacy) toolchain is mature and well-documented for educational use. As boards age, replacement EPF81188AQC240-2 units sustain these educational platforms, though newer Cyclone-based boards are recommended for new curricula.
Recommandé
Avionics and Defense Legacy Sustainment
The EPF81188AQC240-2 sustains long-life-cycle avionics, military communications, and defense electronic systems originally designed in the late 1990s and early 2000s. Its rugged ceramic variants are no longer in production, but plastic PQFP versions continue to support line-replaceable units (LRUs) requiring form-fit-function compatibility. The FLEX 8000 architecture, while obsolete for new designs, remains well-characterized for legacy defense qualification. Authorized distributors holding lot-traceable inventory provide the only source for these long-tail applications. When repairing fielded systems, the EPF81188AQC240-2 enables direct board-level replacement without re-qualification of the host system, provided the bitstream is preserved.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF81188AQC240-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF81188AQC240-3 | EPF81188AQC240-4 | EPF81500AQC240-2 | EPF8820AQC240-2 | EPF8636AQC240-2 |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP (BFQFP) | 240-pin PQFP (BFQFP) - same | 240-pin PQFP (BFQFP) - same | 240-pin PQFP (BFQFP) - same | 240-pin PQFP (BFQFP) - same | 240-pin PQFP (BFQFP) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 16,000 (+33%) | 8,000 (-33%) | 6,000 (-50%) |
| Speed Grade | -2 (fastest) | -3 (slower) | -4 (slowest) | -2 (fastest) | -2 (fastest) | -2 (fastest) |
| Supply Voltage | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core (no MultiVolt in 84-pin pkg only) |
Principaux différenciateurs
- Highest logic density at the -2 speed grade within FLEX 8000 family at this package (vs EPF81188AQC240-3)
- Migration path within same package for higher density requirements (vs EPF81500AQC240-2)
- MultiVolt I/O flexibility for mixed-voltage system integration (vs EPF8636AQC240-2)
- Sufficient user I/O for wide parallel bus designs (vs EPF81188AQC240-3)
Notes de conception
The EPF81188AQC240-2 requires a 5 V ±5% core supply with sufficient bulk decoupling (typically 100 µF tantalum + 0.1 µF ceramic per supply pin cluster). Estimated: core current at full toggle activity and 12K gate utilization can reach 200-400 mA. Add 100 µF bulk + 10 µF + 0.1 µF ceramic decoupling at each VCC pin. MultiVolt I/O banks require separate 3.3 V or 5.0 V supply per bank reference, decoupled independently. Inrush during configuration can spike to ~500 mA; size upstream regulators accordingly.
The 240-pin PQFP package has an estimated θJA of approximately 25-35 C/W in still air (PQFP packages are larger and have lower thermal resistance than smaller QFNs). At maximum power dissipation (~1.5 W estimated at 12K gates with high toggle rate), junction temperature rise is roughly 40-50°C above ambient. For sealed enclosures or high-ambient industrial environments, provide airflow or attach a clip-on heatsink to the PQFP body. Thermal shutdown is not a FLEX 8000 feature; design conservatively within thermal limits.
The 240-pin PQFP uses 0.5 mm pitch leads requiring precise PCB footprint and reflow profile. Per Altera PQFP package guidelines, design land pads with 0.27 mm width and 1.27 mm length to ensure reliable solder fillets. Use solder mask-defined (SMD) pads to control pad geometry, especially for prototype runs. Place configuration EPROM (EPC1441 or EPC1) within 50 mm of the FLEX 8000 device to minimize DATA0/DCLK trace length and avoid configuration errors. Add 4-layer PCB with dedicated ground plane directly beneath the device for signal integrity and thermal spreading.
Common pitfalls with EPF81188AQC240-2 designs include: (1) forgetting MultiVolt I/O bank voltage reference configuration - all four I/O banks must have VCCIO pins tied to either 3.3 V or 5.0 V; (2) attempting to use EPC1 with 3.3 V-only systems - EPC1 requires 5 V VCC; (3) leaving JTAG TCK/TMS/TDO/TDI pins floating - they need 1-10 kΩ pull-ups or pull-downs per datasheet; (4) not providing a clean CONF_DONE pull-up to VCC - configuration can hang; (5) mixing -2/-3/-4 speed grades in multi-FPGA designs without verifying timing closure. Always verify configuration with the Altera programming software before depopulation.
Informations de conformité
RoHS/REACH compliance not specified in verified web data - [DATA_NEEDED]. AEC-Q100 not applicable for FLEX 8000 commercial-grade device. For automotive applications, consider Cyclone IV EQ or newer automotive-qualified FPGAs.
