FPDB30PH60 - 600V 30A Bridgeless PFC Smart Power Module | onsemi
Référence : FPDB30PH60 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1 495,00 |
| 500 | $13.2 | $6 600,00 |
| 1 000 | $11.85 | $11 850,00 |
FPDB30PH60 Présentation
A Power Factor Correction (PFC) smart power module is a co-packaged sub-system that combines the power switching devices (IGBTs and diodes), the high-side and low-side gate drivers, fault protection, and often bootstrap diodes for the high-side supply. Bridgeless PFC eliminates the input diode bridge used in conventional boost PFC, which directly reduces conduction losses and improves overall efficiency at higher power levels. This places the FPDB30PH60 in the functional hierarchy of: smart power module -> IPM (Intelligent Power Module) -> power semiconductor -> power management solution.
Key electrical features include a 600 V collector-emitter breakdown voltage, a 30 A continuous IGBT current rating (20 A module rating), an integrated gate drive optimized for low EMI, and on-module protection circuits that include under-voltage lockout (UVLO), over-current protection (OCP), and thermal shutdown interfacing. The 2.5 kV isolation rating supports direct heatsink mounting. The dip-style module with offset leads simplifies PCB layout by separating power leads from signal leads.
Internally, the device uses a bridgeless topology in which the AC line current flows through two IGBT/diode pairs rather than a diode bridge plus a boost switch. The integrated gate drive IC is matched to the IGBT characteristics to minimize switching losses and control dv/dt. The SPMC A case (SPMCA-027) provides a screw-mountable base for direct thermal attachment to a chassis-mounted heatsink.
Typical applications include air conditioner outdoor units (the part was designed especially for this segment), refrigerator compressor drives, fan and pump motor PFC front ends, medical imaging equipment front-end PFC, and industrial SMPS input stages. The bridgeless architecture makes the device particularly attractive when efficiency targets exceed what a conventional boost PFC + bridge rectifier stage can deliver.
When designing with this part, ensure that the heatsink is sized for the worst-case IGBT conduction and switching losses, place a low-ESR electrolytic bulk capacitor on the DC bus, and follow the application guidance for the thermistor interface. Avoid connecting signal ground and power ground at the module - they must meet only at the PCB star ground.
This page synthesizes distributor pricing, drop-in alternative cross-references, and application-specific design notes that are not aggregated in the manufacturer's datasheet, providing engineers with a single-decision-source view of the FPDB30PH60.
Alternatives de remplacement direct pour FPDB30PH60 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
FPDB50PH60
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
FPDB20PH60
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
FPDB30PH60 Valeurs maximales et caractéristiques électriques
| Topologie | Bridgeless PFC |
| Collector-Emitter Voltage (Vces) | 600 V |
| Continuous IGBT Current Rating | 30 A |
| Module Current Rating | 20 A |
| Isolation Voltage | 2.5 kV |
| Configuration | 2 Phase (Bridgeless PFC) |
| Boîtier | 27-PowerDIP Module, Offset Leads (SPMCA-027) |
| Type de montage | Through-Hole, Screw-Mount Heatsink |
| Family | PFC SPM 3 series |
| Integrated Protections | UVLO, Over-Current, Fault Output |
| Gate Drive | Optimized Internal Drive IC |
Configuration des broches de FPDB30PH60
| Broche 1 | VB1 — High-side bootstrap supply, phase 1 |
| Broche 2 | VS1 — High-side floating supply return, phase 1 |
| Broche 3 | P1 — Phase 1 IGBT emitter / half-bridge midpoint |
| Broche 4 | VB2 — High-side bootstrap supply, phase 2 |
| Broche 5 | VS2 — High-side floating supply return, phase 2 |
| Broche 6 | P2 — Phase 2 IGBT emitter / half-bridge midpoint |
| Broche 7 | VCC — 15 V gate-drive logic supply |
| Broche 8 | IN1 — Logic input, phase 1 low-side |
| Broche 9 | IN2 — Logic input, phase 2 low-side |
| Broche 10 | EN1 — Enable / enable-merged signal, channel 1 |
| Broche 11 | EN2 — Enable signal, channel 2 |
| Broche 12 | COM — Logic / signal ground |
| Broche 13 | FLT — Fault output (open-drain) |
| Broche 14 | NTC — Thermistor interface to internal temperature sensor |
| Broche 15 | RTH — Thermistor reference / return |
| Broche 16 | AC1 — AC line 1 input (power pin) |
| Broche 17 | AC2 — AC line 2 / AC neutral input (power pin) |
| Broche 18 | P+ — Positive DC-link (power pin) |
| Broche 19 | P+ — Positive DC-link (power pin, parallel pin) |
| Broche 20 | P+ — Positive DC-link (power pin, parallel pin) |
| Broche 21 | P+ — Positive DC-link (power pin, parallel pin) |
| Broche 22 | P- — Negative DC-link (power pin) |
| Broche 23 | P- — Negative DC-link (power pin, parallel pin) |
| Broche 24 | P- — Negative DC-link (power pin, parallel pin) |
| Broche 25 | P- — Negative DC-link (power pin, parallel pin) |
| Broche 26 | NC — Not connected (per datasheet mechanical drawing) |
| Broche 27 | NC — Not connected (per datasheet mechanical drawing) |
Applications typiques
FPDB30PH60 convient pour 6 applications: Air Conditioner Outdoor Unit PFC, White Goods Compressor Drive PFC Front End, Industrial SMPS PFC Input Stage, Medical Imaging Equipment PFC, Pump and Fan Variable-Frequency Drive, Telecom Rectifier PFC Stage.
Air Conditioner Outdoor Unit PFC
The FPDB30PH60 was specifically designed by onsemi for air conditioner PFC front ends, and its 600 V Vces / 30 A IGBT rating is sized for 1.5 to 3 kW outdoor-unit inverter PFC stages fed from universal-input mains. The bridgeless topology eliminates the input diode bridge, reducing conduction losses by typically 0.5-1.0% at full load compared to a conventional boost + bridge PFC stage. The integrated UVLO and OCP shorten fault-response time, which matters in compressor-load inrush events. Mount the SPMC A-027 package on a chassis heatsink sized for roughly 40 W of PFC dissipation at 2.5 kW continuous load, and place a 1 uF X2-rated filter capacitor at the module AC inputs to suppress switching noise.
Recommandé
White Goods Compressor Drive PFC Front End
Refrigerator and washing-machine variable-speed compressors require compact, efficient PFC stages that fit alongside the compressor inverter. The FPDB30PH60's SPMC A-027 screw-mount package integrates the power stage onto the same chassis as the compressor, while 2.5 kV isolation ensures regulatory compliance for appliances. The 20 A module rating delivers approximately 2.6 kW of usable DC-link power at 390 V - adequate for 1-2 HP variable-speed compressor drives. Bridgeless operation reduces rectifier losses that would otherwise show up as waste heat inside an enclosed appliance cabinet. Pair with a low-leakage common-mode choke and an X-cap Y-cap EMI network on the AC input to satisfy EN 55011 Class B.
Recommandé
Industrial SMPS PFC Input Stage
Three-phase and high-power single-phase industrial SMPS that need a PFC stage above 1.5 kW benefit from the FPDB30PH60's integrated protections and short fault-clearing time. The bridgeless topology delivers 96-98% typical efficiency at 2 kW output, reducing heatsink cost relative to discrete designs. The 600 V Vces gives substantial margin above 385 V DC link in 264 V AC universal-input designs. The SPMC A-027 module mounts directly to a chassis sidewall or forced-air heatsink, simplifying mechanical integration in 1U and 2U SMPS form factors. Apply a small NTC thermistor at the module base to back off switching frequency if overtemperature is detected.
Recommandé
Medical Imaging Equipment PFC
CT scanners, MRI chillers, and ultrasound power supplies require robust PFC front ends with predictable behavior under fault. The FPDB30PH60's integrated OCP provides hardware-level current limit that complements the PFC controller's software loop, satisfying IEC 60601-1 risk-management requirements for fault-tolerant power. The 2.5 kV isolation rating gives the creepage and clearance margin medical equipment typically demands across the AC-DC barrier. Bridgeless topology minimizes patient-applied leakage currents that EMI filter capacitors would otherwise provide a path for. The 20 A module rating comfortably supports 1.5-2.5 kW input stages commonly found in imaging carts and stationary imaging power cabinets.
Recommandé
Pump and Fan Variable-Frequency Drive
Variable-frequency drives for HVAC pumps and fans require a compact PFC front end that handles wide load swings from idle to full flow. The FPDB30PH60's 30 A IGBT current and integrated gate drive allow the PFC stage to maintain high power factor from 20% to 100% load, satisfying harmonic standards such as IEC 61000-3-2 Class A. The SPMC A-027 module drops into the same mechanical envelope as the inverter IGBT module, simplifying the BOM and the mechanical assembly. Bridgeless operation at light load keeps efficiency high in pump applications that spend significant time in standby. Use a microcontroller-based fan controller to dynamically reduce PFC switching frequency at low demand.
Recommandé
Telecom Rectifier PFC Stage
48 V telecom rectifier modules in the 2-3 kW range benefit from bridgeless PFC for incremental efficiency at every load point. The FPDB30PH60's 20 A module continuous rating targets 2 kW front-end stages commonly found in -48 V rectifier shelves. The integrated gate drive minimizes EMI that could couple into adjacent rectifier modules in densely packed 1U shelves. UVLO and OCP ensure graceful response to AC brownouts and short-circuit events on the distribution bus. Mount the SPMC A-027 module on the chassis sidewall adjacent to the rectifier output stage to minimize DC-link loop inductance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour FPDB30PH60 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | FPDB50PH60 | FPDB20PH60 |
|---|---|---|---|
| Brand | onsemi | onsemi | onsemi |
| Topology | Bridgeless PFC | Bridgeless PFC | Bridgeless PFC |
| Package | 27-PowerDIP Offset Leads (SPMCA-027) | 27-PowerDIP Offset Leads (SPMCA-027) - same | 27-PowerDIP Offset Leads (SPMCA-027) - same |
| Collector-Emitter Voltage (Vces) | 600 V | 600 V | 600 V |
| IGBT Continuous Current Rating | 30 A | 50 A (+67%) | 20 A (-33%) |
| Isolation Voltage | 2.5 kV | 2.5 kV | 2.5 kV |
| Integrated UVLO | Yes | Yes | Yes |
| Integrated OCP | Yes | Yes | Yes |
Principaux différenciateurs
- Bridgeless PFC topology integrated in single module (vs Discrete IGBT + boost + diode-bridge design)
- Higher current rating in the same SPMC A-027 footprint (vs FPDB20PH60)
- Lower BOM cost per ampere compared to higher-current sibling (vs FPDB50PH60)
Notes de conception
Estimated: at a typical 2 kW PFC output and bridgeless conduction loss of approximately 30-40 W plus 10-15 W of switching loss, the SPMC A-027 module requires a heatsink rated for a thermal resistance below 1.0 C/W to maintain case temperature below 90 C in 40 C ambient. Verify with a thermal probe after bench characterization. Apply thermal interface material (TIM) at 50-100 um thickness and torque the screw to the manufacturer-specified value (typically 0.5-0.8 N.m) to ensure consistent thermal contact. For natural-convection cooling at 2 kW the heatsink will likely require 200+ cm of fin length.
The FPDB30PH60 logic ground (pin 12, COM) and the power ground (DC-link negative, pins 22-25) must be tied only at the PCB star ground. Running logic return currents through the power ground can inject switching noise into the gate-drive signals and cause nuisance OCP trips. Place the star-ground connection within 5 cm of the negative DC-link bulk capacitor. Also, the NTC pin requires a specific thermistor interface per the datasheet - do not leave it floating or drive it with an arbitrary voltage source.
Keep the DC-link bulk capacitor loop (module P+ / P- pins to bulk cap) under 20 nH of loop inductance to limit voltage overshoot during IGBT turn-off. Use a multilayer PCB with at least 2 oz copper on inner layers for P+ and P- planes, or place the bulk capacitor within 15 mm of the module DC-link pins. The bootstrap diodes for VB1 / VB2 (pins 1 and 4) require a low-ESR ceramic bypass of 1 uF minimum, placed within 5 mm of each pin.
Keep the AC input traces (pins 16-17) isolated from signal traces (pins 1-15) by at least 4 mm creepage and clearance. Use slotted PCB cutouts where creepage requirements exceed 4 mm. The fault output (pin 13, FLT) should be routed away from the AC inputs and pulled up to the logic VCC via 10 kohm; do not pull FLT directly to the DC-link voltage.
Informations de conformité
Compliance status not extractable from verified web data - refer to the onsemi product page or PCN documents for authoritative RoHS / REACH / lead-free status. AEC-Q100 is not applicable as this is a power module, not an automotive IC.
