ISO1640BDR - Hot-Swappable Bidirectional I2C Isolator | Texas Instruments
Référence : ISO1640BDR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.65 | $36,50 |
| 100 | $2.85 | $285,00 |
| 500 | $2.4 | $1 200,00 |
| 1 000 | $2.05 | $2 050,00 |
ISO1640BDR Présentation
An I2C digital isolator is a galvanic isolation device that allows two I2C buses to communicate across an isolation barrier while protecting low-voltage circuitry from high-voltage transients, ground potential differences, and noise. The hypernym hierarchy for this category is: I2C isolator -> digital isolator -> isolator -> interface IC -> integrated circuit -> semiconductor. Digital isolators replace legacy optocouplers in I2C applications by using CMOS-based capacitive or transformer coupling, achieving higher data rates, lower power, and better CMTI.
Key features of the ISO1640BDR include bidirectional open-drain channels that pass SDA and SCL across the isolation barrier, hot-swap capability that tolerates plugging into a live backplane without latch-up, robust EMC that survives IEC 61000-4-2/4-4/4-5 system-level tests, integrated 3.0 mA current-limited pull-ups on each side for hot-swap control, and an operating temperature range of -40 C to +125 C. The device consumes roughly 8 mA per channel at 1 MHz and supports I2C data rates up to 1.7 Mbps (fast-mode plus).
Typical applications include isolated I2C communication between a microcontroller and a high-side sensor or power-converter telemetry interface, isolated GPIO expansion over I2C, isolated EEPROM programming, isolated battery-management IC (BMS) comms in 48 V and 400 V systems, and isolated LED-display drivers. Industrial field-bus adapters, isolated PoE controllers, and isolated PMBus interfaces are also common deployments where 3000 Vrms isolation is sufficient.
When designing with the ISO1640BDR, place 0.1 uF bypass capacitors on both VCC1 and VCC2 within 2 mm of the IC pins, and follow IEC 60747-17 creepage/clearance guidance for the chosen working voltage. The 8-D package has 4 mm of creepage across the barrier, which limits the maximum working voltage to approximately 400 Vrms for reinforced isolation per IEC 60747-17.
This page synthesizes distributor pricing from LCSC and DigiKey, same-brand drop-in alternatives within the ISO164x family, and practical EMC and hot-swap design guidance not found in the manufacturer datasheet alone. Pinout, comparison, and design notes are derived from TI ISO1640 datasheet ISO1640 family literature.
Alternatives de remplacement direct pour ISO1640BDR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ISO1640BDR (même facteur de forme et même empreinte) — différant par Package, Number of Channels, RoHS Status, Function, Common-Mode Transient Immunity (CMTI).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ISO1640D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ISO1640BDRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ISO1641DR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ADUM1251ARZ
✅ Remplacement direct✓ En stock
$4.23 / unité
Voir la fiche technique →MAX14828AWA+T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ISO1640BDR Spécifications
| Fonction | Bidirectional I2C Digital Isolator |
| Isolation Rating (UL 1577) | 3000 Vrms (8-D package) |
| Number of Channels | 2 (bidirectional SDA + SCL) |
| CMTI | 50 kV/us (minimum) |
| Débit de données | 1.7 Mbps (max, Fast-Mode Plus I2C) |
| Hot-Swap Support | Yes (integrated current-limited pull-ups) |
| Input Voltage (each side) | 2.25 V to 5.5 V |
| Courant de repos | 8 mA per channel (typ, 1 MHz) |
| Température de fonctionnement | -40 C to +125 C |
| Boîtier | 8-SOIC (D) 0.154 inch / 3.90 mm width |
| Pins | 8 |
| Type de montage | Surface Mount |
| Niveau MSL | 2 / 260 C / 1 year (per PartGenie) |
| Statut RoHS | Compliant (RoHS & Green per PartGenie) |
| Family | ISO1640 / ISO1641 / ISO1642 / ISO1643 / ISO1644 |
Configuration des broches de ISO1640BDR
| Broche 1 | VCC1 — Side-1 supply voltage (2.25 V to 5.5 V) |
| Broche 2 | SDA1 — Side-1 bidirectional serial data line |
| Broche 3 | SCL1 — Side-1 bidirectional serial clock line |
| Broche 4 | GND1 — Side-1 ground reference |
| Broche 5 | GND2 — Side-2 ground reference |
| Broche 6 | SCL2 — Side-2 bidirectional serial clock line |
| Broche 7 | SDA2 — Side-2 bidirectional serial data line |
| Broche 8 | VCC2 — Side-2 supply voltage (2.25 V to 5.5 V) |
Applications typiques
ISO1640BDR convient pour 6 applications: Isolated BMS (Battery Management System) Telemetry, Isolated I2C Sensor Interface (Industrial Field Bus), Isolated Power Converter PMBus Interface, Isolated EEPROM Programming and Security, Isolated LED Driver / Display Interface, Isolated PoE / Telecom Interface.
Isolated BMS (Battery Management System) Telemetry
The ISO1640BDR is widely used to isolate the SMBus/I2C interface between a low-voltage MCU and a high-voltage battery monitor IC such as the TI BQ76930 or BQ76940 in 48 V mild-hybrid, e-bike, and telecom battery stacks. Its 3000 Vrms isolation (UL 1577) and 50 kV/us CMTI tolerate the high dV/dt transients produced by the cell-balancing MOSFETs and the high-side sense-amp charge pumps, while its bidirectional SDA/SCL lines pass clock-stretch events from the monitor back to the host. Designers place the ISO1640BDR across the high-voltage isolation barrier with 0.1 uF bypass caps on both VCC1 and VCC2, giving a low-power, hot-swappable interface for fuel-gauge and SOC telemetry without requiring a dedicated digital isolator + discrete level shifter.
Recommandé
Isolated I2C Sensor Interface (Industrial Field Bus)
In 4-20 mA loop-powered transmitters, PLC analog front-ends, and isolated sensor hubs, the ISO1640BDR provides the galvanic isolation for SDA and SCL between a host MCU and downstream I2C sensors (temperature, pressure, humidity). The 3000 Vrms isolation is sufficient for IEC 61131-2 industrial working voltages, and the 1.7 Mbps data rate supports Fast-Mode Plus communication with sensors such as the HDC1080 humidity sensor or TMP117 temperature sensor. Its hot-swap capability allows the sensor board to be replaced in a live backplane without disrupting the bus, while the integrated 3 mA current-limited pull-ups prevent inrush damage during insertion.
Recommandé
Isolated Power Converter PMBus Interface
Digital point-of-load (POL) converters, isolated DC-DC bricks, and telecom rectifier modules expose a PMBus (I2C-compatible) interface for telemetry, fault reporting, and output-voltage margin testing. The ISO1640BDR bridges the PMBus signals between the host and the converter's secondary-side controller, surviving the switching-noise environment of a 1-2 MHz buck or forward converter with its 50 kV/us CMTI margin. The bidirectional channels carry both the PMBus clock (with clock-stretch from the converter) and data, eliminating the need for a separate isolated GPIO for the ALERT# signal.
Recommandé
Isolated EEPROM Programming and Security
Many factory-automation and medical devices store calibration constants, MAC addresses, or cryptographic keys in an I2C EEPROM (24C02, AT24C256) on the high-voltage side of an isolation barrier. The ISO1640BDR isolates the EEPROM write/read interface so that firmware updates and factory provisioning can occur safely from the host MCU without exposing the low-voltage side to high-voltage faults. The 1.7 Mbps data rate is well above the 400 kHz Fast-Mode limit of most EEPROMs, leaving ample margin for bus-capacitance-related rise-time penalties across the barrier.
Recommandé
Isolated LED Driver / Display Interface
LED matrix drivers, RGB controllers, and large-format LCD bias supplies are often referenced to a high-side return that must remain isolated from the host logic. The ISO1640BDR carries the I2C control signals across this barrier, supporting hot-swap of the LED-driver daughter-card during servicing without rebooting the host. The robust EMC margin (IEC 61000-4-2 ESD and IEC 61000-4-4 EFT-tested per TI) keeps the interface stable in electrically noisy LED-PWM environments.
Recommandé
Isolated PoE / Telecom Interface
Power-over-Ethernet powered devices, IEEE 802.3at PD controllers, and telecom line cards need galvanic isolation on the I2C status interface between the PoE controller and the host CPU. The ISO1640BDR provides the 3000 Vrms barrier while fitting the compact 8-SOIC footprint typical of PoE front-end designs. Its low 8 mA per-channel quiescent current keeps the always-on bias budget manageable, and the integrated hot-swap pull-ups simplify compliance with IEEE 802.3 isolation impedance testing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ISO1640BDR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ISO1640D | ISO1640BDRG4 | ADuM1251ARZ | MAX14828AWA+T |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices | Maxim Integrated |
| Package | SOIC-8 (D) 3.90 mm | SOIC-8 (D) 3.90 mm - same | SOIC-8 (D) 3.90 mm - same | SOIC-8 - same footprint, different pinout | SOIC-8 (W) - same, verify pinout |
| Isolation Voltage (UL 1577) | 3000 Vrms | 3000 Vrms | 3000 Vrms | 2500 Vrms | 2500 Vrms |
| CMTI | 50 kV/us (min) | 50 kV/us (min) | 50 kV/us (min) | 25 kV/us (min) | 50 kV/us (min) |
| Data Rate | 1.7 Mbps | 1.7 Mbps | 1.7 Mbps | 1 Mbps | 1 Mbps |
| Hot-Swap Support | Yes (3 mA pull-up current-limit) | Yes (3 mA) | Yes (3 mA) | No (external pull-ups required) | Yes |
| Quiescent Current per Channel | 8 mA @ 1 MHz | 8 mA @ 1 MHz | 8 mA @ 1 MHz | 2.5 mA @ 1 MHz | 4 mA @ 1 MHz |
| Automotive Grade | No | No | No | No | No |
Principaux différenciateurs
- 3000 Vrms UL 1577 isolation in compact 8-SOIC (vs ADuM1251ARZ)
- Highest data rate in SOIC-8 I2C isolator class (vs ADuM1251ARZ / MAX14828AWA+T)
- Integrated hot-swap current-limited pull-ups (vs ADuM1251ARZ)
Notes de conception
Estimated: place 0.1 uF X7R bypass capacitors on VCC1 (pin 1) and VCC2 (pin 8) within 2 mm of the IC pins. The 8-SOIC (D) package has approximately 4 mm of creepage across the barrier; for IEC 60747-17 reinforced isolation the maximum working voltage is approximately 400 Vrms. Maintain a 4 mm wide slot free of copper, traces, and vias directly under the package to preserve the isolation barrier. Avoid routing any signal or ground trace under the package body between side-1 and side-2 pins.
Do not confuse the 8-D SOIC (ISO1640BDR) with the 16-DW SOIC-W (ISO1640DWR). They share the same datasheet family but the 16-DW package provides 5000 Vrms isolation with extra GPIO pins. Pinout and footprint are NOT compatible - PCB rework is required to migrate. Also, the integrated 3 mA pull-up current-limit is shared between hot-swap transients and DC pull-up current; for systems with multiple downstream slaves, ensure that sum of sink currents does not exceed the 3 mA budget during steady-state ACK pulses.
Although the ISO1640BDR is rated for IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), and IEC 61000-4-5 (surge) at the system level per TI's ISO164x datasheet, additional PCB-level protection (TVS arrays on the bus pins, common-mode chokes on VCC1/VCC2) is recommended when the isolator is exposed to cable discharge or field-cable EFT events. Keep I2C traces short and route over a continuous ground plane on both sides of the barrier to maximize CMTI margin in motor-drive and IGBT-bridge applications.
Informations de conformité
RoHS & Green per PartGenie listing. MSL Level-2-260C-1 YEAR. Not AEC-Q100 qualified; AEC-Q100 versions are available as ISO1640BDRQ1 - not listed on this MPN.
