KMPC8540VT667LB - PowerPC e500 MPU 667MHz 783-FCBGA | NXP
Référence : KMPC8540VT667LB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $165.25 | $165,25 |
| 10 | $156.5 | $1 565,00 |
| 100 | $142 | $14 200,00 |
| 500 | $128.75 | $64 375,00 |
| 1 000 | $115 | $115 000,00 |
KMPC8540VT667LB Présentation
Background: A microprocessor (MPU) is an integrated circuit that contains a full central processing unit on a single die, often paired with integrated memory controllers, peripheral interfaces, and accelerator blocks. The MPC85xx family belongs to the PowerQUICC III hierarchy - high-performance communications processors built on Power Architecture technology, positioned between general-purpose CPUs and application-specific network processors in the broader embedded system taxonomy.
Key features include a 32-bit PowerPC e500 core with Book E instruction set support, integrated DDR memory controller, PCI Express and RapidIO fabric interfaces, four GigaBit Ethernet MACs, and an enhanced local bus controller. The device also integrates security acceleration, DMA engines, and dual I2C, SPI, and DUART interfaces, consolidating what previously required multiple companion chips into a single BGA package.
The architecture employs a superscalar e500 core backed by L1 instruction and data caches (32 KB each) and a unified L2 cache, delivering deterministic throughput for packet-processing workloads. Hardware-assisted queue management, table lookup acceleration, and CRC engines offload work that would otherwise consume CPU cycles in software, enabling the 667 MHz device to sustain multi-Gbps data plane performance.
Typical applications include multi-service routers, Layer 2/3 enterprise switches, network attached storage (NAS) controllers, line cards for base stations, and industrial control gateways. The combination of integrated memory controller and high-speed serial interfaces makes the MPC8540 well suited to designs where board real estate and bill-of-materials count are critical.
When designing with this device, allocate at least four PCB layers for the 783-ball FCBGA breakout and follow NXP's reference design for power sequencing - the 1.2 V core rail must ramp before the I/O rails to avoid latch-up. Use controlled-impedance routing for the DDR2 memory channels and observe the strict length-matching tolerances documented in the hardware specifications.
This page synthesizes current distributor pricing, validated drop-in MPC85xx family alternatives, and engineering-graded design notes not aggregated in any single distributor page.
Alternatives de remplacement direct pour KMPC8540VT667LB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec KMPC8540VT667LB (même facteur de forme et même empreinte) — différant par Data Bus Width, Operating Temperature, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
KMPC8540VT833LB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMPC8540VT667LC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8555EVTAPF
✅ Remplacement direct✓ En stock
$218.75 / unité
Voir la fiche technique →KMPC8540VT667LD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8544EVTALQ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMPC8540VT667LB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC85xx PowerQUICC III |
| Processor Type | PowerPC e500 MPU |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Maximum Clock Speed | 667 MHz |
| Core Voltage | 1.2 V |
| Boîtier / Format | 783-FCPBGA (29 mm x 29 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +70C (commercial) |
| Instruction Set | PowerPC Book E |
| L1 Cache | 32 KB instruction + 32 KB data |
| Integrated Interfaces | DDR memory controller, PCI Express, RapidIO, 4x GbE, I2C, SPI, DUART, Enhanced Local Bus |
| Packaging | Tray |
| Lead Free / RoHS | Lead Free, RoHS status per NXP product page |
Guide de configuration des broches du KMPC8540VT667LB 783-fcpbga (29 mm x 29 mm)
Configuration des broches du KMPC8540VT667LB (boîtier 783-fcpbga (29 mm x 29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour KMPC8540VT667LB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
KMPC8540VT667LB convient pour 7 applications: Multi-Service Routers and Edge Gateways, Enterprise Layer 2/3 Switch Control Plane, Network Attached Storage (NAS) Controllers, Industrial Control and Automation Gateways, Wireless Base Station Line Cards, Telecom and Datacenter Edge Appliances, Print and Imaging Controller Boards.
Multi-Service Routers and Edge Gateways
The KMPC8540VT667LB's integrated quad Gigabit Ethernet MACs and hardware queue management make it well suited for multi-service router and edge gateway designs. Its DDR memory controller feeds line-rate packet buffers, while the four GbE ports handle WAN/LAN fan-out without external switches. The 667 MHz e500 core sustains deep packet inspection at typical edge rates (1-5 Gbps aggregate), making it a workhorse for SMB router and SD-WAN edge appliances.
Recommandé
Enterprise Layer 2/3 Switch Control Plane
Control-plane processor duties in enterprise switches map cleanly to the KMPC8540VT667LB's PCI Express and RapidIO interfaces, which link to external PHY and switch-fabric ASICs. The 1.2 V low core voltage keeps the part within typical switch chassis thermal envelopes, while the integrated I2C, SPI, and DUART handle management peripherals. Using the 783-FCPBGA, designers can dedicate the MPC8540 to management-plane duties while line-card ASICs handle data-plane switching.
Recommandé
Network Attached Storage (NAS) Controllers
NAS appliances benefit from the KMPC8540VT667LB's combination of GbE ports for network attachment and the Enhanced Local Bus for direct NAND/NOR flash and SATA-attach storage controllers. The 32-bit e500 with 32 KB L1 caches handles file-system metadata operations efficiently, while the DMA engines accelerate block transfers between storage and network. This integration typically eliminates a separate storage controller chip in four-drive NAS designs.
Recommandé
Industrial Control and Automation Gateways
Industrial gateways leverage the KMPC8540VT667LB's deterministic interrupt response from the PowerPC Book E architecture to bridge Modbus, PROFINET, and EtherCAT fieldbuses to Ethernet backbones. The integrated serial interfaces (I2C, SPI, DUART) connect directly to industrial sensors and actuators, while the GbE ports aggregate traffic onto plant networks. Operating from 0C to +70C, the part handles commercial-industrial control cabinet environments without derating.
Recommandé
Wireless Base Station Line Cards
Base station line cards use the KMPC8540VT667LB's RapidIO links for chip-to-chip communication between baseband ASICs and the control-plane processor, while maintaining timing references through its hardware timer blocks. The 667 MHz e500 runs PHY calibration and link-adaptation algorithms in real time, offloading the main baseband DSP. At 1.2 V core voltage, the part meets the power budgets of distributed radio units in macro-cell installations.
Recommandé
Telecom and Datacenter Edge Appliances
Datacenter edge appliances such as load balancers and security appliances benefit from the KMPC8540VT667LB's PCI Express and RapidIO fabrics to attach specialized co-processors for cryptography and deep packet inspection. The 32 KB L1 caches accelerate per-flow state lookups while the integrated DMA engines move bulk packet payloads without CPU intervention. Combined with its quad GbE ports, the MPC8540 can fan out traffic to multiple uplink paths in a 1U rack appliance form factor.
Recommandé
Print and Imaging Controller Boards
High-end multifunction printer and production-print controller boards use the KMPC8540VT667LB to coordinate imaging pipelines between scanner engines, RIP processors, and print-head drivers. The Enhanced Local Bus connects to high-speed image buffers, while the GbE ports handle network print-job ingestion and remote management. The deterministic PowerPC core produces consistent page-render timing required for industrial print quality assurance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour KMPC8540VT667LB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | KMPC8540VT833LB | KMPC8540VT667LC | MPC8555EVTAPF | MPC8544EVTALQ |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Series / Family | MPC85xx PowerQUICC III | MPC85xx PowerQUICC III (same) | MPC85xx PowerQUICC III (same) | MPC85xx PowerQUICC III (extended) | MPC85xx successor family |
| Integrated GbE | 4x Gigabit Ethernet | 4x Gigabit Ethernet (same) | 4x Gigabit Ethernet (same) | 4x Gigabit Ethernet + crypto | Updated Ethernet block |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Crypto Acceleration | No | No | No | Yes - security engine | Optional variant |
| Temperature Grade | Commercial (0C to +70C) | Commercial | Industrial variant | Commercial | Commercial |
Principaux différenciateurs
- Speed upgrade in identical package (vs KMPC8540VT833LB)
- Cryptographic acceleration add-on (vs MPC8555EVTAPF)
- Extended temperature variant available (vs KMPC8540VT667LC)
Notes de conception
Estimated: The 783-FCPBGA package has theta_JA typically in the 12-18 C/W range for a properly designed 4-layer board with thermal vias under the BGA. At 667 MHz and 1.2 V core, power dissipation is approximately 5-7 W depending on workload, requiring either a heat spreader or significant copper thermal relief. Designers should follow NXP's reference thermal design and verify junction temperature with the on-die thermal diode in production characterization.
Power sequencing for KMPC8540VT667LB requires the 1.2 V core rail to ramp before the I/O voltage rails per NXP's hardware design checklist. A sequencer IC such as the MAX16046 or equivalent must control enable ordering to prevent latch-up and bus contention. Bulk decoupling of at least 47 uF ceramic plus 220 uF bulk capacitance is recommended near the BGA, with high-frequency 0.1 uF and 1 nF capacitors distributed across adjacent power balls.
The 783-ball flip-chip BGA requires 4-8 layer PCB stackup with controlled-impedance routing for the DDR2 memory channels and high-speed serial interfaces. Microvia-in-pad technology is recommended to escape the dense ball grid, and length matching of DDR signals to within 25 mil tolerance is mandatory for reliable memory operation. Follow NXP's reference PCB layout in the MPC8540 hardware design guide for ball breakout, via placement, and ground plane stitching.
Do not omit the JTAG TAP pins or the system reset configuration latch signals - they are required for bring-up and field firmware updates. Do not route differential pairs (PCIe, RapidIO, GbE) without impedance matching and skew control. Do not exceed the absolute maximum ratings for I/O voltage, including the 3.3 V tolerant I/O cells, and ensure the DDR reference voltage (VREF) tracks within 50 mV of VDDQ/2 across all operating conditions.
Informations de conformité
Lead-free per NXP product brief; RoHS and REACH compliance noted in distributor parametric data as of 2026-10-16. AEC-Q100 not applicable (non-automotive part).