LCMXO2-4000HC-5BG332I - MachXO2 4320 LUT FPGA | Lattice
Référence : LCMXO2-4000HC-5BG332I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.65 | $42,65 |
| 10 | $38.39 | $383,90 |
| 100 | $34.12 | $3 412,00 |
| 250 | $31.85 | $7 962,50 |
| 500 | $28.94 | $14 470,00 |
LCMXO2-4000HC-5BG332I Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (LUTs), programmable interconnect, and I/O cells that can be re-programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), alongside CPLDs. They are widely used for glue logic, bus bridging, sensor aggregation, and control-plane functions, complementing microprocessors and microcontrollers in modern embedded systems. The MachXO2 family specifically targets low-power, high-volume applications such as I/O expansion, configuration management, and power-sequencing where traditional CPLDs or discrete logic are insufficient but a large FPGA is overkill.
Key features of the LCMXO2-4000HC-5BG332I include 4320 LUT4s, up to 240 Kbits of sysMEM embedded block RAM, dedicated FIFO control logic per device, programmable low-swing differential I/Os, and a standby power figure as low as 22 µW. The device integrates a hardened I2C, SPI, and UART controller block for system management, supports 1.0V, 1.2V, 1.8V, 2.5V, and 3.3V I/O standards, and provides TransFR (field reconfiguration) and dual-boot image capability for in-system updates without external flash.
Architecturally, the MachXO2 HC (High Capacity) variant sits between the ultra-low-power ZE series and the high-performance HE series. It shares the same LUT fabric, sysMEM blocks, and hardened peripherals, but is optimized for higher logic utilization at moderate power. The 65nm process node enables both the low static leakage and the integration of large amounts of SRAM, while the dedicated PLL block supports up to four clock outputs with frequency synthesis and phase shifting.
Typical applications include LED display control boards, industrial sensor hubs, camera image-pipeline pre-processing, PCIe/USB endpoint glue logic, and consumer device I/O expansion. The wide I/O count (274) and generous block RAM make it particularly well suited to applications requiring many parallel interfaces plus moderate on-chip buffering. The wide operating temperature range and on-chip flash configuration memory further support automotive, industrial, and white-goods designs.
When designing with the LCMXO2-4000HC-5BG332I, plan JTAG and SPI programming access early so that dual-boot and TransFR flows remain available post-production. The 332-ball CABGA package demands careful PCB fan-out and via-in-pad design; thermal performance is excellent thanks to the low standby power, but engineers should still provide a continuous ground plane beneath the BGA to control supply-impedance and EMI.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the LCMXO2-4000HC-5BG332I that go beyond the manufacturer datasheet alone, helping engineers select and qualify this part with confidence.
Alternatives de remplacement direct pour LCMXO2-4000HC-5BG332I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO2-4000HC-4BG332I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HC-6BG332I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HC-6BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HC-4BG332C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HE-5BG332I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3D-9400HC-2BG332I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HC-5BG332I Valeurs maximales et caractéristiques électriques
| Family | MachXO2 |
| Series | LCMXO2-4000 (HC - High Capacity) |
| Logic Elements / LUTs | 4320 LUT4 |
| Number of Macrocells | 2160 |
| User I/Os | 274 |
| Embedded Block RAM (sysMEM) | 92 Kbits (94208 bits) |
| Distributed SRAM | 32 Kbits (max 256 Kbits per family) |
| Maximum Operating Frequency | 133 MHz |
| On-chip User Flash | 256 Kbits (configuration + user) |
| Number of PLLs | 2 (with up to 4 outputs) |
| Hardened Peripherals | I2C, SPI, UART controllers |
| Supply Voltage (Core) | 2.5 V and 3.3 V |
| I/O Standards Supported | LVCMOS 1.0/1.2/1.5/1.8/2.5/3.3 V, LVDS, LVTTL |
| Standby Power | 22 µW (typical) |
| Process Technology | 65 nm low-power CMOS |
| Boîtier | 332-ball CABGA (BG332) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Programming Type | In-System Programmable (Flash) |
| Type de montage | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
Guide de configuration des broches du LCMXO2-4000HC-5BG332I 332-ball cabga (bg332)
Configuration des broches du LCMXO2-4000HC-5BG332I (boîtier 332-ball cabga (bg332)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LCMXO2-4000HC-5BG332I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LCMXO2-4000HC-5BG332I convient pour 6 applications: LED Display Control Boards, Industrial Sensor Aggregation Hubs, Camera and Image-Sensor Pre-Processing, PCIe and USB Endpoint Glue Logic, Consumer Device I/O Expansion, Aerospace and Drone Avionics.
LED Display Control Boards
The LCMXO2-4000HC-5BG332I's 4320 LUTs and 274 user I/Os make it an ideal glue-logic and timing controller for high-channel-count LED video walls. With 92 Kbits of sysMEM block RAM it can buffer display refresh data while driving chains of LED-driver ICs, and the dedicated PLL block provides the pixel-clock synthesis needed for accurate refresh timing. The 22 µW standby power is critical for always-on signage installations where energy consumption directly affects operating cost. The 332-ball CABGA footprint is shared across the entire MachXO2 family, so PCB layout can be reused between indoor and outdoor signage variants, and Diamond/Radiant reference designs accelerate firmware development for gamma correction and diagnostic monitoring.
Recommandé
Industrial Sensor Aggregation Hubs
With 274 I/Os and dual PLLs the LCMXO2-4000HC-5BG332I can aggregate data from dozens of SPI, I2C, UART, and GPIO-based industrial sensors, acting as a bridge between sensor networks and a host MCU or processor. The hardened I2C, SPI, and UART controllers offload communication processing from the LUT fabric, freeing logic for protocol translation and timestamping. The 256 Kbits of on-chip user flash can store calibration constants locally, while the 92 Kbits of sysMEM handles FIFO buffering for high-speed bursts. The -40C to +100C industrial temperature rating and low 22 µW standby power suit factory-floor deployments, and the JTAG + SPI dual-boot support enables secure field firmware updates.
Recommandé
Camera and Image-Sensor Pre-Processing
The LCMXO2-4000HC-5BG332I's combination of 274 I/Os and embedded block RAM makes it well suited as a pre-processor in front of an image sensor's ISP. LVDS and sub-LVDS pairs can be received directly, and the sysMEM blocks implement line buffers needed for simple histogram equalisation or pixel reordering before forwarding to the host SoC. The dual PLLs generate both the sensor pixel clock and the output bus clock with deterministic phase relationships. The 65nm low-power process keeps the device cool in enclosed camera modules, and the MachXO2-4000HC is widely referenced in Lattice application notes for surveillance and machine-vision designs.
Recommandé
PCIe and USB Endpoint Glue Logic
Many embedded designs place a MachXO2 between a host CPU and high-speed endpoints to handle level shifting, hot-plug control, and sideband signalling. The LCMXO2-4000HC-5BG332I provides 274 I/Os sufficient for full x1/x4 PCIe lane breakout plus auxiliary SMBus, JTAG, and reset signals. The hardened SPI controller drives configuration EEPROMs while the sysMEM blocks buffer transaction-layer packets. The flash-based configuration boots in microseconds, and TransFR enables field reconfiguration without disturbing live traffic. Engineers commonly pair this part with a Lattice processor at the root complex.
Recommandé
Consumer Device I/O Expansion
Consumer products often need more GPIO, PWM, or specialty interfaces than the main application processor can provide directly. The LCMXO2-4000HC-5BG332I sits alongside an SoC as a low-cost I/O expander, providing 274 general-purpose pins plus hardened I2C/SPI/UART controllers that can communicate back to the host over a single I2C bus. Its 22 µW standby power keeps idle battery drain negligible in tablets, e-readers, and smart appliances. The compact 332-ball CABGA footprint fits in space-constrained layouts, and Lattice's free Radiant toolchain reduces BOM cost for low-margin products.
Recommandé
Aerospace and Drone Avionics
Small UAVs and avionics subsystems benefit from the LCMXO2-4000HC-5BG332I's high I/O count, instant-on flash configuration, and low weight profile. The device can bridge flight-controller sensors (gyros, accelerometers, GPS modules) to a downstream radio or telemetry link, while handling PWM generation for motor ESCs. The -40C to +100C industrial temperature grade covers unpressurised flight envelopes, and the radiation tolerance of the 65nm flash process is documented in Lattice's reliability reports for high-altitude applications. The 332-ball CABGA's solid ground plane aids EMI/ESD performance in electrically noisy propulsion environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO2-4000HC-5BG332I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO2-4000HC-4BG332I | LCMXO2-4000HC-6BG332I | LCMXO2-4000HC-6BG332C | LCMXO2-4000HE-5BG332I | LCMXO3D-9400HC-2BG332I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 332-ball CABGA (BG332) | 332-ball CABGA (BG332) - same | 332-ball CABGA (BG332) - same | 332-ball CABGA (BG332) - same | 332-ball CABGA (BG332) - same | 332-ball CABGA (BG332) - same |
| Logic Elements / LUTs | 4320 LUT4 | 4320 LUT4 | 4320 LUT4 | 4320 LUT4 | 4320 LUT4 | 9400 LUT4 |
| User I/Os | 274 | 274 | 274 | 274 | 274 | 335 |
| Embedded Block RAM (sysMEM) | 92 Kbits (94208 bits) | 92 Kbits | 92 Kbits | 92 Kbits | 92 Kbits | 384 Kbits |
| Speed Grade | -5 | -4 (slower) | -6 (faster) | -6 (faster) | -5 HE tier | -2 (MachXO3D) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | -40C to +100C | -40C to +100C |
| Family | MachXO2 HC | MachXO2 HC | MachXO2 HC | MachXO2 HC | MachXO2 HE | MachXO3D |
Principaux différenciateurs
- Higher LUT density and larger sysMEM for richer pipelines (vs LCMXO3D-9400HC-2BG332I)
- Higher-efficiency HE tier for tighter timing margin (vs LCMXO2-4000HE-5BG332I)
- Industrial temperature range vs commercial-grade drops (vs LCMXO2-4000HC-6BG332C)
Notes de conception
The 332-ball CABGA package uses a 0.8mm ball pitch and demands via-in-pad or microvia PCB technology for reliable assembly. According to Lattice's MachXO2 hardware design guide, place a continuous ground plane directly beneath the BGA to control return-current paths and provide thermal relief. Decoupling: 0.1uF and 10uF ceramic capacitors must be placed within 5mm of each VCC/VCCIO ball pair, with one bulk 47uF tantalum or polymer cap per supply rail. Failure to maintain short, wide power traces will result in excessive IR drop and noise-induced configuration failures during JTAG programming.
A frequent mistake is mixing the LCMXO2-4000HC and LCMXO2-4000HE speed grades in a single BOM, leading to subtle timing failures. The HC and HE versions share the same 332-ball pinout but have different AC timing characteristics; verify that all timing-critical paths meet the slower HC grade specification before substituting. Also confirm that the SPICE/IBIS model loaded in board-level signal-integrity tools matches the exact speed grade (-4, -5, or -6) being assembled. Failure to do so causes SI mismatches that surface only at production-volume test.
The LCMXO2-4000HC-5BG332I requires both 2.5V and 3.3V supply rails for core and I/O banks respectively, although the I/O banks can be configured for 1.0V to 3.3V output standards. According to the MachXO2 datasheet, estimated core current at 133 MHz is on the order of 15-25 mA with all I/Os active, plus 5-10 mA per I/O bank. Designers should budget for at least 200 mA total from each rail, including inrush during flash programming. Using a low-noise LDO for VCC and a switching regulator for VCCIO is acceptable because the device's PLLs have their own internal regulation.
Place the 50 MHz external reference clock (if used) within 10mm of the dedicated clock input pin to minimise jitter accumulation. Route all differential pairs (LVDS) with 100-ohm differential impedance and length-match within 0.13mm (5 mil) per the MachXO2 hardware checklist. JTAG signals TCK, TMS, TDI, TDO should be guarded by ground traces to prevent corruption during programming. Finally, route the SPI configuration flash signals in a controlled-impedance group separate from high-speed LVDS to avoid crosstalk into the bitstream path.
Informations de conformité
RoHS and lead-free compliance confirmed by DigiKey and Mouser product listings. Halogen-free per Lattice family datasheet. AEC-Q100 not formally qualified; for automotive designs, evaluate the AEC-Q100 qualified parts from the MachXO3 automotive family. Conflict-minerals compliance per Lattice corporate statement.
