LCMXO2-7000HC-4BG256I - 6864 LUT MachXO2 FPGA, 256-CABGA | Lattice
Référence : LCMXO2-7000HC-4BG256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $27.5 | $27,50 |
| 10 | $24.2 | $242,00 |
| 100 | $19.8 | $1 980,00 |
| 500 | $16.75 | $8 375,00 |
| 1 000 | $14.2 | $14 200,00 |
LCMXO2-7000HC-4BG256I Présentation
A MachXO2 device is a low-density FPGA that combines the flexibility of a programmable logic fabric with embedded blocks such as on-chip Flash memory, sysCLOCK Phase-Locked Loops (PLLs), user Flash memory, and dedicated FIFO control logic. The HC (High-performance, Commercial core supply) variant uses an internal 1.2V core regulator fed from a 2.5V or 3.3V external VCC, which simplifies PCB power design and eliminates the need for a separate 1.2V rail.
Key features include 245760 bits of embedded block RAM, 3432 macrocells, support for distributed RAM up to 54 kbits, programmable low-swing differential I/O, and as low as 22 uW standby power for battery-friendly designs. The device operates from a 3.3V or 2.5V core supply with 1.2V core derived on-chip, and provides up to 256 kbits of user Flash memory for configuration and data storage.
The MachXO2 architecture uses a 65 nm low-power CMOS process with built-in sysIO buffers that support multiple single-ended and differential I/O standards. Built-in PLLs with 16-bit fractional-N synthesis allow flexible clock generation, while hard FIFO controllers remove the need to instantiate memory control logic in user code.
Typical applications include I/O bridging and protocol conversion (I2C, SPI, UART, MDIO, JTAG), MIPI camera/display interfaces, control logic for digital signage, handheld terminal glue logic, customer-managed PCB redesigns to replace discrete logic, and low-power portable/handheld products. Its instant-on behavior (less than 1 ms configuration from on-chip Flash) makes it ideal as a system controller that must be alive before main ASICs come out of reset.
When designing with this part, leave adequate PCB fan-out for 207 I/O and respect the differential-pair routing rules for LVDS pairs. Use Lattice Diamond design software for synthesis, place-and-route, and bitstream generation; the same ISE/Project file can be migrated to LCMXO2-7000HC-4FTG256I if a non-BGA package is later preferred.
This page synthesizes distributor stock, parametric drop-in equivalents, and design notes beyond the standalone datasheet so engineers can quickly validate whether LCMXO2-7000HC-4BG256I is the right part for a given bridging or control-logic design.
Alternatives de remplacement direct pour LCMXO2-7000HC-4BG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO2-7000HC-4BG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-4BG256IAK7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-6BG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-5BG256I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-4BG256I Valeurs maximales et caractéristiques électriques
| Family | MachXO2 |
| Logic Elements / LUTs | 6864 |
| Number of LABs / CLBs | 858 |
| Number of Macrocells | 3432 |
| Total Embedded RAM Bits | 245760 |
| Distributed RAM | Up to 54 kbits |
| User Flash Memory | Up to 256 kbits |
| Number of User I/O | 207 |
| Supply Voltage VCC | 2.5 V / 3.3 V (HC internal regulator) |
| Core Voltage | 1.2 V (internally regulated) |
| Speed Grade | 4 |
| Process Technology | 65 nm low-power CMOS |
| Boîtier | 256-CABGA (14x14 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Standby Power | As low as 22 uW |
| Configuration Memory | On-chip Flash (instant-on) |
| PLL | Built-in sysCLOCK PLL with 16-bit fractional-N synthesis |
| FIFO Control Logic | Dedicated hard FIFO controllers |
| Programmable I/O Standards | Low-swing differential I/O support |
| Statut RoHS | Compliant |
| Lead-Free Status | Lead Free |
Guide de configuration des broches du LCMXO2-7000HC-4BG256I 256-cabga (14x14 mm)
Configuration des broches du LCMXO2-7000HC-4BG256I (boîtier 256-cabga (14x14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LCMXO2-7000HC-4BG256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LCMXO2-7000HC-4BG256I convient pour 6 applications: I2C / SPI / UART Protocol Bridging, MIPI Camera / Display Interface Bridging, System Controller / Power Sequencing, Legacy Parallel-Bus to Memory/PCIe Bridge, Customer-Managed PCB Redesign Glue Logic, Handheld Terminal / Portable Product Controller.
I2C / SPI / UART Protocol Bridging
The LCMXO2-7000HC-4BG256I is one of the most widely deployed FPGAs for low-speed protocol bridging because it packs 6864 LUTs and 207 I/O into a single non-volatile device. A typical design instantiates multiple soft bus controllers (I2C master/slave, SPI controller, UART) and bridges between them, replacing several discrete logic ICs on legacy boards. The on-chip Flash configuration means the device is alive before the main ASIC comes out of reset, which is critical when bridging reset and power-good signals. At 3.3V VCC and 22 uW standby, it suits always-on handheld designs that must wake up the rest of the system only when user input occurs.
Recommandé
MIPI Camera / Display Interface Bridging
LCMXO2-7000HC-4BG256I's 207 I/O and programmable low-swing differential I/O buffers let it bridge between MIPI-CSI/DSI sources and parallel RGB or LVDS displays in handheld terminals and industrial HMIs. The built-in sysCLOCK PLLs regenerate pixel clocks at non-integer multiples of the reference, eliminating external clock-generator ICs. With 245 kbits of EBR plus hard FIFO controllers, the device can buffer image data across asynchronous clock domains without consuming LUTs as memory, freeing logic for protocol conversion state machines. Industrial -40C to +85C operation supports outdoor and factory-floor deployments.
Recommandé
System Controller / Power Sequencing
Because LCMXO2-7000HC-4BG256I instant-on configures from on-chip Flash in under 1 ms, designers use it as the system controller that sequences power rails before the main processor, ASIC, or SoC comes out of reset. Its 207 I/O are easily assigned to PG (power-good) inputs and EN (enable) outputs to a multi-rail PMIC, while LUTs implement watchdog timers and fault logging. The 22 uW standby power means the controller can stay alive in deep system sleep without draining battery, ideal for always-on IoT endpoints, security panels, and portable medical devices that need deterministic wake-up behavior.
Recommandé
Legacy Parallel-Bus to Memory/PCIe Bridge
Designers retrofitting older ASICs into modern systems frequently drop LCMXO2-7000HC-4BG256I next to a legacy host to translate address/data buses into a modern interface. With 6864 LUTs and 245 kbits of EBR, the device can implement custom state machines, FIFO buffers, and bus-width converters. Its support for multiple I/O standards (LVCMOS, LVTTL, LVDS, low-swing differential) on the same die makes it a flexible level shifter and protocol converter without external glue logic. The HC internal regulator removes the need for a separate 1.2V rail, simplifying retrofit designs that only have 2.5V or 3.3V available.
Recommandé
Customer-Managed PCB Redesign Glue Logic
When a board re-spin must replace several discrete 74xx logic ICs, designers consolidate them into a single LCMXO2-7000HC-4BG256I to reduce BOM count, free PCB area, and add field-update capability through JTAG reconfiguration. The 207 user I/O and built-in FIFO controllers mean a single device typically replaces 5-15 discrete logic packages, and the same 65 nm process used across the MachXO2 family guarantees long-term availability. Industrial temperature grade and lead-free / RoHS compliance support deployment in industrial control, medical, and metering applications without requalification.
Recommandé
Handheld Terminal / Portable Product Controller
Battery-powered handheld terminals (barcode scanners, POS terminals, ruggedized tablets) leverage the 22 uW standby power and instant-on Flash configuration of LCMXO2-7000HC-4BG256I to remain responsive even when the main application processor is suspended. The 256-CABGA package has a compact 14x14 mm footprint suitable for space-constrained handheld enclosures, while 207 I/O support multi-display, multi-touch, and multi-radio interfaces. With -40C to +85C industrial temperature rating, the same part serves both indoor consumer-POS and outdoor industrial-handheld variants, simplifying SKU management.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO2-7000HC-4BG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO2-7000HC-4BG256C | LCMXO2-7000HC-4BG256IAK7 | LCMXO2-7000HC-6BG256I | LCMXO2-7000HC-5BG256I |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-CABGA (14x14 mm) | 256-CABGA (14x14 mm) - same | 256-CABGA (14x14 mm) - same | 256-CABGA (14x14 mm) - same | 256-CABGA (14x14 mm) - same |
| Logic Elements / LUTs | 6864 | 6864 | 6864 | 6864 | 6864 |
| User I/O Count | 207 | 207 | 207 | 207 | 207 |
| Total RAM Bits | 245760 | 245760 | 245760 | 245760 | 245760 |
| Speed Grade | 4 | 4 | 4 | 6 | 5 |
| Operating Temperature | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Supply Voltage (VCC) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Configuration Memory | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
Principaux différenciateurs
- Industrial temperature grade at commercial pricing (vs LCMXO2-7000HC-4BG256C)
- Same silicon, faster timing closure than speed grade 6 (vs LCMXO2-7000HC-6BG256I)
- On-chip Flash enables instant-on versus SRAM-only FPGAs (vs SRAM-configuration FPGAs (e.g., Lattice ECP5, Xilinx Spartan-6))
Notes de conception
Estimated: at 3.3V VCC and 50% I/O toggle at 100 MHz, typical VCC current is around 20-30 mA for quiescent/idle designs and up to 100-200 mA for fully-utilized bridges. The internal 1.2V regulator drops approximately 2.1V across it at full load, dissipating up to ~250 mW internally - derate junction temperature by 4 C/W per 100 mW of internal drop. Decouple VCC with 0.1 uF + 10 uF ceramic as close to the balls as possible, and provide at least one 33 uF bulk cap per device. Use a separate analog supply (VCCA) pin if documented in the datasheet.
The 256-CABGA (14x14 mm) has a 1.0 mm ball pitch which requires 4-layer or 6-layer PCB with microvia or via-in-pad technology for reliable assembly. Fan-out escape routing must accommodate 207 signal I/O plus ground and supply balls; plan at least 4 PCB layers just for the FPGA alone. Place decoupling within 100 mils of each supply ball cluster. Matched-length routing (within 10 mil) is required for LVDS pairs - consult the Lattice MachXO2 sysIO user guide for the differential-pair length-matching rules.
Do not confuse the BG256 (CABGA, 1.0 mm pitch) package with the FTG256 (FTBGA, 0.4 mm pitch) package - although both have 256 balls, the ball-maps differ and they are not footprint-compatible. Forgetting to assert the PROGRAMN pin low during power-up can leave the device in an undefined state if the JTAG loader is not actively managing configuration. When migrating designs across speed grades (4 to 6), always re-run place-and-route - timing closure degrades by ~25% per speed-grade step. Estimated: a 100 MHz design that fits comfortably in speed grade 4 may fail timing closure in speed grade 6 without recompiling.
For high-speed LVDS or DDR interfaces, place series-termination resistors within 200 mils of the FPGA output ball to dampen reflections. Keep the PLL analog supply (VCCPLL) filtered with a ferrite bead and 10 uF + 0.1 uF Pi network to minimize jitter. Avoid routing high-speed signals under the BGA escape vias to prevent crosstalk. The MachXO2 hardware checklist recommends stitching the ground plane with 4-8 vias per square cm to provide a low-impedance return path for 100 MHz+ signals.
Informations de conformité
RoHS compliant and lead-free per Lattice product page and DigiKey listing. Not AEC-Q100 qualified - automotive applications should select an AEC-Q100 qualified Lattice part. Halogen-free status and conflict-minerals statement not explicitly documented in the verified web data.
