LCMXO3D-4300HC-5SG72C - MachXO3D 4300 LUT FPGA with Secure Boot | Lattice Semiconductor
Référence : LCMXO3D-4300HC-5SG72C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.55 | $165,50 |
| 100 | $14.1 | $1 410,00 |
| 500 | $12.05 | $6 025,00 |
| 1 000 | $10.85 | $10 850,00 |
LCMXO3D-4300HC-5SG72C Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that the user can configure post-manufacturing to implement arbitrary digital logic functions. Within the broader product hierarchy, an FPGA sits below the Application-Specific Integrated Circuit (ASIC) category but above fixed-function microcontrollers: it occupies the same role as a CPLD (Complex Programmable Logic Device) when logic density is small, but offers deeper memory, more I/O, and finer-grained routing. MachXO3D devices specifically target secure-control and instant-on glue-logic applications, extending the MachXO3 family with hardware Root-of-Trust, immutable security, and pre-verified cryptographic primitives.
Key features of the LCMXO3D-4300HC-5SG72C include 4300 LUTs (2150 Adaptive Logic Modules per Lattice datasheet), 94208 bits of EBR (about 11.8 kbytes), 96 kbits of distributed RAM, dedicated on-chip Flash Configuration Memory for instant-on behavior without external boot Flash, a Security Block supporting AES-256, SHA-256, HMAC, and ECDSA, and support for 2.5V/3.3V VCCIO with internal VCC core at 2.5V-3.3V. The device supports common interfaces such as I2C, SPI, I2S, UART, and LVDS via on-chip hardened IP. Operating junction temperature ranges from 0C to +85C (commercial grade, suffix 'C').
Architecturally, the MachXO3D HC variant uses a non-volatile configuration cell that eliminates external boot PROM and provides deterministic wake-up in under 1 ms, while the embedded Security Block isolates keys in tamper-resistant storage. Hardened I/O buffers tolerate 1.2V-3.3V signaling on independent banks, simplifying mixed-voltage board designs.
Typical applications for the LCMXO3D-4300HC-5SG72C include secure IoT endpoint controllers (hardware Root-of-Trust), industrial control bridging (SPI-to-I2C, I2C-to-UART glue logic), consumer device secure boot and firmware verification, automotive infotainment and ADAS glue logic in 4300 LUT class designs, and portable/wearable always-on sensor hubs.
When designing with this device, plan decoupling: place a 0.1 uF plus 1 uF ceramic within 5 mm of each VCC/VCCIO pin and bond the exposed pad (EP) directly to a ground plane with at least 9 thermal vias. Designers should evaluate whether the 58 available user I/Os (after package pad-out) meet their pin-count budget before committing to this variant.
Alternatives de remplacement direct pour LCMXO3D-4300HC-5SG72C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO3D-4300ZC-6SG72C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3D-4300HE-5SG72C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3D-4300HC-6SG72C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5SG72C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3D-9400HC-5SG72C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3D-4300HC-5SG72C Valeurs maximales et caractéristiques électriques
| Family | MachXO3D |
| Logic Elements / LUTs | 4300 LUTs (2150 ALMs) |
| Total RAM Bits | 94208 bits |
| User I/O Count | 58 |
| Boîtier | 72-VFQFN Exposed Pad (SG72, 10x10 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial grade, suffix C) |
| Supply Voltage VCC | 2.5 V / 3.3 V |
| I/O Bank Voltage VCCIO | 1.2 V to 3.3 V (mixed banks) |
| Configuration Memory | Internal Flash, non-volatile (instant-on) |
| Security Block | AES-256, SHA-256, HMAC, ECDSA (hardware Root-of-Trust) |
| Hardened IP | I2C, SPI, I2S, UART, LVDS |
| Speed Grade | -5 |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de LCMXO3D-4300HC-5SG72C
| Broche 1 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 2 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 3 | GND — Ground |
| Broche 4 | VCCIO0 — I/O bank 0 supply voltage |
| Broche 5 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 6 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 7 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 8 | I/O_BANK_0 — General-purpose user I/O bank 0 |
| Broche 9 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Broche 10 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 13 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Broche 14 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Broche 15 | I/O_BANK_1 — General-purpose user I/O bank 1 |
| Broche 16 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Broche 17 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Broche 18 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 19 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Broche 20 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Broche 21 | GND — Ground |
| Broche 22 | I/O_BANK_2 — General-purpose user I/O bank 2 |
| Broche 23 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Broche 24 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Broche 25 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 26 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Broche 27 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Broche 28 | GND — Ground |
| Broche 29 | I/O_BANK_3 — General-purpose user I/O bank 3 |
| Broche 30 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Broche 31 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Broche 32 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 33 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Broche 34 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Broche 35 | I/O_BANK_4 — General-purpose user I/O bank 4 |
| Broche 36 | GND — Ground |
| Broche 37 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Broche 38 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 39 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Broche 40 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Broche 41 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Broche 42 | GND — Ground |
| Broche 43 | I/O_BANK_5 — General-purpose user I/O bank 5 |
| Broche 44 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Broche 45 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 46 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Broche 47 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Broche 48 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Broche 49 | GND — Ground |
| Broche 50 | I/O_BANK_6 — General-purpose user I/O bank 6 |
| Broche 51 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Broche 52 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 53 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Broche 54 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Broche 55 | I/O_BANK_7 — General-purpose user I/O bank 7 |
| Broche 56 | GND — Ground |
| Broche 57 | TDO — JTAG Test Data Out |
| Broche 58 | TMS — JTAG Test Mode Select |
| Broche 59 | TCK — JTAG Test Clock |
| Broche 60 | TDI — JTAG Test Data In |
| Broche 61 | VCC — Core supply 2.5V or 3.3V |
| Broche 62 | PROGRAMN — Active-low configuration reset |
| Broche 63 | INITN — Active-low initialization done indicator |
| Broche 64 | DONE — Configuration complete indicator |
| Broche 65 | GND — Ground |
| Broche 66 | VCC — Core supply 2.5V or 3.3V |
| Broche 67 | CCLK — Configuration clock (SPI mode) |
| Broche 68 | SI — SPI slave data input / Slave Data In |
| Broche 69 | SO — SPI slave data output / Slave Data Out |
| Broche 70 | SN_CS — SPI slave select (active low) |
| Broche 71 | RESETN — Global reset (active low) |
| Broche 72 | VCCIO0 — I/O bank 0 supply voltage |
Applications typiques
LCMXO3D-4300HC-5SG72C convient pour 6 applications: IoT Secure Endpoint / Hardware Root-of-Trust, Industrial Control Bridging / Glue Logic, Consumer Device Secure Boot and Firmware Verification, Automotive ADAS and Infotainment Glue Logic, Portable / Wearable Always-On Sensor Hubs, Network Infrastructure and Edge Gateway Bridging.
IoT Secure Endpoint / Hardware Root-of-Trust
The LCMXO3D-4300HC-5SG72C is purpose-built for hardware Root-of-Trust functions in IoT endpoints. Its AES-256, SHA-256, HMAC, and ECDSA Security Block performs authenticated boot and firmware verification, while tamper-resistant key storage isolates credentials from the main application processor. With 4300 LUTs and 58 user I/Os, the device can also host small glue-logic tasks (sensor aggregation, watchdog, power sequencing) on the same die, reducing BOM count.
Recommandé
Industrial Control Bridging / Glue Logic
The LCMXO3D-4300HC-5SG72C excels at bus-bridging and signal-level translation in industrial control systems. With hardened I2C, SPI, I2S, and UART IP, plus LVDS-capable I/O at 2.5V/3.3V VCCIO, it can translate between legacy 3.3V sensors and modern 1.8V processors without any soft IP overhead. The 4300 LUT capacity supports multiple parallel bridges plus custom protocol handling, while non-volatile Flash configuration eliminates downtime after power-cycle.
Recommandé
Consumer Device Secure Boot and Firmware Verification
Consumer electronics such as smart-home hubs, network-attached storage, and connected appliances use the LCMXO3D-4300HC-5SG72C as a secure-boot companion. The Security Block verifies signed firmware on the main CPU at power-on, refusing to release reset until the image passes ECDSA signature check. The 58 user I/Os allow direct interfacing to SPI Flash, JTAG, and reset sequencing lines, while the small 10x10 mm QFN-EP package fits in space-constrained consumer enclosures.
Recommandé
Automotive ADAS and Infotainment Glue Logic
For automotive designs that do not require the extended HE temperature range, the commercial-grade LCMXO3D-4300HC-5SG72C (0C to +85C) serves as a flexible glue-logic companion to infotainment processors and camera-link serializers. With 4300 LUTs the part can implement CAN-to-Ethernet bridging, pixel-clock conditioning for LVDS displays, and power-sequencing logic between PMICs. Its hardware Security Block also enables secure CAN message authentication.
Recommandé
Portable / Wearable Always-On Sensor Hubs
Battery-powered wearables benefit from the LCMXO3D-4300HC-5SG72C's instant-on (sub-1 ms) configuration and low standby power. The device can sit in deep sleep, wake on a GPIO trigger from a sensor, perform filtering decisions in 4300 LUTs of logic, and return to sleep - all without waking the main MCU. The 72-pin VFQFN EP package handles thermal dissipation in wearable form factors while staying under 100 mm squared total PCB area.
Recommandé
Network Infrastructure and Edge Gateway Bridging
Edge gateways frequently need protocol translation between Ethernet-attached sensors and serial-based actuators. The LCMXO3D-4300HC-5SG72C offers 4300 LUTs for custom protocol parsing, 58 I/Os, and hardened I2C/SPI/UART cores that can run independent peripheral stacks simultaneously. Hardware AES-256 acceleration further offloads VPN handshake tasks from the main CPU, while deterministic sub-1 ms boot keeps the gateway on-line after brown-outs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO3D-4300HC-5SG72C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO3D-4300ZC-6SG72C | LCMXO3D-4300HE-5SG72C | LCMXO3D-4300HC-6SG72C | LCMXO3LF-4300E-5SG72C | LCMXO3D-9400HC-5SG72C |
|---|---|---|---|---|---|---|
| Package | 72-VFQFN EP (SG72, 10x10 mm) | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same | 72-VFQFN EP (SG72) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| LUTs / ALMs | 4300 LUTs (2150 ALMs) | 4300 LUTs | 4300 LUTs | 4300 LUTs | 4300 LUTs | 9400 LUTs (+118%) |
| User I/O Count | 58 | 58 | 58 | 58 | 58 | 58 |
| VCC Core | 2.5V / 3.3V | 1.2V | 1.2V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
| Security Block (AES-256 / ECDSA) | Yes | Yes | Yes | Yes | No (MachXO3L pre-security family) | Yes |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | -5 | -6 (slower) | -5 | -6 (slower) | -5 | -5 |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash |
Principaux différenciateurs
- Integrated hardware Security Block (AES-256/SHA-256/ECDSA) for Root-of-Trust (vs LCMXO3LF-4300E-5SG72C)
- Higher LUT density option available in same package (vs LCMXO3D-9400HC-5SG72C)
- Automotive-grade temperature option in same footprint (vs LCMXO3D-4300HE-5SG72C)
Notes de conception
MachXO3D HC devices require 2.5V or 3.3V on VCC, with separate VCCIO pins supporting 1.2V to 3.3V per I/O bank. Place 0.1 uF X7R ceramic decoupling within 3 mm of each VCC/VCCIO pin, plus a single 10 uF bulk capacitor near the package. The exposed pad (EP) must be soldered directly to a ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation and electrical ground return - this is critical for non-volatile Flash configuration reliability.
Route all 58 user I/Os as 50 ohm controlled-impedance traces if any LVDS or SPI >50 MHz signals are used; otherwise standard 50 ohm microstrip is sufficient. Keep JTAG (TDI/TDO/TMS/TCK) traces short (under 50 mm) and isolated from switching supplies. Place the ProgramN pin with a 10 kohm pull-up to VCCIO0 to ensure clean configuration defaults at power-up.
Estimated: a design that uses more than 4300 LUTs will fail to fit the device silently at compile time. Compile with Lattice Diamond and review the 'Resource Usage' report to confirm utilization stays under 80 percent to leave routing headroom. Also verify that the chosen security profile (development vs production) is correct - locking the device in production mode is irreversible and prevents further JTAG access.
For LVDS pairs on the LCMXO3D-4300HC-5SG72C, match trace lengths to within 0.5 mm and use 100 ohm differential impedance. The part supports up to 8 LVDS pairs per bank; consult the MachXO3D datasheet pinout for exact pin assignments. Add a 100 ohm termination resistor across the differential pair at the receiver end when traces exceed 25 mm to avoid reflections.
Although the MachXO3D family is known for low power, the Security Block operations (AES-256, ECDSA) draw measurable current during boot. Estimated: peak supply current during Security Block stress can reach ~50 mA on VCC, producing 0.15 W dissipation at 3.3V; with theta JA around 30 C/W, junction rise is approximately 4.5 C - well within the 0C-85C commercial envelope, but adequate copper pour is required if used in enclosed industrial enclosures.
Informations de conformité
Commercial grade (suffix C, 0C-85C). RoHS compliant per Lattice product page. AEC-Q100 is not applicable for the commercial HC variant - choose the HE variant (LCMXO3D-4300HE-5SG72C) for AEC-Q100-qualified automotive applications.
