LFE2-35E-5F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor
Référence : LFE2-35E-5F672C ✗ Fin de vieLFE2-35E-5F672C Présentation
An FPGA, or field-programmable gate array, is a programmable digital semiconductor that combines configurable logic blocks, programmable interconnect, memory resources, and I/O into one device. The LFE2-35E-5F672C belongs to the ECP2 family, a low-power FPGA platform used for embedded control, communications, signal processing, and general-purpose programmable logic. Its 450 I/O provide substantial connectivity for parallel buses, memory interfaces, and control logic.
The verified product information identifies 32,000 cells, 450 I/O, a 1.2 V operating voltage, 90 nm process technology, and a -5 speed grade. The 672-pin FPBGA package is specified as a surface-mount, tray-packaged component. The ECP2 architecture is suited to designs requiring deterministic parallel logic rather than a high-level microcontroller workload, while the large pin count supports high-bandwidth external memory and peripheral connectivity.
The LFE2-35E-5F672C is identified as obsolete by GlobalSpec data, so procurement should account for lifecycle risk rather than assuming new production availability. Distributor records and marketplace listings may still show inventory, but availability, pricing, and lead time require confirmation at the time of purchase. A 672-pin BGA package also requires careful PCB layout, controlled reflow, and adequate via-in-pad or fanout routing for reliable assembly.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video processing, interface aggregation, and high-density logic prototyping. The device can also be used in FPGA-based embedded systems where programmable logic, block memory, and a large I/O count must coexist on one package.
Designers should verify the exact pinout, power rails, configuration method, supported I/O standards, and memory interface requirements against the manufacturer documentation before layout. Since the package exposes 672 balls, power and ground distribution, decoupling, escape routing, and thermal management are especially important. A PCB with adequate layer count, via density, and assembly-process capability should be planned before committing to this footprint.
This product page consolidates the verified distributor and manufacturer-oriented specifications, lifecycle status, package information, and same-family replacement candidates into one engineering-focused reference. It also highlights the practical distinction between true package-compatible alternatives and ECP2 devices that require a different footprint.
Alternatives de remplacement direct pour LFE2-35E-5F672C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
LFE2-35E-5FN672C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE2-35SE-5FN672C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE2-35E-5F672I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →LFE2-35E-6FN672C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE2-35SE-5F672C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE2-35E-5F672C Valeurs maximales et caractéristiques électriques
| Device Type | ECP2 Field Programmable Gate Array (FPGA) IC |
| Logic Cells | 32,000 cells |
| Maximum Frequency | 311 MHz |
| Tension d'alimentation | 1.2 V |
| Number of I/O | 450 I/O |
| Boîtier | 672-BBGA FPBGA, 27 x 27 mm |
| Technology | 90 nm |
| Speed Grade | -5 |
| Type de montage | Surface Mount |
| Package Type | Tray |
| Plage de température de fonctionnement | 0C to 85C (TJ) |
| DSP Capability | DSP blocks indicated in distributor listing |
| Logic Density | 35,000 cells as listed in datasheet search result |
| Product Family | LatticeECP2 |
| Programmable Logic Type | FPGA |
| Package Pin Count | 672 pins |
| Terminal Type | Ball |
| Part Status | Obsolete |
Guide de configuration des broches du LFE2-35E-5F672C 672 pins
Configuration des broches du LFE2-35E-5F672C (boîtier 672 pins). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LFE2-35E-5F672C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LFE2-35E-5F672C convient pour 6 applications: Industrial Control Logic, Communications Interface Aggregation, Test and Measurement Equipment, Embedded Parallel Processing, Video and Image Interface Processing, High-Density Programmable Interface Hub.
Industrial Control Logic
The LFE2-35E-5F672C fits industrial control systems requiring extensive parallel I/O, programmable logic, and embedded memory in one FPGA. Its 450 I/O can connect discrete sensors, actuators, counters, interlocks, and parallel buses, while 32,000 logic cells allow control sequencing to be consolidated instead of spread across multiple discrete controllers. The 311 MHz listed maximum provides substantial timing margin for industrial bus and machine-control logic. Designers should account for the obsolete lifecycle status by using it mainly in maintained legacy systems and confirming availability for repair or extension builds.
Recommandé
Communications Interface Aggregation
The ECP2 LFE2-35E-5F672C is suitable for communications equipment that must consolidate parallel data paths, packet framing, buffering, and protocol conversion. Its 450 I/O support high-density interfaces to external memory, transceivers, and network processors, while the 32,000-cell capacity can implement multiple parallel datapaths and DSP-assisted processing. At 1.2 V core operation, the device suits systems designed around modern low-voltage FPGA platforms. Signal-integrity and timing validation remain necessary because the public search data does not provide the complete I/O standard matrix or pin-level differential-pair details.
Recommandé
Test and Measurement Equipment
The LFE2-35E-5F672C can implement parallel acquisition logic, pattern generation, timing control, and data routing in test and measurement instruments. With 450 I/O, it can connect multiple buses and control channels, while 32,000 cells provide room for programmable state machines and embedded data processing. The listed 311 MHz maximum supports demanding synchronous logic when correctly constrained. The large FPBGA footprint requires a high-density board and careful power delivery, so laboratory instruments should include proper grounding, decoupling, and controlled impedance routing.
Recommandé
Embedded Parallel Processing
The LFE2-35E-5F672C is well suited to embedded systems where programmable datapaths must run alongside memory-intensive interfaces. Its 32,000 ECP2 logic cells can implement filters, packet processors, or custom accelerators, while 450 I/O provide broad access to external processors and storage. The 1.2 V core supply and 311 MHz listed timing allow compact high-speed logic blocks without relying on a microprocessor for every real-time operation. Because this is an obsolete ECP2 device, new embedded platforms should compare current ECP2 options unless an existing software build and PCB make reuse advantageous.
Recommandé
Video and Image Interface Processing
The 450-I/O LFE2-35E-5F672C can support video timing generation, pixel-stream routing, color processing, and interface conversion in programmable display or imaging equipment. Its 32,000-cell architecture accommodates parallel control and datapath functions, while DSP capability can accelerate selected filtering or arithmetic operations. The 672-ball package offers extensive connectivity for external memory and capture devices, although it also makes escape routing and assembly more demanding. For new production, engineers should confirm whether a current smaller FPGA provides adequate resources and a simpler package before retaining this legacy footprint.
Recommandé
High-Density Programmable Interface Hub
The LFE2-35E-5F672C can act as a programmable interface hub between legacy parallel buses, memory devices, and modern control logic. Its 450 I/O reduce the need for separate buffers and translators, while 32,000 cells allow protocol state machines, arbitration, and data transformation to be consolidated. The listed 311 MHz maximum supports synchronous bus bridging and timing-critical control functions. A replacement design must match the target's 672-ball footprint and review all power, configuration, and ground pins; otherwise the 484-BBGA alternative requires a new PCB layout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LFE2-35E-5F672C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LFE2-35E-5FN672C | LFE2-35SE-5FN672C | LFE2-35E-5F672I | LFE2-35E-6FN672C | LFE2-35SE-5F672C |
|---|---|---|---|---|---|---|
| Package | 672-BBGA FPBGA, 27 x 27 mm | 672-BBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
Principaux différenciateurs
- Higher I/O density than the 484-package ECP2 option (vs LFE2-35E-6F484C)
- Higher listed speed grade than the -6 ECP2 alternative (vs LFE2-35E-6FN672C)
- Broad 450-I/O connectivity in the required 672-ball footprint (vs LFE2-35E-6F484C)
- Closest same-package family match (vs LFE2-35E-5FN672C)
Notes de conception
Plan the 672-ball FPBGA layout for the full 27 x 27 mm footprint rather than treating it as a generic BGA. Verify every ball location against the official package drawing, provide escape routing to a manageable pitch, and account for assembly via-in-pad or multilayer fanout requirements. Because the target is obsolete, preserving the original PCB may be more economical than redesigning around a different package.
Use the manufacturer power table to define core, I/O, configuration, and auxiliary rails before placing decoupling capacitors. The verified 1.2 V value identifies the device's listed core operating voltage, but it does not establish every external supply requirement. Keep high-current distribution paths short, provide local bulk and high-frequency decoupling at the relevant supply pins, and verify startup and power-sequencing conditions in the device documentation.
The 450-I/O interface makes routing discipline important even when the internal core is only 1.2 V. Match impedance-sensitive nets, provide continuous return paths, avoid splits under high-speed BGA escapes, and apply the manufacturer's I/O standard and slew-rate recommendations. Recheck timing after any ECP2 suffix substitution because I/O behavior, speed grade, or configuration options may differ.
Do not treat every 672-pin ECP2 as a drop-in equivalent. LFE2-35E-6F484C uses a 484-BBGA package and therefore requires a different layout, while suffix changes such as FN, I, SE, or the -6 speed grade may alter ordering attributes or performance. Validate the exact device identifier, pinout, speed grade, temperature grade, lifecycle status, and configuration requirements before releasing production quantities.
Informations de conformité
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The target is an FPGA and is not presented as an automotive-qualified AEC-Q100 device.
