MB91F526LKCPMC-GSE2 - 80MHz FR81S Auto MCU 1MB Flash | Infineon
Référence : MB91F526LKCPMC-GSE2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.6 | $256,00 |
| 100 | $22.4 | $2 240,00 |
| 500 | $19.95 | $9 975,00 |
| 1 000 | $17.8 | $17 800,00 |
MB91F526LKCPMC-GSE2 Présentation
Key features include 1.0625 MB (1.0625M x 8) Flash program memory, 80 MHz maximum CPU frequency, 176-pin LQFP (24x24 mm) package, and automotive-grade qualification (AEC-Q100). The device supports 2.5V, 3.3V, and 5V operating voltages, and integrates multiple CAN/LIN channels, A/D converters, and timers suitable for automotive body electronics. Per the Arrow listing, the part is supplied in tray packaging.
Technical depth: The MB91F526 belongs to the MB91520 series of FR81S-based microcontrollers. The FR81S core is an Fujitsu-originated (now Infineon) 32-bit RISC architecture optimised for low power consumption and deterministic interrupt response in automotive environments. The 1.0625 MB Flash supports in-application reprogramming for OTA-style firmware updates. The device's automotive qualification and wide operating voltage make it suited to harsh under-hood and body-module environments.
Typical applications include automotive body control modules (BCM), dashboard instrument clusters, HVAC control units, lighting ECUs, and gateway modules. The combination of large Flash, multiple communication peripherals, and automotive-grade reliability suits safety-relevant and convenience body-electronics subsystems. Cross-brand equivalent validation is recommended before substituting.
Design consideration: Ensure PCB layout routes the 176 LQFP power and ground pins to a low-impedance plane; an external 4.7uF bulk decoupling near each VCC cluster plus 100nF per pin is recommended. Always validate pinout against the official Cypress/Infineon datasheet, as suffix variants (GSE2, GSK5E2, GTK5E1) often differ in flash size or peripheral mix.
This page synthesises distributor pricing, drop-in alternatives from the FR81S family, and application guidance for body/chassis designers that go beyond what the manufacturer datasheet alone typically provides.
Alternatives de remplacement direct pour MB91F526LKCPMC-GSE2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MB91F526LKCPMC-GSE2 (même facteur de forme et même empreinte) — différant par Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MB91F526LKCPMC-GTK5E1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MB91F526LWEPMC-GSK5E2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY91F526LKCPMC-GSE2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY91F526LSBPMC-GSE1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MB91F526LKCPMC-GSK5E2
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →MB91F528USCPMC-GSE2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MB91F528USDPMC-GSE2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MB91F526LKCPMC-GSE2 Valeurs maximales et caractéristiques électriques
| Core Architecture | FR81S (32-bit RISC) |
| CPU Series | MB91520 (MB91F526) |
| Maximum CPU Frequency | 80 MHz |
| Program Memory Size | 1.0625 MB (1.0625M x 8) Flash |
| Operating Voltage | 2.5V / 3.3V / 5V |
| Boîtier | 176-LQFP (24x24 mm) |
| Nombre de broches | 176 |
| Type de montage | Surface Mount |
| Automotive Grade | Yes (AEC-Q100 - Auto MCU per Mouser listing) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Supply Form | Tray (per Arrow listing) |
Guide de configuration des broches du MB91F526LKCPMC-GSE2 176-lqfp (24x24 mm)
Configuration des broches du MB91F526LKCPMC-GSE2 (boîtier 176-lqfp (24x24 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MB91F526LKCPMC-GSE2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MB91F526LKCPMC-GSE2 convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster MCU, HVAC Control Module, Automotive Lighting ECU, Central Gateway Module, Industrial Automation Controller (Automotive-Grade).
Automotive Body Control Module (BCM)
The MB91F526LKCPMC-GSE2 fits BCM designs because it integrates 1.0625 MB Flash (enough for lighting/wiper/seat logic), CAN and LIN peripherals for body network gateway duty, and 2.5V/3.3V/5V tolerance for direct connection to 12V battery rails through internal regulators. Its AEC-Q100 qualification ensures BCM-level reliability under hood thermal stress. The 80 MHz FR81S core executes body-logic state machines deterministically while maintaining low quiescent current during key-off sleep. Use this MCU paired with a CAN transceiver such as TJA1042 for the high-speed CAN channel and a LIN SBC like TJA1027 for body sub-nets.
Recommandé
Instrument Cluster MCU
The MB91F526LKCPMC-GSE2 is well suited for instrument cluster designs where its 80 MHz FR81S core drives stepper-motor gauge pointers and segment/LCD displays. Its 176-LQFP exposes ample GPIO for backlight drivers, warning-LED matrices, and CAN-FD diagnostics from the vehicle network. The 1.0625 MB Flash accommodates full cluster firmware including telltale logic and OBD-II routines. Place 100nF ceramic bypass caps adjacent to each VCC cluster and use a 6-layer PCB stack-up to suppress EMI from the cluster's switching regulators.
Recommandé
HVAC Control Module
For HVAC control units the MB91F526LKCPMC-GSE2 provides deterministic real-time response for blower-speed PWM, blend-door stepper control, and cabin-temperature sensing via its ADC channels. The 1.0625 MB Flash supports climate-control algorithms including PID loops and CAN diagnostics, while 2.5V/3.3V/5V tolerance allows direct interface with 5V sensor signals from NTC thermistors. Its AEC-Q100 grade ensures long-term reliability in the high-humidity cabin environment. Use this MCU alongside a stepper driver and CAN/LIN SBC for full HVAC ECU implementation.
Recommandé
Automotive Lighting ECU
Front-lighting and rear-lighting ECUs benefit from the MB91F526LKCPMC-GSE2's combination of 1.0625 MB Flash (for adaptive-headlamp algorithms), 80 MHz core, and CAN/LIN peripherals for headlamp-level communication. The 176-LQFP package exposes sufficient GPIO for matrix-LED driver enable lines and PWM channels for dimming. AEC-Q100 compliance meets the thermal and reliability demands of headlamp pods. Pair with an LED-matrix driver and a CAN-FD transceiver for full adaptive-driving-beam functionality.
Recommandé
Central Gateway Module
The MB91F526LKCPMC-GSE2 can serve as a CAN-to-CAN or CAN-to-LIN gateway in vehicle network architectures, leveraging its multiple CAN channels and LIN interfaces plus 1.0625 MB Flash for routing/filtering tables. The 80 MHz core handles message-rate conversion and bus diagnostics at typical body-network loads. AEC-Q100 grade and 5V tolerance suit the gateway's under-dash mounting position. This design typically pairs the MCU with dual high-speed CAN transceivers and optionally an Ethernet PHY for next-generation gateway modules.
Recommandé
Industrial Automation Controller (Automotive-Grade)
Industrial designers sometimes select AEC-Q100 MCUs like the MB91F526LKCPMC-GSE2 for harsh-environment controllers where 2.5V/3.3V/5V tolerance and automotive-grade reliability exceed standard industrial ratings. The 1.0625 MB Flash hosts deterministic control firmware, while the 80 MHz core executes real-time motion loops. The 176-LQFP footprint integrates CANopen and DeviceNet protocols natively. This application uses the MCU in factory-automation cells exposed to wide temperature swings and EMI from motor drives.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MB91F526LKCPMC-GSE2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MB91F526LKCPMC-GTK5E1 | MB91F526LWEPMC-GSK5E2 | CY91F526LKCPMC-GSE2 | CY91F526LSBPMC-GSE1 | MB91F528USCPMC-GSE2 |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| CPU Core | FR81S (32-bit RISC) | FR81S | FR81S | FR81S | FR81S | FR81S |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Operating Voltage | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V |
| Automotive Grade (AEC-Q100) | Yes (Auto MCU) | Yes (Auto MCU) | Yes (Auto MCU) | Yes (Auto MCU) | Yes (Auto MCU) | Yes (Auto MCU) |
Principaux différenciateurs
- Largest same-package drop-in ecosystem in the MB91520 series (vs MB91F528USCPMC-GSE2)
- 1.0625 MB Flash tier - mid-range sweet spot for body ECUs (vs MB91F526LWEPMC-GSK5E2)
- Dual prefix compatibility (MB91 / CY91) (vs CY91F526LKCPMC-GSE2)
Notes de conception
Estimated: For a 176-LQFP automotive MCU switching at 80 MHz with multiple CAN/LIN buses, place 100nF ceramic decoupling capacitors adjacent to every VCC/VSS pin pair. Add a 4.7uF bulk tantalum or polymer cap within 10mm of each power cluster. Use a 4-layer PCB with a dedicated ground plane below the MCU to minimise EMI coupling from CAN bus edges into the digital core.
Estimated: Power dissipation at 80 MHz full activity is approximately 200-300 mW based on the FR81S core's typical current consumption. With 5V supply and 3.3V IO active, junction temperature rise is ~20-30 C above ambient for the 176-LQFP (theta_JA ~30 C/W with adequate copper). Provide a continuous copper pour on top/bottom layers connected to the thermal pad area for reliable thermal performance under hood mounting.
Do not assume suffix-variant MCUs (GSE2 vs GSK5E2 vs GTK5E1) are bit-for-bit identical. Per cross-reference listings on Avaq and Jakelectronics, suffix codes change temperature grade, peripheral mix, or factory screening. Always validate the ordering table in the manufacturer datasheet before substituting parts in production. Also confirm that the firmware image size fits within the smaller Flash variant's 1.0625 MB boundary.
For CAN bus signals, place the TJA1042/TJA1043 transceiver within 50mm of the MCU's CAN TX/RX pins and route the CANH/CANL traces as a 100 ohm differential pair with ground plane reference. Keep CAN traces away from switching regulator and PWM outputs to prevent radiated EMI coupling. Add a 120 ohm split-termination network at each end of the CAN bus for reliable high-speed CAN-FD communication.
Informations de conformité
AEC-Q100 qualified per Mouser listing classifying part as Auto MCU. RoHS compliant per standard Infineon/Cypress automotive MCU product family compliance. Halogen-free status not explicitly disclosed in distributor listings.
