MC13892BJVK - PMIC 4 Buck/12 LDO for i.MX51 | NXP
Référence : MC13892BJVK ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $9.8 | $980,00 |
| 500 | $8.6 | $4 300,00 |
| 1 000 | $7.45 | $7 450,00 |
MC13892BJVK Présentation
A PMIC (Power Management Integrated Circuit) is a category of mixed-signal IC that consolidates multiple DC-DC converters, LDOs, battery charging, and supervisory functions onto one die. The MC13892 belongs to the application-processor companion PMIC subclass, sitting in the power management hierarchy as: PMIC -> power management IC -> mixed-signal IC -> semiconductor. By collapsing a discrete power tree of 5-7 ICs into one device, the MC13892 reduces BOM count, PCB area, and software complexity in portable and embedded designs.
Key specifications include four synchronous buck converters delivering up to 1.55 A combined, twelve low-dropout regulators for system rails, an integrated Li-Ion/Li-Polymer battery charger with thermal regulation, a 10-bit ADC for system monitoring, a real-time clock supply, and a backlight LED driver with programmable current. The 139-TFBGA package uses a 7x7 mm body with 0.5 mm ball pitch, suitable for handheld and mobile PCB layouts. SPI/I2C control enables dynamic voltage scaling for power-aware OS kernels.
Architecturally, the MC13892 uses a buck-then-LDO topology where switching converters generate intermediate rails and clean LDOs post-regulate them for noise-sensitive blocks such as PLL, audio codec AVDD, and RF transceivers. This two-stage approach achieves better ripple performance than a buck-only design while maintaining high efficiency at moderate load currents. The integrated power sequencing controller ensures i.MX boot-up order is satisfied without external logic.
Typical applications include personal media players, GPS/navigation devices, e-readers, handheld industrial terminals, and tablets based on i.MX application processors. The wide input range and integrated charger simplify single-cell Li-Ion designs. The LED backlight driver also serves small LCD panels up to ~5 inches directly.
When designing with this PMIC, follow the i.MX51 reference manual power map and route all four switch-mode converters with minimum 1 oz copper pours to manage thermals at full load. Decoupling per the Freescale PCB layout application note must be observed to maintain noise and stability margins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC13892BJVK — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC13892BJVK (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Battery Charger, LDO Regulators, Product Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC13892CJVKR2
✅ Remplacement direct✓ En stock
$6.4 / unité
Voir la fiche technique →MC13892AJFK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC13892BJFKR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34708VKR2
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →MC34709VKR2
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →MC13892BJVK Spécifications
| Product Type | PMIC (Power Management + User Interface IC) |
| Topologie | 4 Buck + 12 LDO + Battery Charger + LED Driver |
| Application Processor Support | i.MX51, i.MX37, i.MX35, i.MX27 |
| Number of Buck Converters | 4 |
| Number of LDOs | 12 |
| Battery Charger | Integrated Li-Ion/Li-Polymer |
| LED Driver | Integrated backlight LED driver |
| Audio Codec | Integrated |
| ADC | 10-bit monitoring ADC |
| Control Interface | SPI / I2C |
| Boîtier | 139-TFBGA (7x7 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | Compliant (per distributor listing) |
Guide de configuration des broches du MC13892BJVK 139-tfbga (7x7 mm, 0.5 mm pitch)
Configuration des broches du MC13892BJVK (boîtier 139-tfbga (7x7 mm, 0.5 mm pitch)). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour MC13892BJVK.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC13892BJVK convient pour 6 applications: Personal Media Player (PMP), GPS / Navigation Device, E-Reader / Tablet Platform, Handheld Industrial Terminal, Single-Board Computer / Embedded Module, Portable Audio / Headphone Device.
Personal Media Player (PMP)
The MC13892BJVK was designed specifically as the companion PMIC for i.MX51-based personal media players. Its four buck converters deliver the high-current VDD_CORE, VDD_ARM, and memory rails required by the i.MX51, while twelve LDOs supply low-noise audio, USB, and peripheral rails. The integrated Li-Ion charger accepts a USB or wall-adapter input and provides charge-status outputs to the host. Compared to a discrete power tree, the MC13892 reduces BOM count by 6-8 ICs and shrinks the power section to roughly one quarter of the PCB area. Designers should follow the Freescale i.MX51 reference manual power map and the MC13892 PCB layout application note for switching-converter copper-pour geometry to meet audio noise and EMC targets.
Recommandé
GPS / Navigation Device
Portable GPS and personal navigation devices based on the i.MX37 or i.MX35 use the MC13892BJVK to generate every rail in a single chip. The PMIC powers the GPS receiver, display, audio amplifier, and SoC core simultaneously, with dynamic voltage scaling on the buck rails enabling extended battery life on a single Li-Ion cell. Its integrated 10-bit monitoring ADC allows the host to read battery voltage, die temperature, and charger current for fuel-gauge and thermal-management algorithms. The buck-then-LDO architecture ensures the GPS RF section sees sub-mV ripple on its supply, which is critical for receiver sensitivity and TTFF performance. Estimated battery run-time improvement over a discrete design is roughly 15-20% due to lower quiescent current and better sleep-mode coordination.
Recommandé
E-Reader / Tablet Platform
E-readers and small tablets based on the i.MX51 require a complete, low-standby-current power tree that the MC13892BJVK provides out of the box. Its buck converters power the application core and DDR memory, while dedicated LDOs feed the e-ink display controller, audio codec, and touch controller. The integrated LED backlight driver (where applicable) supports front-light arrays without an external driver IC. Sleep-mode quiescent current in the MC13892 is low enough that a fully charged 3.7 V 1500 mAh Li-Polymer cell can power an e-reader on standby for several weeks. The SPI/I2C control interface lets the host OS perform dynamic voltage scaling tied to CPU operating points, maximizing reading-time battery endurance.
Recommandé
Handheld Industrial Terminal
Ruggedized handheld terminals (barcode scanners, inventory devices, field-service computers) based on the i.MX35 or i.MX27 leverage the MC13892BJVK to consolidate power into a single thermally-rugged TFBGA. Industrial temperature support and the integrated battery charger simplify designs operating from -20 C to +70 C ambient with hot-swap battery packs. The four high-current buck rails can source up to roughly 1.5 A combined for the application processor plus a WLAN/Bluetooth module, while twelve LDOs supply the scanner, keypad, display, and audio subsystems. SPI/I2C control enables the host to monitor battery health and rail status for diagnostics, an important requirement for industrial asset-tracking fleets where field failure rates drive service cost.
Recommandé
Single-Board Computer / Embedded Module
Single-board computers and system-on-module designs based on i.MX51, i.MX37, i.MX35, or i.MX27 use the MC13892BJVK as a complete power solution on the carrier board. The PMIC accepts a wide DC input range from a regulated 5 V supply or a single-cell Li-Ion pack and produces all SoC and peripheral rails with proper sequencing. The integrated 10-bit monitoring ADC reports rail voltages and die temperature to the OS for thermal management. Compared to designing four buck + twelve LDO discrete designs, the MC13892 reduces development time from months to weeks, and the Freescale PCB layout application note provides proven keep-out and copper-pour guidance that minimizes EMC and thermal issues. Recommended for new i.MX module designs requiring fast time-to-market.
Recommandé
Portable Audio / Headphone Device
Portable audio devices and headphone amplifiers benefit from the MC13892BJVK's audio-friendly LDO post-regulation. The buck converters generate the high-current digital and memory rails, while dedicated low-noise LDOs feed the audio DAC and headphone amplifier AVDD pins, achieving a power-supply noise floor well below the audible band. The integrated audio block simplifies headphone-driver designs by mixing and routing analog signals directly inside the PMIC. Compared to using a switching regulator alone, the MC13892's buck-then-LDO architecture delivers better than 80 dB PSRR at audio frequencies, which translates into measurable THD+N improvement at the headphone output. Single-cell Li-Ion battery operation extends portable playback time on small-form-factor designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC13892BJVK — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC13892CJVK | MC13892AJFK | MC13892BJFKR2 | MC34708VK | MC34709VK |
|---|---|---|---|---|---|---|
| Package | 139-TFBGA (7x7 mm) | 139-TFBGA (7x7 mm) - same | 139-TFBGA (7x7 mm) - same | 139-TFBGA (7x7 mm) - same | 139-MAPBGA (8x8 mm) - larger | 139-MAPBGA (8x8 mm) - larger |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Buck Converters | 4 | 4 | 4 | 4 | 4 | 4 |
| LDO Regulators | 12 | 12 | 12 | 12 | 12 | 12 |
| Battery Charger | Yes (Li-Ion/Li-Poly) | Yes (Li-Ion/Li-Poly) | Yes (Li-Ion/Li-Poly) | Yes (Li-Ion/Li-Poly) | Yes | Yes |
| LED Driver | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| i.MX Processor Support | i.MX51, i.MX37, i.MX35, i.MX27 | i.MX51, i.MX37, i.MX35, | i.MX51, i.MX37, i.MX35, | i.MX51, i.MX37, i.MX35, | i.MX51 family optimized | i.MX53 optimized |
| Lifecycle Status | NRND | Active (later revision) | EOL (older revision) | NRND | NRND | NRND |
Principaux différenciateurs
- Integrated audio block eliminates external codec for simple audio paths (vs Generic PMIC without audio block)
- Higher LDO count (12 vs typical 6-8 in competing PMICs) (vs TI TPS65090)
- Native i.MX51/37/35/27 power sequencing support (vs Cross-brand PMICs)
Notes de conception
Follow the Freescale/NXP MC13892 PCB layout application note carefully. The four synchronous buck converters require minimum 1 oz copper pours on input/output loops, with the input ceramic capacitors placed within 2 mm of the IC balls and the inductor keep-out region free of traces to minimize radiated EMI. The 139-TFBGA 0.5 mm pitch package requires NSMD (non-solder mask defined) pads with microvia-in-pad recommended for the central ground balls to achieve reliable thermal dissipation.
At full load with all four bucks running near maximum current, the MC13892BJVK can dissipate 1-1.5 W. The 139-TFBGA package relies on thermal balls plus PCB copper pour for heat removal - 4-6 thermal vias under the die-attach pad tied to a 1 square inch inner-layer copper pour is recommended. Without adequate thermal relief, junction temperature can exceed 100 C in enclosed handheld enclosures, triggering the internal thermal shutdown.
Do not apply input voltage until the MC13892BJVK's RESET/ENABLE sequence is satisfied - if the host attempts SPI communication before the PMIC is ready, the bus returns all-ones and the host may misinterpret this as a fault. Also note that the i.MX51 boot order requires specific rails (VDD_CORE, VDD_ARM, then peripheral rails) to come up in sequence; deviating from the reference manual sequence can prevent the SoC from booting cleanly. Always verify the power sequence with an oscilloscope on each rail during bring-up.
Informations de conformité
RoHS compliance confirmed by distributor listings (DigiKey, Mouser). REACH, halogen-free, and conflict-mineral declarations are not present in the verified web data and should be requested from NXP product compliance for production-bill-of-materials sign-off. AEC-Q100 not applicable - industrial/consumer grade only.
