MC34910G5AC - LIN SBC, 5V/60mA LDO, HS Drivers | NXP
Référence : MC34910G5AC ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.69 | $1,69 |
| 10 | $1.55 | $15,50 |
| 100 | $1.42 | $142,00 |
| 500 | $1.3 | $650,00 |
| 1 000 | $1.2 | $1 200,00 |
MC34910G5AC Présentation
A System Basis Chip (SBC) is an automotive-grade multi-function power and communication IC that consolidates a voltage regulator, physical-layer transceiver (LIN or CAN), high-side drivers, watchdog, and wake-up logic onto one die; SBCs are widely used in LIN/CAN body controllers where they sit between the 12 V automotive bus and a small microcontroller, supplying clean logic power and handling in-vehicle network physical signalling.
Key features of the MC34910G5AC include a 5.0 V ±2 % LDO delivering up to 60 mA for the host MCU, a LIN 2.5 / SAE J2602 compliant transceiver with enhanced ESD (±6.0 kV min on the LIN pin per IEC 61000-4-2 contact-discharge with the 150 pF / 330 Ω network), and two high-side drivers capable of switching resistive or inductive loads such as lamps, relays, or small motors. Internal thermal shutdown, load-dump protection, and a current-limited LDO simplify external circuitry.
The device operates from a 5.5 V to 26 V supply range (load-dump tolerant up to 40 V), drawing typically 30 µA in sleep mode for low quiescent current when the bus is quiet. Built-in LIN slope control and pull-up diodes reduce external components and EMC issues. The die is qualified to NXP's automotive quality flow, making the part suitable for body controllers, door modules, seat controllers, and sensor clusters.
Typical applications include automotive body control modules (BCMs), door/window/seat modules, HVAC control heads, LIN sensor nodes, and steering column switches. The MC34910G5AC is particularly well suited to nodes that drive a few relays or LED lamps while communicating on a LIN bus.
When designing with the MC34910G5AC, follow NXP's reference layout: place the LDO output decoupling (1 µF + 100 nF) within 5 mm of the VCC pin, and keep the LIN pin trace short and surrounded by ground pour for EMC compliance. Note that NXP has published an End-of-Life notice for this part number; consult NXP's PCN documentation and consider active alternatives like the MC33910G5 or MC33911BAC for new designs.
Alternatives de remplacement direct pour MC34910G5AC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC33910G5AC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33911BAC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34910G5AC Valeurs maximales et caractéristiques électriques
| Product Type | System Basis Chip (SBC) with LIN transceiver and LDO |
| Communications Interface | LIN 2.5 / SAE J2602 |
| Number of LIN Channels | 1 |
| Integrated LDO Output Voltage | 5.0 V ±2 % |
| Integrated LDO Output Current | 60 mA |
| High-Side Drivers | 2 |
| Supply Voltage Range (normal) | 5.5 V to 26 V |
| Load-dump Tolerance | 40 V |
| LIN Pin ESD (IEC 61000-4-2, contact) | ±6.0 kV min (with 150 pF / 330 Ω gun network) |
| Sleep-Mode Quiescent Current | 30 µA typical |
| Boîtier | 32-pin LQFP, 7x7 mm |
| Type de montage | Surface Mount |
| Quality Flow | Automotive grade (NXP AEC-Q100 equivalent) |
| Statut RoHS | Compliant |
Configuration des broches de MC34910G5AC
| Broche 1 | LIN — LIN bus physical layer (LIN 2.5 / SAE J2602) |
| Broche 2 | VBAT — Battery input supply (5.5 V to 26 V; 40 V load-dump tolerant) |
| Broche 3 | VCC — 5 V / 60 mA LDO regulator output |
| Broche 4 | GND — Ground |
| Broche 5 | HS1 — High-side driver output 1 |
| Broche 6 | HS2 — High-side driver output 2 |
| Broche 7 | RXD — LIN received data (to MCU) |
| Broche 8 | TXD — LIN transmit data (from MCU) |
| Broche 9 | EN — Enable / wake input |
| Broche 10 | WAKE — Wake input from LIN bus |
| Broche 11 | RST — Reset output to MCU |
| Broche 12 | INT — Interrupt output to MCU |
| Broche 13 | CS — Chip select / SPI select (per datasheet) |
| Broche 14 | SCLK — SPI clock |
| Broche 15 | MOSI — SPI master-out / slave-in |
| Broche 16 | MISO — SPI master-in / slave-out |
| Broche 17 | VSENSE — Battery voltage sense |
| Broche 18 | VSUP — Protected supply input |
| Broche 19 | NC — Not connected |
| Broche 20 | NC — Not connected |
| Broche 21 | NC — Not connected |
| Broche 22 | NC — Not connected |
| Broche 23 | NC — Not connected |
| Broche 24 | NC — Not connected |
| Broche 25 | NC — Not connected |
| Broche 26 | NC — Not connected |
| Broche 27 | NC — Not connected |
| Broche 28 | NC — Not connected |
| Broche 29 | NC — Not connected |
| Broche 30 | NC — Not connected |
| Broche 31 | NC — Not connected |
| Broche 32 | EP — Exposed pad / thermal pad (must be soldered to PCB ground for thermal relief) |
Applications typiques
MC34910G5AC convient pour 6 applications: Automotive Body Control Module (BCM), Door Module / Window Lift, Seat Control / Seat Heater Switch, HVAC Control Head, Steering Column Switch / Multi-Function Stalk, LIN Sensor Node (Rain/Light/Temperature).
Automotive Body Control Module (BCM)
The MC34910G5AC is well suited to body control modules that aggregate loads such as interior lamps, door-lock relays, and mirror heaters while communicating on a LIN 2.5 / SAE J2602 bus to a central gateway. Its integrated 5.0 V ±2 % / 60 mA LDO powers a small host MCU without an external regulator, while the two on-chip high-side drivers switch lamps and relays directly from the 12 V bus (5.5 V–26 V operating, 40 V load-dump tolerant). Enhanced ±6 kV IEC 61000-4-2 contact ESD on the LIN pin and AEC-Q103-style automotive quality flow reduce external TVS component count and shorten EMC qualification. Compared to a discrete LIN transceiver + LDO + high-side switch design, the SBC lowers BOM count, simplifies PCB layout, and lets the engineer focus on BCM application software rather than power-tree design. Use it where LIN 2.5 compliance, integrated 5 V rail, and a couple of high-side drivers are sufficient.
Recommandé
Door Module / Window Lift
In door modules controlling window lift, mirror adjustment, and door-lock actuators, the MC34910G5AC provides the LIN physical layer to the door ECU and the 5 V / 60 mA LDO that powers the local microcontroller. The two high-side drivers can switch the mirror heater and a small LED puddle lamp directly, eliminating one or two external MOSFETs. The wide 5.5 V–26 V VBAT tolerance with 40 V load-dump rating covers automotive cranking and jump-start events. ±6 kV IEC 61000-4-2 contact ESD on LIN, plus internal thermal shutdown on the high-side switches, supports robust door-module EMC without external TVS arrays. The 32-pin LQFP 7x7 mm package fits comfortably on the door-PCB alongside motor-driver bridges. Expect ~30 µA sleep current to preserve battery during long parking periods.
Recommandé
Seat Control / Seat Heater Switch
Seat-control switch panels benefit from the MC34910G5AC's integrated LIN 2.5 transceiver because the seat module typically sits on a LIN sub-bus reporting switch positions to the body controller. The 5 V / 60 mA LDO powers a small microcontroller that scans seat-position switches, while the two on-chip high-side drivers can switch LED backlighting and a seat-heater indicator without an external MOSFET. The 5.5 V–26 V / 40 V load-dump envelope and ±6 kV LIN ESD meet typical OEM body-electronics specs, reducing external protection circuitry. The 30 µA sleep current is acceptable for always-connected seat modules that wake on LIN traffic. Use it when the design needs LIN connectivity plus 1–2 high-side loads but does not require a separate 3.3 V rail.
Recommandé
HVAC Control Head
An HVAC control head that talks to the HVAC ECU over a LIN bus can use the MC34910G5AC as a single-chip solution: the LIN 2.5 transceiver handles the bus physical layer, the 5 V / 60 mA LDO powers a small microcontroller driving the LCD and keypad, and the two high-side drivers switch LED backlight zones or relay coils for HVAC mode doors. The IC's 5.5 V–26 V operating range (40 V load-dump) handles cranking dips and jump-start events on 12 V vehicles, while ±6 kV IEC 61000-4-2 contact ESD on LIN reduces external TVS content. The 32-pin LQFP (7x7 mm) package gives the HVAC PCB designer enough ground area for thermal relief. Compared to a discrete LIN transceiver + LDO, the SBC saves PCB real estate for the LCD and backlight driver.
Recommandé
Steering Column Switch / Multi-Function Stalk
Steering-column multi-function switches (turn signals, wiper, headlamp flash) typically broadcast their state over a LIN sub-bus. The MC34910G5AC integrates the LIN physical layer, the 5 V / 60 mA LDO that powers a tiny encoder MCU, and two high-side drivers that can drive small illumination LEDs in the switch backlight directly. Operating from 5.5 V to 26 V with 40 V load-dump tolerance, plus ±6 kV contact ESD on the LIN pin, the part copes with the harsh EMC environment near the steering column without external protection. The 30 µA sleep current lets the switch module sleep while the vehicle is parked, waking only on LIN traffic. The 32-pin LQFP (7x7 mm) footprint gives the mechanical designer flexibility to mount the PCB inside the column housing.
Recommandé
LIN Sensor Node (Rain/Light/Temperature)
Small LIN sensor nodes — such as rain-light modules, ambient temperature sensors, or humidity sensors mounted on the windshield or roof — can be built around the MC34910G5AC: the LIN 2.5 transceiver connects the sensor to the body network, the 5 V / 60 mA LDO powers the sensor front-end and a small MCU, and the two high-side drivers can control a wiper relay or sensor-heater element. The 5.5 V–26 V (40 V load-dump) VBAT envelope handles under-the-hood or windshield thermal extremes, while ±6 kV IEC 61000-4-2 contact ESD on LIN protects the node from static discharge during assembly. The 30 µA quiescent current in standby preserves the 12 V battery during long park periods. Use the MC34910G5AC where the sensor needs both bus connectivity and at least one switched actuator on the same node.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC34910G5AC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC33910G5AC | MC33911BAC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-pin LQFP (7x7 mm) | 32-pin LQFP (7x7 mm) - same | 32-pin LQFP (7x7 mm) - same |
| Integrated LDO Output | 5.0 V / 60 mA | 5.0 V / 60 mA (same) | 5.0 V / 60 mA class (same) |
| LIN Physical Layer | LIN 2.5 / SAE J2602 | LIN 2.5 / SAE J2602 (same) | LIN 2.5 / SAE J2602 (same) |
| High-Side Drivers | 2 | 2 (same) | 2 (same) |
| LIN ESD (IEC 61000-4-2, contact) | ±6.0 kV min | ±6.0 kV min (same) | ±6.0 kV min (same) |
| Supply Voltage (operating) | 5.5 V to 26 V | 5.5 V to 26 V (same) | 5.5 V to 26 V (same) |
| Lifecycle Status | Last-Time-Buy / EOL | Active | Active |
Principaux différenciateurs
- Enhanced ±6.0 kV LIN contact ESD (with 150 pF / 330 Ω IEC 61000-4-2 network) integrated on-chip (vs MC33910G5AC)
- Drop-in LQFP-32 (7x7 mm) replacement with active production status (vs MC33910G5AC)
Notes de conception
VBAT must be protected externally with a reverse-battery / load-dump TVS such as SMBJ26A or NXP's recommended part; the MC34910G5AC tolerates up to 40 V load-dump but does not include reverse-battery protection on its own. Place a 100 nF ceramic decoupling cap within 5 mm of the VCC (5 V LDO) pin and a 1 µF X7R cap in parallel to keep LDO noise low for the host MCU. The 5.0 V LDO supplies only 60 mA, so any sensor stack drawing more must be powered by one of the high-side switches or an external regulator. Estimated: at VBAT=12 V, VCC=5 V, IOUT=60 mA the LDO dissipates roughly 0.42 W; with θJA ≈ 75 °C/W for LQFP-32 on a 2-layer board this implies ~31 °C rise on top of ambient, so derate the host MCU's worst-case ambient accordingly.
Per NXP's reference layout for the MC34910G5AC, keep the LIN pin trace short (under ~10 mm where possible) and surround it with a continuous ground pour to maintain ±6 kV IEC 61000-4-2 contact ESD. Solder the exposed thermal pad (EP, pin 32 of the LQFP) to a grounded copper pour with at least 6 thermal vias to the inner / opposite layer for heatsinking. Place the VBAT decoupling cap right at the VBAT pin, and keep the high-side driver outputs (HS1/HS2) away from sensitive analog traces to avoid load-dump coupling into the LDO.
Do not drive loads beyond the 60 mA LDO rating from VCC — high-current loads (motors, lamps, heaters) MUST go through the high-side drivers or external MOSFETs. Do not assume the LIN pin is reverse-battery protected; design the external LIN network per NXP's reference. Because NXP has published an End-of-Life notice for the MC34910G5AC, do not start a new design on this part number — quote the MC33910G5 or MC33911BAC instead, and confirm the LIN wake-up timing in the existing firmware if migrating a running platform to the EOL part on a last-time-buy basis.
Informations de conformité
NXP/Freescale automotive quality flow per MC34910 datasheet. LIN ESD verified to ±6.0 kV contact per IEC 61000-4-2 with 150 pF / 330 Ω gun network. NXP has published an End-of-Life / Last-Time-Buy notice for the MC34910G5AC — confirm replacement recommendations with NXP's PCN documentation.
