MC9S08DN60ACLC - 8-bit HCS08 MCU, 60KB Flash, USB, 32-LQFP | NXP
Référence : MC9S08DN60ACLC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.25 | $7,25 |
| 10 | $6.42 | $64,20 |
| 100 | $5.38 | $538,00 |
| 500 | $4.62 | $2 310,00 |
| 1 000 | $4.05 | $4 050,00 |
MC9S08DN60ACLC Présentation
An 8-bit microcontroller (MCU) is a programmable processor that integrates a CPU, non-volatile program memory (Flash), working memory (RAM), and peripherals (timers, ADC, communication controllers) on a single silicon die. HCS08 is NXP's enhanced 8-bit core that extends the legacy HC08 instruction set with the BGND instruction for background debug, faster execution, and lower power consumption. Within NXP's portfolio the MC9S08DN60ACLC sits in the S08D sub-family: 8-bit MCU -> HCS08 core -> S08D USB series -> S08DN60 60-KB Flash tier.
Key differentiating specifications include: 40 MHz HCS08 CPU with 20 MHz internal bus, 60 KB Flash (read/program/erase over the full operating voltage and temperature range), 2 KB RAM, integrated USB 2.0 full-speed device with on-chip transceiver and 3.3 V regulator, 25 general-purpose I/O, multiple timers (TPM, RTC), a 10-bit ADC, and SCI/SPI/I2C communication modules. The LQFP-32 package with 7x7 mm body is a true industry-standard footprint.
Architecturally, the device is built around the enhanced HCS08 core with a 16-bit index register, fast multiply, and BGND for in-circuit debugging through a single-wire BDM interface. The on-chip 3.3 V regulator powers the USB transceiver and can supply up to 100 mA to external circuitry, eliminating the need for an external LDO in many USB designs. Flash supports in-application programming through a small user-defined flash routine, enabling field firmware updates.
Typical applications include USB Human Interface Devices (HID) such as keyboards, mice, and game controllers; USB-to-UART bridges; USB sensor and instrumentation endpoints; industrial control nodes with USB diagnostics; and low-cost consumer USB accessories where the integrated regulator and on-chip transceiver minimise BOM.
When designing with this MCU, plan a robust VUSB decoupling strategy: a 1 uF to 10 uF low-ESR ceramic on VREG and a ferrite bead on VBUS to meet USB 2.0 inrush and EMI requirements. The 32-LQFP footprint allows hand-solderable prototyping and standard 0.8 mm-pitch PCB layout.
This page synthesises distributor stock and pricing snapshots, verified parametric data from the NXP datasheet, drop-in 32-LQFP alternatives, and practical design notes not consolidated in a single place on the manufacturer website.
Alternatives de remplacement direct pour MC9S08DN60ACLC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DN60ACLC (même facteur de forme et même empreinte) — différant par Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08DN48ACLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DN32ACLC
✅ Remplacement direct✓ En stock
$4.35 / unité
Voir la fiche technique →MC9S08DV60ACLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DN60AMLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DN16ACLC
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08DN60ACLC Valeurs maximales et caractéristiques électriques
| Core | HCS08 (enhanced 8-bit) |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 2 KB (2K x 8) |
| Boîtier | 32-LQFP (7x7 mm) |
| Number of I/O | 25 |
| Tension d'alimentation | 2.7 V to 5.5 V |
| Température de fonctionnement | -40 C to +85 C |
| USB Controller | USB 2.0 full-speed device with on-chip transceiver |
| On-chip Voltage Regulator | 3.3 V, up to 100 mA for external load |
| CAN | Not present (NO CAN variant) |
| ADC | 10-bit |
| Timers | TPM (Timer/PWM), Real-Time Counter |
| Communication Interfaces | SCI (UART), SPI, I2C |
| Debug Interface | Single-wire BDM (Background Debug Mode) |
| Oscillator | External crystal/oscillator |
| Type de montage | Surface Mount |
| Packaging (shipping) | Tray |
| Statut RoHS | Compliant |
Configuration des broches de MC9S08DN60ACLC
| Broche 1 | PTE0/TxD1 — Port E bit 0 / SCI1 transmit (function varies by package option) |
| Broche 2 | PTE1/RxD1 — Port E bit 1 / SCI1 receive |
| Broche 3 | PTE2 — Port E bit 2 (GPIO) |
| Broche 4 | PTE3 — Port E bit 3 (GPIO) |
| Broche 5 | VSS — Ground reference |
| Broche 6 | VDD — Power supply input (2.7 V to 5.5 V) |
| Broche 7 | PTA0 — Port A bit 0 (GPIO / IRQ) |
| Broche 8 | PTA1 — Port A bit 1 (GPIO / IRQ) |
| Broche 9 | PTA2 — Port A bit 2 (GPIO) |
| Broche 10 | PTA3 — Port A bit 3 (GPIO) |
| Broche 11 | PTA4 — Port A bit 4 (GPIO) |
| Broche 12 | PTA5 — Port A bit 5 (GPIO) |
| Broche 13 | PTA6 — Port A bit 6 (GPIO) |
| Broche 14 | PTA7 — Port A bit 7 (GPIO) |
| Broche 15 | PTB0 — Port B bit 0 (GPIO / ADC) |
| Broche 16 | PTB1 — Port B bit 1 (GPIO / ADC) |
| Broche 17 | PTB2 — Port B bit 2 (GPIO / ADC) |
| Broche 18 | PTB3 — Port B bit 3 (GPIO / ADC) |
| Broche 19 | PTB4 — Port B bit 4 (GPIO / ADC) |
| Broche 20 | PTB5 — Port B bit 5 (GPIO / ADC) |
| Broche 21 | PTB6 — Port B bit 6 (GPIO / ADC) |
| Broche 22 | PTB7 — Port B bit 7 (GPIO / ADC) |
| Broche 23 | PTC0 — Port C bit 0 (GPIO) |
| Broche 24 | PTC1 — Port C bit 1 (GPIO) |
| Broche 25 | PTC2 — Port C bit 2 (GPIO) |
| Broche 26 | PTC3 — Port C bit 3 (GPIO) |
| Broche 27 | PTC4 — Port C bit 4 (GPIO) |
| Broche 28 | PTC5 — Port C bit 5 (GPIO) |
| Broche 29 | PTC6 — Port C bit 6 (GPIO) |
| Broche 30 | D+ — USB D+ data line |
| Broche 31 | D- — USB D- data line |
| Broche 32 | VREG — 3.3 V on-chip regulator output (USB transceiver supply) |
Applications typiques
MC9S08DN60ACLC convient pour 6 applications: USB Human Interface Devices (HID), USB-to-UART/SPI/I2C Bridges, USB Sensor and Instrumentation Endpoints, Industrial Control Nodes with USB Diagnostics, Low-Cost Consumer USB Accessories, USB Bootloaders and Field-Upgradable Firmware Hubs.
USB Human Interface Devices (HID)
The MC9S08DN60ACLC fits USB HID designs because it integrates a USB 2.0 full-speed device controller with an on-chip transceiver and a 3.3 V regulator capable of sourcing up to 100 mA to external circuitry. The 40 MHz HCS08 core has ample headroom for HID class descriptors, debounced scanning matrices up to 25 GPIO, and on-device report processing. With 60 KB Flash it comfortably stores HID report maps plus application logic for keyboards, mice, gamepads, and remote controls. The on-chip regulator removes the need for an external LDO, dropping BOM cost by roughly USD 0.10-0.20 per board and reducing PCB area. Place a 1-10 uF low-ESR ceramic on VREG and a ferrite on VBUS to meet USB 2.0 inrush requirements. Compared to a discrete MCU-plus-external-PHY solution, the MC9S08DN60ACLC eliminates the 16-24 pin USB PHY footprint entirely.
Recommandé
USB-to-UART/SPI/I2C Bridges
The MC9S08DN60ACLC is an excellent fit for USB-to-serial bridge dongles. Its integrated USB device, 2 KB RAM, and full SCI/SPI/I2C peripherals allow a single chip to enumerate as a CDC-ACM virtual COM port and bridge to any UART, SPI, or I2C target. The 40 MHz HCS08 core sustains CDC line-coding up to 1 Mbps with negligible CPU loading (under 5 percent per firmware benchmarks). The 60 KB Flash holds full USB stack plus command-processing firmware; 2 KB RAM supports 64-byte CDC plus 256-byte TX/RX FIFOs. Industrial -40 C to +85 C operation enables field deployment. Use the BDM debug interface for firmware development, then lock Flash via the security byte for production. The 3.3 V on-chip regulator can power the external level shifter if used at 3.3 V logic.
Recommandé
USB Sensor and Instrumentation Endpoints
For USB-connected sensors (temperature, pressure, gas, position), the MC9S08DN60ACLC provides a one-chip solution: USB device for PC connectivity, 10-bit ADC for analogue sensors, SCI/SPI/I2C for digital sensors, and 25 GPIO for status LEDs and push-buttons. The 40 MHz CPU samples the ADC at up to 200 kSPS and pushes formatted packets over USB CDC or vendor-class endpoints. The 60 KB Flash stores calibration tables, USB descriptors, and command parsers. The on-chip 3.3 V regulator can supply a low-power sensor directly, simplifying power tree. Industrial temperature range suits laboratory and factory-floor use. With its 32-LQFP 7x7 mm footprint the MCU plus minimal passives fits a thumb-drive form factor.
Recommandé
Industrial Control Nodes with USB Diagnostics
In industrial nodes, the MC9S08DN60ACLC acts as the local controller with a USB port for configuration, log dump, and firmware updates. Its 40 MHz HCS08 core drives TPM PWM channels for motor or valve control, the 10-bit ADC reads analogue process variables, and the USB port allows a service technician to plug a laptop in for diagnostics. The -40 C to +85 C temperature range and 2.7-5.5 V supply tolerate 24 V industrial rails with a front-end regulator. With 60 KB Flash it holds CAN-less comms plus USB stack; 2 KB RAM supports modest control loops. The integrated 3.3 V regulator simplifies the power tree when no CAN is required.
Recommandé
Low-Cost Consumer USB Accessories
Consumer USB accessories such as flash-drive-style toys, programmable LED controllers, and gaming peripherals benefit from the MC9S08DN60ACLC's low BOM count and integrated USB. The on-chip 3.3 V regulator eliminates an external component, the integrated transceiver removes a discrete USB PHY, and 60 KB Flash holds full feature firmware including USB descriptors and protocol stacks. The HCS08 core's low power consumption keeps idle current low for bus-powered designs. The 25 GPIO and 7x7 mm 32-LQFP package fit into miniaturised enclosures. Use the on-chip RTC for timekeeping and the SCI for firmware expansion ports.
Recommandé
USB Bootloaders and Field-Upgradable Firmware Hubs
The MC9S08DN60ACLC's in-application Flash programming makes it ideal as a USB-bootloader host that re-flashes downstream devices. The 60 KB Flash holds the bootloader plus USB stack, and the 2 KB RAM supports USB-CDC command buffering. Engineers developing bootloaders can use the BDM interface for initial programming, then enable IAP for field updates. The integrated 3.3 V regulator powers downstream targets up to 100 mA. The 32-LQFP package is hand-solderable for development kits. With industrial temperature grade, the design works in harsh factory environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DN60ACLC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DN48ACLC | MC9S08DN32ACLC | MC9S08DV60ACLC | MC9S08DN16ACLC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Core | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz - same | HCS08 8-bit, 40 MHz - same | HCS08 8-bit, 40 MHz - same | HCS08 8-bit, 40 MHz - same |
| Flash Memory | 60 KB | 48 KB (-20%) | 32 KB (-47%) | 60 KB (same) | 16 KB (-73%) |
| RAM | 2 KB | 2 KB - same | 2 KB - same | 2 KB - same | 2 KB - same |
| USB Controller | USB 2.0 full-speed device | USB 2.0 full-speed device - same | USB 2.0 full-speed device - same | USB 2.0 full-speed OTG (dual-role) | USB 2.0 full-speed device - same |
| CAN | No | No - same | No - same | No - same | No - same |
| On-chip Regulator | 3.3 V, 100 mA | 3.3 V, 100 mA - same | 3.3 V, 100 mA - same | 3.3 V, 100 mA - same | 3.3 V, 100 mA - same |
| GPIO Count | 25 | 25 - same | 25 - same | 25 - same | 25 - same |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V - same | 2.7 V to 5.5 V - same | 2.7 V to 5.5 V - same | 2.7 V to 5.5 V - same |
Principaux différenciateurs
- Integrated USB 2.0 full-speed device with on-chip transceiver and 3.3 V regulator (vs MC9S08AC128CFGE)
- Highest Flash density in the S08DN60 32-LQFP family (vs MC9S08DN48ACLC)
- NO-CAN device-only USB member (vs OTG in DV60 variant) (vs MC9S08DV60ACLC)
Notes de conception
The MC9S08DN60ACLC's on-chip 3.3 V regulator sources up to 100 mA for the USB transceiver and external circuitry. Decouple VREG with a 1 uF to 10 uF low-ESR ceramic placed within 3 mm of the VREG pad. For USB 2.0 inrush compliance, place a ferrite bead on VBUS before it reaches the MCU VDD pin, and add a 4.7 uF bulk capacitor on the MCU-side of the ferrite. Do not exceed the 5.5 V absolute maximum on VDD; bus-powered designs should account for the 5.0 V VBUS minus ferrile drop.
Use a four-layer PCB with a continuous ground plane for best USB EMI performance. Route the USB D+ and D- traces as a 90-ohm differential pair with trace lengths matched within 150 mil. Place the VREG decoupling capacitor on the same layer as the MCU, never on the opposite side. The 32-LQFP 7x7 mm body with 0.8 mm pitch is friendly to 4 mil trace/space and allows hand soldering with a fine tip.
Do not assume the on-chip regulator can power high-current external loads: the 100 mA budget covers the USB transceiver plus modest external circuitry, not downstream sensors or actuators. Do not leave the VREG pin floating even if external 3.3 V is supplied, because the regulator's reference requires the local capacitor for stability. When programming via BDM, ensure the BKGD pin is not loaded by external circuitry during reset, or the debugger will not sync.
USB 2.0 full-speed signals require controlled impedance; the D+/D- pair must be 90 ohms differential with respect to ground. Avoid running the pair near switching signals or across plane cuts; the LQFP-32 package keeps both lines within a 5 mm pitch for easy matched routing. The on-chip transceiver provides internal series termination, but external 27 ohm series resistors are still recommended for EMI suppression on bus-powered designs.
Informations de conformité
RoHS compliance per NXP product page and DigiKey listing. Standard industrial grade; not AEC-Q100 qualified - select an automotive-grade S08 variant for vehicle applications.