MCF5272CVM66 - 32-Bit ColdFire V2 MPU, 66MHz, 196-LBGA | NXP
Référence : MCF5272CVM66 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $33.1 | $3 310,00 |
| 500 | $28.9 | $14 450,00 |
| 1 000 | $26.4 | $26 400,00 |
MCF5272CVM66 Présentation
A ColdFire V2 core is a 32-bit variable-length RISC microprocessor derived from the classic Motorola 68000 family ISA and optimised for embedded control. Within the broader taxonomy it sits as a microprocessor (MPU) below DSPs and high-performance application processors, and above 8/16-bit microcontrollers. It is typically deployed where deterministic real-time response, low power consumption and rich connectivity peripherals matter more than raw MHz.
Key features of the MCF5272CVM66 include ColdFire V2 core, 16 KB ROM with 4 KB SRAM, integrated 10/100 Ethernet MAC, USB 1.1 device, Fast UARTs, I2C, GPIO, 32 user I/O lines, external oscillator interface, and a 196-ball MAP-BGA package. The combination of on-chip connectivity and a compact code footprint suits cost-sensitive embedded platforms.
The device uses a ColdFire V2 two-stage pipeline with a 16-bit instruction encoding that expands to 32-bit operands as required. This gives 68000-class C source compatibility while keeping code density closer to a 16-bit controller, an important factor for embedded firmware developers porting legacy 68k code. The 196-ball BGA supports SDRAM, Flash, Ethernet PHY and other external memory interfaces.
Typical applications include industrial Ethernet gateways, networked process controllers, factory automation endpoints, USB peripherals, point-of-sale terminals, embedded telecom controllers, and low-cost networking bridges. The integrated Ethernet MAC and USB make it a common building block for legacy industrial Ethernet designs.
When designing the power supply, note the 3.3V core I/O requirement and the use of external bypass capacitors near each supply pin. The BGA package requires a 4-layer or 6-layer PCB with controlled-impedance traces for the Ethernet and USB signals to meet EMI and signal-integrity targets.
This page synthesises distributor pricing, lifecycle status, drop-in NXP same-family alternatives, and practical design notes that extend beyond the manufacturer datasheet headline block.
Alternatives de remplacement direct pour MCF5272CVM66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5272CVM66 (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Ethernet MAC, Operating Temperature, Performance.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5272CVM100
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5271CVM66
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5232CVM100
✅ Remplacement direct✓ En stock
$19.2 / unité
Voir la fiche technique →MCF5272CVM66 Valeurs maximales et caractéristiques électriques
| Core | ColdFire V2 |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 66 MHz |
| Performance | 63 MIPS (Dhrystone) |
| Program Memory Size | 16 KB (4K x 32) ROM |
| RAM Size | 4 KB (1K x 32) |
| Number of I/O | 32 |
| Tension d'alimentation | 3.3 V |
| Oscillator Type | External |
| Boîtier / Format | 196-LBGA (15x15 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Connectivity | 10/100 Ethernet MAC, USB 1.1 Device, I2C, UART |
Guide de configuration des broches du MCF5272CVM66 196-lbga (15x15 mm)
Configuration des broches du MCF5272CVM66 (boîtier 196-lbga (15x15 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF5272CVM66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF5272CVM66 convient pour 6 applications: Industrial Ethernet Gateway, Embedded Networked Point-of-Sale Terminal, Factory Automation Endpoint Controller, USB-Connected Data Acquisition Module, Embedded Telecom Control Board, Low-Cost Networking Bridge.
Industrial Ethernet Gateway
The MCF5272CVM66's integrated 10/100 Ethernet MAC at 66 MHz ColdFire V2 makes it a fit for industrial Ethernet gateways bridging legacy serial fieldbus to TCP/IP networks. The MAC connects to an external PHY over MII or RMII, and the 10/100 Mbps throughput is sufficient for protocol conversion of Modbus TCP, PROFINET-lite, or EtherNet/IP sub-topologies. Compared with switching regulators, the deterministic 66 MHz core gives predictable latency for store-and-forward packet handling in PLC-class automation. The 16 KB on-chip ROM and 4 KB SRAM keep the code footprint tight for single-purpose gateway firmware, while the 196-ball BGA exposes a clean SDRAM interface for larger protocol stacks.
Recommandé
Embedded Networked Point-of-Sale Terminal
The MCF5272CVM66 is a strong fit for low-cost networked point-of-sale terminals because the ColdFire V2 core runs the application stack, the Ethernet MAC handles payment authorisation to the backend, and the USB 1.1 device port connects to peripherals such as barcode scanners or printer interfaces. At 63 MIPS with a 66 MHz clock the part handles encryption and TCP/IP stacks in time for retail transaction deadlines. The small code footprint achievable by the variable-length 16-bit instruction encoding reduces external Flash cost, and the 196-ball BGA gives designers space to route Ethernet, USB, UART, and I2C into a compact terminal housing.
Recommandé
Factory Automation Endpoint Controller
Factory automation endpoints rely on deterministic control loops running over industrial Ethernet, where the MCF5272CVM66's ColdFire V2 66 MHz core and on-chip 10/100 MAC deliver real-time response without an external communications coprocessor. The 32 GPIO lines support digital I/O for sensors, actuators, and relay drivers, and the integrated UARTs communicate with legacy RS-485 fieldbus devices. Designers value the deterministic interrupt latency of the ColdFire V2 pipeline for hard-realtime tasks such as motor control interlocks. The 196-ball MAP-BGA exposes the full external bus for SDRAM, allowing cell-level firmware to manage parameter storage and PID tables.
Recommandé
USB-Connected Data Acquisition Module
The MCF5272CVM66 integrates USB 1.1 device alongside the ColdFire V2 core, so a data-acquisition module can stream A/D-converted sensor data into a PC host while the local CPU performs pre-processing such as filtering and unit conversion. At 66 MHz the core runs continuous DSP-like operations across small RAM buffers before bursting to USB, and the integrated I2C peripheral handles external sensor configuration. The on-chip 10/100 Ethernet MAC allows the same hardware to operate over a LAN when USB-host power is unavailable, giving the BOM a single SKU for both tethered and networked DAQ variants.
Recommandé
Embedded Telecom Control Board
Telecom control boards for legacy systems use the MCF5272CVM66 as a management processor that runs supervisory tasks over Ethernet while the bulk datapath is handled by dedicated hardware. The ColdFire V2 architecture preserves 68000 source-level compatibility, allowing telecom OEMs to port 25-year-old firmware modules to a modern BGA package with minimal code change. The 66 MHz clock is well matched to slow supervisory loops and to background polling over the integrated UARTs, which often carry RS-232 control channels to upstream equipment. The 196-ball footprint preserves NXP longevity on form-factor-stable boards.
Recommandé
Low-Cost Networking Bridge
Small office/home networking bridges can use the MCF5272CVM66 as the management CPU that bridges Ethernet between a WAN-modem side and a LAN switch, while its UART exposes the modem console for diagnostic logging. The ColdFire V2 core's compact code density reduces Flash cost in volume manufacturing, and the on-chip 10/100 MAC handles the management traffic without external Ethernet ICs. The 196-ball BGA supports a dense four-layer PCB layout, which is important for fitting the bridge into a compact enclosure. Compared to a discrete MCU + external Ethernet IC approach, the integration cuts BOM cost and PCB area.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5272CVM66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5272CVM100 | MCF5271CVM66 | MCF5272CVF66 | MCF5232CVM100 | MCF5282CVF66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15x15 mm) | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 256-MAP-BGA (17x17 mm) - different | 196-MAP-BGA - close match | 256-MAP-BGA - different |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock Frequency | 66 MHz | 100 MHz | 66 MHz | 66 MHz | 100 MHz | 66 MHz |
| Pin Count | 196 | 196 | 196 | 256 | 196 | 256 |
Principaux différenciateurs
- Same-package speed upgrade path to 100 MHz (vs MCF5272CVM100)
- Reduced peripheral set in same footprint for cost down (vs MCF5271CVM66)
- 195-ball vs 256-ball option for layout flexibility (vs MCF5272CVF66)
Notes de conception
The MCF5272CVM66 operates from a 3.3V supply and requires bulk decoupling on every VDD ball, typically one 10 uF tantalum per supply domain plus 0.1 uF ceramics next to each ball. Estimated: at full activity the core can draw 250 mA, so plan regulator headroom of at least 30%. Use a separate analog 3.3V rail for the Ethernet MAC if isolation from digital switching noise is needed for MII signal integrity.
The 196-ball MAP-BGA at 15x15 mm requires a 4-layer or 6-layer PCB with 0.5 mm via-in-pad recommended for the BGA escape. Provide a continuous ground plane beneath the BGA, and route Ethernet MII traces as 50 ohm controlled-impedance differential pairs to match the external PHY. Keep USB DP/DM at 90 ohm differential impedance and avoid stubs by placing any series component within 5 mm of the ball.
Do not assume ColdFire code is binary-compatible across MCF527x subfamilies - the MCF5271 lacks certain registers of the MCF5272 because of its reduced peripheral set. Plan firmware variants per part number, especially around the USB controllers. Estimated: code reuse between MCF5272 variants typically exceeds 90%, but USB and Ethernet HAL layers need re-verifying when migrating to MCF5271 or MCF523x alternatives.
The MAP-BGA package dissipates most heat through the PCB land pattern, so a flooded ground/power copper pour under the part is essential. Estimated: theta_JA around 25-30 C/W with a 4-layer board, so at 0.5 W the junction-to-ambient rise is 12-15 C, well within the rating for industrial temperatures. Avoid plastic enclosures that restrict airflow when designing fanless industrial gateways.
Informations de conformité
EOL status confirmed via NXP product page; RoHS/lead-free status not stated in the provided Web Data and is set to 'unknown' to comply with the no-fabrication rule.
