MCIMX6X2CVN08AB - i.MX 6SoloX 800MHz Cortex-A9 + 166MHz Cortex-M4 MPU | NXP
Référence : MCIMX6X2CVN08AB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.85 | $3 185,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $25.1 | $25 100,00 |
MCIMX6X2CVN08AB Présentation
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit designed to run an operating system and execute complex user-facing workloads, integrating CPU cores, graphics, multimedia, and I/O on a single die. Within the i.MX hierarchy, the 6SoloX sits between the lower-cost i.MX 6ULL (single Cortex-A7) and the higher-end i.MX 6Quad (quad Cortex-A9), offering heterogeneous A9+M4 computing in a cost-effective single-core A9 configuration. The integrated Cortex-M4 enables deterministic real-time tasks (sensor fusion, motor control, IO link management) without burdening the A9 application core.
Key features include 32 KB L1 instruction and data caches per core, 128 KB L2 cache, NEON SIMD media engine, multi-standard video codecs (MPEG-4, H.264, MJPEG), 2D/3D GPU acceleration (GC320 + GC880), dual-display support up to WXGA, dual GbE, two USB 2.0 with PHY, three SD card controllers, and LPDDR2/LVDDR3/DDR3 memory interface. Security is provided by HAB (High Assurance Boot), SNVS, and on-chip crypto acceleration. The SoC targets industrial temperature grades (-40C to +105C TJ).
Architecture combines heterogeneous computing with NXP's Smart System Power Management (SSPM) enabling per-domain power gating and DVFS. Manufacturing is done on a 40 nm low-power CMOS process, providing the performance-per-watt envelope required for fanless industrial designs. Multimedia acceleration offloads video encode/decode from the CPUs, freeing the A9 core for application logic.
Typical applications include industrial HMI panels, building automation gateways, IoT edge controllers, automotive infotainment head units, and telehealth devices. The dual-core A9+M4 split allows real-time sensor handling on the M4 while the A9 runs Linux for graphics and connectivity stacks.
When designing with this part, use the SABRE platform reference design and configure boot mode pins for the desired flash interface. Provide a clean 1.8V/2.5V/2.8V/3.15V I/O supply; decoupling per NXP hardware design guide is mandatory to meet SoC power-up sequencing requirements.
This page synthesizes distributor pricing, lifecycle status, and drop-in alternative analysis not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour MCIMX6X2CVN08AB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX6X2CVN08AB (même facteur de forme et même empreinte) — différant par Core Architecture, Mounting Type, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX6X2EVN08AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6X2CUN08AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6X1AVK08AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6X3EVO10AB
✅ Remplacement direct✓ En stock
$19.2 / unité
Voir la fiche technique →MCIMX6X2DVN10AB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX6X2CVN08AB Valeurs maximales et caractéristiques électriques
| Series | i.MX 6SoloX |
| Core Processor | ARM Cortex-A9 + ARM Cortex-M4 |
| Number of Cores | 2 (1x A9 + 1x M4) |
| Core Architecture | 32-bit |
| A9 Core Speed | 800 MHz |
| M4 Core Speed | 166 MHz |
| Co-Processors / DSP | Multimedia; NEON SIMD, GPU |
| Cache | 32 KB I-cache + 32 KB D-cache per core; 128 KB L2 |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| Graphics Acceleration | Yes (GC320 2D + GC880 3D) |
| USB | 2x USB 2.0 + PHY |
| Ethernet | 2x 10/100/1000 Mbps MAC |
| I/O Voltage | 1.8V, 2.5V, 2.8V, 3.15V |
| Température de fonctionnement | -40C to +105C (TJ) |
| Boîtier | 400-MAPBGA (17x17 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lifecycle | NRND (Not Recommended for New Designs) |
Guide de configuration des broches du MCIMX6X2CVN08AB 400-mapbga (17x17 mm)
Configuration des broches du MCIMX6X2CVN08AB (boîtier 400-mapbga (17x17 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX6X2CVN08AB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX6X2CVN08AB convient pour 7 applications: Industrial HMI Touch Panels, Building Automation Gateways, Automotive Infotainment Head Units, IoT Edge Controllers, Medical Point-of-Care Devices, Smart Energy / Substation Gateways, Digital Signage Players.
Industrial HMI Touch Panels
The MCIMX6X2CVN08AB suits industrial HMI panels requiring both rich graphics on the A9 core and deterministic touch/input handling. The 800 MHz Cortex-A9 with GC320/GC880 GPU drives WXGA LCDs with smooth Qt/Embedded or LVGL rendering, while the 166 MHz Cortex-M4 handles capacitive touch scanning, debouncing, and backlight PWM with microsecond latency. The integrated dual GbE enables PROFINET/EtherCAT gateway functionality, and DDR3 support allows large framebuffers. Industrial temperature rating (-40C to +105C TJ) supports factory floor deployment. Recommended companion: PCF8575 I/O expander for keypad scanning, TFP401 HDMI receiver for secondary displays.
Recommandé
Building Automation Gateways
For BACnet/Modbus/ KNX gateway designs, the MCIMX6X2CVN08AB's heterogeneous architecture is ideal. The Cortex-A9 at 800 MHz runs Linux with protocol stacks and web-based configuration UIs, while the Cortex-M4 at 166 MHz handles time-critical fieldbus polling with deterministic jitter under 10 microseconds. Dual GbE MACs enable daisy-chained ring topologies common in building automation, and the 2x USB 2.0 ports support WiFi/Bluetooth modules for wireless commissioning. Low-power process and per-domain power gating allow fanless DIN-rail mounting. Recommended companion: KSZ8081 PHY for Ethernet, ATWILC3000 for WiFi.
Recommandé
Automotive Infotainment Head Units
The MCIMX6X2CVN08AB targets entry-level automotive infotainment with its video codec acceleration and dual-display capability. The NEON SIMD engine handles H.264 720p decode for rear-seat entertainment, while GC880 3D GPU renders navigation graphics at 60 fps. The Cortex-M4 manages CAN bus message filtering and real-time audio mixing without OS jitter. Multiple SD card slots support map data and media libraries. AEC-Q100 qualification is NOT explicitly listed for this industrial-graded variant; for full automotive, consider i.MX 6Dual auto-grade parts. Recommended companion: TJA1040 CAN transceiver, MAX98090 audio codec.
Recommandé
IoT Edge Controllers
For edge-of-network IoT aggregation gateways, the MCIMX6X2CVN08AB provides Linux-class computing plus deterministic real-time sensor handling. The A9 runs MQTT brokers, TLS-secured cloud clients, and local analytics, while the M4 polls local sensors (temperature, vibration, flow) at fixed rates with guaranteed latency. Integrated HAB secure boot and crypto acceleration protect firmware integrity. Three SD/SDIO/MMC interfaces accommodate local storage, WiFi modules, and cellular modems simultaneously. Low idle power suits solar/battery installations. Recommended companion: BC95G NB-IoT module, BMI160 IMU.
Recommandé
Medical Point-of-Care Devices
The MCIMX6X2CVN08AB fits portable medical devices needing both responsive UI and reliable sensor acquisition. The A9 core drives color touchscreen interfaces for blood analyzers or patient monitors, while the M4 captures ECG/biometric signals at deterministic 1 kHz sampling without OS-induced jitter. The integrated 2D GPU accelerates waveform rendering and icon animations. DDR3 controller supports large patient-data buffers, and dual GbE enables HL7/EHR network connectivity. Industrial temperature grade handles clinical environment thermal variation. Recommended companion: ADS1292 ECG AFE, CC2564 Bluetooth module.
Recommandé
Smart Energy / Substation Gateways
For IEC 61850 / DNP3 substation communication gateways, the MCIMX6X2CVN08AB's heterogeneous cores support protocol conversion between legacy serial and modern Ethernet. The M4 handles time-critical GOOSE message processing with sub-millisecond latency, while the A9 runs the full IEC 61850 stack with MMS reporting. Hardware crypto acceleration secures authentication per IEC 62351. Extended temperature range and industrial-grade reliability suit outdoor cabinet installation. Recommended companion: ST7540 power-line modem, ADUM3151 digital isolator.
Recommandé
Digital Signage Players
The MCIMX6X2CVN08AB drives entry-level digital signage with H.264 hardware decode and dual-display output. The GC880 3D GPU accelerates HTML5/WebGL content rendering, while the A9 manages network content updates via GbE. The M4 monitors thermal sensors and watchdog timers for unattended operation. Low system BOM thanks to integrated USB PHYs, dual GbE MACs, and DDR3 controller reduces total cost. Recommended companion: TFP401 HDMI transmitter, MX25L256 flash memory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX6X2CVN08AB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX6X2EVN08AB | MCIMX6X2CUN08AB | MCIMX6X1AVK08AB | MCIMX6X3EVO10AB | MCIMX6X2DVN10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-MAPBGA (17x17) | 400-MAPBGA (17x17) - same | 400-MAPBGA (17x17) - same | 400-MAPBGA - same | 400-MAPBGA - same | 400-MAPBGA (17x17) - same |
| M4 Core Speed | 166 MHz | 166 MHz | 166 MHz | 166 MHz | 166 MHz | 166 MHz |
| Core Architecture | Cortex-A9 + Cortex-M4 | Cortex-A9 + Cortex-M4 | Cortex-A9 + Cortex-M4 | Cortex-A9 + Cortex-M4 | Cortex-A9 + Cortex-M4 | Cortex-A9 + Cortex-M4 |
| Memory Interface | LPDDR2/LVDDR3/DDR3 | LPDDR2/LVDDR3/DDR3 | LPDDR2/LVDDR3/DDR3 | LPDDR2/DDR3 | LPDDR2/DDR3 | LPDDR2/DDR3 |
Principaux différenciateurs
- First-of-kind heterogeneous A9 + M4 architecture (vs MCIMX6X2EVN08AB)
- NRND vs active lifecycle status (vs MCIMX6X3EVO10AB)
- Integrated 2D/3D GPU acceleration (vs MCIMX6X1AVK08AB)
Notes de conception
The 400-MAPBGA package with 0.8 mm ball pitch requires a 4-layer or higher PCB with microvia HDI stack-up. Per NXP hardware design guide, route all DDR3 signals on inner layers with matched impedance (50 ohm single-ended, 100 ohm differential for clock) and length matching within 25 mil tolerance. Place decoupling capacitors (100 nF + 10 uF) within 1 mm of each BGA power pin to suppress switching noise.
Power sequencing must follow NXP's recommended order: PMIC startup must ramp VDD_SOC and VDD_ARM rails in proper sequence before peripheral I/O. Failure to sequence correctly can cause permanent latch-up. Use NXP's PF0100 or PF3000 PMIC for validated reference designs. Estimate: at 800 MHz A9 + 166 MHz M4 full load, total SoC power is approximately 2-3 W depending on workload - budget thermal dissipation accordingly.
The industrial temperature grade (-40C to +105C TJ) requires thermal management to keep junction temperature within limits. At sustained A9 load, theta_JA for the 400-MAPBGA is approximately 15-20 C/W with proper PCB layout (thermal vias, copper pours). For fanless industrial enclosures, ensure ambient temperature inside the box stays below 85C. Use the SoC's internal thermal sensor via Linux kernel driver for throttling.
Do not assume all i.MX 6SoloX parts are pin-to-pin compatible - speed grade suffixes (V, U, etc.) and feature options differ. Verify the exact MPN against your BSP support before PCB layout commits. Boot mode pins (BOOT_MODE[1:0], BOOT_CFG) must be pulled correctly for the desired boot source (SD, eMMC, SPI flash, NOR) - misconfiguration causes silent boot failures.
Place the DDR3 chip(s) on the same side of the PCB as the SoC within 50 mm trace length. Use NXP's IBIS models for SI simulation of DDR3 interface. The Cortex-M4 subsystem has its own GPIO bank - isolate M4-critical signals (PWM, CAN, timers) on dedicated pins to avoid conflict with A9 Linux GPIO management. Reference NXP SABRE-SD platform for validated layout topology.
Informations de conformité
RoHS compliant per distributor listings. Industrial temperature grade (V suffix) but not AEC-Q100 qualified - choose auto-grade variant for automotive safety applications. NRND lifecycle status - check NXP PCN for replacement.
