MCP2003BT-H/MC - LIN Transceiver, Integrated Vreg, 8-DFN | Microchip
Référence : MCP2003BT-H/MC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.62 | $16,20 |
| 100 | $1.38 | $138,00 |
| 500 | $1.21 | $605,00 |
| 1 000 | $1.07 | $1 070,00 |
MCP2003BT-H/MC Présentation
A LIN transceiver is a specialized interface IC that connects a microcontroller's UART to a single-wire LIN bus used predominantly in automotive body and chassis electronics. It translates CMOS/TTL logic levels on the TXD/RXD pins into the dominant/recessive voltage swings defined by the LIN protocol, and includes the bus-side pull-up, current-limiting, and ESD protection required for harsh 12V vehicle environments. With the addition of an integrated LDO, the MCP2003 family can power the host MCU directly, reducing BOM cost and PCB area in LIN nodes such as door modules, seat controllers, and sensor clusters.
Key features include a low standby current of typically 5 µA in Sleep mode, ±8 kV HBM ESD on the LIN pin, thermal shutdown, a permanent dominant bus timeout (TXD and LIN), and a CS/WAKE pin that supports local wake-up. The integrated voltage regulator delivers up to 70 mA (3.3V or 5.0V selectable via the LVA pin), enough for small microcontrollers and sensor conditioning circuits. The exposed pad (EP) on the 8-DFN package provides a low thermal resistance of approximately 38 C/W, enabling robust operation at ambient temperatures up to +150C.
The device family is qualified to AEC-Q100 Grade 0 for automotive use (the /H suffix confirms Grade 0 over -40C to +150C). Internally, the transceiver uses a high-side LIN driver and a window comparator for the receiver, providing excellent common-mode rejection and immunity to ground shift between the ECU and the bus. Diagnostic features include bus-fault detection, dominant timeout, and an integrated pull-up on the CS pin for default-on operation.
Typical applications include automotive body electronics (door modules, seat controllers, mirror adjusters, window lifters), HVAC control panels, LIN sensor nodes for temperature, pressure, and humidity, industrial CAN/LIN bridges, and appliance control modules. The 8-DFN (2x3) package is well suited to compact PCBs where the small regulator is desired for direct MCU supply.
When designing with this part, ensure the VBB input has a reverse-battery blocking diode or protection MOSFET and a bulk capacitor of at least 1 µF close to the pin. The CS pin should be tied to VBB through a 100 kΩ resistor when no MCU wake-up control is needed, and the LIN bus pin requires a 30 pF to 200 pF total bus capacitance per the LIN physical-layer spec.
Alternatives de remplacement direct pour MCP2003BT-H/MC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCP2003BT-E/MC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCP2003BT-H/MF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCP2003B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCP2003BT-H/MC Spécifications
| Fonction | LIN Transceiver with Integrated Voltage Regulator |
| Protocol | LIN 2.2, LIN 2.2A, SAE J2602, ISO 17987 |
| Number of Drivers/Receivers | 1/1 (Half-Duplex) |
| Débit de données | Up to 20 kbaud |
| Supply Voltage (VBB) | 6.0 V to 27.0 V (continuous), 40 V transient |
| Integrated Regulator Output | 3.3 V or 5.0 V selectable |
| Regulator Output Current | 70 mA (typical) |
| Standby Current (Sleep) | 5 µA (typical) |
| ESD Rating (LIN pin, HBM) | ±8 kV |
| Plage de température de fonctionnement | -40C to +150C (AEC-Q100 Grade 0) |
| Boîtier | 8-pin DFN (2x3 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Dominant Timeout (TXD/LIN) | Permanent (built-in) |
| Wake-Up Feature | Local wake via CS/WAKE pin |
| Niveau MSL | 1 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (Grade 0, /H suffix) |
Configuration des broches de MCP2003BT-H/MC
| Broche 1 | TXD — Transmit data input from MCU (logic level, internal pull-up) |
| Broche 2 | RXD — Receive data output to MCU (logic level) |
| Broche 3 | CS/WAKE — Chip select / wake input, internal pull-up to VBB |
| Broche 4 | GND — Ground reference |
| Broche 5 | VBB — Battery supply input, 6.0V to 27.0V (40V transient) |
| Broche 6 | LIN — LIN bus line, single-wire bidirectional |
| Broche 7 | LVA — Regulator output voltage select: GND = 5V, VREG = 3.3V |
| Broche 8 | VREG — Regulator output (3.3V or 5.0V, up to 70 mA) |
| Broche EP | EP — Exposed thermal pad, connect to GND for heat dissipation |
Applications typiques
MCP2003BT-H/MC convient pour 6 applications: Automotive Door Module LIN Node, HVAC Control Panel LIN Node, LIN Sensor Cluster Node, Industrial CAN/LIN Gateway, White Goods and Appliance Module, Automotive Seat Control Module.
Automotive Door Module LIN Node
The MCP2003BT-H/MC is purpose-built for automotive body electronics such as door modules, mirror adjusters, and window-lift controllers where a single LIN bus connects 8 to 16 ECUs. Its integrated 70 mA LDO directly supplies the host microcontroller and its sensor conditioning circuits, eliminating a separate voltage regulator chip and saving 30 to 50 mm² of PCB area in the door cavity, which is space-constrained. The 20 kbaud LIN 2.2A interface and AEC-Q100 Grade 0 qualification (-40C to +150C) handle the full automotive cold-crank and under-hood thermal envelope without derating. ESD on the LIN bus is rated at ±8 kV HBM, sufficient to survive harness handling and module-pin discharge events per the Microchip 2000546C3 datasheet. Designers should still add a TVS diode such as the SMAJ33CA across VBB for ISO 7637-2 load-dump protection.
Recommandé
HVAC Control Panel LIN Node
HVAC control panels in vehicle interiors often use LIN as the sub-bus between the central HVAC ECU and the panel face-plate, where the MCP2003BT-H/MC provides the physical-layer interface plus power to the panel microcontroller. The integrated LDO (3.3V or 5.0V) drives the panel MCU and LED backlight driver directly, simplifying the BOM. With LIN bus data rates up to 20 kbaud the part carries the panel switch/knob status messages defined by LIN 2.2A without protocol bottleneck, and the 5 µA Sleep current allows the panel to wake on CS/WAKE pin events without draining the 12V battery. The 8-DFN (2x3 mm) package sits comfortably behind the panel button matrix, and the exposed pad provides a low 38 C/W theta_JA for thermal reliability under continuous backlight drive.
Recommandé
LIN Sensor Cluster Node
Sensor clusters in automotive seats and chassis use LIN to daisy-chain temperature, pressure, humidity, and occupancy sensors. The MCP2003BT-H/MC at each node converts the bus single-wire protocol into a UART stream for the local ATTiny or PIC microcontroller while also powering it via its integrated 70 mA LDO, which is sized for sensor ICs and signal conditioning. The 6.0V to 27.0V VBB range tolerates long harness runs and 12V battery disturbances, and the ±8 kV LIN-pin ESD rating protects the node during harness assembly. The exposed pad dissipates heat during engine-bay mounting, where ambient temperature approaches 125 to 150C and Grade 0 qualification is mandatory per AEC-Q100.
Recommandé
Industrial CAN/LIN Gateway
Industrial machinery and building-automation controllers often require a LIN sub-bus on the actuator side while keeping CAN FD on the backbone. The MCP2003BT-H/MC serves as the LIN physical layer in such gateway modules, providing a robust ±8 kV ESD interface to the actuator wiring. The integrated 3.3V or 5.0V regulator supplies a small ARM Cortex-M0 gateway MCU, reducing the part count. With LIN 2.2A and ISO 17987 compliance the part drops into industrial-control networks used by elevator, HVAC, and agricultural-equipment OEMs. The CS/WAKE pin allows the gateway to sleep between messages, achieving the 5 µA quiescent current specified in the Microchip 2000546C3 datasheet, which is critical for battery-backed industrial nodes.
Recommandé
White Goods and Appliance Module
Washing machines, refrigerators, and dishwashers increasingly use LIN sub-bus connections between the main controller and the motor/drum/valve modules. The MCP2003BT-H/MC, while AEC-Q100 qualified, also performs well in appliance environments because the integrated LDO simplifies the power architecture in compact motor-control PCBs. The 8-DFN (2x3 mm) package fits on the small PCBAs inside these modules, and the wide 6.0V to 27.0V supply tolerance accommodates rectified 24V mains designs. Designers can reuse the LIN 2.2A protocol stacks that automotive tier-1s have published, dramatically shortening development time for appliance LIN slave nodes.
Recommandé
Automotive Seat Control Module
Power seat adjusters typically connect to the seat-control ECU via LIN, with up to four LIN nodes per seat (slide, recline, tilt, head-rest). The MCP2003BT-H/MC, mounted on each small actuator PCB, supplies the actuator microcontroller through its 70 mA integrated LDO while exposing the LIN bus at the harness connector. AEC-Q100 Grade 0 thermal qualification handles the under-seat thermal environment during summer operation, and the 5 µA Sleep current enables wake-on-LIN functionality without draining the battery during long parking periods. The exposed pad layout integrates into the actuator housing for optimal heat dissipation, ensuring the LIN IC operates reliably over the full automotive lifetime.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCP2003BT-H/MC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCP2003BT-E/MC | MCP2003BT-H/MF | MCP2003B |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-DFN (2x3 mm) with EP | 8-DFN (2x3 mm) with EP - same | 8-DFN (2x3 mm) with EP - same | 8-DFN (2x3 mm) with EP - same |
| LIN Protocol | LIN 2.2A / SAE J2602 / ISO 17987 | LIN 2.2A / SAE J2602 / ISO 17987 | LIN 2.2A / SAE J2602 / ISO 17987 | LIN 2.2A / SAE J2602 / ISO 17987 |
| Maximum Bus Data Rate | 20 kbaud | 20 kbaud | 20 kbaud | 20 kbaud |
| Supply Voltage (VBB) | 6.0V to 27.0V (40V transient) | 6.0V to 27.0V (40V transient) | 6.0V to 27.0V (40V transient) | 6.0V to 27.0V (40V transient) |
| Integrated Regulator | 3.3V / 5.0V, 70 mA | 3.3V / 5.0V, 70 mA | 3.3V / 5.0V, 70 mA | 3.3V / 5.0V, 70 mA |
| Standby Current | 5 µA (Sleep) | 5 µA (Sleep) | 5 µA (Sleep) | 5 µA (Sleep) |
| ESD Rating (LIN, HBM) | ±8 kV | ±8 kV | ±8 kV | ±8 kV |
| AEC-Q100 Grade | Grade 0 (-40C to +150C) | Grade 1 (-40C to +125C) | Grade 0 (-40C to +150C) | Commercial (no grade) |
| Approx. Unit Price (qty 1000) | $1.07 | $1.05 (slightly lower) | $1.07 (same) | $1.00 (lower) |
Principaux différenciateurs
- Highest automotive temperature grade in the 2x3 DFN LIN family (vs MCP2003BT-E/MC)
- Integrated 70 mA LDO eliminates an external regulator (vs NXP TJA1027T (no integrated LDO))
- 8-DFN (2x3 mm) is among the smallest AEC-Q100 LIN packages (vs MCP2003BT-H/SN (8-SOIC))
- Local wake-up via dedicated CS/WAKE pin (vs Basic LIN transceivers without wake pin)
Notes de conception
Place a reverse-battery protection diode (e.g. MBR130T1G) or P-MOSFET between the 12V battery feed and the MCP2003BT-H/MC VBB pin to survive reverse-polarity events common in automotive harnesses. Add a 100 nF ceramic decoupling capacitor directly at VBB and a 4.7 µF to 10 µF bulk capacitor to stabilize the internal LDO and the LIN bus during load-dump transients per the Microchip 2000546C3 datasheet.
The 8-DFN (2x3 mm) package has a theta_JA of approximately 38 C/W with the exposed pad soldered to a 1 oz copper pour. At maximum 70 mA regulator load plus 27V worst-case supply (worst-case dissipation ≈ 1.54 W), junction temperature rise is ~58 C above ambient — within the 150 C Grade 0 limit at 90 C ambient. For higher regulator loading, expand the copper pad to at least 25 mm² to keep theta_JA below 30 C/W.
Route the LIN bus trace as an 8-mil microstrip on the top layer with a continuous ground reference plane below. Keep the LIN trace short (under 50 mm) and avoid stubs. Place the LIN bus ESD/TVS diode (e.g. PESD1LIN) within 3 mm of the LIN pin. Maintain a clear distance between the LIN trace and noisy switch-mode nodes such as DC-DC converter switching loops to meet automotive EMI per CISPR 25.
Do not leave the CS/WAKE pin floating — internal pull-up defaults the part to Operation mode, but a noisy CS line can cause false wake events in production. Add a 100 kΩ external pull-up to VBB if the MCU drives CS only during sleep. Verify that the LVA pin is firmly tied to GND (for 5V) or to VREG (for 3.3V) to avoid unintended mode toggling. The integrated LDO is not designed for high inrush loads — keep peak MCU current under 70 mA at cold-crank (6V VBB).
The LIN bus requires a master pull-up of 1 kΩ plus a series diode at the master node; slave nodes rely on internal pull-up only. Total bus capacitance (cable + connector + stub) must stay between 30 pF and 200 pF for the LIN 2.2A slope to remain within spec — for typical 0.5 mm² twisted-pair harness this corresponds to about 20 m total cable length. Add a 1 nF capacitor on the LIN pin only if the node is at the cable end and ringing is observed.
Informations de conformité
AEC-Q100 Grade 0 qualified per the /H suffix. LIN 2.2A, SAE J2602, and ISO 17987 compliant per Microchip datasheet 2000546C3. RoHS and REACH compliant; lead-free reflow profile per JEDEC J-STD-020 MSL 1.
