MPC8271CVRTIEA - PowerQUICC II 400MHz 32-bit MPU 516-BGA | NXP
Référence : MPC8271CVRTIEA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $136.02 | $136,02 |
| 10 | $128.5 | $1 285,00 |
| 100 | $116.8 | $11 680,00 |
| 500 | $104.5 | $52 250,00 |
| 1 000 | $92.4 | $92 400,00 |
MPC8271CVRTIEA Présentation
An MPU (Microprocessor Unit) in the PowerQUICC II class is a system-on-chip designed for cost-sensitive networking and telecom equipment where deterministic peripheral handling matters as much as raw core throughput. The MPC8271 family sits above the MPC8247/MPC8248 in CPM feature density while sharing the same HiP7 process, allowing software written for one variant to migrate across siblings with minimal driver change.
Key features include a single PowerPC G2_LE core running up to 400 MHz, on-chip CPM with dual Fast Ethernet MAC, PCI bridge, USB 1.1 host/slave, UTOPIA/L2 interface, and I2C/SPI/UART serial channels. Memory management is handled by an integrated MMU with 16-entry TLB and hardware table-walk assist, allowing Linux, VxWorks, and other RTOS deployments. Industrial temperature grade (-40C to +105C) supports outdoor and hardened enclosures.
The HiP7 0.13 µm CMOS process integrates the PowerPC core, CPM engine, dual memory controllers, and peripheral bridges while keeping thermal dissipation within the BGA thermal envelope. Hardware-assisted encryption (on the sibling MPC8272) is intentionally absent on the MPC8271, positioning it for designs that prefer software crypto or external accelerators.
Typical applications include small/medium enterprise routers, xDSL/Cable modem aggregation, industrial control gateways, PCI-based embedded SBCs, and telecom line cards. The CPM offloads protocol processing from the core, leaving CPU cycles for routing, filtering, and management-plane tasks.
When designing with this device, provide separate power rails for core, PLL, and I/O, and follow NXP AN2810 for BGA decoupling. The 27x27 mm PBGA requires a 4-6 layer PCB with at least one solid ground plane beneath the device; thermal relief is provided through the package's exposed die paddle via in-package vias.
This page synthesizes distributor pricing, lifecycle status, drop-in same-package alternatives, and practical BGA-layout design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour MPC8271CVRTIEA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8271CVRTIEA (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, Series, Core Architecture, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8247VRTIEA
✅ Remplacement direct✓ En stock
$58.25 / unité
Voir la fiche technique →MPC8248VRTIEA
✅ Remplacement direct✓ En stock
$62.5 / unité
Voir la fiche technique →MPC8272VVRTIEA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8271CVRTIEA
✅ Remplacement direct✓ En stock
$92.4 / unité
Voir la fiche technique →MPC8271ZQTIEA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8271CVRTIEA Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC G2_LE |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 400 MHz |
| Boîtier | 516-PBGA (27x27 mm) |
| Process Technology | 0.13 µm HiP7 CMOS |
| Température de fonctionnement | -40 °C to +105 °C |
| Communications Processor Module (CPM) | Integrated with PCI, USB, UTOPIA |
| Memory Management Unit (MMU) | Yes, with hardware table-walk |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| PCI Interface | PCI 2.2 compatible |
| USB Interface | USB 1.1 host/slave |
| UTOPIA Interface | UTOPIA Level 2 (8/16-bit) |
| Serial Interfaces | I2C, SPI, UART (multiple) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Family | PowerQUICC II / MPC82xx |
| Series | MPC8271 |
Guide de configuration des broches du MPC8271CVRTIEA 516-pbga (27x27 mm)
Configuration des broches du MPC8271CVRTIEA (boîtier 516-pbga (27x27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8271CVRTIEA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8271CVRTIEA convient pour 6 applications: Small/Medium Enterprise Routers, xDSL/Cable Modem Aggregation Line Cards, Industrial Control Gateways, PCI-Based Embedded Single Board Computers, Telecom Line Cards (T1/E1 Aggregation), PCI Express-to-PCI Bridge Adapters.
Small/Medium Enterprise Routers
The MPC8271CVRTIEA fits SME router designs because its integrated CPM offloads PCI, USB, and dual Fast Ethernet MAC traffic, freeing the 400 MHz G2_LE core for routing-table lookup, NAT, and management-plane processing. The 32-bit PowerPC core and 16 KB instruction/data caches deliver deterministic throughput for forwarding at line rate on Fast Ethernet uplinks. With the 516-PBGA 27x27 mm package, the same board can host both wired routing and integrated USB for storage or 3G/4G dongle failover.
Recommandé
xDSL/Cable Modem Aggregation Line Cards
The MPC8271CVRTIEA's UTOPIA Level 2 (8/16-bit) interface and dual Fast Ethernet MACs make it well-suited for xDSL/Cable modem aggregation line cards. The CPM engine handles ATM AAL2/AAL5 segmentation and reassembly in hardware, while the PowerPC core runs the routing and PPPoE termination. The 27x27 mm 516-PBGA package supports multi-line card designs with shared PCI backplane, and the industrial -40 °C to +105 °C temperature range survives outdoor DSLAM cabinets.
Recommandé
Industrial Control Gateways
Industrial control gateways benefit from the MPC8271CVRTIEA's integrated USB host/slave, I2C, SPI, and UART channels, all routed through the CPM so deterministic polling is independent of the PowerPC core. The -40 °C to +105 °C industrial temperature grade supports outdoor enclosures, factory floors, and unconditioned cabinets. The 32-bit PowerPC G2_LE core runs embedded Linux or VxWorks, while PCI provides a high-speed link to FPGA coprocessors for real-time fieldbus bridging.
Recommandé
PCI-Based Embedded Single Board Computers
The MPC8271CVRTIEA's PCI 2.2 interface and 32-bit PowerPC G2_LE core make it ideal for compact embedded SBCs that need PCI expansion slots for data acquisition cards, video capture, or network adapters. The 516-PBGA 27x27 mm package supports integration with on-board DDR SDRAM, Flash, and a southbridge companion chip. Software stacks including Linux and VxWorks are well supported across the PowerQUICC II family, shortening time-to-market for OEM SBC designs.
Recommandé
Telecom Line Cards (T1/E1 Aggregation)
Telecom line cards aggregating T1/E1 channels benefit from the MPC8271CVRTIEA's multi-channel serial ports and CPM-driven DMA, which keeps the G2_LE core free for higher-layer processing. The 516-PBGA 27x27 mm package supports line-card mezzanine layouts, and the integrated PCI bridge connects to a central switching fabric. Industrial -40 °C to +105 °C operation tolerates central-office thermal envelopes and outdoor remote terminals in carrier networks.
Recommandé
PCI Express-to-PCI Bridge Adapters
The MPC8271CVRTIEA serves as a host CPU in legacy PCI bridge adapters, where the integrated PCI 2.2 interface connects to legacy PCI peripherals while the PowerPC core manages protocol translation. The 32-bit core and MMU with hardware table-walk allow full Linux deployment, and the integrated CPM provides USB host/slave for diagnostic channels. Industrial temperature operation suits factory-floor and outdoor deployments where commercial-temperature parts would fail.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8271CVRTIEA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8247VRTIEA | MPC8248VRTIEA | MPC8272VVRTIEA | MPC8271ZQTIEA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Maximum Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| CPM Fast Ethernet MACs | 2 | 2 | 2 | 2 | 2 |
| Hardware Crypto (SEC 2.0) | No | No | No | Yes (DES/3DES/AES/SHA) | No |
| USB Interface | USB 1.1 host/slave | Reduced/absent on some speed grades | USB 1.1 host/slave | USB 1.1 host/slave | USB 1.1 host/slave |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Pin-compatible upgrade path to MPC8272 with hardware crypto (vs MPC8247VRTIEA)
- Full CPM feature set versus reduced-cost siblings (vs MPC8247VRTIEA)
- Same 516-PBGA package across the family (vs MPC8248VRTIEA)
Notes de conception
The 27x27 mm 516-PBGA package requires a 4-6 layer PCB with at least one solid ground plane directly beneath the device. Reference the PowerQUICC II Design Checklist (NXP AN2810) for BGA escape routing, via-in-pad recommendations, and decoupling capacitor placement. Route high-speed DDR memory signals on inner layers with controlled impedance (50 ohm single-ended) and matched lengths within ±25 ps to satisfy the integrated memory controller timing.
Provide separate, well-decoupled power rails for the G2_LE core (1.5 V or 1.8 V depending on speed grade), the PLL analog supply, and the 3.3 V I/O. Each rail requires at least one bulk capacitor (10 µF or larger) plus high-frequency ceramics (0.1 µF and 1 nF) within 5 mm of the BGA balls. Sequence the rails per NXP AN2810 to avoid latch-up during power-up and power-down.
At 400 MHz with full CPM and Fast Ethernet activity, the MPC8271CVRTIEA dissipates approximately 2-3 W. The PBGA thermal resistance (theta_JA) is around 15-20 C/W on a JEDEC-compliant 4-layer test board, so junction temperature rise above ambient is 30-60 C. Industrial enclosures with no active cooling must keep ambient below +45 °C to remain within the +105 °C junction limit; otherwise attach a small heatsink or use thermal vias under the die paddle.
Do not assume the MPC8271 family has hardware cryptography: the SEC 2.0 engine is present on the MPC8272 only. Also confirm the part suffix carefully because 'CVR' (commercial), 'ZQT' (lead-free), and 'VRTIEA' (industrial temp + tray) variants differ in temperature grade and packaging. Mixing part numbers across production runs risks RoHS or temperature-grade failures in the field.
Informations de conformité
RoHS and REACH compliance per NXP product page; lead-free PBGA. AEC-Q100 not applicable for communications processor MPU. Halogen-free status not stated in verified data.