MPC8323VRADDCA - PowerQUICC II Pro 266MHz SoC | NXP
Référence : MPC8323VRADDCA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $52.93 | $52,93 |
| 10 | $49.5 | $495,00 |
| 100 | $46.2 | $4 620,00 |
| 500 | $42.85 | $21 425,00 |
| 1 000 | $39.4 | $39 400,00 |
MPC8323VRADDCA Présentation
A PowerQUICC processor is a member of the broader communications processor family that sits between a microcontroller and a full network processor on the system hierarchy: PowerQUICC II Pro -> PowerQUICC family -> communications processor -> embedded microprocessor -> integrated circuit. PowerQUICC II Pro specifically adds DDR1/DDR2 support, a faster e300 core, USB 2.0 and PCI interfaces, and a more capable QUICC Engine for protocol termination. Understanding this taxonomy helps engineers reading collateral from legacy Freescale / NXP documents, where PowerQUICC I, II, II Pro, and III parts are often referenced side-by-side.
Key features include 266 MHz core frequency, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1 Gb capable Ethernet MACs (via the QUICC Engine), USB 2.0 host/device, PCI 2.2 interface, UTOPIA / xGMII glue-less PHY interfaces, and 32-bit local bus. The on-chip QUICC Engine supports up to eight UCCs running multi-protocol firmware for HDLC, PPP, ATM, and Ethernet bridging. Security is handled by hardware-assisted acceleration for DES, 3DES, AES, SHA-1/MD5, and a true random number generator on the MPC8323E variant.
Architecturally the MPC8323 is built on a 0.13-micron process with a 1.0 V core supply and 3.3 V I/O. Power consumption typically falls in the 2.5 W to 4.5 W range depending on frequency, traffic load, and which peripherals are enabled. The QUICC Engine and CPU operate on separate internal power islands, allowing unused UCCs to be clock-gated.
Typical applications include SOHO routers, integrated access devices, xDSL line cards, industrial control gateways, factory-floor protocol bridges, and low-density wireless backhaul baseband cards. The MPC8323VRADDCA is the 0 to 105C commercial-temperature variant, making it suitable for thermally-controlled indoor enclosures.
A key design consideration is power sequencing: the 1.0 V core voltage must be brought up before the 3.3 V I/O supply, and RESET must remain asserted until both rails are stable. The integrated DDR controller requires careful impedance-matched routing and a matched-length address/command group to avoid signal-integrity issues at 266 MHz.
This page synthesizes distributor pricing, drop-in alternatives, datasheet pinout, and engineer-grade design notes that go beyond the manufacturer product page. References to the official datasheet (82 pages) and the NXP end-of-life notification help procurement and design engineers plan a transition strategy for long-life-cycle programs.
Alternatives de remplacement direct pour MPC8323VRADDCA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8323VRADDCA (même facteur de forme et même empreinte) — différant par Memory Controller, Mounting Type, Core Architecture, Operating Temperature, PCI.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8323ECVRADDC
✅ Remplacement direct✓ En stock
$62.4 / unité
Voir la fiche technique →MPC8323ECZQADDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323VRAFDC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323EZQADDC
✅ Remplacement direct✓ En stock
$14.06 / unité
Voir la fiche technique →MPC8323EVRAFDCA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8323VRADDCA Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e300c2 (32-bit) |
| Core Frequency | 266 MHz |
| Core Count | 1 |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| MMU | Yes (hardware) |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet MACs | Dual 10/100/1000 (via QUICC Engine) |
| USB | USB 2.0 host/device |
| PCI | PCI 2.2 (32-bit, 66 MHz) |
| QUICC Engine UCCs | Up to 8 multi-protocol UCCs |
| UTOPIA / xGMII | UTOPIA-2 / xGMII PHY interface |
| Local Bus | 32-bit, up to 66 MHz |
| Core Supply Voltage | 1.0 V |
| I/O Supply Voltage | 3.3 V |
| Température de fonctionnement | 0C to 105C (commercial) |
| Boîtier | 516-PBGA (27 x 27 mm) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Guide de configuration des broches du MPC8323VRADDCA 516-pbga (27 x 27 mm)
Configuration des broches du MPC8323VRADDCA (boîtier 516-pbga (27 x 27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8323VRADDCA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8323VRADDCA convient pour 6 applications: SOHO Router / Integrated Access Device, xDSL Line Card / DSLAM, Industrial Protocol Gateway, Wireless Backhaul Baseband Card, Set-Top Box / Media Aggregation, Factory Floor Networking Switch.
SOHO Router / Integrated Access Device
The MPC8323VRADDCA fits SOHO router and integrated access device designs because its e300c2 core at 266 MHz delivers adequate processing headroom for routing table lookup, NAT, and QoS classification while the integrated PCI 2.2 and USB 2.0 host ports enable Wi-Fi card and 3G/4G modem attachment without external glue. The QUICC Engine offloads protocol termination, freeing the CPU for control-plane tasks. With 16 KB I/D caches and a hardware DDR1/DDR2 controller with ECC, the device sustains line-rate forwarding on Fast Ethernet and basic Gigabit uplink paths. Compared to a switch-ASIC plus external MCU approach, the MPC8323VRADDCA consolidates CPU, memory controller, Ethernet MACs, and serialization on one die, reducing PCB complexity and BOM cost.
Recommandé
xDSL Line Card / DSLAM
For xDSL line card and DSLAM designs the MPC8323VRADDCA provides the UTOPIA-2 / xGMII glue-less PHY interface required to attach multi-channel DSL framer ICs without external logic. Its dual 10/100/1000 Ethernet MACs (via QUICC Engine) backhaul aggregated subscriber traffic to the upstream network, while the integrated DDR1/DDR2 controller holds packet buffers and routing tables. The QUICC Engine's eight UCCs can be programmed for ATM, HDLC, or PPP termination depending on the DSL variant deployed. The 0 to 105C commercial temperature range supports thermally-controlled indoor DSLAM shelves. The 516-PBGA's central thermal pad simplifies heat-sinking the device in densely-populated line cards.
Recommandé
Industrial Protocol Gateway
The MPC8323VRADDCA suits industrial protocol gateway applications - bridging Modbus, Profibus, EtherCAT, and serial fieldbus traffic to Ethernet backbones - thanks to its flexible QUICC Engine UCCs that can be reconfigured for multiple protocols in firmware. The PCI 2.2 bus accepts industrial IO cards or FPGA co-processors for deterministic real-time fieldbus termination. Operating from 0 to 105C it tolerates factory cabinet temperatures when paired with adequate airflow or conduction cooling. The hardware MMU enables embedded Linux or VxWorks deployment for engineers who need POSIX networking stacks. Compared to a generic ARM SoC, the PowerQUICC's deterministic interrupt response and proven long-term NXP support favor long-life industrial programs.
Recommandé
Wireless Backhaul Baseband Card
For low-density wireless backhaul baseband cards (point-to-point microwave, small-cell fronthaul, WiMax), the MPC8323VRADDCA delivers 266 MHz of processing headroom plus UTOPIA glue-less interfaces that attach directly to RF framer ASICs. The integrated DDR1/DDR2 controller with ECC holds baseband buffers and forward-error-correction tables. PCI 2.2 enables connection to a baseband DSP for PHY-layer processing. Power consumption of 2.5 W to 4.5 W is acceptable for outdoor pole-mount enclosures with sun-load thermal budgets, although the 0 to 105C commercial range may require additional derating in direct sun. The QUICC Engine's HDLC support is well-suited for legacy TDM backhaul links.
Recommandé
Set-Top Box / Media Aggregation
The MPC8323VRADDCA's combination of PCI 2.2 (for tuner card attachment), dual Gigabit Ethernet, and DDR1/DDR2 with ECC supports set-top box designs where multiple tuners feed a high-definition media pipeline. The e300c2 core runs embedded Linux middleware and conditional-access stacks. USB 2.0 enables external storage and Wi-Fi dongle attachment. Compared to dedicated STB SoCs, the MPC8323VRADDCA provides greater flexibility for IPTV and hybrid broadcast broadband TV deployments where software-defined features are critical. The 516-PBGA's 27 x 27 mm footprint requires careful PCB layout but is well-documented in NXP reference designs.
Recommandé
Factory Floor Networking Switch
For factory floor networking switches the MPC8323VRADDCA offers the determinism and long-term NXP supply required for industrial Ethernet deployments. The PCI 2.2 bus accepts managed-switch coprocessors or FPGA-accelerated EtherCAT/TSN bridges. Dual 10/100/1000 Ethernet MACs handle ring-topology or daisy-chain aggregation. The QUICC Engine's multi-protocol support enables legacy serial-to-Ethernet bridging for older PLCs and instrumentation. Operating temperature of 0 to 105C tolerates control cabinet environments. The integrated DDR controller with ECC improves reliability in noisy factory environments where bit-flips from EMI are a concern. Compared to commercial-grade switches, the PowerQUICC platform's longevity favors 10 to 15 year industrial lifecycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8323VRADDCA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8323ECVRADDC | MPC8323ECZQADDC | MPC8323VRAFDC | MPC8323EZQADDC | MPC8323EVRAFDCA |
|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 333 MHz | 266 MHz | 333 MHz |
| Security Engine | No | Yes (AES/3DES/SHA/RNG) | Yes (AES/3DES/SHA/RNG) | No | Yes (AES/3DES/SHA/RNG) | Yes (AES/3DES/SHA/RNG) |
| Core Architecture | e300c2 | e300c2 | e300c2 | e300c2 | e300c2 | e300c2 |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet MACs | Dual 10/100/1000 (via QE) | Dual 10/100/1000 (via QE) | Dual 10/100/1000 (via QE) | Dual 10/100/1000 (via QE) | Dual 10/100/1000 (via QE) | Dual 10/100/1000 (via QE) |
| Operating Temperature | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C | -40C to 105C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Higher core frequency option available in same package (vs MPC8323VRAFDC)
- No Security Engine block - lower cost variant (vs MPC8323EZQADDC)
- Commercial temperature range matches indoor enclosures (vs MPC8323EVRAFDCA)
Notes de conception
Power sequencing is critical for the MPC8323VRADDCA. The 1.0 V core supply (Vdd_core) must rise before or simultaneously with the 3.3 V I/O supply (Vdd_io). The RESET pin must remain asserted until both rails are within regulation for at least 100 ms. Use a supervisor IC such as the MAX6365 to enforce the sequence and reset delay. Reverse sequencing can cause latch-up and permanent damage to the I/O cells.
The 516-PBGA package relies on the central thermal pad for heat dissipation. The PCB land pattern must include a 1:1 thermal pad with at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an inner ground plane. Without proper thermal design, junction temperature can exceed 105C at ambient above 70C with full peripheral loading. Estimated: at typical 3 W dissipation, theta_JA of approximately 15 C/W (with thermal vias) yields 45C temperature rise above ambient.
DDR memory routing requires strict impedance matching (50 ohm single-ended, 100 ohm differential for DDR2) and matched-length address/command traces within +/- 25 mil. Use fly-by topology for DDR2 instead of T-branch to reduce stub reflections. Maintain at least 3W spacing between DDR traces and adjacent high-frequency signals to minimize crosstalk. The 266 MHz core clock must be guarded by a ground fence on both sides.
Do not confuse the MPC8323 (non-E) with the MPC8323E variant - the E parts include the Security Engine and have different ball assignments for approximately 8 pins. Verify the exact pinout against the datasheet before PCB layout. Also note that the MPC8323 family does NOT support 32-bit PCI at 66 MHz with 5 V signaling - use 3.3 V PCI signaling only. Mixing 5 V and 3.3 V on the PCI bus can damage the device.
Place the 25 MHz or 33 MHz system reference oscillator within 0.5 inch of the XTAL1/XTAL2 pins, with a continuous ground reference beneath the traces. Route USB 2.0 data lines as 90 ohm differential with no more than 2 vias and maximum length of 50 mm to maintain signal quality. Series termination resistors near the driver help reduce reflections. Avoid routing USB traces parallel to clock traces to prevent crosstalk.
Informations de conformité
RoHS compliant per NXP product page. Last-time-buy notification issued per NXP.com product page - no new production orders accepted. Halogen-free status not explicitly confirmed in available data.
