MPC8536AVTAQGA557 - PowerPC e500 1GHz MPU | NXP | Networking
Référence : MPC8536AVTAQGA557 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.6475 | $2,65 |
| 10 | $2.4 | $24,00 |
| 100 | $2.1 | $210,00 |
| 500 | $1.85 | $925,00 |
| 1 000 | $1.65 | $1 650,00 |
MPC8536AVTAQGA557 Présentation
A microprocessor (MPU) is the central processing unit of an embedded system, packaged as a single integrated circuit with its own core, cache hierarchy, memory controller, and peripheral interfaces. Unlike a microcontroller (MCU), an MPU typically requires external DRAM/NOR/NAND and a companion chipset for system I/O. The MPC85xx line sits inside the broader taxonomy: MPU > embedded processor > SoC > semiconductor, and historically targets routers, switches, line cards, and storage controllers where deterministic performance and rich I/O are essential.
Key features include a 32-bit PowerPC e500 core with dual-issue pipeline, integrated L1/L2 caches, a high-bandwidth system bus, three USB 2.0 interfaces, multiple gigabit Ethernet MACs, DDR memory controller, and PCI Express support. The 783-ball FCPBGA package is optimized for high-speed signal integrity, multi-layer PCB escape routing, and chassis-grade thermal dissipation. Operating temperature range is 0C to 90C (TA) for commercial-grade deployments.
Architecturally, the MPC8536 uses a coherent core complex with hardware-assisted MMU and integrated security features, enabling wire-speed packet processing and low-latency I/O handling. Compared with discrete CPU + glue-logic designs, the integrated peripherals reduce BOM cost and board area while improving power-noise behavior.
Typical applications include enterprise networking equipment (routers, switches, line cards), industrial control, secure gateways, single-board computers, and legacy telecommunications infrastructure. The combination of 1 GHz core speed and integrated I/O makes it suitable for control-plane workloads and packet forwarding at line rate.
When designing with this MPU, allocate the largest possible PCB region to the BGA escape and follow NXP's reference layout guidelines for DDR impedance matching and SerDes routing. Plan for a multi-layer (>=8 layer) stack-up to maintain signal integrity on the high-speed parallel bus.
This page synthesizes distributor pricing, drop-in equivalents, and practical design notes that are not aggregated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MPC8536AVTAQGA557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8536AVTAQGA557 (même facteur de forme et même empreinte) — différant par Ethernet, Operating Temperature, Package, Core Architecture, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8536AVTAQGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8536AVTAKGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$64.8 / unité
Voir la fiche technique →MPC8536EAVTAQGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$72.1 / unité
Voir la fiche technique →P2020NSE2MHC
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8536ECVTAQGA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$171 / unité
Voir la fiche technique →MPC8536AVTAQGA557 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Status | Active |
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Max Clock Frequency | 1.0 GHz |
| Boîtier | 783-FCPBGA (29x29 mm) |
| Température de fonctionnement | 0C to 90C (TA) |
| Voltage - I/O | 1.8V, 2.5V, 3.3V |
| USB | USB 2.0 x 3 |
| Type de mémoire | DDR1/DDR2 with integrated controller |
| Type de montage | Surface Mount (FCPBGA) |
| Ethernet | Multiple integrated Gigabit Ethernet MACs |
| PCI Express | Integrated PCI Express controller |
Guide de configuration des broches du MPC8536AVTAQGA557 783-fcpbga (29x29 mm)
Configuration des broches du MPC8536AVTAQGA557 (boîtier 783-fcpbga (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8536AVTAQGA557.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8536AVTAQGA557 convient pour 6 applications: Enterprise Routers and Switches, Industrial Control and Automation, Secure Network Gateways, Single-Board Computers and SBC, Storage Controllers and NAS, Legacy Telecom Infrastructure.
Enterprise Routers and Switches
The MPC8536AVTAQGA557 is widely used as the control-plane processor in entry-level enterprise routers and managed switches. Its 1.0 GHz PowerPC e500 core plus integrated Gigabit Ethernet MACs and PCI Express provide line-card control bandwidth without external co-processors. The 783-FCPBGA package delivers the signal integrity required for high-speed SerDes links, while the DDR memory controller supports fast routing-table lookups. The three USB 2.0 ports simplify console, storage, and Wi-Fi/Bluetooth module attachment during product development.
Recommandé
Industrial Control and Automation
In industrial control platforms, the MPC8536AVTAQGA557 serves as the central MPU for programmable logic controllers, motion controllers, and human-machine interface gateways. The 1.0 GHz e500 core executes deterministic control loops, while the integrated USB 2.0 ports connect to HMI panels, programming devices, and industrial sensors. Commercial temperature bin (0C to 90C) covers most factory-floor enclosures. The 783-FCPBGA package is well suited to ruggedized, vibration-resistant board assemblies when paired with proper PCB underfill.
Recommandé
Secure Network Gateways
The MPC8536AVTAQGA557 is frequently deployed in small-form-factor secure gateways, VPN appliances, and unified threat management devices. The integrated Gigabit Ethernet MACs handle multiple WAN/LAN segments, while PCI Express connects crypto accelerators and high-speed network processors. The PowerPC e500 core executes control-plane firmware (Linux, VxWorks, or NetBSD) with deterministic latency. The 783-FCPBGA package enables compact board layouts with proper thermal management for fanless designs.
Recommandé
Single-Board Computers and SBC
Single-board computers built around the MPC8536AVTAQGA557 benefit from the MPU's integrated peripherals, which minimize companion chip count. A typical reference design pairs the 783-FCPBGA MPC8536 with DDR2 SO-DIMM or chip-down memory, a Gigabit Ethernet PHY, and standard I/O headers. The 1.0 GHz e500 core supports full desktop-class Linux distributions, making the platform suitable for educational SBCs, industrial kiosks, and embedded developer kits. NXP provides reference schematics to accelerate board bring-up.
Recommandé
Storage Controllers and NAS
Network-attached storage and RAID controller designs leverage the MPC8536AVTAQGA557's combination of Gigabit Ethernet MACs, PCI Express, and DDR memory bandwidth to manage multiple SATA drives. The 1.0 GHz e500 core runs the storage control plane (file system, RAID engine, iSCSI target) while the high-speed SerDes lanes aggregate link bandwidth. The 783-FCPBGA package aids thermal dissipation in chassis with limited airflow, and the three USB 2.0 ports allow external backup device connectivity.
Recommandé
Legacy Telecom Infrastructure
Telecom equipment requiring long-life, deterministic processing continues to use the MPC8536AVTAQGA557 in line cards, base-station controllers, and signaling gateways. The PowerPC architecture enjoys mature toolchain support and a long-term software ecosystem. The integrated DDR controller, Ethernet MACs, and PCI Express handle legacy telecom backplane protocols while the commercial temperature bin (0C to 90C) meets typical central-office environments. NXP's long-term silicon supply programs support multi-decade telecom deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8536AVTAQGA557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8536AVTAQGA | MPC8536AVTAKGA | MPC8536EAVTAQGA | P2020NSE2MHC | MPC8536ECVTAQGA |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 with security engine | PowerPC e500 (dual core) | PowerPC e500 with security engine |
| Max Clock Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| USB Ports | 3 x USB 2.0 | 3 x USB 2.0 | 3 x USB 2.0 | 3 x USB 2.0 | 3 x USB 2.0 | 3 x USB 2.0 |
| Security Engine | Standard | Standard | Standard | Enhanced | Standard | Enhanced |
| Operating Temperature | 0C to 90C (TA) | 0C to 90C (TA) | 0C to 90C (TA) | 0C to 90C (TA) | 0C to 90C (TA) | 0C to 90C (TA) |
Principaux différenciateurs
- Single-core PowerPC e500 with mature software ecosystem (vs P2020NSE2MHC)
- Three integrated USB 2.0 ports reduce BOM (vs MPC8536AVTAQGA)
- Flexible 1.8V/2.5V/3.3V I/O signaling (vs MPC8536EAVTAQGA)
Notes de conception
The 783-ball FCPBGA (29x29 mm) requires at least an 8-layer PCB stack-up with continuous ground and power planes beneath the package. Use NXP's recommended via-in-pad or microvia escape pattern to maintain BGA pad-to-trace impedance control. Maintain matched trace lengths on the DDR data, address, and clock groups to within the tolerances stated in the NXP hardware specifications. Place decoupling capacitors directly under the package BGA shadow with short, wide vias to the power plane.
The MPC8536AVTAQGA557 dissipates significant power at 1.0 GHz across all active peripherals. Provide a continuous copper pour on the top layer connected to the FCPBGA thermal balls and stitch to inner ground planes with a dense thermal via array. For sealed enclosures, conduct thermal simulations against worst-case ambient (90C) to confirm junction temperature stays below the device limit. Use NXP's published thermal model (Two-Resistor or DELPHI) when validating chassis designs.
Do not assume all 'MPC8536' suffixes share identical firmware. The 'E' suffix indicates an enhanced security engine that requires boot code and software support. The '557' suffix is an ordering code referring to packaging/tray variant; the silicon is identical to the base MPC8536AVTAQGA. Verify the exact device marking against NXP's ordering information document before programming boot images, since mismatched firmware on E variants may disable security features inadvertently.
Route high-speed SerDes lanes (PCI Express, Gigabit Ethernet) on the top layer or a dedicated inner stripline layer with reference ground planes. Avoid routing these signals across plane splits or near noisy power switching nodes. Use length matching within 150 mil for PCI Express pairs and follow the SerDes reference clock routing guidelines to keep jitter within the eye mask. Keep I/O voltage reference rails (1.8V/2.5V/3.3V) routed as wide traces with bulk capacitors at the package entry.
Informations de conformité
RoHS, REACH, and lead-free status not confirmed in the provided web data; refer to the NXP MPC8536 product page material declaration documents for definitive compliance statements. AEC-Q100 is not applicable - this is an MPU, not an automotive-grade IC.