NXP Semiconductors

MPC8543VTAQGB - 1GHz PowerQUICC III e500 MPU | NXP | FCBGA-783

Référence : MPC8543VTAQGB ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.0 V Vdss 783-FCBGA (29x29 mm) Package 1.0 GHz Speed DDR1/DDR2 with 36-bit addressing Memory
À partir de $95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-16
Tarifs dégressifs
Qté Prix unitaire Total
1 $145 $145,00
10 $132.5 $1 325,00
100 $118 $11 800,00
500 $105.5 $52 750,00
1 000 $95 $95 000,00
ℹ️ Tous les prix sont en USD

MPC8543VTAQGB Présentation

The NXP (formerly Freescale) MPC8543VTAQGB is a PowerQUICC III integrated microprocessor featuring a PowerPC e500 core running up to 1.0 GHz in a 783-ball FCBGA (29x29 mm) package. It integrates a 32-bit RISC CPU subsystem with MMU, dual I/O controllers supporting DDR2 memory, and high-speed serial interfaces targeting networking and embedded communications equipment.

An embedded MPU (Microprocessor Unit) is a high-integration processor that combines a CPU core, memory controllers, peripheral interfaces, and often communications accelerators on a single die. The MPC8543VTAQGB belongs to the PowerQUICC III family, the system-on-chip lineage that descends from the original PowerQUICC architecture - a hypernym hierarchy of MPU -> microprocessor -> integrated processor -> SoC -> semiconductor.

Key differentiating features include a 32-bit PowerPC e500 core with Book-E instruction set, integrated DDR1/DDR2 memory controller with 36-bit addressing, four Gigabit Ethernet MACs, dual PCI/PCI-X controllers, and two 10/100/1000 Mbit Ethernet interfaces with TCP/IP acceleration. The device operates from a 1.0 V core supply with 2.5 V and 3.3 V I/O rails, and is rated for the industrial temperature range.

Architecture-wise, the MPC8543VTAQGB uses a 90 nm CMOS process and integrates the e500 core with 32 KB instruction and 32 KB data L1 caches, plus a unified 256 KB L2 cache. The platform delivers deterministic latency suitable for packet processing and supports LocalPlus and RapidIO interconnect for multi-processor designs.

Typical applications include networking routers and switches, line cards for telecom equipment, industrial control, secure network appliances, and storage area network (SAN) controllers. The integrated devices make high-density multi-port designs without external bridges.

Design consideration: route all four Ethernet MII/GMII signals with controlled-impedance traces, and place decoupling capacitors directly beneath the FCBGA land pattern. The -40C to +125C junction rating demands thermal via arrays under the exposed die.

This page synthesizes distributor stock data, drop-in MPC85xx alternatives, and design notes that complement the Freescale/NXP hardware specifications manual.

Alternatives de remplacement direct pour MPC8543VTAQGB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MPC8543VTAQGB (même facteur de forme et même empreinte) — différant par Series, Mounting Type, Package / Case, Core Architecture, Ethernet.

NXP Semiconductors
Series: MPC85xx PowerQUICC III
Package / Case: 783-FCBGA (29 mm x 29 mm)
Ethernet: Integrated multi-Gbit Ethernet MACs
Comparer avec MPC8543VTAQGB →
NXP Semiconductors
Mounting Type: Surface Mount
Core Architecture: Power Architecture e500
Comparer avec MPC8543VTAQGB →
NXP Semiconductors
Package / Case: 783-FCBGA (29x29 mm)
Core Architecture: Power Architecture (BookE), 32-bit
Comparer avec MPC8543VTAQGB →
NXP Semiconductors
Series: MPC85xx (PowerQUICC III)
Mounting Type: Surface Mount
Package / Case: 783-FCBGA (29x29 mm)
Comparer avec MPC8543VTAQGB →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MPC8545VTAQGB

✅ Remplacement direct
NXP Semiconductors
📦 783-FCBGA (29x29)
Power Architecture e500 · 1 · 32-bit · 1.0 GHz · Power Architecture Book E · 256 KB · DDR1/DDR2 SDRAM

✓ En stock

$115.4 / unité

Voir la fiche technique →

MPC8547VTAQGB

✅ Remplacement direct
NXP Semiconductors
📦 783-FCBGA (29x29)
PowerPC e500 Microprocessor IC, MPC85xx PowerQUICC III · Power Architecture (BookE), 32-bit · 1 · 1.0 GHz · 1.1 V · 1.8 V / 2.5 V / 3.3 V · 0.09 um CMOS · 783-FCBGA (29x29 mm)

✓ En stock

$72.4 / unité

Voir la fiche technique →

MPC8543EVTAQGB

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 783-FCBGA (29x29)
same die/package, extended temperature grade variant

📋 Alternative de référence (hors catalogue)

MPC8543VTANGB

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 783-FCBGA (29x29)
same FCBGA-783 footprint, lower core frequency (667 MHz vs 1.0 GHz)

📋 Alternative de référence (hors catalogue)

MPC8543VTAJD

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 783-FCBGA (29x29)
same FCBGA-783 footprint, same 1.0 GHz core, different speed grade letter

📋 Alternative de référence (hors catalogue)

MPC8543VTAQGB Valeurs maximales et caractéristiques électriques

Manufacturer NXP Semiconductors (formerly Freescale)
Series PowerQUICC III (MPC85xx)
Core Processor PowerPC e500
Number of Cores / Bus Width 1 Core / 32-Bit
Maximum Core Frequency 1.0 GHz
Boîtier 783-FCBGA (29x29 mm)
Plage de température de fonctionnement -40C to +125C (industrial)
L1 Cache 32 KB instruction + 32 KB data
L2 Cache 256 KB unified
Memory Controller DDR1/DDR2 with 36-bit addressing
Ethernet MACs 4x Gigabit (10/100/1000 Mbit)
PCI/PCI-X Controllers 2
Supply Voltage (Core) 1.0 V
Supply Voltage (I/O) 2.5 V / 3.3 V
Process Technology 90 nm CMOS
Type de montage Surface Mount (BGA)

Guide de configuration des broches du MPC8543VTAQGB 783-fcbga (29x29 mm)

Configuration des broches du MPC8543VTAQGB (boîtier 783-fcbga (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier 783-fcbga (29x29 mm) pour le MPC8543VTAQGB

Aucune donnée de brochage détaillée disponible pour MPC8543VTAQGB.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

MPC8543VTAQGB convient pour 6 applications: Enterprise Networking Router, Telecom Line Card Processor, Industrial Control & Automation, Network-Attached Storage (NAS) Controller, Secure Network Appliance, Embedded Telecom Base Station.

🌐

Enterprise Networking Router

The MPC8543VTAQGB's PowerPC e500 core at 1.0 GHz, integrated DDR2 controller, and four Gigabit Ethernet MACs with TCP/IP acceleration make it a strong fit for enterprise routing platforms. Its deterministic interrupt latency and hardware checksum offload allow gigabit-rate forwarding without an external NPU. Placed as the main CPU with 256 MB DDR2, the processor drives routing tables, QoS classification, and management plane tasks while operating across the -40C to +125C industrial range required for carrier-grade hardware.

🏭

Telecom Line Card Processor

In telecom line cards, the MPC8543VTAQGB serves as the main control-plane processor interfacing to network processors and framer/mapper ASICs via PCI-X and LocalPlus. The integrated 36-bit DDR2 controller with ECC handles large packet buffers while the dual PCI-X controllers provide legacy bus connectivity to fabric and TDM chips. The 1.0 GHz e500 core delivers the headroom needed for routing-protocol convergence (OSPF, BGP), SNMP polling, and CLI processing on ATCA or proprietary backplanes.

🏭

Industrial Control & Automation

The MPC8543VTAQGB's -40C to +125C operating range and rich peripheral set (PCI-X, four Gbit Ethernet, DDR2 with ECC) suit it to industrial control platforms running deterministic control loops. Engineers use it as a supervisory controller that bridges Ethernet-based SCADA networks, Modbus/TCP, and PROFINET traffic with on-chip TCP/IP acceleration. The e500 core's real-time interrupt response and integrated memory controller eliminate external bridge complexity, while the FCBGA package's exposed die enables direct thermal management in sealed enclosures.

🖥️

Network-Attached Storage (NAS) Controller

For mid-range NAS appliances, the MPC8543VTAQGB provides the CPU horsepower, ECC-protected DDR2 controller, and four Gigabit Ethernet ports to drive RAID controllers and SATA multipliers over PCI-X. The 1.0 GHz e500 core delivers the throughput for file-system operations (NFS, SMB, iSCSI) while hardware TCP/IP offload maintains wire-rate performance on bonded Ethernet links. Designers pair it with a dedicated storage controller ASIC or external SATA multiplier to scale capacity beyond the integrated peripherals.

🔒

Secure Network Appliance

The MPC8543VTAQGB serves as the main CPU in VPN/firewall appliances where its TCP/IP acceleration and hardware AES hooks integrate with external crypto accelerators. The four Gigabit Ethernet ports natively segment WAN, LAN, DMZ, and management networks without external switches, while the PCI-X bus attaches crypto ASICs and tamper-detection hardware. The 256 KB L2 cache keeps state-table lookups fast even under DoS-grade packet floods, and the FCBGA package supports conformal-coated designs for outdoor enclosures.

✈️

Embedded Telecom Base Station

In small-cell or pico-cell base stations, the MPC8543VTAQGB acts as the baseband-adjacent control processor handling O&M, timing synchronization (IEEE 1588), and backhaul Ethernet aggregation. Its deterministic interrupt response supports real-time control-plane tasks while the integrated Ethernet MACs deliver CPRI/eCPRI traffic to remote radio units via external bridges. The industrial temperature range and ECC memory support satisfy MTBF targets required by telecom operators.

Récapitulatif des produits recommandés

MPC8545VTAQGB NXP Semiconductors Utilisé dans : Enterprise Networking Router, Network-Attached Storage (NAS) Controller MPC8547VTAQGB NXP Semiconductors Utilisé dans : Enterprise Networking Router, Secure Network Appliance MPC8560VT833LC Higher-performance sibling for advanced line-card designs Utilisé dans : Telecom Line Card Processor, Embedded Telecom Base Station MPC8543EVTAQGB Extended-temperature grade variant for harsher environments Utilisé dans : Industrial Control & Automation
What is the core architecture and maximum frequency of the MPC8543VTAQGB?
The MPC8543VTAQGB integrates a single 32-bit PowerPC e500 core running up to 1.0 GHz, built on a 90 nm CMOS process. According to the Freescale/NXP hardware specifications, the core delivers deterministic interrupt latency and includes 32 KB instruction and 32 KB data L1 caches plus a unified 256 KB L2 cache for high-throughput packet processing in networking and telecom line-card applications.
What package does the MPC8543VTAQGB use and how many pins does it have?
The MPC8543VTAQGB is housed in a 783-ball FCBGA (Flip-Chip BGA) package with a 29x29 mm body. Per the NXP/Freescale hardware specification document, the FCBGA land pattern requires a multi-layer PCB with controlled-impedance routing, microvia fanout under the package, and thermal via arrays beneath the exposed die to meet the -40C to +125C junction operating range.
How much does the MPC8543VTAQGB cost and where can I buy it?
As of 2026-10-17, the MPC8543VTAQGB lists at approximately $145.00 at qty 1, scaling down to about $95.00 at qty 1000 per the tier table. The part is available through authorized distributors including DigiKey (Rochester Electronics listing) and Mouser (NXP stock), with lead time on order due to the device's status in the mature PowerQUICC III product family.
Is the MPC8543VTAQGB in stock at major distributors?
As of 2026-10-17, the MPC8543VTAQGB is listed as available on order (BackOrder) through Rochester Electronics on DigiKey (listing 11541881) and NXP direct inventory on Mouser. Stock is limited because the part belongs to the mature PowerQUICC III generation; designers should confirm current inventory before committing to long-running builds.
What is the lead time for the MPC8543VTAQGB?
As of 2026-10-17, the MPC8543VTAQGB typically carries a lead time of approximately 8-12 weeks when ordered through authorized distributors. The PowerQUICC III family is mature, so distributors rely on Rochester Electronics and remaining factory inventory; engineers designing new platforms should evaluate NXP's newer QorIQ Layerscape families for long-term supply assurance.
MPC8543VTAQGB vs MPC8545VTAQGB - which is better for my application?
The MPC8543VTAQGB and MPC8545VTAQGB share the same FCBGA-783 (29x29) footprint and PowerPC e500 core, but the MPC8545VTAQGB typically runs at a higher maximum core frequency and adds enhanced security features. Choose the MPC8543VTAQGB for cost-sensitive industrial or networking line-card designs that don't need the highest MHz headroom; pick the MPC8545VTAQGB for compute-intensive packet processing.
MPC8543VTAQGB vs MPC8547VTAQGB - what is the difference?
The MPC8547VTAQGB is a higher-tier sibling in the PowerQUICC III family with additional communications accelerators (typically enhanced TCP/IP offload) and faster memory interfaces. The MPC8543VTAQGB uses the same 783-FCBGA package so the boards are pin-compatible, but the 8547 variant draws more power and targets higher-end routing platforms - per Utmel's side-by-side comparison.
When should I choose the MPC8543VTAQGB over a QorIQ alternative?
Choose the MPC8543VTAQGB when you have a legacy PowerQUICC III design that requires a drop-in 783-FCBGA replacement or when your firmware is already validated on the e500 core. Switch to a NXP QorIQ Layerscape processor when starting a new design, since the PowerQUICC III family is in mature production and QorIQ parts deliver better performance-per-watt and active long-term support.
What is the best drop-in replacement for the MPC8543VTAQGB?
The closest drop-in replacements for the MPC8543VTAQGB are other 783-FCBGA PowerQUICC III variants from NXP - notably the MPC8545VTAQGB (same footprint, higher MHz) and the MPC8547VTAQGB (same footprint, additional offload engines). All three share the 29x29 mm FCBGA-783 land pattern, enabling direct PCB substitution where firmware permits the variant swap.
What is the operating temperature range of the MPC8543VTAQGB?
The MPC8543VTAQGB is rated for an operating junction temperature range of -40C to +125C, qualifying it for industrial and extended-temperature networking equipment. Per the Freescale hardware specification, designers must use thermal via arrays under the FCBGA exposed die and ensure adequate airflow or heatsinking to keep Tj below 125C under worst-case load.
Where can I download the MPC8543VTAQGB datasheet PDF?
The MPC8543VTAQGB hardware specification document (formerly Freescale document number MPC8543EC) is available from Freescale/NXP directly and from third-party repositories including Alldatasheet.com. Search for 'MPC8543VTAQGB hardware specifications' on the NXP documentation portal to access the most up-to-date revision covering electrical characteristics, pinout, and timing diagrams.
Where do I find the MPC8543VTAQGB pinout and ball map?
The MPC8543VTAQGB pinout (full 783-ball FCBGA ball map) is published in the Freescale/NXP hardware specifications manual section covering Package Information. Engineers can use the official document plus NXP's BSDL files for boundary-scan testing; third-party BGA viewer tools also load the .csv ball map extracted from the datasheet's package drawing.
What memory controller does the MPC8543VTAQGB integrate?
The MPC8543VTAQGB integrates a high-performance DDR1/DDR2 SDRAM memory controller with 36-bit physical addressing, supporting ECC for reliability. Per the hardware specification, the controller connects directly to external DDR2 DIMMs or discrete SDRAM, providing the bandwidth required for packet buffers and routing tables in networking line cards at gigabit line rates.
What Ethernet and bus interfaces does the MPC8543VTAQGB provide?
The MPC8543VTAQGB integrates four Gigabit Ethernet MACs (10/100/1000 Mbit) with TCP/IP acceleration, dual PCI/PCI-X interfaces, and LocalPlus / RapidIO interconnect for multi-processor expansion. According to the Freescale/NXP datasheet, this high level of integration eliminates external bridge chips and reduces BOM cost in multi-port router and switch designs.
What are the key specifications of the MPC8543VTAQGB that engineers should know?
The MPC8543VTAQGB key specifications are: PowerPC e500 32-bit core up to 1.0 GHz, 32 KB + 32 KB L1 cache, 256 KB unified L2 cache, four Gigabit Ethernet MACs, DDR1/DDR2 memory controller with 36-bit addressing, dual PCI/PCI-X, FCBGA-783 (29x29 mm) package, and 1.0 V core / 2.5 V + 3.3 V I/O supply. It targets networking routers, line cards, and industrial control with TCP/IP offload and -40C to +125C operation.

Données de référence d'ingénierie pour MPC8543VTAQGB — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MPC8543VTAQGB when designing networking line cards, mid-range routers, or industrial control platforms that need an integrated 1.0 GHz PowerPC e500 core with four Gigabit Ethernet MACs in the 783-FCBGA (29x29) footprint. Pick the MPC8545VTAQGB when you need higher MHz for deeper packet pipelines, or the MPC8547VTAQGB when you require enhanced TCP/IP offload engines. Select the MPC8543EVTAQGB for harsh-environment applications where the extended temperature grade is mandatory. Avoid the MPC8543VTANGB unless cost trumps performance, since the 667 MHz variant has roughly 33% less compute headroom. For new designs where long-term supply matters, consider migrating to NXP's QorIQ Layerscape family, but the MPC8543VTAQGB remains the right choice when firmware compatibility, drop-in fit, or cost targets dominate.

Comparaison avec les alternatives

Paramètre Ce produit MPC8545VTAQGB MPC8547VTAQGB MPC8543EVTAQGB MPC8543VTANGB MPC8543VTAJD
Package 783-FCBGA (29x29) 783-FCBGA (29x29) - same 783-FCBGA (29x29) - same 783-FCBGA (29x29) - same 783-FCBGA (29x29) - same 783-FCBGA (29x29) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Maximum Core Frequency 1.0 GHz ~1.2 GHz ~1.0 GHz with enhanced offload 1.0 GHz 667 MHz 1.0 GHz
Core PowerPC e500 (32-bit) PowerPC e500 (32-bit) PowerPC e500 (32-bit) PowerPC e500 (32-bit) PowerPC e500 (32-bit) PowerPC e500 (32-bit)
Ethernet MACs 4x Gigabit 4x Gigabit 4x Gigabit 4x Gigabit 4x Gigabit 4x Gigabit
Memory Controller DDR1/DDR2 (36-bit) DDR1/DDR2 (36-bit) DDR1/DDR2 (36-bit) DDR1/DDR2 (36-bit) DDR1/DDR2 (36-bit) DDR1/DDR2 (36-bit)
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C (extended grade) -40C to +125C -40C to +125C

Principaux différenciateurs

  • Lower cost entry into PowerQUICC III with 1.0 GHz e500 core (vs MPC8547VTAQGB)
  • Industrial temperature rating from the start (vs MPC8560VT833LC)
  • Integrated 4x Gigabit Ethernet MACs eliminates external bridge chips (vs MPC8543VTANGB (667 MHz variant))

Notes de conception

The 783-FCBGA package requires a high-density PCB with microvia-in-pad or sub-1 mm via fanout to escape the 0.8 mm ball pitch. Use at least an 8-layer stackup with dedicated ground and power planes directly beneath the BGA. Place decoupling capacitors on the bottom side directly under the BGA footprint, connected through short vias to the power planes. Maintain 50 ohm controlled impedance on all Ethernet MII/GMII and RapidIO traces, with length matching for differential pairs.

The FCBGA exposes die to a heat spreader or directly to the board; place a thermal via array (0.3 mm drilled, 1.0 mm pitch) under the central die region and stitch them to the internal ground plane. Estimated: at 1.0 GHz with all four Gigabit Ethernet ports active, the device dissipates approximately 8-10 W; without thermal vias, Tj could exceed 125C in a sealed enclosure at 70C ambient. Always validate Tj under worst-case workload with a thermal probe or IR camera.

DDR2 memory interface traces must be length-matched within +/- 25 mils per byte lane with proper termination at the fly-by topology. The 90 nm e500 core's clock PLL is sensitive to power-rail noise - isolate the 1.0 V core supply from the 2.5 V/3.3 V I/O supplies using a ferrite bead and dedicate separate bulk capacitors to each rail. Use series damping resistors on PCI-X clock lines to suppress overshoot in long backplane traces.

Do not confuse the MPC8543 with the pin-compatible but electrically different MPC8545/8547 variants when ordering - the firmware binary must match the silicon revision. Always order from authorized distributors (Rochester Electronics on DigiKey or NXP direct on Mouser) to avoid remarked parts with incorrect speed-grade stamps. The HRESET_REQ pin must be held high during power-up until all supplies stabilize, otherwise the e500 core may latch up; refer to the hardware specification's power-on sequence diagram.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS and REACH compliant per NXP/Freescale product page. Lead-free and halogen-free packaging. Not AEC-Q100 qualified - this is an industrial/networking processor, not an automotive grade.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MPC8543VTAQGB MPC8543VTAQGB datasheet NXP MPC8543VTAQGB PowerQUICC III 1GHz FCBGA-783 MPC8543VTAQGB pinout MPC8543 router processor MPC8543VTAQGB vs MPC8545VTAQGB MPC8543VTAQGB drop-in replacement MPC8543VTAQGB buy price PowerPC e500 32-bit MPU 1GHz MPC8543VTAQGB alternative FCBGA-783 networking processor

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MPC8543VTAQGB MPC8545VTAQGB MPC8547VTAQGB MPC8560VT833LC PowerQUICC III PowerPC e500 Microprocessor Unit (MPU) system-on-chip (SoC) integrated processor DDR2 SDRAM FCBGA-783 Ball Grid Array (BGA) Gigabit Ethernet MAC TCP/IP offload engine PCI-X LocalPlus RapidIO IEEE 1588 RoHS REACH telecom line card enterprise router industrial control platform
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