MPC885ZP80 - PowerQUICC 32-Bit MPU, 80MHz, 357-BGA | NXP
Référence : MPC885ZP80 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.75 | $387,50 |
| 100 | $33.9 | $3 390,00 |
| 500 | $29.2 | $14 600,00 |
| 1 000 | $25.85 | $25 850,00 |
MPC885ZP80 Présentation
A PowerQUICC processor is a category of integrated communications processor that pairs a Power Architecture CPU with peripheral subsystems optimized for WAN, LAN, telecom, and industrial control. In the broader taxonomy it sits between a general-purpose microcontroller (MCU) and a high-performance applications processor, filling the niche where deterministic real-time response plus on-chip serial protocols are required without paying the cost and power of an applications SoC. The MPC885 belongs to the PowerQUICC I family, distinguished from PowerQUICC II by its core architecture and peripheral mix.
Key features include an 80 MHz 32-bit Power Architecture core, integrated communications processor module (CPM) supporting serial protocols, 3.3 V single-supply operation, 357-ball PBGA package (25 x 25 mm), and the legacy industrial operating range of 0 °C to 95 °C. The CPM offloads DMA, HDLC, and serial-channel handling from the core, freeing the CPU for higher-layer protocol and application logic.
Architecturally, the MPC885ZP80 implements separate instruction and data caches, a memory management unit, and the CPM that drives multiple SCCs, SMCs, and an SPI/I2C controller. The 0.18 µm CMOS process and integrated PLL allow the 3.3 V I/O while internally scaling the core. Power dissipation is bounded by the package thermal resistance and the activity of the CPM-driven serial channels.
Typical applications include low-end routers, DSL and cable modems, industrial serial protocol bridges, set-top box controllers, and embedded telecom line cards. The 357-PBGA footprint is shared across the MPC885 family, enabling PCB reuse across speed, temperature, and feature variants. Designers value the deterministic CPM interrupt latency for real-time serial traffic.
When designing with this part, allocate the full PBGA breakout with at least 4 inner power/ground planes for the 357-ball array, and follow NXP's reference design for power decoupling. The legacy 0-95 °C temperature window means the part is NOT suited for extended-industrial or automotive environments - choose the MPC885CVR80 or a PowerQUICC II derivative for -40 °C to +105 °C applications.
This page synthesizes distributor pricing, drop-in alternatives within the 357-PBGA footprint, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MPC885ZP80 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC885ZP80 (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Data Cache, Instruction Cache, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC885VR80
✅ Remplacement direct✓ En stock
$27.5 / unité
Voir la fiche technique →MPC885CVR80
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC880ZP80
✅ Remplacement direct✓ En stock
$19.1 / unité
Voir la fiche technique →MPC880VR80
✅ Remplacement direct✓ En stock
$25.53 / unité
Voir la fiche technique →KMPC885ZP80
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC885ZP80 Valeurs maximales et caractéristiques électriques
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture (MPC8xx) |
| Core Speed | 80 MHz |
| Operating Voltage | 3.3 V |
| Boîtier / Format | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Statut RoHS | Non-Compliant (legacy product) |
| Number of Cores | 1 |
| Bit Width | 32-Bit |
| Température de fonctionnement | 0 °C to +95 °C (commercial) |
| On-chip Communications Module | CPM (SCC/SMC/SPI/I2C) |
| Type de montage | Surface Mount (BGA) |
| Process Technology | 0.18 µm CMOS |
| I/O Voltage | 3.3 V |
Configuration des broches de MPC885ZP80
| Broche A1 | VDD — Core power supply |
| Broche A2 | VCC — I/O power supply |
| Broche B1 | GND — Ground |
| Broche B23 | TMS — JTAG test mode select |
| Broche C12 | TXD1 — SCC1 transmit data |
| Broche D5 | RXD1 — SCC1 receive data |
| Broche L23 | RESET — Hardware reset (active low) |
| Broche T1 | XTAL1 — Crystal oscillator input |
| Broche T2 | XTAL2 — Crystal oscillator output |
| Broche W12 | TCK — JTAG test clock |
| Broche Y23 | TDI — JTAG test data in |
| Broche AB5 | TDO — JTAG test data out |
Applications typiques
MPC885ZP80 convient pour 6 applications: Low-End Routers and Edge Networking, DSL and Cable Modem CPE, Industrial Serial Protocol Bridges, Set-Top Box and Media Gateway Controllers, Embedded Telecom Line Cards, Legacy POS and Kiosk Controllers.
Low-End Routers and Edge Networking
The MPC885ZP80 fits low-end router and edge-networking designs because it integrates a Power Architecture core at 80 MHz with the CPM that offloads HDLC, UART, and transparent serial protocols. Placed on a WAN-edge line card, it can drive multiple SCC channels simultaneously while the core handles routing tables and management plane. Unlike a discrete MCU plus external PHY approach, the integrated CPM provides deterministic interrupt latency that is critical for serial WAN timing. Power draw is bounded by CPM channel activity and the 357-PBGA thermal envelope.
Recommandé
DSL and Cable Modem CPE
The MPC885ZP80 is well-matched to DSL and cable modem customer-premises equipment where 80 MHz core performance and on-chip serial controllers are sufficient for the data-plane forwarding. The CPM's SCC channels can host the DSL/Cable PHY interface directly, while Ethernet connects to the LAN side. Compared with a discrete CPU + serial-controller chipset, the MPC885ZP80 reduces BOM and PCB area. Designers should budget thermal headroom for continuous PPPoE/ATM cell processing.
Recommandé
Industrial Serial Protocol Bridges
Industrial serial protocol bridges benefit from the MPC885ZP80's CPM because it provides multiple SCC/SMC channels that can run UART, HDLC, or transparent bit streams concurrently. The 80 MHz core is sufficient to terminate Modbus, Profibus, or proprietary serial protocols while forwarding to Ethernet. The commercial 0-95 °C temperature window is the key constraint - choose MPC885VR80 for industrial cabinets. Integration reduces the need for an external protocol-conversion ASIC.
Recommandé
Set-Top Box and Media Gateway Controllers
The MPC885ZP80 was widely deployed in early-generation set-top boxes and media gateways where it handled transport-stream demultiplexing and conditional-access logic via its SCC channels. The 80 MHz core and on-chip memory controllers can sustain MPEG-2 transport processing for standard-definition streams. For HD or modern H.264 streams, designers migrated to PowerQUICC II (MPC8280) or PowerQUICC III parts. The legacy footprint remains useful for sustaining installed SD deployments.
Recommandé
Embedded Telecom Line Cards
Embedded telecom line cards use the MPC885ZP80 for T1/E1 termination and channelized serial aggregation through the CPM SCCs. The deterministic CPM interrupt latency ensures framing and signaling bits are processed within their time-slot budgets. Compared with a soft-core CPU + FPGA approach, the integrated CPM and TDM support reduce complexity. The 3.3 V supply simplifies line-card power architecture relative to 5 V legacy telecom designs.
Recommandé
Legacy POS and Kiosk Controllers
Legacy point-of-sale terminals and kiosk controllers can use the MPC885ZP80 to drive multiple serial peripherals (Pole displays, receipt printers, magnetic-stripe readers, cash drawers) via the integrated SCCs. The 80 MHz core handles payment-flow application logic while the CPM offloads real-time serial byte streams. The 357-PBGA package and 0-95 °C window suit indoor retail environments. New designs should evaluate modern ARM Cortex-A7 SoCs for cost reasons, but the MPC885ZP80 remains viable for long-life-cycle deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC885ZP80 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC885VR80 | MPC885CVR80 | MPC880ZP80 | MPC880VR80 | KMPC885ZP80 |
|---|---|---|---|---|---|---|
| Package | 357-BPBGA (25x25) | 357-BPBGA (25x25) - same | 357-BPBGA (25x25) - same | 357-BPBGA (25x25) - same | 357-BPBGA (25x25) - same | 357-BPBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +95 °C | -40 °C to +105 °C (industrial) | -40 °C to +105 °C (industrial, RoHS) | 0 °C to +95 °C | -40 °C to +105 °C (industrial) | 0 °C to +95 °C |
| CPM Peripherals | Full MPC885 CPM (multiple SCCs + SMCs) | Full MPC885 CPM | Full MPC885 CPM | Reduced MPC880 CPM (fewer SCCs) | Reduced MPC880 CPM (fewer SCCs) | Full MPC885 CPM |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant (legacy) | RoHS-compliant | Non-Compliant (legacy) | Non-Compliant (legacy) | Non-Compliant (legacy) |
| Lifecycle Status | Last-time-buy | Last-time-buy (similar) | Last-time-buy (similar) | Last-time-buy (similar) | Last-time-buy (similar) | Last-time-buy (Rochester stock) |
Principaux différenciateurs
- Full MPC885 CPM peripheral set (vs MPC880ZP80)
- 80 MHz maximum speed grade of the family (vs MPC880VR80)
- Commercial temperature grade for indoor use (vs MPC885CVR80)
Notes de conception
The 357-ball PBGA requires a 4-layer minimum stackup with at least 2 inner ground planes for the via-in-pad and dog-bone fanout. Use a 1.0 mm ball pitch PCB fabricator to keep breakout manageable. Per NXP design guidelines, place 0.1 uF + 10 uF decoupling within 50 mils of every power ball, and route the PLL analog supply (VDDSYN) through a ferrite bead filter to isolate from digital switching noise.
Estimated: at typical 3.3 V operation with CPM driving 2-4 active SCC channels at 80 MHz, the MPC885ZP8 ball-grid array dissipates approximately 1.5-2.5 W depending on I/O toggle rate. The 357-PBGA junction-to-ambient thermal resistance is [DATA_NEEDED] C/W per datasheet - assume 25-30 C/W with modest airflow and derate accordingly. Provide at least 1 oz copper on outer layers with thermal via arrays under the center power balls.
Do not confuse the MPC885ZP80 (commercial 0-95 °C, lead-bearing) with the MPC885VR80 (industrial -40 to +105 °C) or the MPC885CVR80 (industrial + RoHS). The package suffix 'ZP' encodes commercial + non-RoHS - always verify against your application's temperature and RoHS requirements. Boot-mode configuration pins must be pulled correctly at reset, otherwise the part will hang in the BIST loop.
The CPM-driven SCC serial lines (TXD/RXD clocks) can produce sharp edges; route these as 50-ohm controlled-impedance traces with proper termination at the PHY. Avoid routing SCC traces adjacent to the crystal oscillator traces (XTAL1/XTAL2) to prevent coupling. The JTAG signals (TCK/TMS/TDI/TDO) should be pulled per IEEE 1149.1 to keep the boundary scan stable during reset.
Informations de conformité
DigiKey listing shows Lead Free Status: Contains Lead. RoHS non-compliant per verified web data. Reach, halogen, and conflict-mineral status not stated in source material.
