P1014NXN5HFA - QorIQ P1 800MHz PowerPC e500v2 MPU | NXP
Référence : P1014NXN5HFA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $75 | $75,00 |
| 10 | $68.5 | $685,00 |
| 100 | $60.2 | $6 020,00 |
| 500 | $52.75 | $26 375,00 |
| 1 000 | $47.1 | $47 100,00 |
P1014NXN5HFA Présentation
A communications SoC (System-on-Chip) is an integrated circuit that consolidates a CPU core, memory controller, and multiple peripheral interfaces onto a single die. The P1014 belongs to the QorIQ P1 tier of NXP's QorIQ family, which evolved from the PowerQUICC line and is built on Power Architecture technology. Within the broader hierarchy, it sits between low-cost microcontrollers and high-performance Layerscape processors, optimized for fanless industrial gateways, routers, and control-plane tasks.
Key features of the P1014NXN5HFA include an 800 MHz e500v2 core, hardware-accelerated SEC security block, dual GbE MACs, three PCIe Gen 2 controllers, two SATA interfaces, two USB 2.0 ports, a DDR3/DDR3L memory controller with ECC support, and an extended-temperature grade of -40C to +105C. The 45 nm process technology provides a balanced power/performance envelope for embedded networking workloads without active fans.
The architecture combines a single-threaded e500v2 execution core with a coherent system bus connecting to the platform's peripheral IP. The integrated SEC block offloads cryptographic operations such as AES, DES, SHA, and Kasumi, while the DDR3 controller with ECC supports memory reliability for industrial and networking deployments. The integrated communication interfaces reduce external component count, BOM cost, and PCB complexity.
Typical applications include industrial Ethernet gateways, factory-automation controllers, secure routers and firewalls, telecom control-plane processors, networked printers, smart-grid edge nodes, and small-form-factor NAS/SAN appliances. The extended temperature range enables deployment in harsh industrial environments without thermal derating.
When designing with the P1014NXN5HFA, ensure proper thermal management using the thermal pad exposed on the bottom of the 425-TEPBGA package, and follow NXP's hardware design guide for DDR3 trace length matching and PCIe reference clock routing to avoid signal-integrity issues.
This page synthesizes distributor pricing, same-family NXP alternatives (P1014NXN5HFB, P1024NXN5HFA, P1010NXN5HFA), and practical design notes not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour P1014NXN5HFA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1014NXN5HFA (même facteur de forme et même empreinte) — différant par Memory Controller, Operating Temperature, Package, Security Engine, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1014NXN5HFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1010NXN5HFA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1024NXN5HFA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1014NSE5HFA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$53.2 / unité
Voir la fiche technique →P1014NSN5HFA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$25.1 / unité
Voir la fiche technique →P1014NXN5HFA Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 800 MHz |
| Température de fonctionnement | -40C to +105C |
| Boîtier | 425-TEPBGA I (19x19 mm) |
| Type de montage | Surface Mount |
| Integrated Interfaces | USB 2.0, SATA, Gigabit Ethernet, PCIe Gen 2 |
| Memory Controller | DDR3 / DDR3L with ECC |
| Security Accelerator | SEC (AES, DES, SHA, Kasumi) |
| Process Technology | 45 nm |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Packaging | Tray |
Guide de configuration des broches du P1014NXN5HFA 425-tepbga i (19x19 mm)
Configuration des broches du P1014NXN5HFA (boîtier 425-tepbga i (19x19 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1014NXN5HFA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1014NXN5HFA convient pour 6 applications: Industrial Ethernet Gateway, Secure Router and Firewall, Telecom Control Plane Equipment, Factory Automation Controller, Networked Printer / MFP Controller, Smart-Grid Edge Node / Substation Equipment.
Industrial Ethernet Gateway
The P1014NXN5HFA is well matched to industrial ethernet gateway applications because its 800 MHz PowerPC e500v2 core delivers enough compute to run protocol conversion stacks while the dual integrated Gigabit Ethernet MACs, three PCIe Gen 2 controllers, and DDR3 with ECC provide the connectivity and reliability demanded by industrial networks. Placed as the system processor with two GbE ports for LAN/WAN separation and PCIe lanes for wireless or expansion modules, the part avoids adding a discrete MAC and reduces BOM cost. The hardware SEC accelerator offloads IPsec and TLS, enabling secure remote access. The extended -40C to +105C temperature range supports deployment inside unventilated control cabinets near motors.
Recommandé
Secure Router and Firewall
The P1014NXN5HFA fits secure router and firewall designs because the SEC block accelerates AES, DES, SHA, and Kasumi at line rate while the e500v2 core runs the routing and policy engines. Used as the main control-plane and data-plane processor with two GbE WAN/LAN ports, the part eliminates the need for a discrete crypto ASIC. The 425-TEPBGA I package exposes a thermal pad for direct heatsink attachment, which keeps the junction within safe limits under sustained encrypted throughput. The DDR3 with ECC controller is well suited for routing-table-heavy workloads that demand memory integrity. The integrated SATA and USB 2.0 ports simplify local logging and firmware update storage.
Recommandé
Telecom Control Plane Equipment
The P1014NXN5HFA is appropriate for telecom control-plane applications because its 800 MHz e500v2 core, hardware encryption, ECC-protected DDR3 controller, and industrial temperature range meet telecom environmental requirements. Placed as the management and control-plane processor, the part handles OAM, provisioning, and encryption while leaving line-rate forwarding to a co-processor. The three PCIe Gen 2 lanes connect to PHY or co-processor companions, and the dual GbE MACs address OAM and management ports. The -40C to +105C operating envelope and ECC memory support the long-life, high-reliability requirements of telecom central-office and outdoor deployments.
Recommandé
Factory Automation Controller
The P1014NXN5HFA suits factory automation controllers because the integrated SoC consolidates CPU, networking, encryption, and storage I/O on a single chip, shrinking PCB footprint and BOM in space-constrained DIN-rail enclosures. The dual GbE ports carry EtherCAT, PROFINET, or OPC UA traffic while PCIe lanes attach to industrial I/O modules. The hardware SEC block secures machine-to-machine authentication, and the DDR3 with ECC controller protects against soft errors in long-life deployments. The -40C to +105C temperature range and 425-TEPBGA I thermal pad support fanless cabinet installation without thermal throttling under continuous CNC or PLC workloads.
Recommandé
Networked Printer / MFP Controller
The P1014NXN5HFA fits networked printer and MFP controller boards because the e500v2 core runs the page-description-language interpreter and the integrated SATA port attaches a hard drive for job spooling. The USB 2.0 host supports peripheral expansion, the dual GbE MACs handle print-server and admin traffic, and the DDR3 with ECC controller protects large job buffers against soft errors. The 425-TEPBGA I package enables compact controller-board layouts that fit inside printer chassis with constrained thermal envelopes. The industrial temperature grade supports the elevated internal temperatures common in toner-fusing printer enclosures.
Recommandé
Smart-Grid Edge Node / Substation Equipment
The P1014NXN5HFA is well matched to smart-grid edge nodes because its hardware SEC block accelerates IEC 62351 secure authentication while the dual GbE MACs support substation LAN and WAN connectivity. The extended -40C to +105C operating range handles outdoor cabinet and substation environments, and the DDR3 with ECC controller delivers the memory integrity required by long-life utility deployments. Used as the main processor with PCIe-attached PHY and serial-attached I/O modules, the part consolidates secure metering aggregation, and remote firmware management functions. The 425-TEPBGA I package's thermal pad allows passive heatsink attachment for fanless substation cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1014NXN5HFA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1014NXN5HFB | P1010NXN5HFA | P1024NXN5HFA | P1014NSE5HFA | P1014NSN5HFA |
|---|---|---|---|---|---|---|
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 (dual-core) | PowerPC e500v2 | PowerPC e500v2 |
| Core Count | 1 | 1 | 1 | 2 | 1 | 1 |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Security Accelerator (SEC) | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Extended industrial temperature range with integrated SEC crypto acceleration (vs P1010NXN5HFA)
- Single-core 800 MHz optimum for embedded control versus dual-core P1024 (vs P1024NXN5HFA)
- Fully integrated SoC reduces external component count (vs Discrete CPU + external MAC + discrete crypto ASIC design)
Notes de conception
The P1014NXN5HFA is housed in a 425-TEPBGA I package with an exposed-die thermal pad on the top surface. The pad must be thermally bonded to a heatsink or spreader using a high-quality thermal interface material to keep the junction below 125C under sustained load. Without adequate thermal management, the device can exceed safe operating limits during encrypted line-rate workloads where the SEC block draws noticeable power.
The 425-TEPBGA I package uses a sub-1.0 mm ball pitch, which typically requires 0.5 mm or smaller via-on-pad and laser-drilled microvia PCB fabrication for reliable assembly. Per the NXP QorIQ P1014 hardware design guide, the DDR3 data group requires trace-length matching within tight tolerances, and the PCIe reference clock must be routed with proper isolation to avoid jitter. Allocate at least 4 routing layers for breakouts under the BGA fan-out region.
The P1014NXN5HFA requires multiple supply rails (core, DDR3 I/O, and SERDES I/O). Per the NXP QorIQ P1014 datasheet, decoupling must follow the reference schematic with bulk capacitors placed within 25 mm of the BGA and high-frequency ceramics within 5 mm of each supply pin. Cold-rail sequencing is recommended at power-up to prevent latch-up; consult the NXP reference schematic for the canonical sequencing network.
PCIe Gen 2 interfaces require AC-coupling capacitors on transmit pairs and matched-length routing. The dual GbE MACs typically drive RGMII or SGMII PHYs, with the SGMII variant needing careful attention to reference-clock jitter. The DDR3 controller with ECC requires VTT termination and matched impedance; use fly-by topology per the NXP DDR3 design guide to avoid signal-integrity degradation at higher data rates.
Estimated: do not populate the boot configuration without first programming the RCW (Reset Configuration Word) into the SPI flash or NOR flash, otherwise the part will fail to boot. The 'HFA' suffix indicates the 800 MHz extended-temperature grade; substituting the 'HFB' suffix without verifying the boot RCW matches may produce non-functional boards. Avoid mounting the part near high-variability heat emitters on the PCB to keep the case temperature within the -40C to +105C rating.
Informations de conformité
RoHS compliant and lead-free per NXP product page and DigiKey listings. REACH, halogen-free, and conflict-minerals status not specified in verified data. AEC-Q100 not applicable for industrial-grade MPU.
