PACDN006MR - 6-Channel ESD Protection Array | onsemi
Référence : PACDN006MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
PACDN006MR Présentation
An ESD protection array is a circuit-protection component placed beside a connector, exposed interface, or sensitive electronic subsystem. It absorbs electrostatic-discharge transients before they reach lower-voltage logic or analog circuitry. In the broader protection hierarchy, the PACDN006MR belongs to TVS diode arrays and surge protectors, with low parasitic capacitance helping preserve high-frequency signal integrity. It is intended for interfaces where ESD immunity and compact routing matter more than continuous power-conversion functionality.
The principal verified characteristics are six protection channels, 3 pF capacitance, and an 8-pin MSOP package. The product is marketed as an ESD suppressor diode array rather than a general-purpose rectifier or power regulator. Its protection topology uses steering diodes connected between protected signal nodes and supply rails, allowing transient current to be diverted away from the protected device. The manufacturer product page specifically identifies positive VP and negative VN rails, and notes that the decoupling capacitor should be placed as close as possible to pin 7.
Because this is a discrete protection array, its key design trade-off is low added capacitance versus transient-current capability and clamp behavior. The exact pin names, voltage ratings, current limits, and detailed application-specific clamp data were not included in the supplied verified records and are marked for data completion rather than inferred. Use the manufacturer datasheet and application guidance before finalizing PCB placement, rail selection, and production release.
Typical applications include handheld-device connectors, USB and other low-voltage communication interfaces, external control ports, and mixed-signal subsystems requiring protection on several adjacent signals. The array is particularly useful when a design needs multiple protected channels in one small package. Compared with discrete single-channel TVS devices, the integrated six-channel arrangement can reduce component count and simplify protection routing, while its 3 pF capacitance adds a measurable loading budget to fast interfaces.
For layout, place the protection array at the board edge or immediately adjacent to the connector entry, connect protected traces directly into the array, and route transient-current paths toward the appropriate supply rails with short, low-impedance traces. Keep the decoupling capacitor close to pin 7 as directed by the manufacturer guidance. Confirm the external interface voltage, data rate, ground-reference arrangement, and the required IEC 61000-4-2 system-level test conditions before production.
This page consolidates verified distributor and manufacturer information, package-level identification, protection intent, and engineering guidance for PACDN006MR evaluation.
Alternatives de remplacement direct pour PACDN006MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PACDN006MR
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →PACDN006MR Spécifications
| Product Type | 6-channel ESD protection diode array |
| Protection Channels | 6 channels |
| Capacitance | 3 pF |
| Contact Discharge Protection | ±8 kV per IEC 61000-4-2 |
| Air Discharge Protection | ±15 kV per Human Body Model |
| Positive Rail | VP |
| Negative Rail | VN |
| Boîtier | 8-pin MSOP surface-mount package |
| Termination Style | Solder pad |
| Type de montage | Surface mount |
| Diode Topology | Pair of diodes per protected channel |
| Transient Path | Steers ESD current toward VP or VN |
| Decoupling Capacitor Recommendation | Place as close as possible to pin 7 |
| Application Category | ESD protection for electronic components or subsystems |
| Statut RoHS | unknown |
| REACH Status | unknown |
Guide de configuration des broches du PACDN006MR 8-pin msop surface-mount package
Configuration des broches du PACDN006MR (boîtier 8-pin msop surface-mount package). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour PACDN006MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PACDN006MR convient pour 6 applications: Handheld Device Connector Protection, Low-Voltage Communication Port, USB-Style External Interface, Industrial Control and Sensor Interface, Mixed-Signal Measurement Interface, Embedded System External Control Port.
Handheld Device Connector Protection
The PACDN006MR fits handheld-device connectors because its six-channel architecture can protect several adjacent external-accessible signals in one compact 8-pin MSOP. The 3 pF capacitance helps limit loading on digital or control lines, while the paired steering diodes direct ESD current toward VP or VN rather than into the protected electronics. Place the array at the connector entry and keep the transient path short. The manufacturer-related guidance specifically recommends placing the decoupling capacitor as close as possible to pin 7.
Recommandé
Low-Voltage Communication Port
For a low-voltage communication port, the PACDN006MR provides a compact multi-line ESD barrier at the physical interface boundary. Its six channels allow several data or control conductors to be protected without placing six separate single-line devices on the board. The 3 pF capacitance should be included in the receiver and trace capacitance budget, particularly when rise times are short. Confirm that VP and VN rails match the interface voltage and that the protected signal amplitudes remain within the array's working limits.
Recommandé
USB-Style External Interface
The PACDN006MR is suitable for a USB-style or similar external connector when the design needs several ESD-protected conductors near the board edge. Its surface-mount MSOP package supports compact routing, and the 3 pF capacitance is a useful starting point for evaluating signal integrity. The protection array should be positioned before the traces enter the main board area, with a short return to the designated supply rails. Verify line speed, connector insertion exposure, rail voltage, and the exact channel mapping in the manufacturer datasheet.
Recommandé
Industrial Control and Sensor Interface
Industrial control boards often expose connectors to cable transients and user-contact discharge, making the PACDN006MR useful as a six-line protection array. The component helps steer ESD energy toward VP or VN while maintaining a relatively low 3 pF capacitance. In an industrial design, the exact protection network must be coordinated with the signal source impedance, cable length, connector grounding, and any additional surge-protection requirement. Validate the completed assembly under the applicable system-level ESD test conditions.
Recommandé
Mixed-Signal Measurement Interface
A mixed-signal measurement interface can benefit from placing PACDN006MR at exposed connector pins before sensitive analog or digital circuitry receives the signal. The 3 pF capacitance is the primary design check: it must be acceptable for the source impedance, sampling rate, and required settling behavior. The six-channel format is useful when several external controls or sensors share a connector. Confirm that the ESD steering topology does not interfere with the normal bias, common-mode, and power-supply arrangement.
Recommandé
Embedded System External Control Port
The PACDN006MR can protect the external control port of an embedded system where several lines leave the board through a connector or header. Integrating six channels in one 8-pin MSOP can simplify the protection layout and reduce component count compared with separate single-channel devices. Route the array at the enclosure-facing edge, keep protected traces away from sensitive analog nodes, and verify the VP/VN return paths. The device supplements the MCU's internal protection and does not replace correct enclosure and grounding design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PACDN006MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PACDN006MR |
|---|---|---|
| Package | 8-pin MSOP | 8-pin MSOP |
| Brand | onsemi | onsemi |
| Protection Channels | 6 channels | 6 channels |
| Capacitance | 3 pF | 3 pF |
| Contact Discharge | ±8 kV per IEC 61000-4-2 | ±8 kV per IEC 61000-4-2 |
| Air Discharge | ±15 kV per Human Body Model | ±15 kV per Human Body Model |
| Positive Rail | VP | VP |
| Negative Rail | VN | VN |
| Termination | Solder pad | Solder pad |
| Protection Architecture | Paired diodes steering ESD current | Paired diodes steering ESD current |
Principaux différenciateurs
- Six-channel protection in one compact package (vs Single-channel discrete ESD diodes)
- Low verified capacitance for compact interface protection (vs Higher-capacitance generic TVS arrangements)
- Bidirectional ESD steering to named rails (vs Protection networks lacking explicit VP/VN routing)
Notes de conception
Place the PACDN006MR directly at the connector entry, with the shortest practical connection between connector pins and the protected signal nodes. Keep the VP and VN transient-current paths short and low-impedance, and route the protected traces away from sensitive analog nodes. The supplied manufacturer-related guidance specifically calls for placing the decoupling capacitor as close as possible to pin 7; verify the final pin assignment against the official datasheet before routing.
Use the verified 3 pF capacitance as an early input to the interface budget. Compare it with the connector, PCB trace, receiver input, and cable capacitance, then check edge rate, attenuation, and settling requirements. The array may be acceptable for many low-voltage control or communication interfaces, but low capacitance alone does not guarantee compliance on every high-speed link. Validate with the actual connector, trace geometry, and termination network.
Do not treat PACDN006MR as a general-purpose power clamp or as the sole system-level ESD solution. Confirm the protected signal's maximum voltage, the VP/VN rail arrangement, channel-to-pin mapping, and the manufacturer clamp data before production. Avoid placing sensitive traces between the connector and protection array, and do not assume that the family-level IEC 61000-4-2 claim guarantees final-product compliance without enclosure and grounding evaluation.
Informations de conformité
The supplied verified records do not include definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. IEC 61000-4-2 and Human Body Model ESD ratings are device-protection references from the onsemi product page, not blanket product compliance claims.
