PIC16F1516T-I/ML - 8-Bit 20MHz 14KB Flash MCU | Microchip
Référence : PIC16F1516T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.95 | $1,95 |
| 10 | $1.78 | $17,80 |
| 100 | $1.55 | $155,00 |
| 500 | $1.32 | $660,00 |
| 1 000 | $1.18 | $1 180,00 |
| 1 600 | $1.05 | $1 680,00 |
PIC16F1516T-I/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash for program storage, SRAM for data, and EEPROM for non-volatile data), and programmable peripherals into one package. PIC microcontrollers from Microchip use a RISC-based architecture with a small, deterministic instruction set, and they sit at the foundation of the embedded system hierarchy: MCU -> embedded controller -> semiconductor IC. The PIC16F1516 specifically belongs to the enhanced mid-range (XLP - eXtreme Low Power) family, balancing peripheral richness with very low active and sleep currents.
Key features include 10-bit ADC, two Capture/Compare/PWM (CCP) modules, SPI, MI2C, and EUSART communication peripherals. The supply voltage range is 2.3V to 5.5V, supporting both 3.3V and 5V system designs. Internal oscillator options reduce BOM cost, while the integrated 10-bit ADC eliminates the need for an external converter in many sensor-interface designs.
The PIC16F1516T-I/ML uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, providing deterministic interrupt latency and predictable execution timing. The 20MHz maximum clock delivers up to 5 MIPS throughput, sufficient for control loops, sensor fusion, and human-machine interface (HMI) logic in cost-sensitive applications.
Typical applications include battery-powered IoT sensors, consumer electronics control, industrial sensor interfaces, and low-power remote controls. The XLP technology enables sleep currents in the nanoampere range, which is critical for energy harvesting or battery-life-sensitive designs.
When designing with this part, ensure proper decoupling (100nF + 10uF bulk) close to VDD/VSS and use the exposed thermal pad (EP) for both thermal dissipation and ground reference. The QFN package requires careful PCB layout - via-in-pad or thermal vias under the EP are recommended for manufacturability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a faster path from selection to prototype.
Alternatives de remplacement direct pour PIC16F1516T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F1516T-I/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, I/O Pins, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F1516-I/ML
✅ Remplacement direct✓ En stock
$1.49 / unité
Voir la fiche technique →PIC16F1516-E/ML
✅ Remplacement direct✓ En stock
$1.21 / unité
Voir la fiche technique →PIC16F1517T-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F1516T-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | 8-bit PIC enhanced mid-range |
| CPU Frequency | 20 MHz (max, up to 5 MIPS) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 512 bytes |
| Operating Voltage | 2.3 V to 5.5 V |
| ADC | 10-bit |
| CCP Modules | 2 |
| Serial Interfaces | SPI, I2C (MI2C), EUSART |
| Nombre de broches | 28 |
| Boîtier | 28-pin QFN (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Family | PIC16F XLP 16F |
| Series | PIC16F1516 |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC16F1516T-I/ML 28-pin qfn (6x6 mm) with exposed pad
Configuration des broches du PIC16F1516T-I/ML (boîtier 28-pin qfn (6x6 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC16F1516T-I/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC16F1516T-I/ML convient pour 7 applications: Battery-Powered IoT Sensor Node, Industrial Sensor Interface Module, Consumer Remote Control (IR/RF), Automotive Interior Lighting Controller, Home Appliance Control Board, Hobby & Maker MCU Development Board, Security Keypad & Access Control Panel.
Battery-Powered IoT Sensor Node
The PIC16F1516T-I/ML is well-suited for battery-powered IoT sensor nodes thanks to its XLP (eXtreme Low Power) architecture and 2.3V-5.5V supply range. The 14KB Flash comfortably fits typical sensor-firmware stacks including sensor drivers, sample buffering, and small protocol stacks such as Modbus or lightweight MQTT-SN. The integrated 10-bit ADC handles temperature, light, or analog sensor interfaces without external converters. Sleep currents in the nanoampere range extend battery life to multiple years on a single coin cell. The 28-QFN package keeps the BOM footprint small - critical for wearable or spatially constrained sensor pods. Pair with a low-power radio such as the RFM69 or LoRa transceiver for a complete IoT node.
Recommandé
Industrial Sensor Interface Module
The PIC16F1516T-I/ML fits industrial 4-20mA sensor interface boards thanks to its industrial -40C to +85C temperature range and 5V-tolerant operation. The 10-bit ADC with multiple channels supports multiple sensor inputs simultaneously. The EUSART enables RS-485 half-duplex communication for industrial fieldbus connectivity. The 14KB Flash accommodates calibration tables and linearization firmware. Industrial designers benefit from the MCU's deterministic interrupt latency for time-critical control loops. The exposed-pad QFN package provides robust thermal performance under continuous operation in factory-floor enclosures.
Recommandé
Consumer Remote Control (IR/RF)
The PIC16F1516T-I/ML is an excellent fit for handheld remote controls that demand low cost, low power, and compact form factor. Its XLP architecture delivers microamp sleep current so a coin-cell remote can last years without battery replacement. The 2 CCP modules enable IR carrier generation or PWM-driven LED indicators. The 14KB Flash stores button-mapping logic, IR/RF protocol encoders (RC5, NEC, or proprietary), and learning-mode firmware for universal remotes. The 28-QFN 6x6 mm package fits slim handheld enclosures.
Recommandé
Automotive Interior Lighting Controller
The PIC16F1516T-I/ML's 2 CCP modules directly drive PWM-controlled interior LED channels for ambient lighting, dome lamps, or footwell illumination. The 20MHz CPU executes lighting animations, fade curves, and CAN/LIN message handling with low latency. Industrial temperature rating supports under-dash mounting environments. The 14KB Flash fits color-sequence firmware and LIN slave protocol stack. Note: this part is not AEC-Q100 qualified; for AEC-Q100 automotive designs choose PIC16F1516-E/ML (extended temp) or a Q-graded PIC16 variant. The 28-QFN footprint keeps PCB area minimal in space-constrained lamp modules.
Recommandé
Home Appliance Control Board
The PIC16F1516T-I/ML powers control boards in white goods and small home appliances such as coffee makers, blenders, or air purifiers. The 14KB Flash fits user-interface state machines, sensor-fusion routines, and motor-control logic. The 2 CCP modules drive PWM for fan speed control or solenoid actuation. The 10-bit ADC reads temperature, humidity, or motor current feedback. The industrial temperature rating ensures reliable operation in warm appliance enclosures. The 5V-tolerant GPIO interfaces directly with buttons, displays, and triac-driven AC loads.
Recommandé
Hobby & Maker MCU Development Board
The PIC16F1516T-I/ML is a strong choice for educational and maker development boards targeting PIC architecture learners. The 28-QFN package is breadboard-friendly when paired with a breakout PCB; the 14KB Flash and 512B RAM support non-trivial Arduino-style projects. The MPLAB X IDE and XC8 compiler offer free development tools. Pinout includes 25+ GPIO supporting LEDs, buttons, UART, SPI, and I2C peripherals - ideal for teaching embedded fundamentals. The XLP features demonstrate low-power design techniques in classroom labs.
Recommandé
Security Keypad & Access Control Panel
The PIC16F1516T-I/ML is appropriate for low-volume security keypads and access control panels where cost sensitivity matters. The 14KB Flash stores PIN-verification logic, EEPROM emulation for credential storage, and communication protocols for centralized access control systems. The EUSART interfaces with Wiegand readers or RS-485 networked panels. The 10-bit ADC supports tamper-detection circuitry and battery-backup voltage monitoring. Low-power XLP operation suits battery-backed panels that must operate through power outages.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F1516T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F1516-I/ML | PIC16F1516-E/ML | PIC16F1517T-I/ML | PIC16F1513-I/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SSOP - different |
| Program Memory (Flash) | 14 KB | 14 KB | 14 KB | 28 KB | 7 KB |
| Data RAM | 512 bytes | 512 bytes | 512 bytes | 1024 bytes | 256 bytes |
| CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| CCP Modules | 2 | 2 | 2 | 2 | 2 |
| Shipping Format | Tape & Reel | Tray | Tray/Tape & Reel | Tape & Reel | Tube |
Principaux différenciateurs
- Larger Flash at same price tier (vs PIC16F1513-I/SS)
- Extended temperature drop-in option available (vs PIC16F1516-I/ML)
- Memory upgrade path within same footprint (vs PIC16F1517T-I/ML)
Notes de conception
The 28-QFN (6x6) exposed thermal pad (EP) MUST be soldered to a continuous ground plane on the top PCB layer for both thermal dissipation and electrical grounding. Place an array of thermal vias (0.3 mm drill, 0.5 mm pitch) directly under the EP connecting to inner ground layers. Without EP soldering, the part's thermal resistance rises substantially and electrical performance degrades. A 100nF 0402 X7R decoupling capacitor placed within 2 mm of each VDD pin is recommended per Microchip QFN layout guidelines.
The PIC16F1516T-I/ML requires both high-frequency decoupling (100nF X7R ceramic per VDD/VSS pair) and bulk decoupling (4.7uF to 10uF tantalum or ceramic) on the main supply rail. For battery-powered designs using XLP sleep modes, add a 100k bleeder resistor to define ground reference during deep sleep. The internal voltage regulator requires an external 1uF to 10uF low-ESR capacitor on the VCORE pin per datasheet Section 2.0 - omitting this capacitor prevents startup.
Common pitfalls when designing with PIC16F1516T-I/ML: (1) Forgetting to configure unused I/O pins as outputs (not inputs) to minimize sleep current; (2) using the wrong oscillator configuration bits - the CONFIG registers must be set before code execution and can only be changed via ICSP; (3) confusing the F vs LF variants - LF parts have different voltage ranges and must not be substituted without firmware validation; (4) not enabling the watchdog timer in noisy industrial environments, leading to MCU lockups; (5) attempting to use the ADC with source impedance above 10 kOhm without an external buffer amplifier.
For SPI and MI2C signal integrity, keep trace lengths under 50 mm and route away from switching power traces. Add 4.7k pull-ups on I2C SDA/SCL lines per the I2C specification. For EUSART RS-485 connections, place a 100 Ohm termination resistor at the far end of the bus. Keep the ICSP programming header (PGD/PGC/VPP/VSS/VDD) accessible - through-hole pads at 2.54 mm pitch are recommended for production programming and debug access.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - choose PIC16F1516-E/ML extended temperature or a Q-graded variant for automotive applications. Halogen-free per Microchip environmental compliance statement.
