PIC16F15354T-E/SSVAO - 8-bit MCU 7KB Flash 28-SSOP AEC-Q100 | Microchip
Référence : PIC16F15354T-E/SSVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.66 | $16,60 |
| 100 | $1.41 | $141,00 |
| 500 | $1.2 | $600,00 |
| 1 000 | $1.05 | $1 050,00 |
| 2 100 | $0.92 | $1 932,00 |
PIC16F15354T-E/SSVAO Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and a rich set of peripheral interfaces (ADC, timers, communication, GPIO). Within the broader product hierarchy, the PIC16F15354 belongs to 8-bit microcontrollers -> microcontrollers -> embedded processors -> integrated circuits -> semiconductors. The /VAO suffix indicates the automotive-qualified variant of this device, screened to AEC-Q100 stress-test standards for use in vehicle body, chassis, and infotainment ECUs.
Key features include 7KB self-programmable Flash with device information area, 256B data EEPROM, Peripheral Module Disable (PMD) for granular power gating, multiple temperature sensor inputs, zero-cross detection, and a windowed watchdog timer. The CIPs (Core Independent Peripherals) implement signal conditioning, waveform generation, and logic functions in hardware without CPU intervention, offloading the core for deterministic real-time response and lower software complexity.
The architecture is built on an enhanced mid-range 8-bit core with a 14-bit instruction word, hardware stack, and a 32 MHz internal oscillator. The 10-bit ADC can run in sleep mode under core-independent control, enabling ultra-low-power sensor acquisition. The combination of XLP sleep currents in the sub-uA range and CIP-based wake-up logic enables years of battery life in automotive and IoT edge-node applications.
Typical applications include automotive body control modules, sensor interface nodes, HVAC controls, interior lighting, automotive sensor clusters, low-power IoT edge nodes, and battery-powered industrial sensor transmitters where AEC-Q100 qualification and small footprint are required.
When designing with this device, place a 100 nF ceramic bypass capacitor as close to VDD as possible and follow Microchip's AN2300 layout guidelines for SSOP-28. Use the PMD register to disable unused peripherals and drive the device into XLP sleep whenever the application allows to maximize battery life.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not aggregated on any single distributor product page.
Alternatives de remplacement direct pour PIC16F15354T-E/SSVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F15354T-E/SSVAO (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F15354-E/SS
✅ Remplacement direct✓ En stock
$0.84 / unité
Voir la fiche technique →PIC16F15345T-E/SSVAO
✅ Remplacement direct✓ En stock
$1.27 / unité
Voir la fiche technique →PIC16F15344-I/SS
✅ Remplacement direct✓ En stock
$0.79 / unité
Voir la fiche technique →PIC16F15254-I/SS
✅ Remplacement direct✓ En stock
$0.55 / unité
Voir la fiche technique →PIC16F1518T-I/SS
✅ Remplacement direct✓ En stock
$1.21 / unité
Voir la fiche technique →ATMEGA88PA-AUR
✅ Remplacement direct✓ En stock
$0.82 / unité
Voir la fiche technique →PIC16F15354T-E/SSVAO Valeurs maximales et caractéristiques électriques
| Product Family | PIC16F153xx |
| Core | 8-bit PIC (enhanced mid-range, 14-bit instruction word) |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data RAM | 512 B |
| Data EEPROM | 256 B |
| Max CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 3 V (per datasheet, F-series) |
| ADC | 10-bit, up to 24 channels |
| DAC | 5-bit, 1 channel |
| Comparators | Yes |
| Core Independent Peripherals (CIPs) | Yes (CWG, NCO, CLC, CCP, PWM) |
| Peripheral Module Disable (PMD) | Yes |
| Temperature Sensor | Internal |
| Operating Temperature (E suffix) | -40C to +125C |
| Boîtier | 28-pin SSOP (5.30 mm body width) |
| Automotive Qualification | AEC-Q100 (/VAO suffix) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de PIC16F15354T-E/SSVAO
| Broche 1 | RA5 — I/O port A bit 5 |
| Broche 2 | RA4 — I/O port A bit 4 |
| Broche 3 | RA3 — I/O port A bit 3 (also MCLR shared on some PIC16F153xx variants) |
| Broche 4 | RA2 — I/O port A bit 2 |
| Broche 5 | RA1 — I/O port A bit 1 |
| Broche 6 | RA0 — I/O port A bit 0 |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7 — I/O port A bit 7 |
| Broche 9 | RA6 — I/O port A bit 6 |
| Broche 10 | RC0 — I/O port C bit 0 |
| Broche 11 | RC1 — I/O port C bit 1 |
| Broche 12 | RC2 — I/O port C bit 2 |
| Broche 13 | RC3 — I/O port C bit 3 |
| Broche 14 | RC4 — I/O port C bit 4 |
| Broche 15 | RC5 — I/O port C bit 5 |
| Broche 16 | RC6 — I/O port C bit 6 |
| Broche 17 | RC7 — I/O port C bit 7 |
| Broche 18 | VSS — Ground reference (second VSS) |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | RB0 — I/O port B bit 0 |
| Broche 21 | RB1 — I/O port B bit 1 |
| Broche 22 | RB2 — I/O port B bit 2 |
| Broche 23 | RB3 — I/O port B bit 3 |
| Broche 24 | RB4 — I/O port B bit 4 |
| Broche 25 | RB5 — I/O port B bit 5 |
| Broche 26 | RB6 — I/O port B bit 6 (also ICSPCLK) |
| Broche 27 | RB7 — I/O port B bit 7 (also ICSPDAT) |
| Broche 28 | VDD — Positive supply voltage (second VDD) |
Applications typiques
PIC16F15354T-E/SSVAO convient pour 6 applications: Automotive Body Control Modules, Automotive Sensor Interface Nodes, HVAC Climate Controls, Interior LED Lighting Controllers, Low-Power IoT Edge Nodes, Industrial Sensor Transmitters.
Automotive Body Control Modules
The PIC16F15354T-E/SSVAO is well suited for automotive body control modules (BCMs) that aggregate and actuate loads such as mirrors, locks, wipers, and lighting. Its AEC-Q100 /VAO qualification confirms it has been screened to automotive reliability standards across the -40C to +125C grade-2 window. The 10-bit ADC with up to 24 channels digitizes sensor feedback from switches, position sensors, and current shunts, while the 5-bit DAC and comparators handle analog set-points for actuators. CIPs like the Configurable Logic Cell (CLC) and Numerically Controlled Oscillator (NCO) implement hardware-only signal conditioning, offloading the CPU. Combined with XLP sleep currents below 1 uA, the MCU keeps quiescent draw low to support CAN/LIN wake-up without draining the bus battery.
Recommandé
Automotive Sensor Interface Nodes
Edge sensor nodes inside the vehicle harness - such as temperature, humidity, and seat-occupancy sensors - fit the PIC16F15354T-E/SSVAO profile. The 10-bit ADC runs in sleep under CIP control, sampling and buffering while the CPU is parked in XLP deep sleep. On wake, the on-chip temperature sensor and comparator perform threshold checks and only then signal the bus controller. The 7KB Flash absorbs modest application firmware plus calibration curves, and the 28-SSOP package offers enough I/O for analog inputs plus a LIN or SENT-style digital interface. The /VAO qualification removes the need for separate automotive screening of the MCU, simplifying OEM PPAP documentation.
Recommandé
HVAC Climate Controls
HVAC climate-control modules require mixed-signal capability to read thermistors, drive actuators, and generate PWM fan/blower signals. The PIC16F15354T-E/SSVAO provides a 10-bit ADC for the thermistor network, a 5-bit DAC for set-point reference, multiple PWM channels for blower and mode-door motors, and CIPs for hardware-only zero-cross detection. Its 32 MHz clock and 14-bit instruction throughput provide ample headroom for closed-loop control loops. AEC-Q100 /VAO qualification ensures it survives the under-hood thermal stress for cabin HVAC electronics that share the engine-bay air path. XLP sleep enables park-mode quiescent currents below automotive quiescent targets.
Recommandé
Interior LED Lighting Controllers
Interior ambient lighting drivers and RGB controllers benefit from the PIC16F15354T-E/SSVAO's PWM channels, Core Independent Peripherals, and AEC-Q100 /VAO qualification. Each LED string requires a high-resolution PWM channel for color mixing; the multiple Capture/Compare/PWM (CCP) and CWG peripherals deliver this without taxing the CPU. The 10-bit ADC monitors string current via shunt resistors for fault detection, while the 5-bit DAC trims reference voltages for the LED driver front-end. The 28-SSOP footprint is small enough for inline modules hidden in headliners and door panels. XLP sleep supports the always-on standby current budget.
Recommandé
Low-Power IoT Edge Nodes
Battery-powered IoT edge nodes running on coin cells or two-AA cells fit the PIC16F15354T-E/SSVAO XLP sleep profile and CIP-based wake-up logic. The internal temperature sensor and 10-bit ADC in sleep mode enable years of battery life by sampling periodically without waking the CPU. The 7KB Flash accommodates small LoRaWAN / Zigbee / BLE application code plus a Microchip-certified protocol stack snippet. While the /VAO suffix targets automotive use, the silicon behavior is also attractive for industrial-grade IoT nodes that need the wider -40C to +125C operating range. CIPs implement hardware-only debouncing, edge detection, and waveform generation on wake-up.
Recommandé
Industrial Sensor Transmitters
Loop-powered 4-20 mA and battery-powered industrial sensor transmitters (pressure, flow, level) align with the PIC16F15354T-E/SSVAO analog-rich feature set and 32 MHz throughput. The 10-bit ADC digitizes the sensor bridge with on-chip PGA gain, while the 5-bit DAC calibrates offset. The hardware CIPs handle HART or IO-Link-style signaling without CPU intervention, deterministic to the clock cycle. The -40C to +125C temperature range covers process-industry environments. With Peripheral Module Disable (PMD), unused peripherals are clock-gated at the source, reducing active current. AEC-Q100 /VAO screening adds margin for harsh-environment reliability audits.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F15354T-E/SSVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F15354-E/SS | PIC16F15345T-E/SSVAO | PIC16F15344-I/SS | PIC16F15254-I/SS | PIC16F1518T-I/SS | ATmega88PA-AUR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP-class - same footprint |
| Program Memory (Flash) | 7 KB | 7 KB | Smaller (PIC16F15345 family) | Smaller (PIC16F15344 family) | Smaller (PIC16F15254 family) | Smaller (PIC16F1518 family) | 8 KB AVR Flash |
| Data RAM | 512 B | 512 B | Smaller (PIC16F15345 family) | Smaller (PIC16F15344 family) | Smaller (PIC16F15254 family) | Smaller (PIC16F1518 family) | 1 KB AVR SRAM |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 20 MHz (PIC16F1518 family) | 20 MHz AVR core |
| ADC | 10-bit, 24 ch | 10-bit, 24 ch | 10-bit, fewer channels (PIC16F15345) | 10-bit, fewer channels (PIC16F15344) | 10-bit, similar class (PIC16F15254) | 10-bit, fewer channels (PIC16F1518) | 10-bit, 8 channels (AVR) |
| Automotive Qualification (AEC-Q100) | Yes (/VAO) | No (non-automotive variant) | Yes (/VAO) | No (industrial) | No (industrial) | No (industrial) | No (industrial) |
| Core | PIC 8-bit | PIC 8-bit | PIC 8-bit | PIC 8-bit | PIC 8-bit | PIC 8-bit | AVR 8-bit |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C |
Principaux différenciateurs
- AEC-Q100 /VAO automotive qualification in the 28-SSOP footprint (vs PIC16F15354-E/SS)
- Largest Flash/RAM in PIC16F153xx 28-SSOP family (vs PIC16F15345T-E/SSVAO)
- Hardware CIPs that offload logic from the CPU (vs PIC16F1518T-I/SS)
Notes de conception
Place a 100 nF (0.1 uF) low-ESR ceramic bypass capacitor as close to the VDD pin (pin 19 and pin 28 on the 28-SSOP) as possible, ideally within 3 mm of the pin pad. Per Microchip application note AN2300, the capacitor ground lead must connect directly to a low-impedance ground pour on the top layer or via to the VSS plane. Add a bulk 1 uF to 10 uF tantalum or ceramic capacitor at the board supply input. Inadequate bypass can couple digital switching noise into the analog ADC inputs and degrade the 10-bit ADC ENOB.
Use the Peripheral Module Disable (PMD) registers to gate unused peripherals at the clock-tree level. The PIC16F15354T-E/SSVAO PMD feature is independent of the CPU sleep state, so a peripheral that is disabled does not draw active current even when the core is running. This reduces IDD during active loops that use only a few peripherals. For battery-powered designs, switch the device into XLP sleep between sample windows to achieve sub-uA quiescent currents documented in Microchip datasheet DS40001882.
Do not program user code into the device information area at the top of Flash memory - this region is reserved for Microchip calibration constants, user IDs, and the device ID. Per the PIC16F153xx programming specification, attempted writes to this region can lock the device or corrupt the ADC calibration. Reserve the last page of Flash for the device configuration words. Also verify the MCLR pin configuration in the CONFIG register - it must be disabled if the pin is used as a GPIO (RA3).
Informations de conformité
AEC-Q100 qualified per /VAO suffix per Microchip datasheet DS40001882. RoHS and REACH compliance per Microchip product page. Conflict-minerals declaration available on Microchip corporate compliance portal. Halogen-free status not explicitly confirmed in provided verified web data - mark as unknown.
