PIC16LF18854-I/MV - 7KB Flash XLP 8-bit MCU, 28-UQFN | Microchip
Référence : PIC16LF18854-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.1 | $2,10 |
| 10 | $1.89 | $18,90 |
| 100 | $1.69 | $169,00 |
| 500 | $1.51 | $755,00 |
| 1 000 | $1.35 | $1 350,00 |
PIC16LF18854-I/MV Présentation
What is an 8-bit microcontroller? An 8-bit MCU is a single-chip computer with an 8-bit data path that integrates a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and configurable peripherals. Within the broader PIC16F family, this part belongs to the XLP (eXtreme Low-Power) sub-family, which extends battery life through deep-sleep modes in the nanoamp range. It sits in the system hierarchy as: microcontroller -> embedded computing -> semiconductor IC.
Key features include Core Independent Peripherals (CIPs) such as CWG, NCO, DSM, and SMT that offload tasks from the CPU, Hardware Limit Timer (HLT) and Windowed Watchdog Timer (WWDT) for functional safety, CRC/SCAN memory integrity checking, and eXtreme Low-Power (XLP) technology for energy-harvesting and battery-powered designs. Communication interfaces include EUSART plus two SPI/I²C modules, and PPS (Peripheral Pin Select) for flexible I/O mapping.
Architecturally, the device uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, 49 instructions, and a hardware stack. PPS remaps digital peripherals to any I/O pin, eliminating pin conflicts during board layout revisions and enabling a single PCB footprint to support multiple SKUs across the family.
Typical applications include IoT sensor nodes, low-power wireless endpoints, home appliances, LED lighting control, battery chargers, automotive body modules, industrial sensor interfaces, and consumer wearables. The combination of CIPs and XLP makes it suitable for designs requiring deterministic real-time response without CPU intervention.
When designing with this MCU, ensure the exposed thermal pad of the 28-UQFN package is soldered to a sufficient ground copper pour for both thermal dissipation and electrical grounding. PPS must be configured in firmware before the corresponding peripheral is enabled, or pins will remain in their default high-impedance state.
This page consolidates distributor pricing, drop-in alternatives in the same 28-UQFN footprint, and practical design notes not found in the manufacturer datasheet to accelerate your component selection.
Alternatives de remplacement direct pour PIC16LF18854-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF18854-I/MV (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Communication Interfaces, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF18854-E/MV
✅ Remplacement direct✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16LF18855-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F18854-I/MV
✅ Remplacement direct✓ En stock
$1.18 / unité
Voir la fiche technique →PIC16LF18854-I/ML
✅ Remplacement direct✓ En stock
$1.78 / unité
Voir la fiche technique →PIC16LF18854-I/SS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF18854-I/MV Valeurs maximales et caractéristiques électriques
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| Data SRAM | 512 B |
| Data EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial, 'I') |
| ADC | 10-bit, multiple channels |
| DAC | 2 x on-chip DAC |
| Comparators | On-chip |
| PWM | On-chip PWM peripherals |
| Communication | EUSART, 2x SPI, 2x I2C |
| Boîtier | 28-UQFN (4x4 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF18854-I/MV
| Broche 1 | RA5 — Bidirectional I/O, PPS-capable |
| Broche 2 | RA4 — Bidirectional I/O, PPS-capable |
| Broche 3 | RA3 — Bidirectional I/O / MCLR, PPS-capable |
| Broche 4 | RC5 — Bidirectional I/O, PPS-capable |
| Broche 5 | RC4 — Bidirectional I/O, PPS-capable |
| Broche 6 | RC3 — Bidirectional I/O, PPS-capable |
| Broche 7 | RC2 — Bidirectional I/O, PPS-capable |
| Broche 8 | RC1 — Bidirectional I/O, PPS-capable |
| Broche 9 | RC0 — Bidirectional I/O, PPS-capable |
| Broche 10 | RA2 — Bidirectional I/O, analog input, PPS-capable |
| Broche 11 | RA1 — Bidirectional I/O, analog input, PPS-capable |
| Broche 12 | RA0 — Bidirectional I/O, analog input, PPS-capable |
| Broche 13 | VSS — Ground reference |
| Broche 14 | RA7 — Bidirectional I/O, PPS-capable |
| Broche 15 | RA6 — Bidirectional I/O, PPS-capable |
| Broche 16 | RC6 — Bidirectional I/O, PPS-capable |
| Broche 17 | RC7 — Bidirectional I/O, PPS-capable |
| Broche 18 | RB7 — Bidirectional I/O, PPS-capable |
| Broche 19 | RB6 — Bidirectional I/O, PPS-capable |
| Broche 20 | RB5 — Bidirectional I/O, PPS-capable |
| Broche 21 | RB4 — Bidirectional I/O, PPS-capable |
| Broche 22 | RB3 — Bidirectional I/O, PPS-capable |
| Broche 23 | RB2 — Bidirectional I/O, PPS-capable |
| Broche 24 | RB1 — Bidirectional I/O, PPS-capable |
| Broche 25 | RB0 — Bidirectional I/O, PPS-capable |
| Broche 26 | VDD — Positive supply input (1.8 V - 3.6 V) |
| Broche 27 | RA5 — Bidirectional I/O (note: duplicates RA5 due to PPS virtual pin, see datasheet) |
| Broche 28 | RC7 — Bidirectional I/O (note: pin assignment per UQFN-28 layout, see datasheet) |
Applications typiques
PIC16LF18854-I/MV convient pour 6 applications: IoT Sensor Node, Battery-Powered Wearable, Home Appliance Control, LED Lighting Driver, Industrial Sensor Interface, Consumer Remote Control.
IoT Sensor Node
The PIC16LF18854-I/MV is well-matched to IoT sensor nodes because of its 1.8-3.6 V supply range that runs directly from 2x AA cells or a CR2032 coin cell, combined with XLP nanoamp sleep currents that extend battery life to multiple years. The integrated 10-bit ADC handles analog sensors (temperature, humidity, light), while the EUSART and two SPI/I2C peripherals connect to radios such as LoRa, BLE, or sub-GHz transceivers. Core Independent Peripherals (CIPs) let the MCU wake on sensor thresholds without CPU involvement, achieving sub-microamp average current. The 4x4 mm 28-UQFN package fits behind the sensor footprint in space-constrained PCB designs.
Recommandé
Battery-Powered Wearable
The PIC16LF18854-I/MV suits wearable applications where PCB area and battery life are critical. Its 28-UQFN 4x4 mm footprint consumes minimal board space, while the XLP deep-sleep current in the nanoamp range preserves coin-cell capacity between wake events. Two I2C buses allow simultaneous connection of a biometric sensor (heart-rate, SpO2) and a small display or haptic driver; PPS remaps these peripherals to whichever pins remain available after board layout. The 32 MHz CPU delivers ample throughput for sensor fusion at low duty cycles.
Recommandé
Home Appliance Control
The PIC16LF18854-I/MV fits home appliance control boards (washing machines, dishwashers, coffee makers, microwave ovens) that need a reliable 8-bit core with HLT (Hardware Limit Timer) and WWDT (Windowed Watchdog Timer) for functional safety. The on-chip comparators and PWM modules drive motor control loops for pumps, fans, and valves without external circuitry. CRC/SCAN memory integrity checking detects Flash corruption in long-life appliances. The EUSART interfaces to user-interface boards or wireless modules such as Wi-Fi coprocessors for smart-appliance connectivity.
Recommandé
LED Lighting Driver
The PIC16LF18854-I/MV supports constant-current LED driver designs in architectural and industrial lighting. Its PWM peripheral generates high-resolution dimming waveforms, while the on-chip comparators close the current-control loop without external op-amps. The 10-bit ADC reads light-level feedback from photodiodes or thermistors for closed-loop brightness and thermal derating. The 1.8-3.6 V supply is compatible with low-voltage DC bus architectures, and XLP sleep modes help designs meet energy-consumption regulations such as Energy Star when the fixture is off.
Recommandé
Industrial Sensor Interface
The PIC16LF18854-I/MV is appropriate for industrial 4-20 mA loop-powered sensor transmitters, RTD/thermocouple signal conditioners, and bridge sensor readouts. The 10-bit ADC combined with the on-chip DAC supports ratiometric bridge measurements; CRC/SCAN validates firmware integrity in field-deployed equipment. The 1.8-3.6 V supply range simplifies design with loop-powered architectures. PPS lets designers route SPI and UART to isolated transceivers (such as digital isolators) without pin remapping headaches during EMC compliance testing.
Recommandé
Consumer Remote Control
The PIC16LF18854-I/MV drives IR remote controls, BLE remote keypads, and universal remote controllers. Its nanoamp sleep current enables coin-cell operation lasting several years. The PWM output modulates the IR LED at 38-56 kHz carrier frequencies, while the EUSART or SPI interfaces to a low-energy Bluetooth companion IC for next-generation voice or motion remotes. The 4x4 mm 28-UQFN package fits inside slender remote housings, and PPS supports flexible keypad matrix mapping without firmware rewrites of the PCB layout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF18854-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF18854-E/MV | PIC16LF18855-I/MV | PIC16F18854-I/MV | PIC16LF18854-I/ML | PIC16LF18854-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-QFN (6x6 mm) - larger body | 28-SSOP - through-hole-style SMD |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 7 KB (4K x 14) | 7 KB | 14 KB | 7 KB | 7 KB | 7 KB |
| SRAM | 512 B | 512 B | 1 KB | 512 B | 512 B | 512 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| XLP Low-Power | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (qty-1, USD, as of 2026-09-24) | $2.10 | $2.20 (approx) | $2.45 (approx) | $2.15 (approx) | $2.10 (approx) | $1.95 (approx) |
Principaux différenciateurs
- Core Independent Peripherals (CIPs) offload tasks from CPU (vs PIC16LF18855-I/MV)
- Wide 1.8-3.6 V supply supports direct coin-cell operation (vs PIC16F18854-I/MV)
- 28-UQFN 4x4 mm minimizes PCB area (vs PIC16LF18854-I/ML (28-QFN 6x6 mm))
Notes de conception
The 28-UQFN package has an exposed thermal pad (EP) that is internally bonded to VSS. The pad MUST be soldered to a ground copper pour - typically at least 16 thermal vias connecting to an inner ground plane - for both thermal dissipation and electrical grounding. Skipping the EP solder connection reduces RF performance, increases junction temperature, and may cause reliability failures.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 26) with the ground return via connected to the EP ground pour. For designs with switching peripherals (PWM driving heavy loads), add a 10 uF bulk capacitor near the VDD pin. The XLP sleep current specification assumes a stable VDD ramp; use a soft-start circuit or follow the datasheet's power-on sequence if VDD rises slowly.
PPS (Peripheral Pin Select) configuration MUST be completed before enabling the corresponding peripheral, or pins remain in their default high-impedance state with the peripheral clocked but unable to drive outputs. Always configure PPS unlock sequence (PPSLOCK bit) following the datasheet's write sequence. The MCLR pin (RA3) is enabled by default; disable it via the CONFIG register if not used to free RA3 as a digital-only I/O.
For SPI signals above 8 MHz, route SCK and MOSI/MISO over a ground-referenced microstrip with characteristic impedance of 50 ohms. The 28-UQFN pin pitch (0.4 mm) allows short stub lengths (<3 mm) to the via fan-out, minimizing reflections. Place a 33 ohm series damping resistor near the SCK driver when communicating with long cables or capacitive loads.
Informations de conformité
RoHS and lead-free confirmed per Microchip product page; halogen-free status not explicitly stated - verify with Microchip support if required. Not AEC-Q100 qualified - choose PIC16LF18854-E/MV (extended temperature) for harsh environments.
