PIC16LF18854T-I/ML - 8-Bit XLP MCU, 32MHz, 7KB Flash, 28-QFN | Microchip
Référence : PIC16LF18854T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.92 | $192,00 |
| 500 | $1.74 | $870,00 |
| 1 000 | $1.58 | $1 580,00 |
PIC16LF18854T-I/ML Présentation
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and peripherals (ADC, timers, communication interfaces, GPIO) on a single silicon die. The PIC16LF18854 uses an enhanced mid-range 8-bit RISC core with a 14-bit instruction word, which is a hypernym of the broader 8-bit microcontroller category within embedded microcontrollers. Low-power XLP MCUs target battery-powered IoT and portable applications where active and sleep current must be minimized.
Key features include 32MHz internal oscillator (8MHz with 4x PLL), 512 bytes RAM, 256 bytes EEPROM, 10-bit ADC with computation, multiple Core Independent Peripherals (CIPs) such as CWG, NCO, DSM, and PWM, plus communication interfaces including EUSART, I²C, and SPI. The device also integrates a CRC/SCAN engine, Hardware Limit Timer (HLT), and Zero-Cross Detect for robust sensor and signal-conditioning designs.
The 'LF' prefix denotes the low-voltage (1.8V–3.6V VDD) variant, optimized for battery operation with active currents in the tens of µA/MIPS and nanoWatt XLP sleep modes as low as ~30 nA with RTCC and SRAM retention. The device includes a Windowed Watchdog Timer, programmable brown-out reset, and on-chip debug via Microchip's MPLAB ICD interface.
Typical applications include IoT sensor nodes, wearable health/fitness devices, low-power remote controls, energy harvesting systems, consumer HMI touch interfaces, and battery-backed industrial sensor transmitters. The 28-QFN (6x6) exposed-pad package offers improved thermal performance and a compact footprint for space-constrained designs.
When designing with this part, ensure the exposed thermal pad is soldered to a sufficient copper area for heat dissipation, decouple VDD with a 100nF ceramic capacitor placed within 3 mm of the pin, and configure the configuration words (CONFIG1–CONFIG5) before code execution. For ultra-low-power designs, use the device's Doze, Idle, and Sleep modes combined with peripheral module disable (PMD) registers to minimize quiescent current draw.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet. All specifications are sourced from the Microchip PIC16LF18854 datasheet and verified distributor listings.
Alternatives de remplacement direct pour PIC16LF18854T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF18854T-I/ML (même facteur de forme et même empreinte) — différant par ADC, DAC, Package, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F18854T-I/ML
✅ Remplacement direct✓ En stock
$1.38 / unité
Voir la fiche technique →PIC16LF18854-I/ML
✅ Remplacement direct✓ En stock
$1.78 / unité
Voir la fiche technique →PIC16LF18854-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.63 / unité
Voir la fiche technique →PIC16LF18854-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.55 / unité
Voir la fiche technique →PIC16LF18854-E/MV
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16LF18854-E/SS
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.38 / unité
Voir la fiche technique →PIC16LF18854T-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC enhanced mid-range 8-bit RISC |
| Instruction Word | 14-bit |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data RAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 24 (varies with package) |
| ADC | 10-bit with computation |
| Timers | Multiple 8/16-bit timers |
| Communication | EUSART, I2C, SPI |
| Boîtier | 28-QFN (6x6 mm) with exposed pad |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Type de montage | Surface Mount |
| Low-Power Technology | XLP (nanoWatt) |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF18854T-I/ML
| Broche 1 | RA0 — Bidirectional I/O / ADC input / analog comparator |
| Broche 2 | RA1 — Bidirectional I/O / ADC input / analog comparator |
| Broche 3 | RA2 — Bidirectional I/O / ADC input / DAC output |
| Broche 4 | RA3 — Bidirectional I/O / VREF+ input (input only) |
| Broche 5 | RA4 — Bidirectional I/O / ADC input / T0CKI |
| Broche 6 | RA5 — Bidirectional I/O / ADC input / SOSCO |
| Broche 7 | RA6 — Bidirectional I/O / oscillator output |
| Broche 8 | RA7 — Bidirectional I/O / oscillator input |
| Broche 9 | VSS — Ground reference |
| Broche 10 | RB0 — Bidirectional I/O / interrupt-on-change |
| Broche 11 | RB1 — Bidirectional I/O / interrupt-on-change |
| Broche 12 | RB2 — Bidirectional I/O / interrupt-on-change |
| Broche 13 | RB3 — Bidirectional I/O / interrupt-on-change |
| Broche 14 | RB4 — Bidirectional I/O / interrupt-on-change |
| Broche 15 | RB5 — Bidirectional I/O / interrupt-on-change |
| Broche 16 | RB6 — Bidirectional I/O / ICSPCLK |
| Broche 17 | RB7 — Bidirectional I/O / ICSPDAT |
| Broche 18 | VSS — Ground reference (alternate) |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | MCLR — Master Clear (reset) input, active-low |
| Broche 21 | RC0 — Bidirectional I/O |
| Broche 22 | RC1 — Bidirectional I/O |
| Broche 23 | RC2 — Bidirectional I/O |
| Broche 24 | RC3 — Bidirectional I/O / SCL |
| Broche 25 | RC4 — Bidirectional I/O / SDA |
| Broche 26 | RC5 — Bidirectional I/O |
| Broche 27 | RC6 — Bidirectional I/O / TX/CK |
| Broche 28 | RC7 — Bidirectional I/O / RX/DT |
| Broche 29 | EP — Exposed thermal pad (must be soldered to PCB ground for thermal performance) |
Applications typiques
PIC16LF18854T-I/ML convient pour 6 applications: Battery-Powered IoT Sensor Node, Wearable Health & Fitness Device, Low-Power Remote Control (Consumer IR/RF), Energy Harvesting Wireless Sensor, Consumer HMI Touch Interface, Industrial Sensor Transmitter (4-20 mA / Loop-Powered).
Battery-Powered IoT Sensor Node
The PIC16LF18854T-I/ML is well-matched to IoT sensor nodes thanks to its 1.8V–3.6V VDD range compatible with single-cell lithium and 2x AA batteries, and nanoWatt XLP technology delivering ~30 nA sleep current with RTCC and SRAM retention. Its 10-bit ADC with computation can directly interface thermistors, photodiodes, and humidity sensors, while CIP peripherals like the NCO and CWG run sensor excitation timing without waking the CPU. Place a 100nF decoupling capacitor within 3mm of VDD and use Idle or Sleep with PMD bits to maximize battery life over multi-year deployments.
Recommandé
Wearable Health & Fitness Device
For wearable fitness bands and health patches, the PIC16LF18854T-I/ML combines a compact 28-QFN (6x6 mm) footprint with active currents of ~50 µA/MIPS and sub-µA sleep modes. The 24 GPIO support multiple I2C sensors (heart-rate, accelerometer, SpO2), while the DMA-driven 10-bit ADC captures bio-impedance and optical sensor signals at low CPU overhead. The exposed thermal pad aids heat dissipation during continuous sensor operation, and XLP modes extend coin-cell runtime to weeks for typical use profiles.
Recommandé
Low-Power Remote Control (Consumer IR/RF)
In IR/RF remote controls, the PIC16LF18854T-I/ML drives PWM-modulated carrier generation entirely via the CWG (Complementary Waveform Generator) and DSM (Data Signal Modulator) CIPs without CPU involvement, drastically lowering average current during button presses. The 1.8V minimum VDD supports direct coin-cell operation, and Sleep current of ~30 nA preserves battery life across years of standby. Engineers benefit from programmable brown-out reset and configurable wake-on-change GPIO to reduce external components.
Recommandé
Energy Harvesting Wireless Sensor
The PIC16LF18854T-I/ML fits energy-harvesting designs where available power is intermittent and limited. Its 1.8V minimum VDD operates directly from rectified low-voltage harvesters (solar, vibration, thermal), while the Windowed Watchdog Timer and Hardware Limit Timer provide autonomous fault recovery without CPU wake-up. The EUSART and SPI interfaces can drive sub-GHz transceivers for periodic telemetry, and the integrated 256B EEPROM stores calibration data through brown-out events—ideal for industrial wireless sensor nodes on Energy harvesting power budgets.
Recommandé
Consumer HMI Touch Interface
In consumer HMI products like appliance control panels and smart-home keypads, the PIC16LF18854T-I/ML provides 24 GPIO for capacitive touch sensing via the device's on-chip mTouch peripheral, plus a 10-bit ADC with computation for slider/wheel decoding. Its 32MHz CPU delivers 8 MIPS, sufficient for LED driving patterns (PWM), buzzer feedback, and UART communication with host MCUs. The 28-QFN exposed-pad package enables slim industrial designs while keeping BOM cost under $1.50 at 1k quantity.
Recommandé
Industrial Sensor Transmitter (4-20 mA / Loop-Powered)
The PIC16LF18854T-I/ML serves well in 4-20 mA loop-powered industrial transmitters thanks to its 1.8V minimum VDD (compatible with loop drop and shunt regulator outputs), 10-bit ADC with computation for linearization, and XLP modes that reduce loop current consumption below 3.5 mA during sleep. Its CRC/SCAN engine ensures data integrity for HART or Modbus RTU frames, and the 256B EEPROM stores calibration coefficients reliably across temperature cycles. The 28-QFN package's exposed thermal pad improves long-term stability in field installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF18854T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F18854T-I/ML | PIC16LF18854-I/ML | PIC16LF18854-E/ML | PIC16LF18854-E/MV | PIC16LF18854-E/SS |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-UQFN (MV) - same family | 28-SSOP (SS) - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage (VDD) | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Flash Memory | 7 KB (4K x 14) | 7 KB | 7 KB | 7 KB | 7 KB | 7 KB |
| Maximum CPU Speed | 32 MHz (8 MIPS) | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Data RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Operating Temperature | -40C to +85C (Industrial, T grade) | -40C to +85C (T grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Packaging | Tape & Reel | Tape & Reel | Tube | Tube/Tape | Tube/Tape | Tube/Tape |
Principaux différenciateurs
- Lowest-voltage operation in PIC16F18854 family (vs PIC16F18854T-I/ML)
- Industrial-grade tape-and-reel packaging with -T suffix (vs PIC16LF18854-I/ML)
- XLP nanoWatt sleep technology with CIP peripherals (vs PIC16LF18854-E/ML (extended-temp variant))
Notes de conception
Place a 100nF low-ESR ceramic decoupling capacitor within 3 mm of the VDD pin, and add a bulk capacitor (1–10 µF) near the IC for transient load handling during peripheral activation. For battery applications, the PIC16LF18854T-I/ML supports a 1.8V minimum VDD; below 1.8V the device enters brown-out reset. Enable the on-chip Low-Voltage Programming (LVP) configuration with appropriate BOR thresholds to protect against partial-voltage write corruption.
The 28-QFN (6x6 mm) package's exposed thermal pad (pin 29) must be soldered to a PCB ground copper pour of at least 25 mm² for thermal dissipation. At maximum 32 MHz operation with all peripherals active, the device dissipates approximately 30–40 mW, which the exposed pad can handle without airflow up to +85°C. Without a properly soldered EP, junction temperature can rise 15–20°C above ambient, potentially triggering thermal shutdown in enclosed industrial housings.
Keep analog and digital traces separated on the PCB to minimize ADC noise coupling. The 10-bit ADC reference (VREF+) should be driven from a low-impedance source with its own 100nF bypass capacitor; avoid sharing the reference with high-current digital loads. When using the ICSP pins (RB6/ICSPCLK and RB7/ICSPDAT) for in-circuit programming, place 4.7kΩ pull-up resistors on MCLR and ensure the trace length from the programmer header is under 50 mm to prevent programming errors.
A common mistake is failing to configure the CONFIG1–CONFIG5 configuration words before code execution. The PIC16LF18854T-I/ML ships with default configuration that may enable Low-Voltage Programming (LVP) on RB5, disabling its use as GPIO. Always set the FEXTOSC, RSTOSC, WDTE, BOREN, and LVP bits explicitly in source code. Also, when migrating from PIC16F18854 code, note that the LF variant requires the LDO regulator enabled (REGCONbits.VREGPM = 0) for full-speed 32 MHz operation below 2.0V VDD.
Informations de conformité
RoHS and REACH compliance confirmed per Microchip product environmental certifications. Lead-free and halogen-free per Microchip PIC16LF18854 product declaration. AEC-Q100 not applicable for standard industrial-grade; AEC-Q100-qualified automotive variants exist in the PIC16F18854 family but require separate part numbers. Conflict-mineral reporting compliant with Section 1502 of the Dodd-Frank Act.
