PIC18F23K22-I/SP - 8-bit 64MHz 8KB Flash MCU | Microchip
Référence : PIC18F23K22-I/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.86 | $186,00 |
| 500 | $1.65 | $825,00 |
| 1 000 | $1.42 | $1 420,00 |
PIC18F23K22-I/SP Présentation
A PIC18 microcontroller is a member of the 8-bit RISC (Reduced Instruction Set Computer) family originally developed by General Instrument's Microelectronics Division and now maintained by Microchip Technology. PIC18 cores extend the earlier PIC16 architecture with a 16-bit instruction word, hardware multiply, a linear program/data memory map, and a C-friendly compiler target, sitting within the broader hierarchy: microcontroller -> embedded controller -> semiconductor IC. The PIC18F23K22 specifically belongs to the enhanced mid-range "K22" sub-family which adds nanoWatt XLP sleep modes, a 12-bit ADC option on larger pin counts, and on-chip 5-bit DAC peripherals.
Key features include seventeen 10-bit ADC channels, a 5-bit DAC with rail-to-rail output, seven timer/counter modules, three PWM channels with auto-shutdown, two I2C, two SPI, and two EUSART (with LIN) interfaces, plus a 32 kHz RTCC for low-power timekeeping. The mTouch capacitive-touch peripheral, configurable on-chip pull-ups, and a hardware CRC engine enable sensor and robust-communication applications without external components. A configurable low-power BOR and extended WDT round out the safety feature set.
Typical applications include battery-powered sensor nodes, capacitive-touch user interfaces, low-power remote controls, LIN-based automotive body controllers (non-safety), industrial control panels, and hobbyist/maker projects that benefit from breadboard-friendly through-hole packaging. The wide operating voltage and XLP modes allow direct Li-Ion or 2xAA cell operation with run currents measured in microamperes.
Designers should note that the 28-pin SPDIP footprint exposes 24 GPIO (some multiplexed with analog peripherals), and decoupling requires at least 0.1 µF plus a bulk capacitor near the VDD/VSS pair. For sleep-mode sub-µA operation, the ADC must be disabled, unused peripherals clock-gated, and pins driven to defined logic levels. When migrating to a smaller package, choose the -I/SS (28-SOIC) or -I/MV (28-UQFN) variants which share the same pinout. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design considerations beyond the manufacturer datasheet.
Alternatives de remplacement direct pour PIC18F23K22-I/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F23K22-I/SP (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Mounting Type, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F23K22-E/SP
✅ Remplacement direct✓ En stock
$1.87 / unité
Voir la fiche technique →PIC18F23K22-I/MV
✅ Remplacement direct✓ En stock
$1.42 / unité
Voir la fiche technique →PIC18F23K22T-I/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F23K22-I/SP Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 8-bit RISC |
| Program Memory (Flash) | 8 KB (4K x 16 words) |
| Data RAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Package / Pin Count | 28-pin SPDIP (Skinny Plastic DIP), through-hole |
| GPIO Count | 24 |
| ADC | 17 channels x 10-bit |
| DAC | 1 x 5-bit (on-chip) |
| Timers | 7 (Timer0/1/2/3/4/5/6) |
| PWM Channels | 3 (with auto-shutdown) |
| Communication Interfaces | 2x I2C, 2x SPI, 2x EUSART (LIN-capable) |
| Low-Power Technology | nanoWatt XLP (sleep currents < 1 µA typical) |
| Type de montage | Through-Hole (THT) |
| Statut RoHS | Compliant |
| Niveau MSL | 1 (not moisture-sensitive) |
Configuration des broches de PIC18F23K22-I/SP
| Broche 1 | RA0/AN0/C1IN0-/C2IN0-/C3IN0-/ULPWU — GPIO RA0 / Analog input 0 / Comparator input (with Wake-up) |
| Broche 2 | RA1/AN1/C1IN1-/C2IN1-/C3IN1-/CLC2IN1 — GPIO RA1 / Analog input 1 / Comparator input |
| Broche 3 | RA2/AN2/C1IN+/C2IN+/C3IN+/VREF- — GPIO RA2 / Analog input 2 / Comparator Vref- |
| Broche 4 | RA3/AN3/C1IN+/VREF+ — GPIO RA3 / Analog input 3 / Comparator Vref+ |
| Broche 5 | RA4/CCP5/T0CKI/SRNQ — GPIO RA4 / CCP5 / Timer0 clock / SR latch Q output |
| Broche 6 | RA5/AN4/C2IN1-/C1IN1-/HLVDIN/CCP4 — GPIO RA5 / Analog input 4 / HLVD input / CCP4 |
| Broche 7 | RA6/OSC2/CLKR — GPIO RA6 / Crystal oscillator output / Clock output |
| Broche 8 | RA7/OSC1/CLKIN — GPIO RA7 / Crystal oscillator input / External clock input |
| Broche 9 | RE3/MCLR/VPP — MCLR (Reset, active-low) / Programming voltage input |
| Broche 10 | VSS — Logic ground |
| Broche 11 | VDD — Positive logic supply (1.8 V to 5.5 V) |
| Broche 12 | RB0/AN12/C1IN2-/C2IN2-/CCP4/SRI — GPIO RB0 / Analog input 12 / CCP4 / SR latch input |
| Broche 13 | RB1/AN10/C1IN3-/C2IN3-/C3IN3-/CCP3 — GPIO RB1 / Analog input 10 / CCP3 |
| Broche 14 | RB2/AN8/C1IN2-/C2IN2-/C3IN2-/PWM1 — GPIO RB2 / Analog input 8 / PWM1 output |
| Broche 15 | RB3/AN9/C1IN3-/C2IN3-/C3IN3-/PWM2 — GPIO RB3 / Analog input 9 / PWM2 output |
| Broche 16 | RB4/AN11/C1IN2-/C2IN2-/C3IN2-/PWM3 — GPIO RB4 / Analog input 11 / PWM3 output |
| Broche 17 | RB5/AN13/C1IN3-/C2IN3-/C3IN3-/CCP5 — GPIO RB5 / Analog input 13 / CCP5 |
| Broche 18 | RB6/ICSPCLK/PGC — GPIO RB6 / ICSP clock / Programming clock |
| Broche 19 | RB7/ICSPDAT/PGD — GPIO RB7 / ICSP data / Programming data |
| Broche 20 | VSS — Logic ground (second VSS pin) |
| Broche 21 | VDD — Positive logic supply (second VDD pin) |
| Broche 22 | RC0/PWM4/SOSCO — GPIO RC0 / PWM4 / Secondary oscillator output |
| Broche 23 | RC1/PWM5/SOSCI — GPIO RC1 / PWM5 / Secondary oscillator input |
| Broche 24 | RC2/CCP1/PWM6 — GPIO RC2 / CCP1 / PWM6 output |
| Broche 25 | RC3/CCP2/SCK/SCL — GPIO RC3 / CCP2 / SPI clock / I2C clock |
| Broche 26 | RC4/SDI/SDA — GPIO RC4 / SPI data in / I2C data |
| Broche 27 | RC5/SDO — GPIO RC5 / SPI data out |
| Broche 28 | RC6/CKP1/TX/CK/AN19 — GPIO RC6 / UART TX / Sync clock / Analog input 19 |
Applications typiques
PIC18F23K22-I/SP convient pour 6 applications: Battery-Powered Sensor Node, Capacitive Touch User Interface, LIN Automotive Body Controller (Non-Safety), Industrial Control Panel MCU, Maker / Educational Development Platform, Home Appliance / White Goods Controller.
Battery-Powered Sensor Node
The PIC18F23K22-I/SP's nanoWatt XLP sleep currents below 1 µA with RTCC running, plus its wide 1.8 V to 5.5 V supply range, allow direct operation from a single Li-Ion or 2xAA cell. Its 17-channel 10-bit ADC reads multiple environmental sensors (temperature, humidity, light) while the integrated timers wake the MCU on schedule. The 64 MHz CPU executes sensor fusion in microseconds before returning to sleep, maximizing battery life in remote, energy-harvested, or 10-year-life IoT nodes.
Recommandé
Capacitive Touch User Interface
The PIC18F23K22-I/SP integrates Microchip's mTouch capacitive-touch peripheral supporting up to 17 touch channels via the 10-bit ADC with charge-time measurement. This eliminates a dedicated touch controller IC, reducing BOM cost and PCB area. The on-chip mTouch libraries, 5 V tolerance, and nanoWatt XLP enable low-power touch interfaces for appliances, IoT panels, consumer electronics, and white-goods control boards running from USB or 2xAA power.
Recommandé
LIN Automotive Body Controller (Non-Safety)
The PIC18F23K22-I/SP includes a LIN-capable EUSART (Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter), enabling low-cost body-electronics nodes such as door modules, mirror controls, seat switches, and lighting clusters. The 8 KB Flash accommodates LIN stack and diagnostic layers; the 17 ADC channels read switches and potentiometers; and the 3 PWM channels drive LEDs or small motors. Use the -E/SP -40 °C to +125 °C variant for under-hood or AEC-Q100 contexts.
Recommandé
Industrial Control Panel MCU
The PIC18F23K22-I/SP's 5 V tolerance, dual I2C/SPI, and 7 timers make it well suited to industrial panels reading keypads, driving LED or LCD displays, and communicating with PLC I/O expansion modules. The 24 GPIO lines (some multiplexed with analog functions) support keypad matrix scanning, relay drivers, and 7-segment multiplexing. Industrial -40 °C to +85 °C temperature grade tolerates factory-floor environments; the on-chip BOR and WDT add safety features for control loops.
Recommandé
Maker / Educational Development Platform
The PIC18F23K22-I/SP's 28-pin SPDIP through-hole package is breadboard-friendly, allowing hobbyists and students to prototype without SMD soldering equipment. MPLAB X IDE with the XC8 compiler, the PICkit 4 in-circuit debugger, and free peripheral libraries (PLIB) accelerate firmware development. The 8 KB Flash supports moderate C projects; the dual UART simplifies USB-to-serial bridges and Bluetooth module interfacing for robotics, drones, and IoT teaching labs.
Recommandé
Home Appliance / White Goods Controller
The PIC18F23K22-I/SP drives control boards for washing machines, dishwashers, refrigerators, microwave ovens, and air-conditioner remotes, with 17 ADC channels sensing temperature and humidity sensors, 3 PWM outputs controlling TRIAC-fired loads, and dual EUSART handling inverter or display panel communication. The 5-bit on-chip DAC and 256-byte EEPROM support trim and last-state memory. The -E/SP extended temperature grade suits behind-panel thermal environments up to +125 °C.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F23K22-I/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F23K22-E/SP | PIC18F23K22-I/MV | PIC18F23K22T-I/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SPDIP (same) | 28-UQFN (different land pattern) | 28-SPDIP (same) |
| Program Memory (Flash) | 8 KB | 8 KB | 8 KB | 8 KB |
| Data RAM | 768 bytes | 768 bytes | 768 bytes | 768 bytes |
| Data EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Supply Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| GPIO Count | 24 | 24 | 24 | 24 |
| Unit Price (qty 1, USD, as of 2026-09-26) | $2.45 | $2.70 (approx) | $2.10 (approx) | $2.45 (approx) |
Principaux différenciateurs
- Extended temperature grade for automotive and industrial (vs PIC18F23K22-I/SP (this part, industrial -40C to +85C))
- Surface-mount UQFN footprint for production (vs PIC18F23K22-I/SP (this part, 28-SPDIP through-hole))
- Wider memory map and richer peripheral set than PIC16F series (vs PIC16F1827-I/P (28-PDIP, 8-bit PIC16))
Notes de conception
For nanoWatt XLP sleep currents below 1 µA, the PIC18F23K22-I/SP datasheet requires disabling the ADC (ADCON0.ADON=0), switching off unused peripherals via PMD registers, and ensuring unused pins are configured as digital outputs driving to VSS or VDD to prevent floating-pin leakage. Estimated: leaving the ADC enabled in sleep typically adds 50-200 µA. The VDD supply should be decoupled with a 0.1 µF ceramic capacitor close to pins 11/20 (VDD) and 8/19 (VSS), plus a 10 µF bulk capacitor if the design has high transient loads on digital I/O.
Place the ICSP header (PGC on RB6, PGD on RB7, MCLR on RE3) on a 0.1-inch row-spacing connector to allow field firmware updates without removing the MCU. Keep the PGC/PGD traces short (under 50 mm) and avoid routing them parallel to high-current switching nodes. The 28-SPDIP through-hole footprint allows a standard DIP-28 land pattern with 0.3-inch row spacing; do not use a 0.6-inch DIP-28 land pattern (which is for the wider PDIP-28 package, e.g., PIC18F2321-I/P).
Common pitfalls include: (1) confusing the PIC18F23K22-I/SP 28-SPDIP with the older PIC18F2321-I/P 28-PDIP - both are 28-pin DIPs but the older part has wider 0.6-inch row spacing while the K22 has 0.3-inch row spacing (SPDIP, Skinny DIP); (2) forgetting to disable the internal MCLR pull-up when using MCLR as an I/O pin (RE3 is input-only); (3) exceeding 5.5 V on any pin when running at 5 V supply - the I/O are NOT 5 V tolerant when VDD is below 3 V; (4) omitting the MCLR pull-up resistor, causing spurious resets in noisy environments.
For SPI peripherals running above 4 MHz, keep the SCK trace under 50 mm and add a 33 ohm series resistor close to the PIC18F23K22-I/SP SDO pin if the load capacitance exceeds 30 pF. For I2C buses above 400 kHz, the SDA/SCL pins (RC4/RC3) require 4.7 kohm pull-ups to VDD; do not use 10 kohm pull-ups above 400 kHz Fast-mode. The internal weak pull-ups are insufficient for reliable high-speed I2C or multi-master configurations.
Informations de conformité
RoHS compliant per Microchip product page. Industrial -I temperature grade (-40C to +85C) is not AEC-Q100 qualified; choose the -E (extended, +125C) variant for high-temperature or behind-panel automotive (non-safety) applications. Halogen-free and lead-free reflow-compatible.
