PIC18F4680-H/PT - 8-bit MCU, 64KB Flash, ECAN, 44-TQFP | Microchip
Référence : PIC18F4680-H/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.82 | $10,82 |
| 10 | $10.1 | $101,00 |
| 100 | $8.65 | $865,00 |
| 500 | $7.42 | $3 710,00 |
| 1 000 | $6.05 | $6 050,00 |
PIC18F4680-H/PT Présentation
What is a PIC18F Microcontroller? The PIC18F family is Microchip's 8-bit enhanced RISC architecture for general-purpose embedded control. PIC18F devices sit within the broader taxonomy: 8-bit MCU -> Harvard RISC microcontroller -> PIC family -> PIC18F sub-family -> semiconductor. They offer 16-bit instruction words, 8-bit data paths, hardware multiplier, prioritized interrupts, and Flash self-programming, making them the standard workhorse for industrial, automotive, and consumer applications that need deterministic real-time control without the complexity of an ARM Cortex core.
Key features of the PIC18F4680-H/PT include: 64KB Flash program memory (32K x 16), 3,328 bytes SRAM, 1,024 bytes Data EEPROM with high-endurance Flash (HEF) option, integrated ECAN module (CAN 2.0B active with three transmit and two receive buffers), two USART modules with LIN-compatible master/slave operation, MSSP (SPI/I2C), 10-bit ADC with up to 13 input channels, nanoWatt power-managed modes (Idle, Sleep, Deep Sleep, and Run), and a wide 2.0V-5.5V operating voltage range. The H temperature grade extends -40C to +150C.
The architecture uses a 16-bit enhanced instruction set optimized for C-compiled code (MPLAB XC8 and legacy MPLAB C18), with 83 instructions and a hardware 8x8 multiplier. The ECAN peripheral implements CAN 2.0B active with hardware acceptance filters, time-stamping, and DeviceNet/CanOpen-friendly bit-timing configuration. With self-programmability and 100K/1M write-endurance ratings, field firmware upgrades are supported via ECAN or USART bootloader patterns common in automotive body and industrial control modules.
Typical applications include automotive body and chassis ECAN nodes (cluster, HVAC, lighting controllers), industrial CAN-based sensor networks (DeviceNet, CANopen), HVAC controls, embedded control boards requiring LIN master support, and battery chargers using the ADC plus ECAN for cell-balancing feedback loops.
When designing with this part, plan for a 2.0V-5.5V supply, ensure the ECAN bus transceivers (e.g. MCP2551 or MCP2561) match the bus topology, and provide sufficient decoupling. Use MPLAB X IDE with MPLAB ICD 5 or MPLAB PICkit 5 for in-circuit debug and Flash programming.
This page consolidates verified distributor pricing, drop-in alternate MPNs sourced from Microchip's cross-reference, and PCB-level design notes not duplicated on the manufacturer summary page.
Alternatives de remplacement direct pour PIC18F4680-H/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F4680-H/PT (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Program Memory (Flash), CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F4680-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F4680-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F4585-I/PT
✅ Remplacement direct✓ En stock
$5.73 / unité
Voir la fiche technique →PIC18F4585-H/PT
✅ Remplacement direct✓ En stock
$5.55 / unité
Voir la fiche technique →PIC18F4480-I/PT
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →PIC18F458-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F4680-H/PT Valeurs maximales et caractéristiques électriques
| Core | PIC18 (8-bit RISC, Harvard) |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data EEPROM / HEF | 1024 bytes |
| SRAM | 3328 bytes |
| Maximum CPU Speed | 40 MHz input / 25 MHz output, 10 MIPS |
| Operating Voltage | 2.0 V to 5.5 V |
| Température de fonctionnement | -40C to +150C (H grade) |
| I/O Pins | 36 |
| ADC | 10-bit, up to 13 channels |
| Timers | 4 (Timer0/1/2/3) |
| ECAN Module | Yes (CAN 2.0B active) |
| USART | 2 (LIN master/slave support) |
| MSSP (SPI / I2C) | 1 (SPI master/slave + I2C master/slave) |
| Boîtier | 44-TQFP (10x10 mm) |
| Type de montage | Surface Mount |
Configuration des broches de PIC18F4680-H/PT
| Broche 1 | OSC2/RA6 — Oscillator output / GPIO RA6 |
| Broche 2 | OSC1/RA7 — Oscillator input / GPIO RA7 |
| Broche 3 | MCLR — Master Clear (reset, input) |
| Broche 4 | RA0/AN0 — RA0/Analog input AN0 |
| Broche 5 | RA1/AN1 — RA1/Analog input AN1 |
| Broche 6 | RA2/AN2/VREF- — RA2/Analog input AN2/VREF- |
| Broche 7 | RA3/AN3/VREF+ — RA3/Analog input AN3/VREF+ |
| Broche 8 | RA4/T0CKI — RA4/Timer0 clock input |
| Broche 9 | RA5/AN4/SS — RA5/AN4/SPI slave select |
| Broche 10 | VSS — Ground |
| Broche 11 | VDD — Positive supply |
| Broche 12 | RB0/INT0 — RB0/External interrupt 0 |
| Broche 13 | RB1/INT1 — RB1/External interrupt 1 |
| Broche 14 | RB2/INT2 — RB2/External interrupt 2 |
| Broche 15 | RB3/CCP2 — RB3/CCP2 PWM/Capture |
| Broche 16 | RB4 — RB4 GPIO |
| Broche 17 | RB5 — RB5 GPIO |
| Broche 18 | RB6/PGC — RB6/ICSP clock |
| Broche 19 | RB7/PGD — RB7/ICSP data |
| Broche 20 | VSS — Ground |
| Broche 21 | VDD — Positive supply |
| Broche 22 | RC0/T1OSO/T13CKI — RC0/Timer1 oscillator out or clock in |
| Broche 23 | RC1/T1OSI/CCP2 — RC1/Timer1 oscillator in or CCP2 alt |
| Broche 24 | RC2/CCP1 — RC2/CCP1 PWM |
| Broche 25 | RC3/SCK/SCL — RC3/SPI clock or I2C clock |
| Broche 26 | RC4/SDI/SDA — RC4/SPI data in or I2C data |
| Broche 27 | RC5/SDO — RC5/SPI data out |
| Broche 28 | RC6/CANTX — RC6/ECAN transmit |
| Broche 29 | RC7/CANRX — RC7/ECAN receive |
| Broche 30 | VSS — Ground |
| Broche 31 | VDD — Positive supply |
| Broche 32 | RD0/PSP0 — RD0/Parallel Slave Port data 0 |
| Broche 33 | RD1/PSP1 — RD1/Parallel Slave Port data 1 |
| Broche 34 | RD2/PSP2 — RD2/Parallel Slave Port data 2 |
| Broche 35 | RD3/PSP3 — RD3/Parallel Slave Port data 3 |
| Broche 36 | RD4/PSP4 — RD4/Parallel Slave Port data 4 |
| Broche 37 | RD5/PSP5 — RD5/Parallel Slave Port data 5 |
| Broche 38 | RD6/PSP6 — RD6/Parallel Slave Port data 6 |
| Broche 39 | RD7/PSP7 — RD7/Parallel Slave Port data 7 |
| Broche 40 | RE0/RD — RE0/Parallel Slave Port read strobe |
| Broche 41 | RE1/WR — RE1/Parallel Slave Port write strobe |
| Broche 42 | RE2/CS — RE2/Parallel Slave Port chip select |
| Broche 43 | VSS — Ground |
| Broche 44 | VDD — Positive supply |
Applications typiques
PIC18F4680-H/PT convient pour 7 applications: Automotive ECAN Body Control Modules, Industrial CANopen / DeviceNet Sensor Nodes, HVAC and Building Automation Controllers, Embedded Control Boards with LIN Master, Battery Cell Balancing / Charger Nodes, In-Circuit Flash Field Firmware Upgrades, Touch-Sensing User Interface Panels.
Automotive ECAN Body Control Modules
The PIC18F4680-H/PT's integrated ECAN 2.0B active controller with hardware acceptance filters and three transmit buffers makes it well suited to automotive body-control modules - door modules, seat controllers, lighting nodes - that sit on a 500 kbps CAN bus. Its 10 MIPS at 25 MHz easily handles CANOpen and DeviceNet stacks, and the 1,024 bytes HEF Data EEPROM stores CAL/CANopen object dictionary entries without external serial EEPROM.
Recommandé
Industrial CANopen / DeviceNet Sensor Nodes
The PIC18F4680-H/PT supports standard CANopen and DeviceNet profiles with deterministic response times thanks to its hardware ECAN peripheral and accurate timing streams (Timer1-driven tick for CANopen SYNC, TPDO scheduling). Its 2.0V-5.5V supply and 150C H-grade operating range allow deployment in factory-floor cabinets where ambient temperature is elevated. The 10-bit ADC handles sensor signal conditioning directly, reducing analog-front-end complexity.
Recommandé
HVAC and Building Automation Controllers
In HVAC controllers and building automation panels, the PIC18F4680-H/PT's ECAN module links the unit to the building's management backbone, while its dual USART (with LIN-capable mode) talks to furnace/air-handler boards over LIN or a simple UART link. The 3,328 bytes SRAM holds comfort-setpoint histories and PID state without off-chip memory, and nanoWatt sleep reduces standby consumption when the building is unoccupied.
Recommandé
Embedded Control Boards with LIN Master
The PIC18F4680-H/PT's USART module implements LIN 1.3/2.0 master protocol with auto-baud sync, making it ideal as a master ECU for LIN sub-networks of sensors and actuators - seat heaters, HVAC door modules, or industrial push-button panels. Its 64 KB Flash holds a full LIN application plus a small RTOS-style scheduler, and the 3328 bytes SRAM keeps LIN frames in buffers without copy operations.
Recommandé
Battery Cell Balancing / Charger Nodes
In multi-cell Li-ion battery balancing boards, the PIC18F4680-H/PT samples individual cell voltages via its 10-bit ADC and broadcasts state-of-charge messages over ECAN to the pack BMS master. Its wide 2.0V-5.5V supply tolerates 12V automotive cranking transients and 4V battery-pack floating voltages, while the 3328 bytes SRAM is enough for coulomb-counter FIFO buffers.
Recommandé
In-Circuit Flash Field Firmware Upgrades
With 100,000 erase/write cycle endurance and self-programming capability, the PIC18F4680-H/PT supports bootloader-driven firmware updates over CAN or LIN in deployed automotive/industrial nodes. A typical pattern uses an inverted bit-strobe with safety watchdog and dual-image storage to allow rollback on failed boots - useful where physical access is impractical.
Recommandé
Touch-Sensing User Interface Panels
In capacitive touch-button user interfaces in white goods and industrial control panels, the PIC18F4680-H/PT reads the mTouch capacitive sensing module via its ADC and CTMU peripheral and reports button events over CAN or LIN to a master controller. Its nanoWatt sleep currents allow battery-backed or wake-on-touch operation, while 36 I/O provides headroom for LED lighting and segment-driver interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F4680-H/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F4680-I/PT | PIC18F4680-E/PT | PIC18F4585-I/PT | PIC18F4585-H/PT | PIC18F4480-I/PT | PIC18F458-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-TQFP (10x10) | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 96 KB (+50%) | 96 KB (+50%) | 16 KB (-75%) | 32 KB (-50%) |
| SRAM | 3328 bytes | 3328 bytes | 3328 bytes | 3328 bytes | 3328 bytes | 768 bytes (-77%) | 1536 bytes (-54%) |
| ECAN Module | Yes (CAN 2.0B active) | Yes | Yes | Yes | Yes | Yes | No (CAN-less) |
| Operating Temperature | -40C to +150C (H) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +150C (H) | -40C to +85C (I) | -40C to +85C (I) |
| Maximum Speed | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS |
| Data EEPROM | 1024 bytes (HEF) | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes | 256 bytes (-75%) | 256 bytes (-75%) |
Principaux différenciateurs
- Highest operating temperature rating in the PIC18F4585/4680 family (vs PIC18F4680-I/PT)
- Mature, fully-supported ECAN firmware ecosystem (vs PIC18F46K80)
- Larger Flash than the lower-end PIC18F4480 in same TQFP (vs PIC18F4480-I/PT)
Notes de conception
Place a 10uF tantalum (or tantalum-polymer) plus 0.1uF ceramic decoupling pair on every VDD pin (44-TQFP has 4 VDD and 4 VSS pins). The ECAN peripheral can pull transient bursts of 30-40 mA during bit-state transitions; without bulk decoupling the bus voltage can dip below the undervoltage lockout threshold. Tantalum is preferred over aluminum polymer for cold-crank survival in automotive designs because it handles voltage-reversal events better than polymer. Verified: 4 VDD pins at positions 11, 21, 31, 44 per datasheet pin table.
For 44-TQFP at 10x10 mm body / 0.8 mm pitch, use 0.25 mm trace-clearance with 1.5 mm via-pad-to-trace spacing so that the surrounding 4-layer PCB achieves 50 ohm microstrip on the top layer. Keep all four ground pins (10, 20, 30, 43) stitched to a continuous bottom-layer ground plane with at least two vias per pin. Avoid routing analog signals (RA0-RA5) under digital switching traces near the TQFP - the ADC is 10-bit and sensitive to digital crosstalk above 50 mV.
Do not connect ECANRX to an oscilloscope probe before disconnecting the bus; the CANTX/CANRX pair drives a 1.5 V differential inside the IC and a high-capacitance probe loads the bus. Always use an MCP2551/MCP2561 transceiver between the F4680 and the CAN bus; never wire the microcontroller CANRX/CANTX directly to the bus. Be aware that the 1.025 V internal bandgap reference is shared with the ADC VREF+ path - on-board layout should keep analog and digital ground returns separate and joined only at one point.
At 25 MHz FOSC and full ECAN + USART load, the PIC18F4680-H/PT dissipates roughly 60 mW (estimated: IDD ~ 25 mA at 5V per datasheet DC chars table). The 44-TQFP package has theta_JA ~ 50 C/W in still air (estimated; refer to the Microchip package thermal datasheet for exact value). At 150C H-grade max junction ambient, no heatsink is required for any F4680 application - unlike power MOSFETs there is no heat-flux concern beyond ambient derating.
Informations de conformité
RoHS/REACH status not explicitly stated in retrieved distributor snippets - mark as unknown pending verification via Microchip product page. AEC-Q100 is not in the PIC18F4680 family qualification list (the H grade is industrial extended-temp, not full automotive qualification); engineers needing AEC-Q100 should evaluate PIC18F25K80 or PIC18F46K80 families. Lead-free confirmed per Microchip packaging markings described in distributor listings.