PIC18LF26K83-E/ML - 64KB Flash 8-bit MCU 28-QFN | Microchip
Référence : PIC18LF26K83-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.88 | $38,80 |
| 100 | $3.45 | $345,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.72 | $2 720,00 |
| 3 000 | $2.41 | $7 230,00 |
PIC18LF26K83-E/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable peripherals. Within the broader semiconductor taxonomy, the PIC18LF26K83 belongs to the 8-bit microcontroller family, descended from the PIC18 instruction set, with XLP (eXtreme Low Power) extensions for battery-driven designs. The 'LF' prefix denotes a wide-voltage 1.8V to 3.6V core, and the 'F' variant typically runs from 2.3V to 5.5V, making the 'LF' die the preferred choice for 3.3V-only rails.
Key differentiating features include 64 KB self-programmable Flash with 10 kcycle endurance, 4 KB SRAM, 1 KB EEPROM, a 12-bit ADC2 with automatic averaging and CVD touch-sensing support, a 10-bit DAC, two analog comparators, and Core Independent Peripherals (CIPs) such as CWG, CCP, PWM, and NCO. Communication is covered by one CAN, two I2C, two SPI, and two UART modules - the highest peripheral count in the 28-pin PIC18 K83 family.
The CPU executes the PIC18 instruction set at up to 16 MIPS, using a hardware multiply and a 31-level hardware stack. A Memory Access Partition (MAP) protects boot- and bootloader regions, and Device Information Area (DIA) read-only rows support device ID and calibration. The device supports In-Circuit Serial Programming (ICSP) and in-circuit debug via ICD, with dedicated PGED/PGEC pins.
Typical applications include industrial sensor nodes, automotive body and HVAC controllers (CAN), battery-powered IoT data loggers, touch-interface human-machine interfaces, and low-power remote controls. The combination of ADC2 with CVD enables robust proximity and metal-over-cap touch buttons.
Design-wise, note that the '-E/ML' suffix specifies the -40 C to +125 C extended industrial temperature grade and the 28-QFN (ML) package. Decoupling demands a 100 nF + bulk 1 uF or 4.7 uF arrangement; the analog Vdd/Vss pins must be Kelvin-connected to digital rails to avoid ADC2 noise coupling.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page alone.
Alternatives de remplacement direct pour PIC18LF26K83-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF26K83-E/ML (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Core Architecture, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18LF26K83-I/ML
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →PIC18F26K83-E/ML
✅ Remplacement direct✓ En stock
$1.8 / unité
Voir la fiche technique →PIC18LF25K83-E/ML
✅ Remplacement direct✓ En stock
$1.55 / unité
Voir la fiche technique →PIC18LF26K83-I/MX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18LF26K42-I/ML
✅ Remplacement direct✓ En stock
$2.62 / unité
Voir la fiche technique →PIC18LF26K83-E/ML Valeurs maximales et caractéristiques électriques
| Core | PIC18 8-bit |
| Program Memory | 64 KB Flash |
| RAM | 4 KB SRAM |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage Range (LF) | 1.8 V to 3.6 V |
| DAC | 10-bit |
| Comparators | 2 |
| CAN | 1 x CAN 2.0B |
| UART | 2 |
| I2C | 2 |
| SPI | 2 |
| Boîtier | 28-QFN (6x6 mm), ML suffix |
| Température de fonctionnement | -40 C to +125 C (E grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC18LF26K83-E/ML
| Broche 1 | RA2 — Port A bit 2 / analog input |
| Broche 2 | RA3 — Port A bit 3 / analog input |
| Broche 3 | RA4 — Port A bit 4 / analog input |
| Broche 4 | RA5 — Port A bit 5 / analog input |
| Broche 5 | RA6 — Port A bit 6 / analog input |
| Broche 6 | RA7 — Port A bit 7 / analog input |
| Broche 7 | VDD — Digital supply |
| Broche 8 | VSS — Digital ground |
| Broche 9 | OSC1/RA0 — Crystal oscillator input or Port A bit 0 |
| Broche 10 | OSC2/RA1 — Crystal oscillator output or Port A bit 1 |
| Broche 11 | RC0 — Port C bit 0 |
| Broche 12 | RC1 — Port C bit 1 |
| Broche 13 | RC2 — Port C bit 2 |
| Broche 14 | RC3 — Port C bit 3 / SDA on MSSP |
| Broche 15 | RC4 — Port C bit 4 / SCL on MSSP |
| Broche 16 | RC5 — Port C bit 5 |
| Broche 17 | RC6 — Port C bit 6 / TX on UART1 |
| Broche 18 | RC7 — Port C bit 7 / RX on UART1 |
| Broche 19 | VSS — Digital ground |
| Broche 20 | VDD — Digital supply |
| Broche 21 | RB0 — Port B bit 0 / INT0 / CCP4 |
| Broche 22 | RB1 — Port B bit 1 / INT1 |
| Broche 23 | RB2 — Port B bit 2 / INT2 |
| Broche 24 | RB3 — Port B bit 3 / INT3 |
| Broche 25 | RB4 — Port B bit 4 |
| Broche 26 | RB5 — Port B bit 5 / PGED3 |
| Broche 27 | RB6 — Port B bit 6 / ICSPCLK / PGEC3 |
| Broche 28 | RB7 — Port B bit 7 / ICSPDAT / PGED3 |
| Broche EP | EP — Exposed thermal pad (center pin on QFN) |
Applications typiques
PIC18LF26K83-E/ML convient pour 6 applications: Automotive Body and HVAC CAN Nodes, Battery-Powered IoT Sensor Node, Capacitive Touch HMI Keypad, Industrial Process Sensor Transmitter, Low-Power Remote Control with RF Link, White Goods Motor Control Board.
Automotive Body and HVAC CAN Nodes
The PIC18LF26K83-E/ML fits automotive body and HVAC controllers because of its on-chip CAN 2.0B controller, 12-bit ADC2 for thermistor and current sensing, and -40 C to +125 C extended temperature grade. With 64 KB Flash and 4 KB RAM, it can host a CANopen or J1939-style application layer with diagnostic UDS services. Placed on the LIN/CAN gateway PCB, the MCU replaces a 5 V analog ASIC and a discrete CAN transceiver interface, reducing BOM by 4 to 6 components. The ADC2 with Computation averaging handles HVAC flap position feedback without CPU intervention, leaving the CPU free for HVAC scheduling logic. Compared to NXP S08P or older PIC16F variants, the K83 brings CAN as a true CIP peripheral with DMA-style message buffering.
Recommandé
Battery-Powered IoT Sensor Node
The PIC18LF26K83-E/ML is a strong fit for battery-driven IoT sensor nodes because the LF 1.8 V to 3.6 V core can run directly from a single-cell Li-ion or dual-AA battery, eliminating boost regulators. ADC2 with auto-averaging lets the CPU remain in sleep for 99 percent of the time, drawing nanoWatt-class IDD during sensor idle. The 64 KB Flash easily hosts a LoRaWAN MAC or BLE-Mesh application layer plus OTA bootloader. Placed as the main MCU between a sensor front-end and a low-power radio, it can wake the radio only on threshold crossings. Trade-off: this 8-bit core is 3 to 5x slower at DSP than Cortex-M0+ alternatives, so choose this part when throughput < 1 ksps.
Recommandé
Capacitive Touch HMI Keypad
The PIC18LF26K83-E/ML's ADC2 module integrates Capacitive Voltage Divider (CVD) hardware that automates touch-button scanning without CPU overhead. The 12-bit ADC with hardware oversampling and averaging delivers sub-percent touch threshold drift across temperature, satisfying HMI keypad reliability targets. Combined with the Core Independent Peripherals (CIPs) CWG and PWM, the MCU can directly drive LED backlighting and piezo buzzer feedback from the same chip. Placed behind a glass or plastic panel, it scans up to [DATA_NEEDED: touch button count] electrodes with auto-calibration. The LF variant's 1.8 V minimum supports coin-cell or USB-powered HMI panels.
Recommandé
Industrial Process Sensor Transmitter
The PIC18LF26K83-E/ML fits 4-20 mA industrial process transmitters because of its 12-bit ADC2, 10-bit DAC for loop current, and -40 C to +125 C temperature grade. The CAN peripheral supports the CANopen DS404 profile commonly seen in process automation. With 4 KB RAM, the MCU can run a small PID loop for valve or pump control alongside the application layer. Placed on a 2-wire loop-powered PCB, it can sustain the HART or IO-Link basic protocol stack in the LF variant's 1.8 V minimum. Compared to bare op-amp analog transmitters, the K83 enables software-calibrated linearity below 0.1 percent FS at lower BOM cost.
Recommandé
Low-Power Remote Control with RF Link
The PIC18LF26K83-E/ML drives battery-powered RF remote controls because its XLP nanoWatt sleep currents (Doze/Retention) and 1.8 V minimum operation extend battery life beyond 5 years on a CR2032. The two UART peripherals allow direct host interfaces, and the CCP/PWM modules generate IR carrier waveforms for TV-style or sub-GHz remote protocols. Placed between the keypad matrix and a TI CC1101 sub-GHz transceiver, it handles debouncing, IR coding, and link-layer acknowledgment. The K83's 1 KB EEPROM stores 1000+ pairing codes without external NVM. Trade-off: 16 MIPS limits polling rate versus Cortex-M0+ alternatives, but XLP sleep profile wins for click-count applications.
Recommandé
White Goods Motor Control Board
The PIC18LF26K83-E/ML is suitable for washing-machine, dishwasher, and refrigerator motor-control boards where a mix of sensor acquisition, UART/MFC user interface, and basic motion timing is required. The PIC18 FPU-less 8-bit core handles low-frequency trapezoidal commutation at < 50 Hz electrical, paired with the 12-bit ADC2 for back-EMF sensing. The two I2C peripherals interface to display/keypad, and the 10-bit DAC drives dimming signals. Placed next to an external 3-phase inverter gate driver, the MCU handles user-interface and motor sequencing while leaving the inverter to the gate driver. Trade-off: prefer PIC18F57Q43 for FOC algorithm at higher RPM, but the K83 wins at BOM cost below 1 kRPM.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF26K83-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18LF26K83-I/ML | PIC18F26K83-E/ML | PIC18LF25K83-E/ML | PIC18LF26K83-I/MX | PIC18LF26K42-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) ML | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) MX - same footprint, ordering-code suffix differs | 28-QFN (6x6) ML - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | E: -40 C to +125 C | I: -40 C to +85 C | E: -40 C to +125 C | E: -40 C to +125 C | I: -40 C to +85 C | I: -40 C to +85 C |
| CAN Bus | 1 x CAN 2.0B | 1 x CAN 2.0B | 1 x CAN 2.0B | 1 x CAN 2.0B | 1 x CAN 2.0B | No CAN (K42 family drop-in only if CAN is not needed) |
| ADC | 12-bit ADC2 with Computation | 12-bit ADC2 | 12-bit ADC2 | 12-bit ADC2 | 12-bit ADC2 | 12-bit ADC2 |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
Principaux différenciateurs
- Highest peripheral count in the 28-pin PIC18 family with on-chip CAN 2.0B (vs PIC18LF26K42-I/ML)
- 12-bit ADC2 with hardware computation enables CIP-based sensor averaging (vs PIC18LF25K83-E/ML)
- Extended -40 C to +125 C temperature grade in 28-QFN ML package (vs PIC18LF26K83-I/ML)
Notes de conception
The PIC18LF26K83-E/ML's 1.8 V to 3.6 V VDD allows direct connection to single-cell Li-ion or dual-AA batteries without a boost regulator. For ADC2 measurements above 100 ksps, place a 100 nF X7R ceramic directly on each VDD/VSS pin pair (pins 7/8 and pins 20/19) plus a 4.7 uF bulk capacitor within 5 mm of the IC. AVDD and AVSS (when used) should be Kelvin-tied to the same rails as VDD/VSS to avoid digital switching noise coupling into analog acquisitions.
Although the 28-QFN package has a small exposed thermal pad (EP), the LF26K83 typically dissipates well below 100 mW even at 64 MHz full-load. For continuous 64 MHz + CAN + ADC2 operation, solder the central EP to a ground copper pour of at least 25 mm^2. Junction-to-ambient thermal resistance is approximately 35 C/W on a 2-layer 1 oz FR4 PCB and 22 C/W on a 4-layer PCB, leaving ample thermal margin up to +125 C in still air.
Route the 28-QFN (6x6 mm, 0.65 mm pitch) with 0.2 mm trace width and 0.4 mm via pad. Keep the ICSP/PGED/PGEC pair (RB6/RB7) short and shielded with a ground guard trace on both sides to avoid debugger noise pickup. The CAN bus traces (RC6/RC7 for UART1 or the dedicated CANTX/CANRX pins) must be length-matched to within 5 mm to meet CAN 1 Mb/s timing.
Do not confuse the LF voltage range (1.8 V to 3.6 V) with the F voltage range (2.3 V to 5.5 V). When a 5 V rail is supplied, the LF26K83 will exceed absolute maximum ratings and fail. Always match the 'LF' or 'F' prefix to your supply rail. Also note the -E (extended) versus -I (industrial) temperature suffix - choosing I-grade for an automotive +125 C environment will cause thermal-shutdown failures.
Informations de conformité
RoHS and lead-free per Microchip product page. Halogen-free per QFN package materials. AEC-Q100 not formally qualified by Microchip, but -E/-40 C to +125 C grade is widely used in automotive non-safety applications. For AEC-Q100-qualified automotive body, source from Microchip's automotive-grade product family separately.
