PIC18LF6627-I/PT - 8-Bit 40MHz MCU 96KB Flash 64-TQFP | Microchip
Référence : PIC18LF6627-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.23 | $13,23 |
| 10 | $11.74 | $117,40 |
| 100 | $10.28 | $1 028,00 |
| 500 | $9.1 | $4 550,00 |
| 1 000 | $8.2 | $8 200,00 |
PIC18LF6627-I/PT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals into one IC. Within the broader taxonomy, a microcontroller belongs to the integrated circuit family, sits alongside microprocessors, DSPs, and FPGAs, and is the lowest-power member of the programmable-logic hierarchy used for embedded control. The PIC18F sub-family adds hardware multipliers, multiple interrupt priority levels, and C-friendly architecture on top of the original PIC16 baseline.
Key differentiating specifications include 96 KB Flash with self-programmability, 1 KB of EEPROM data memory, 12 channels of 10-bit ADC, up to five 16-bit timers/counters, two enhanced USART modules, two MSSP (SPI/I2C) peripherals, an integrated ECAN controller, dual analog comparators, and nanoWatt XLP sleep currents below 100 nA. The 64-pin TQFP gives engineers enough GPIO and peripheral pin-out for medium-complexity human-interface, sensor-fusion, and CAN-connected designs.
The PIC18LF6627 uses Microchip's enhanced Harvard RISC core with a 16-bit instruction word, hardware multiply, and a 31-level hardware stack. The 'LF' suffix designates the low-voltage F-variant that supports 2.0 V operation, distinguishing it from the standard PIC18F6627 that runs from 4.2 V to 5.5 V. Code developed for the PIC18F6627 is generally portable to the LF version as long as VDD stays inside the LF mask window.
Typical applications include industrial CAN nodes, HVAC and building-automation controllers, automotive body-comfort modules, low-power sensor hubs, USB-to-CAN bridges, and portable instrumentation where extended battery life matters. Engineers frequently select this part for designs that need ECAN, multiple serial interfaces, and analog sensing in a single chip.
When designing with this part, reserve the MCLR pin for an external pull-up and decoupling, provide a bulk + 100 nF pair on VDD/VSS, and follow Microchip's emulator header pinout if in-circuit debug is required. Also ensure your firmware linker script matches the 48K-word Flash boundary to avoid placement errors during build.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to help procurement and firmware engineers evaluate the PIC18LF6627-I/PT for new designs and second-source programs.
Alternatives de remplacement direct pour PIC18LF6627-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF6627-I/PT (même facteur de forme et même empreinte) — différant par Timers, Package, Program Memory (Flash), I/O Pins, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18LF6627T-I/PT
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →PIC18LF6622-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F6627-I/PT
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →PIC18LF6527-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18LF6622T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.96 / unité
Voir la fiche technique →PIC18LF6627-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 8-bit RISC (Harvard) |
| Family | PIC18F (PIC18 LF series) |
| Program Memory (Flash) | 96 KB (48K x 16 words) |
| Data Memory (RAM) | 4 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Frequency | 40 MHz |
| Operating Voltage (VDD) | 2.0 V to 5.5 V |
| I/O Pins | 70 (max) |
| ADC | 12-channel, 10-bit |
| Timers | 5 (16-bit / 8-bit mix) |
| UART / USART | 2x Enhanced USART |
| SPI | 2x MSSP (SPI / I2C) |
| I2C | 2x MSSP (SPI / I2C) |
| CAN | 1x ECAN (Enhanced CAN) |
| Analog Comparators | 2 |
| Boîtier | 64-pin TQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial, -I suffix) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC18LF6627-I/PT
| Broche 1 | RE3/MCLR — Digital input RE3 or Master Clear (reset) |
| Broche 2 | RA0/AN0 — Digital I/O RA0 or analog input AN0 |
| Broche 3 | RA1/AN1 — Digital I/O RA1 or analog input AN1 |
| Broche 4 | RA2/AN2/VREF- — Digital I/O RA2, AN2, or VREF- |
| Broche 5 | RA3/AN3/VREF+ — Digital I/O RA3, AN3, or VREF+ |
| Broche 6 | RA4/T0CKI — Digital I/O RA4 or Timer0 clock input |
| Broche 7 | RA5/AN4 — Digital I/O RA5 or analog input AN4 |
| Broche 8 | AVDD — Analog supply voltage |
| Broche 9 | AVSS — Analog ground |
| Broche 10 | RB0/INT0 — Digital I/O RB0 or external interrupt 0 |
| Broche 11 | RB1/INT1 — Digital I/O RB1 or external interrupt 1 |
| Broche 12 | RB2/INT2 — Digital I/O RB2 or external interrupt 2 |
| Broche 13 | RB3/INT3 — Digital I/O RB3 or external interrupt 3 |
| Broche 14 | RB4/KBI0 — Digital I/O RB4 or keyboard interrupt 0 |
| Broche 15 | RB5/KBI1 — Digital I/O RB5 or keyboard interrupt 1 |
| Broche 16 | RB6/KBI2/PGC — Digital I/O RB6, KBI2, or ICSP clock |
| Broche 17 | RB7/KBI3/PGD — Digital I/O RB7, KBI3, or ICSP data |
| Broche 18 | VSS — Digital ground |
| Broche 19 | VDD — Digital supply voltage |
| Broche 20 | RC0 — Digital I/O RC0 |
| Broche 21 | RC1 — Digital I/O RC1 |
| Broche 22 | RC2 — Digital I/O RC2 |
| Broche 23 | RC3 — Digital I/O RC3 |
| Broche 24 | RC4 — Digital I/O RC4 |
| Broche 25 | RC5 — Digital I/O RC5 |
| Broche 26 | RC6/TX1 — Digital I/O RC6 or EUSART1 transmit |
| Broche 27 | RC7/RX1 — Digital I/O RC7 or EUSART1 receive |
| Broche 28 | RD0 — Digital I/O RD0 |
| Broche 29 | RD1 — Digital I/O RD1 |
| Broche 30 | RD2 — Digital I/O RD2 |
| Broche 31 | RD3 — Digital I/O RD3 |
| Broche 32 | RD4 — Digital I/O RD4 |
| Broche 33 | RD5 — Digital I/O RD5 |
| Broche 34 | RD6 — Digital I/O RD6 |
| Broche 35 | RD7 — Digital I/O RD7 |
| Broche 36 | VSS — Digital ground |
| Broche 37 | VDD — Digital supply voltage |
| Broche 38 | RE0/RD — Digital I/O RE0 or parallel port read strobe |
| Broche 39 | RE1/WR — Digital I/O RE1 or parallel port write strobe |
| Broche 40 | RE2/CS — Digital I/O RE2 or parallel port chip select |
| Broche 41 | RF0 — Digital I/O RF0 |
| Broche 42 | RF1 — Digital I/O RF1 |
| Broche 43 | RF2 — Digital I/O RF2 |
| Broche 44 | RF3 — Digital I/O RF3 |
| Broche 45 | RF4 — Digital I/O RF4 |
| Broche 46 | RF5 — Digital I/O RF5 |
| Broche 47 | RF6 — Digital I/O RF6 |
| Broche 48 | RF7 — Digital I/O RF7 |
| Broche 49 | RG0 — Digital I/O RG0 |
| Broche 50 | RG1 — Digital I/O RG1 |
| Broche 51 | RG2 — Digital I/O RG2 |
| Broche 52 | RG3 — Digital I/O RG3 |
| Broche 53 | RG4 — Digital I/O RG4 |
| Broche 54 | MCLR/RE3 — Master Clear / RE3 (alt pin 1) |
| Broche 55 | VSS — Digital ground |
| Broche 56 | VDD — Digital supply voltage |
| Broche 57 | OSC1/CLKIN — Crystal oscillator input / external clock |
| Broche 58 | OSC2/CLKOUT — Crystal oscillator output |
| Broche 59 | SOSCO — Secondary oscillator (Timer1) crystal output |
| Broche 60 | SOSCI — Secondary oscillator (Timer1) crystal input |
| Broche 61 | NC — Not connected (per datasheet) |
| Broche 62 | NC — Not connected (per datasheet) |
| Broche 63 | NC — Not connected (per datasheet) |
| Broche 64 | NC — Not connected (per datasheet) |
Applications typiques
PIC18LF6627-I/PT convient pour 6 applications: Industrial CAN Nodes, HVAC and Building Automation Controllers, Automotive Body Comfort Modules, Low-Power Sensor Hubs, USB-to-CAN Bridge Modules, Portable Instrumentation and Data Loggers.
Industrial CAN Nodes
The PIC18LF6627-I/PT's on-chip Enhanced CAN (ECAN) controller makes it well-suited for industrial CAN bus nodes such as motor controllers, valve actuators, and distributed I/O modules. With 96 KB Flash, 4 KB RAM, and 70 I/O pins, the device can host a complete CANopen or DeviceNet slave stack while still leaving room for application-specific logic. The 2.0-5.5 V supply range allows the part to be powered directly from 24 V industrial buses after regulation, simplifying bill of materials. Pairing it with an external MCP2562 CAN transceiver creates a robust, isolated-capable node with deterministic CAN 2.0B communication at 1 Mbit/s.
Recommandé
HVAC and Building Automation Controllers
The PIC18LF6627-I/PT fits building automation controllers that need to aggregate temperature, humidity, and air-quality sensors through its 12-channel 10-bit ADC, then communicate over RS-485 or CAN to a central BMS. Its 96 KB Flash can host a complete BACnet MS/TP or Modbus slave stack, while the 4 KB RAM supports real-time scheduling tables. nanoWatt XLP sleep currents below 1 uA in deep sleep enable battery-backed thermostats that run for years on a single CR2032. The dual MSSP peripherals allow simultaneous SPI sensor and I2C RTC connectivity without an external multiplexer.
Recommandé
Automotive Body Comfort Modules
The PIC18LF6627-I/PT is used in body-comfort automotive subsystems such as seat controllers, mirror adjusters, and lighting modules where moderate Flash and CAN connectivity are required. The integrated ECAN controller connects directly to vehicle body networks, while the 12-bit ADC and dual analog comparators handle window-current sensing and lamp-bulb health monitoring. The industrial -40 C to +85 C temperature rating covers most cabin environments. For under-hood applications, however, designers should migrate to AEC-Q100-qualified PIC18 variants such as the PIC18F46K80-I/PT family to meet automotive reliability targets.
Recommandé
Low-Power Sensor Hubs
Battery-powered sensor hubs leverage the PIC18LF6627-I/PT's nanoWatt XLP technology and 2.0 V minimum supply to run years on a single AA cell. The 12-channel ADC can read multiple analog sensors simultaneously while the dual MSSP handles SPI environmental sensors and I2C displays. Sleep currents below 100 nA with RAM retention allow wake-on-interrupt from sensor triggers without external RTC chips. The 96 KB Flash stores sensor calibration tables and edge-processing algorithms on-device, reducing wireless traffic and cloud-billing costs.
Recommandé
USB-to-CAN Bridge Modules
Engineers building USB-to-CAN bridges, automotive diagnostic dongles, or industrial protocol converters benefit from the PIC18LF6627-I/PT's combination of ECAN and dual enhanced USART. The 96 KB Flash can host USB CDC plus CANopen, J1939, or DeviceNet stack layers, while the 4 KB RAM provides buffer headroom for high-throughput packet forwarding. Industrial temperature rating allows the module to operate reliably in enclosure-mounted installations. For lower-cost bridges, the smaller-pin PIC18LF46K80T-I/PT family may be evaluated.
Recommandé
Portable Instrumentation and Data Loggers
Portable data loggers and field-instrumentation devices use the PIC18LF6627-I/PT because it integrates ADC, multiple serial interfaces, and large Flash in a single chip. The 1 KB EEPROM is ideal for non-volatile configuration storage that survives battery swaps, while the 96 KB Flash supports weeks of buffered measurement data. The industrial temperature range allows operation in outdoor enclosures, and the 2.0 V minimum VDD supports direct lithium primary-cell operation. CTMU-based capacitive touch support enables rugged front-panel buttons without mechanical switches.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF6627-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18LF6627T-I/PT | PIC18LF6622-I/PT | PIC18F6627-I/PT | PIC18LF6527-I/PT | PIC18LF6622T-I/PT |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 96 KB | 96 KB | 64 KB (-33%) | 96 KB | 48 KB (-50%, drop-in floor) | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Voltage (VDD) | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 4.2 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| ADC Channels | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit | 12 x 10-bit |
| ECAN | Yes | Yes | Yes | Yes | Yes | Yes |
| Industrial Temperature Grade | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Industry-leading low-voltage PIC18F family with ECAN and nanoWatt XLP (vs PIC18F6627-I/PT)
- 96 KB Flash for full CANopen or DeviceNet stacks plus application code (vs PIC18LF6622-I/PT)
- 12-channel 10-bit ADC and dual analog comparators on-chip (vs PIC18LF6527-I/PT)
- 70 I/O pins on the 64-pin TQFP package (vs PIC18LF55K42-I/PT)
Notes de conception
Estimated: at 5 V VDD, 40 MHz CPU, full peripheral activity, the PIC18LF6627-I/PT draws approximately 15 mA, giving power dissipation of about 75 mW. The 64-pin TQFP exposes the thermal pad (pin 64 area) for board-level cooling, but at this power level a 4-layer PCB with a ground plane is more than adequate. Designers targeting nanoWatt XLP deep-sleep should configure the part in Sleep mode with peripherals disabled; typical deep-sleep current is below 100 nA per Microchip datasheet. Decouple each VDD/VSS pair with 100 nF X7R placed within 5 mm of the pins.
Place the MCLR pull-up (typically 10 kohm) close to the pin and route the ICSP PGC/PGD traces together without stubs to maintain signal integrity during programming. Keep the crystal traces short and surround them with a ground guard ring to avoid injecting oscillator noise into the analog inputs. Use a 4-layer PCB with a continuous ground plane for designs that rely on the 12-bit ADC performance, and place the AVSS pin directly to the analog ground plane if separating analog and digital grounds.
Do not confuse the LF (2.0-5.5 V) variant with the standard F (4.2-5.5 V) variant when designing at 3.3 V - only LF parts operate reliably across the full 2.0-5.5 V range. When migrating from PIC18F6627 to PIC18LF6627 firmware, verify that the configuration bits for oscillator mode and brown-out voltage remain within the LF datasheet limits. Also confirm the linker script places code within the 48K-word Flash boundary; firmware built for a 64 KB device will not run on this 96 KB part without verification of the linker memmap.
The ECAN controller on the PIC18LF6627-I/PT requires a high-speed CAN transceiver on the bus side such as the MCP2551 or MCP2562. Without a transceiver, the ECAN pins cannot drive the differential bus directly. For systems exposed to ESD or surge events (industrial and automotive), add TVS protection such as the PESD1CAN on the bus lines and common-mode chokes to meet IEC 61000-4-2 transient immunity requirements. Configure the ECAN baud rate and propagation segment timing per the CiA 601 CAN bit-time recommendations for reliable 1 Mbit/s operation.
Informations de conformité
RoHS compliant per Microchip product page. The -I suffix indicates industrial temperature grade (-40 C to +85 C) but is not AEC-Q100 qualified; choose a Q1-suffix variant for automotive applications requiring AEC-Q100. Lead-free packaging confirmed by Microchip documentation.
