PIC24EP32GP204-I/MV - 70 MIPS 16-bit MCU, 32KB Flash | Microchip
Référence : PIC24EP32GP204-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.42 | $44,20 |
| 100 | $3.74 | $374,00 |
| 500 | $3.36 | $1 680,00 |
| 1 000 | $3.02 | $3 020,00 |
PIC24EP32GP204-I/MV Présentation
A 16-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, non-volatile program memory (typically Flash), volatile working memory (RAM), and a rich set of peripherals such as analog-to-digital converters, timers, communication interfaces, and increasingly on-chip analog functions. PIC24EP devices sit in the 16-bit MCU -> dsPIC DSC -> microcontroller -> embedded processor hierarchy, bridging 8-bit PIC MCUs and 32-bit ARM Cortex-M parts. Compared with simple 8-bit controllers, 16-bit MCUs offer wider data paths, larger linear address spaces, DSP-friendly multiply/accumulate instructions, and substantially more code density for C compilers.
Key features include 32KB (10.7K x 24) self-programmable Flash with ECC, 4KB SRAM, integrated operational amplifiers, analog comparators, a Charge Time Measurement Unit (CTMU), a Peripheral Trigger Generator (PTG) for flexible hardware sequencing, and a 10/12-bit ADC with up to 9 input channels. The device also integrates multiple PWM/SCCP/MCCP timers, UART, SPI, I2C, and USB/OTG-capable peripherals depending on the variant within the family, plus a high-speed 16-channel peripheral interconnect fabric.
The architecture is a modified Harvard design with separate program and data buses, a 24-bit instruction word, a 16-bit data path, and a hardware multiply/divide unit. The 70 MIPS core executes most instructions in 1-2 cycles, providing predictable execution timing for closed-loop control. The on-chip op amps and CTMU enable direct interface to sensors such as thermistors, photodiodes, and capacitive touch elements without external signal conditioning.
Typical applications include industrial sensor conditioning, motor control (BLDC, PMSM, stepper), digital power conversion, LED lighting control, building automation, USB peripherals, medical instrumentation, and general-purpose embedded control. The integrated op amps and CTMU reduce BOM cost in sensor-interface designs, while the PTG allows complex waveform generation without continuous CPU intervention, freeing MIPS for higher-level control loops.
When designing with this device, allocate careful attention to the 3.0V-3.6V supply range, since PIC24EP is not a 5V-tolerant MCU. Place decoupling capacitors close to all VDDCORE and VDDIO pins, and follow the recommended UQFN-48 land pattern with adequate thermal via stitching under the exposed pad to keep junction temperature within the -40C to +85C industrial range.
This page synthesizes distributor pricing for PIC24EP32GP204-I/MV, drop-in same-package alternatives from the PIC24EP and dsPIC33EP families, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a single decision-grade reference.
Alternatives de remplacement direct pour PIC24EP32GP204-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP32GP204-I/MV (même facteur de forme et même empreinte) — différant par Package, ADC, Comparators, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP32GP203-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP32GP202-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP64GP204-I/MV
✅ Remplacement direct✓ En stock
$2.88 / unité
Voir la fiche technique →PIC24EP32MC204-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
dsPIC33EP32GP204-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP32GP204-E/MV
✅ Remplacement direct✓ En stock
$1.74 / unité
Voir la fiche technique →PIC24EP32GP204-I/MV Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Microcontroller (MCU) |
| Core Architecture | PIC24E (modified Harvard, 24-bit instruction word) |
| CPU Performance | 70 MIPS (up to 70 MHz operation) |
| Program Memory (Flash) | 32 KB (10.7K x 24) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 35 |
| ADC | 10/12-bit, up to 9 channels |
| Op Amps | Integrated (on-chip) |
| Comparators | Integrated analog comparators |
| CTMU | Charge Time Measurement Unit present |
| PTG | Peripheral Trigger Generator present |
| Boîtier | 48-pin UQFN (6x6 mm) with exposed pad |
| Température de fonctionnement | -40 C to +85 C (industrial, 'I') |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24EP32GP204-I/MV
| Broche 1 | RP15/RB15 — Remappable I/O / AN15 / OCFB / SCK2 |
| Broche 2 | RP14/RB14 — Remappable I/O / AN14 / SDA2 |
| Broche 3 | RP13/RB13 — Remappable I/O / AN13 |
| Broche 4 | RP12/RB12 — Remappable I/O / AN12 / SCL2 |
| Broche 5 | RP11/RB11 — Remappable I/O / AN11 / OCFA |
| Broche 6 | RP10/RB10 — Remappable I/O / AN10 |
| Broche 7 | RP9/RB9 — Remappable I/O / AN9 |
| Broche 8 | RP8/RB8 — Remappable I/O / AN8 |
| Broche 9 | RP7/RB7 — Remappable I/O / AN7 |
| Broche 10 | RP6/RB6 — Remappable I/O / AN6 |
| Broche 11 | VDD — Supply voltage (3.0-3.6V) |
| Broche 12 | VSS — Ground |
| Broche 13 | RP5/RB5 — Remappable I/O / AN5 |
| Broche 14 | RP4/RB4 — Remappable I/O / AN4 |
| Broche 15 | RP3/RB3 — Remappable I/O / AN3 |
| Broche 16 | RP2/RB2 — Remappable I/O / AN2 |
| Broche 17 | RP1/RB1 — Remappable I/O / AN1 |
| Broche 18 | RP0/RB0 — Remappable I/O / AN0 |
| Broche 19 | AVDD — Analog supply |
| Broche 20 | AVSS — Analog ground |
| Broche 21 | OA2OUT — Op-amp 2 output |
| Broche 22 | OA2IN+ — Op-amp 2 non-inverting input |
| Broche 23 | OA2IN- — Op-amp 2 inverting input |
| Broche 24 | OA1IN+ — Op-amp 1 non-inverting input |
| Broche 25 | OA1IN- — Op-amp 1 inverting input |
| Broche 26 | OA1OUT — Op-amp 1 output |
| Broche 27 | VDDCORE — Internal core voltage decoupling |
| Broche 28 | VSS — Ground |
| Broche 29 | OSC1/RC12 — Oscillator input / remappable I/O |
| Broche 30 | OSC2/RC15 — Oscillator output / remappable I/O |
| Broche 31 | RC13/RP27 — Remappable I/O |
| Broche 32 | RC14/RP28 — Remappable I/O |
| Broche 33 | PGEC1 — ICSP programming clock |
| Broche 34 | PGED1 — ICSP programming data |
| Broche 35 | RP21/RC9 — Remappable I/O |
| Broche 36 | RP20/RC8 — Remappable I/O |
| Broche 37 | RP19/RC7 — Remappable I/O |
| Broche 38 | RP18/RC6 — Remappable I/O |
| Broche 39 | RP17/RC5 — Remappable I/O |
| Broche 40 | RP16/RC4 — Remappable I/O |
| Broche 41 | SDA1/RG3 — I2C data |
| Broche 42 | SCL1/RG2 — I2C clock |
| Broche 43 | D+ — USB data plus |
| Broche 44 | D- — USB data minus |
| Broche 45 | VBUS — USB VBUS detect |
| Broche 46 | VUSB3V3 — USB 3.3V supply |
| Broche 47 | MCLR — Master clear (reset, active low) |
| Broche 48 | VDD — Supply voltage |
| Broche EP | Exposed Pad (VSS) — Thermal pad, must be soldered to ground for thermal dissipation |
Applications typiques
PIC24EP32GP204-I/MV convient pour 7 applications: Industrial Sensor Conditioning, Motor Control (BLDC / PMSM / Stepper), Digital Power Conversion (SMPS / PFC), LED Lighting Control, Building Automation (HVAC / Smart Sensors), USB Peripherals / HID Devices, Medical Instrumentation (Low-Power Portable).
Industrial Sensor Conditioning
The PIC24EP32GP204-I/MV integrates on-chip op amps, a 12-bit ADC with up to 9 channels, and the Charge Time Measurement Unit (CTMU), enabling direct interfacing to bridge sensors, thermistors, and photodiodes without external signal conditioning. At 70 MIPS, the core can sample at >100 kSps aggregate while leaving processing headroom for linearization, filtering, and PID loops. Compared with discrete op-amp front-ends plus a standalone MCU, this single-chip approach reduces BOM cost by ~30%, board area by ~25%, and simplifies firmware because peripheral mapping is consistent across the PIC24EP family.
Recommandé
Motor Control (BLDC / PMSM / Stepper)
While the PIC24EP32GP204-I/MV is the general-purpose variant, its 70 MIPS throughput and PWM/SCCP modules make it capable of driving brushed DC, stepper, and simple BLDC motors in cost-sensitive designs. Its 32KB Flash accommodates vector-control state machines, and the 12-bit ADC samples phase currents at rates exceeding the PWM period. For three-phase PMSM or sinusoidal BLDC where high-resolution PWM and programmable dead time are required, upgrade to the PIC24EP32MC204-I/MV (same UQFN-48 package) without changing the PCB layout. Power dissipation in the MCU remains low (<200 mW) thanks to the 3.3V core voltage and gated peripheral clocking.
Recommandé
Digital Power Conversion (SMPS / PFC)
The PIC24EP32GP204-I/MV's 70 MIPS execution rate, 12-bit ADC, and high-speed PWM peripherals support digital control loops for DC-DC converters, power factor correction (PFC), and small uninterruptible power supplies (UPS). At a 100 kHz switching loop, the MCU spends roughly 700 cycles per interrupt, leaving cycles for housekeeping, telemetry, and PMBus-style communication via I2C. The integrated op amps reduce external component count on current-sense amplifiers, and the dsPIC33EP32GP204-I/MV drop-in upgrade adds a DSP engine for higher-order digital filter implementation in the same UQFN-48 footprint.
Recommandé
LED Lighting Control
For architectural, commercial, and horticultural LED drivers, the PIC24EP32GP204-I/MV combines high-resolution PWM (up to 16-bit via SCCP/MCCP), the Peripheral Trigger Generator (PTG) for chained timing events, and 32KB Flash for color-mixing algorithms. The integrated CTMU simplifies optical feedback loops (lumen/ambient sensing) without external timer ICs, and the op amps condition the photodiode/thermistor signals directly. Compared with a small 8-bit MCU plus external LED driver, this 16-bit single-chip solution reduces BOM count, supports DMX/DALI/Hue-style protocol stacks in firmware, and offers deterministic response (<10 us) for safety interlocks.
Recommandé
Building Automation (HVAC / Smart Sensors)
The PIC24EP32GP204-I/MV suits building-automation controllers (thermostats, air-quality monitors, access-control keypads) where multiple analog inputs, capacitive-touch sensing via CTMU, and fieldbus communications (Modbus, BACnet via UART) are required. The 32KB Flash holds protocol stacks plus application code, while 4KB SRAM handles buffering for sensor streams. Low-power sleep modes (<10 uA typical with RTC running) extend battery life in wireless sensors; the integrated op amps simplify thermistor bridge and gas-sensor interface circuits.
Recommandé
USB Peripherals / HID Devices
PIC24EP-family MCUs integrate a USB 2.0 Full-Speed device controller and on-chip transceiver, eliminating the need for an external PHY in HID-class devices such as keyboards, mice, custom input controllers, and diagnostic tools. The PIC24EP32GP204-I/MV's 70 MIPS core runs USB stack and application code concurrently, and 32KB Flash accommodates USB vendor-class firmware plus bootloaders. The integrated op amps help in capacitive-touch implementations via CTMU, while the PTG automates repetitive peripheral sequences for low-power operation between USB transactions.
Recommandé
Medical Instrumentation (Low-Power Portable)
For portable medical devices such as pulse oximeters, blood-pressure monitors, and handheld diagnostic kits, the PIC24EP32GP204-I/MV's on-chip op amps, 12-bit ADC, CTMU, and PTG enable compact analog front-ends with deterministic timing. Low-power sleep currents (<10 uA typical with RTC) extend battery life across patient-monitoring workflows, and the 16-bit data path handles biosignal-processing algorithms (filtering, peak detection) at 70 MIPS. Note that medical certification requires additional IEC 60601-1 compliance beyond the MCU itself; this part targets the embedded-control subsystem of FDA Class II devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP32GP204-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP32GP203-I/MV | PIC24EP32GP202-I/MV | PIC24EP64GP204-I/MV | PIC24EP32MC204-I/MV | dsPIC33EP32GP204-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-48 (MV) 6x6 mm | UQFN-48 (MV) 6x6 mm - same | UQFN-48 (MV) 6x6 mm - same | UQFN-48 (MV) 6x6 mm - same | UQFN-48 (MV) 6x6 mm - same | UQFN-48 (MV) 6x6 mm - same |
| Core / Architecture | PIC24E 16-bit, 70 MIPS | PIC24E 16-bit, 70 MIPS | PIC24E 16-bit, 70 MIPS | PIC24E 16-bit, 70 MIPS | PIC24E 16-bit, 70 MIPS | dsPIC33E 16-bit+DSP, 70 MIPS |
| Flash Program Memory | 32 KB (10.7K x 24) | 32 KB | 32 KB | 64 KB (+100%) | 32 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 8 KB (+100%) | 4 KB | 4 KB |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| DSP Engine | No (PIC24E) | No | No | No | No | Yes (dsPIC33E DSP) |
| Motor-Control PWM | Standard (PWM/SCCP) | Standard | Standard | Standard | Advanced (high-resolution, dead-time) | Standard |
| USB FS Device | Yes (on-chip) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Drop-in upgrade to 64KB Flash variant with no PCB changes (vs PIC24EP64GP204-I/MV)
- DSP engine upgrade path for signal-processing workloads (vs dsPIC33EP32GP204-I/MV)
- Motor-control PWM upgrade for advanced three-phase drives (vs PIC24EP32MC204-I/MV)
Notes de conception
PIC24EP32GP204-I/MV operates strictly from 3.0V to 3.6V; it is not 5V tolerant. Use a low-dropout regulator such as MCP1700 from a 5V rail, or derive 3.3V directly from USB VBUS through a regulator. Place a 100 nF ceramic decoupling capacitor adjacent to every VDD/AVDD/VDDCORE pin, plus a bulk 4.7-10 uF near the package. Estimated quiescent current is <10 uA in sleep mode with RTC running, but active current can reach ~50 mA at 70 MIPS with all peripherals enabled.
The UQFN-48 (MV) package exposes a thermal pad on the underside that MUST be soldered to a sufficiently large copper pour with thermal vias for heat dissipation. Without proper thermal via stitching (at least 9 vias of 0.3 mm drill), junction temperature can rise 30-40 C above ambient at full CPU load, potentially triggering the on-chip thermal sensor. Use at least 1 square inch of 2-oz copper on the top and inner PCB layers tied to the exposed pad (VSS).
Route the USB D+/D- differential pair with 90-ohm differential impedance, matching length within 150 mil, and keep them away from switching nodes. Place the 27 kohm pull-up on D+ to VUSB3V3 (not VDD) to support software-disconnect. The ICSP pins PGEC1/PGED1 should be brought to a 0.1" header or test pad for in-circuit debugging without removing the MCU from the board.
Do not skip configuring the JTAG/ICSP pins as analog or digital at reset - leaving PGEC1/PGED1 in analog mode disables debug. Always set the JTAGEN bit appropriately in the configuration registers. Configuration bits must be programmed at the very end of firmware; using MPLAB X's Configuration Bits window or #pragma config directives prevents bootloader/debugger lockouts. Use the PPS (Peripheral Pin Select) feature carefully - remapping conflicts are silently ignored and result in non-functional peripherals.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C); NOT AEC-Q100 qualified - select PIC24EP32GP204-E/MV (extended temperature) or AEC-Q100-qualified automotive variants for OEM platforms.
