PIC24F08KA102-E/SO - 16-bit XLP MCU, 8KB Flash, 28-SOIC | Microchip
Référence : PIC24F08KA102-E/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.95 | $2,95 |
| 10 | $2.66 | $26,60 |
| 100 | $2.31 | $231,00 |
| 500 | $2.04 | $1 020,00 |
| 1 000 | $1.85 | $1 850,00 |
PIC24F08KA102-E/SO Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, peripherals and I/O. The PIC24F family sits in Microchip's 16-bit dsPIC/PIC24 portfolio, between the 8-bit PIC18 family and the 32-bit PIC32MX/PIC32MM families, and is positioned for low-power embedded applications where 8-bit performance is insufficient but 32-bit cost is not justified. XLP variants add ultra-low-power sleep modes aimed at energy-harvesting and battery-powered IoT endpoints.
Key differentiating specifications include nanoWatt XLP technology with deep-sleep currents in the nanoampere range, on-chip 32 kHz low-power oscillator for RTC operation, a 10-bit 9-channel ADC, multiple serial interfaces (UART, SPI, I2C), and CTMU/IOC peripherals for capacitive touch and edge-triggered wake-up. The wide operating voltage range from 1.8 V to 3.6 V supports 2-cell alkaline, single-cell Li-Ion and coin-cell battery topologies directly without external regulation.
The PIC24F architecture uses a 16-bit modified Harvard CPU with a hardware multiply/divide, 24-bit instruction word and 16-bit data path. Code runs from internal Flash through a prefetch buffer, allowing single-cycle Flash access and a 32 MHz execution rate from a 16 MIPS core clock. The combination of small Flash/RAM footprints and a strong peripheral set makes the family suited for tightly-constrained sensing nodes.
Typical applications include battery-powered sensor nodes, wearable health monitors, remote controls, low-power wireless sensor platforms, energy harvesting devices, capacitive touch user interfaces and industrial data loggers. The extended temperature grade also allows deployment in outdoor metering and automotive cabin electronics.
When designing with the -E/SO variant, evaluate the active versus sleep current budget early - XLP gains are only realized if the firmware stays in deep sleep for the majority of the duty cycle. Place a 0.1 uF decoupling capacitor on every VDD/VSS pair and keep the analog reference traces short if the ADC is used.
This page synthesizes distributor stock status, parametric drop-in alternatives and practical design notes that are not aggregated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24F08KA102-E/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24F08KA102-E/SO (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, I/O Pins, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24F08KA101-I/P
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.45 / unité
Voir la fiche technique →PIC24F08KA101-E/P
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.74 / unité
Voir la fiche technique →PIC24F04KA201-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.78 / unité
Voir la fiche technique →PIC24F04KA200T-I/ST
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.99 / unité
Voir la fiche technique →PIC24F04KL101-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.05 / unité
Voir la fiche technique →PIC24F08KA102-E/SO Valeurs maximales et caractéristiques électriques
| Series | PIC® XLP™ 24F |
| Core | 16-bit dsPIC30/PIC24 modified Harvard |
| Core Size | 16-Bit |
| Program Memory Type | FLASH |
| Program Memory Size | 8 KB (2.75K x 24 words) |
| RAM Size | 1.5 KB (1.5K x 8) |
| EEPROM Size | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Number of I/O Pins | 18 |
| ADC | 9-channel, 10-bit |
| Oscillator Type | Internal (with external and 32 kHz LP support) |
| Plage de température de fonctionnement | -40 C to +125 C (Extended, -E grade) |
| Boîtier / Format | 28-SOIC (SO) |
| Type de montage | Surface Mount |
| Packaging | Tube |
| Statut RoHS | Compliant |
| Connectivity | UART, SPI, I2C |
Configuration des broches de PIC24F08KA102-E/SO
| Broche 1 | MCLR — Master clear (reset) input; active low |
| Broche 2 | RA0 — I/O / analog input |
| Broche 3 | RA1 — I/O / analog input |
| Broche 4 | RB0 — I/O / programming |
| Broche 5 | RB1 — I/O |
| Broche 6 | RB2 — I/O |
| Broche 7 | RB3 — I/O |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1 — Crystal oscillator input |
| Broche 10 | OSC2 — Crystal oscillator output |
| Broche 11 | RB4 — I/O |
| Broche 12 | RB5 — I/O |
| Broche 13 | VDD — Positive supply |
| Broche 14 | RB6 — I/O / ICSPCLK |
| Broche 15 | RB7 — I/O / ICSPDAT |
| Broche 16 | RA2 — I/O / analog input |
| Broche 17 | RA3 — I/O / analog input |
| Broche 18 | RA4 — I/O / analog input |
| Broche 19 | VSS — Ground reference |
| Broche 20 | RA5 — I/O / analog input |
| Broche 21 | RB8 — I/O |
| Broche 22 | RB9 — I/O |
| Broche 23 | RB10 — I/O |
| Broche 24 | RB11 — I/O |
| Broche 25 | RB12 — I/O |
| Broche 26 | RB13 — I/O |
| Broche 27 | RB14 — I/O |
| Broche 28 | VDD — Positive supply |
Applications typiques
PIC24F08KA102-E/SO convient pour 6 applications: Battery-Powered Sensor Node, Wearable Health Monitor, Capacitive Touch User Interface, Industrial Data Logger, Remote Control / HMI Front-End, Energy-Harvesting Endpoint.
Battery-Powered Sensor Node
The PIC24F08KA102-E/SO's nanoWatt XLP technology with deep-sleep BOR, deep-sleep WDT and RTCC operation delivers nanoampere-level sleep currents, making it ideal for wireless sensor nodes that wake briefly to sample and transmit before re-entering deep sleep. With 8 KB Flash and 1.5 KB RAM the device accommodates sensor drivers, MAC-stack fragments and a small application protocol stack. The 1.8-3.6 V supply range supports direct connection to 2x alkaline or single-cell Li-Ion batteries without external regulation, removing a buck-boost stage from the BOM and shrinking the PCB footprint.
Recommandé
Wearable Health Monitor
Wearable devices demand long battery life in a small surface-mount form factor. The PIC24F08KA102-E/SO combines 16 MIPS performance for sensor fusion with deep-sleep currents that allow weeks of standby on a small coin cell. The 9-channel 10-bit ADC handles multiple biosensor inputs (pulse oximetry, body temperature, motion via external accelerometer), while the integrated RTCC keeps wall-clock time across sleep cycles. The 28-SOIC package is large for the tightest wrist-form-factor designs but is well suited to chest-strap and patch wearables.
Recommandé
Capacitive Touch User Interface
The PIC24F08KA102 family integrates the Charge Time Measurement Unit (CTMU) and Interrupt-on-Change (IOC) peripherals that enable robust capacitive touch sensing without external touch ICs. Up to 9 ADC channels provide a generous touch-pad capacity, while the 16-bit MIPS core handles debouncing, gesture detection and backlight control. Pairing the MCU with Microchip's mTouch reference firmware shortens development. Low power consumption makes the device suitable for battery-powered touch remotes and appliance control panels.
Recommandé
Industrial Data Logger
The 32 MHz 16-bit core, 512-byte EEPROM and 1.5 KB RAM make the PIC24F08KA102-E/SO well suited to compact industrial data loggers that periodically sample and store sensor readings. The wide 1.8-3.6 V supply range supports 3.3 V industrial sensor rails, and the -40 C to +125 C extended temperature grade tolerates outdoor and cabinet-mounted environments. The on-chip RTCC provides time-stamped events without an external RTC chip, reducing BOM cost and PCB area for sealed environmental loggers.
Recommandé
Remote Control / HMI Front-End
Consumer remote controls and small HMI front-ends benefit from the PIC24F08KA102's combination of UART, SPI and I2C interfaces, IOC wake-up on user input, and XLP deep sleep that keeps quiescent current in the nanoampere range. The 18 GPIO easily accommodates an IR LED driver, key matrix scan, status LED PWM and a serial link to a host. Industrial temperature grade adds reliability in cabinet-mounted and outdoor applications such as garage-door keypads and motorized blinds.
Recommandé
Energy-Harvesting Endpoint
Energy-harvesting IoT endpoints must spend the overwhelming majority of time in deep sleep and wake only on harvested energy or rare events. The PIC24F08KA102's deep-sleep currents in the nanoampere range and on-chip RTCC make it an ideal MCU for solar, thermal or vibration harvesters that pulse a sensor reading into non-volatile memory. The 28-SOIC industrial package and 1.8-3.6 V input range allow direct attachment to low-voltage energy-harvester outputs without regulation, and the 16 MIPS core handles occasional over-the-air firmware updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24F08KA102-E/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24F08KA101-I/P | PIC24F08KA101-E/P | PIC24F04KA201-I/SO | PIC24F04KL101-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC (SO) | 28-PDIP (P) - through-hole | 28-PDIP (P) - through-hole | 28-SOIC (SO) - same | 28-SOIC (SO) - same |
| Program Memory | 8 KB Flash | 8 KB Flash | 8 KB Flash | 4 KB Flash (-50%) | 4 KB Flash (-50%) |
| RAM | 1.5 KB | 1.5 KB | 1.5 KB | 512 B (-66%) | 1 KB (-33%) |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (E) | Industrial -40C to +85C (I) | Extended -40C to +125C (E) | Industrial -40C to +85C (I) | Industrial -40C to +85C (I) |
| Low-Power Technology | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP |
Principaux différenciateurs
- Extended temperature grade in SOIC-28 packaging (vs PIC24F08KA101-I/P)
- Higher Flash and RAM for richer firmware (vs PIC24F04KA201-I/SO)
- Same 28-SOIC footprint for direct PCB drop-in (vs PIC24F08KA101-I/P)
Notes de conception
XLP gains are only realized if the firmware spends the majority of the duty cycle in deep sleep. Use the Sleep instruction immediately after configuring peripherals, enable deep-sleep BOR and WDT only when needed, and gate clocks to unused peripherals via the PMDx registers. Reference Microchip application note AN1267 'nanoWatt XLP Technology' for typical current consumption numbers at 1.8 V and 3.3 V.
Place a 0.1 uF ceramic decoupling capacitor within 5 mm of every VDD/VSS pair; pins 13/28 share VDD and pins 8/19 share VSS on the 28-SOIC package. A single 10 uF bulk capacitor at the board supply input stabilizes load steps during radio transmission. Keep analog reference traces (AVDD if exposed) and the ADC input traces short to minimize pickup.
Do not assume the internal 8 MHz oscillator is accurate enough for UART or USB timing - configure the OSCTUN register and use the PLL only if the application needs precise baud rates. The MCLR pin must be pulled high through a resistor for normal operation; a floating MCLR causes erratic reset behavior. When migrating from PIC24F08KA102 to PIC24F04KA201-I/SO, re-check the linker script and verify that reduced Flash/RAM does not exceed the application's stack and constant footprint.
Informations de conformité
RoHS-compliant, lead-free, halogen-free per manufacturer product page. Not AEC-Q100 qualified - this is a commercial/industrial-grade MCU, not an automotive-qualified part.
