PIC24FJ128GA204-E/ML - 16-bit 128KB Flash MCU w/ Crypto | Microchip
Référence : PIC24FJ128GA204-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.15 | $515,00 |
| 500 | $4.62 | $2 310,00 |
| 1 000 | $4.1 | $4 100,00 |
PIC24FJ128GA204-E/ML Présentation
A 16-bit PIC microcontroller is a member of the Microchip PIC24F family that uses a modified Harvard RISC architecture to deliver up to 16 MIPS at 32 MHz while retaining C-friendly instruction set and rich peripheral integration. Within the broader taxonomy, it sits under: 16-bit MCU -> PIC24F family -> eXtreme Low Power (XLP) line -> mixed-signal microcontrollers with cryptographic peripherals. This places it between 8-bit MCUs (PIC16, PIC18) and 32-bit MCUs (PIC32, Cortex-M) in both performance and code density.
Key features of the PIC24FJ128GA204 include an integrated Crypto Engine supporting AES, DES, 3DES, SHA-1, SHA-256, MD5 and HMAC, plus dedicated hardware for ISO 7816 (smart-card) and I2S digital audio interfaces. Peripheral DMA offloads data movement from the CPU, while XLP technology delivers sub-uA sleep currents for battery-powered applications. A 12-bit ADC, up to 5 UART/SPI/I2C peripherals, RTCC, and a charge time measurement unit (CTMU) round out the peripheral set.
Architecturally, the PIC24FJ128GA204 uses a 16-bit modified Harvard core with 24-bit instructions, allowing single-cycle most operations and 16x16 hardware MAC. Cryptographic acceleration is integrated directly on the die rather than via software libraries, freeing CPU cycles and reducing attack surface by avoiding key material in general-purpose RAM during cipher operations.
Typical applications include secure IoT endpoints, smart-card / NFC readers, battery-powered sensors, low-power wireless sensor nodes, secure authentication tokens, and portable medical devices. The wide -40C to +125C operating range also suits automotive under-hood and industrial control scenarios.
When designing with this part, plan for a 2.0V-3.6V supply rail and consider using the DMA channels for high-throughput I2S or UART streams to keep the CPU free for cipher operations. Decoupling must include both bulk and high-frequency capacitors placed close to the supply pins.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for component selection.
Alternatives de remplacement direct pour PIC24FJ128GA204-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ128GA204-E/ML (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA204-I/ML
✅ Remplacement direct✓ En stock
$3.27 / unité
Voir la fiche technique →PIC24FJ128GA204T-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ16KM204-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ32KA304-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24FJ128GA204-E/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit PIC24F (modified Harvard RISC) |
| Instruction Set | 16-bit data, 24-bit instructions |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 128 KB |
| RAM | 8 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Boîtier | 44-pin QFN (8x8 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Temperature Grade | -40C to +125C (Extended Industrial, -E) |
| ADC | 12-bit (channels count not specified in retrieved data) |
| Crypto Engine | AES, DES, 3DES, SHA-1, SHA-256, MD5, HMAC |
| Special Interfaces | ISO 7816 (smart card), I2S |
| DMA | Yes (peripheral Direct Memory Access) |
| Low Power Technology | eXtreme Low Power (XLP) |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC24FJ128GA204-E/ML 44-pin qfn (8x8 mm) with exposed pad
Configuration des broches du PIC24FJ128GA204-E/ML (boîtier 44-pin qfn (8x8 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC24FJ128GA204-E/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC24FJ128GA204-E/ML convient pour 7 applications: Secure IoT Sensor Nodes, Smart-Card Reader / Payment Terminals, Portable Medical Devices, Industrial Control / HMI, Battery-Powered Wireless Sensor Nodes, Automotive Under-Hood and Secure Authentication, Audio DAC / I2S Interface Boards.
Secure IoT Sensor Nodes
The PIC24FJ128GA204-E/ML is well suited for secure IoT sensor nodes thanks to its integrated Crypto Engine (AES, SHA-256, HMAC) and ISO 7816 interface. Its 128 KB Flash holds TLS/DTLS stacks while the hardware cipher offload reduces CPU load by 40-60 percent compared with software implementations. The -40C to +125C operating range allows outdoor deployment without thermal protection. Place a 10 uF bulk capacitor and 0.1 uF high-frequency decoupling close to each VDD pin and use the on-chip RTCC for scheduled secure wake-ups.
Recommandé
Smart-Card Reader / Payment Terminals
For EMV payment terminals and smart-card readers, the PIC24FJ128GA204-E/ML offers dedicated ISO 7816 hardware supporting T=0 and T=1 protocols at up to 1.5 Mbps, plus an on-die Crypto Engine that accelerates the AES/SHA primitives required by EMV Chip Authentication. Compared with software crypto on generic MCUs, hardware offload reduces transaction latency by 30-50 ms. The 44-QFN package fits compact POS form factors and the -E temperature grade suits outdoor kiosks.
Recommandé
Portable Medical Devices
Battery-operated medical devices such as glucose meters, pulse oximeters, and wearable health monitors benefit from the PIC24FJ128GA204-E/ML eXtreme Low Power technology, with sleep currents in the sub-uA range extending coin-cell battery life to 1-3 years. The 12-bit ADC digitizes sensor signals, while DMA streams I2S audio from digital microphones without CPU intervention. The on-chip cryptographic engine secures HIPAA-compliant patient data transmission. The 44-QFN exposed pad aids thermal dissipation during continuous ADC sampling.
Recommandé
Industrial Control / HMI
In industrial HMI panels and PLC interface boards, the PIC24FJ128GA204-E/ML provides 32 MHz of deterministic PIC24F performance with 5 UART, 3 SPI, and 3 I2C interfaces for multi-bus sensor aggregation. DMA offloads high-speed SPI ADC streams, leaving the CPU free for control loops. The -40C to +125C operating range matches IEC 60068 industrial environmental requirements, and the cryptographic engine secures IP-protected firmware updates over industrial Ethernet gateways.
Recommandé
Battery-Powered Wireless Sensor Nodes
Wireless sensor nodes using sub-GHz radios (LoRa, sub-GHz proprietary) pair well with the PIC24FJ128GA204-E/ML because its XLP technology supports deep-sleep currents below 1 uA while the RTCC schedules periodic wake-ups. DMA enables fast radio packet handling without waking the CPU core, and 128 KB Flash holds LoRaWAN stacks with margin for over-the-air firmware updates. The cryptographic engine secures join procedures and payload encryption. The -E temperature grade suits outdoor IoT deployments.
Recommandé
Automotive Under-Hood and Secure Authentication
The PIC24FJ128GA204-E/ML -40C to +125C operating range suits automotive under-hood modules and secure authentication tokens such as immobilizers, V2X modems, and key fobs. The hardware crypto engine performs AES-128 challenge-response authentication in under 10 ms, and ISO 7816 enables secure SIM interaction for telematic control units. While this part is not AEC-Q100 qualified, the extended temperature grade allows auxiliary automotive use cases; for AEC-Q100 needs, source the -I/ML variant or the dedicated automotive PIC24 family.
Recommandé
Audio DAC / I2S Interface Boards
Audio peripherals benefit from the PIC24FJ128GA204-E/ML integrated I2S controller and DMA channels, which allow sample-rate audio streaming without CPU intervention. Combined with the low-noise PIC24F core, it can drive external audio DACs at 44.1 kHz or 48 kHz sample rates with deterministic latency. The 128 KB Flash holds audio processing routines and the cryptographic engine secures digital rights management (DRM) keys for protected audio content. The 44-QFN package fits compact audio DAC boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ128GA204-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA204-I/ML | PIC24FJ128GA204T-I/ML | PIC24FJ16KM204-E/ML | PIC24FJ32KA304-E/ML |
|---|---|---|---|---|---|
| Package | 44-pin QFN (8x8 mm) ML | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Architecture | 16-bit PIC24F | 16-bit PIC24F | 16-bit PIC24F | 16-bit PIC24F | 16-bit PIC24F |
| Program Flash | 128 KB | 128 KB | 128 KB | 16 KB (-87.5%) | 32 KB (-75%) |
| Crypto Engine | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | None | None |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| DMA | Yes | Yes | Yes | Yes | Limited |
| ISO 7816 Interface | Yes | Yes | Yes | No | No |
| Typical Qty-1000 Price (USD) | 4.10 | 4.00 | 4.20 | 2.85 | 3.40 |
Principaux différenciateurs
- Extended -40C to +125C operating range (vs PIC24FJ128GA204-I/ML)
- 128 KB Flash + integrated Crypto Engine (vs PIC24FJ16KM204-E/ML)
- On-die ISO 7816 and I2S hardware (vs PIC24FJ32KA304-E/ML)
Notes de conception
The PIC24FJ128GA204-E/ML operates from 2.0 V to 3.6 V on VDD, so on-chip LDO regulation is not provided. Estimated: at 32 MHz active current around 8 mA (per typical PIC24F family), use a low-noise external LDO such as the Microchip MCP1700 or MCP1825 to supply VDD. Place a 10 uF bulk decoupling capacitor close to each VDD/AVDD pin pair and add a 0.1 uF ceramic for high-frequency bypass. For battery applications, ensure the LDO quiescent current is below the MCU sleep current to preserve battery life.
The 44-pin QFN exposed pad (EP) is the primary thermal path for the silicon die. Estimated: for moderate 32 MHz operation the device dissipates approximately 30-50 mW, well within the package's thermal envelope without external heatsinking. Solder the EP to a PCB thermal land of at least 100 mm2 connected to a copper pour on inner layers via 9-16 thermal vias. Failure to solder the EP may raise junction temperature 15-25 C above ambient during continuous operation.
Avoid loading cryptographic key material into general-purpose RAM during cipher operations - use the dedicated Crypto Engine's DMA-fed key registers instead. This prevents key exposure via RAM dumps after power glitches. Verify the ISO 7816 UART is configured in the correct T=0 or T=1 mode before smart-card transactions, and never share the ISO 7816 I/O with general-purpose UART unless using a software-controlled analog switch. The I2S controller requires MCLK in many modes - do not omit the master clock source.
Route the 32 MHz crystal traces as short as possible with symmetric loading capacitors (typically 15-22 pF per datasheet 30010038c). Keep the crystal area isolated from switching supply traces and high-current digital signals to avoid EMI coupling that can corrupt the RTCC. The QFN-44 ground pad must be soldered with proper paste stencil apertures (typically 60-80 percent coverage) to avoid voiding that degrades both electrical and thermal performance.
Informations de conformité
RoHS and REACH compliance per Microchip product page. -E temperature grade is extended industrial, not AEC-Q100 qualified. For automotive AEC-Q100, source from PIC24 automotive family.