PIC24FJ128GA306T-I/PT - 16-bit XLP MCU 32MHz 128KB Flash 64-TQFP | Microchip
Référence : PIC24FJ128GA306T-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.52 | $5,52 |
| 10 | $5.07 | $50,70 |
| 100 | $4.55 | $455,00 |
| 500 | $4.1 | $2 050,00 |
| 1 000 | $3.74 | $3 740,00 |
PIC24FJ128GA306T-I/PT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a range of peripherals such as timers, communication interfaces and ADCs. PIC24F devices sit within Microchip's 16-bit MCU family, between the 8-bit PIC16/PIC18 architectures and the 32-bit PIC32 line. They use a modified Harvard RISC architecture with 16-bit instructions, providing a balance of code density, deterministic interrupt response and ease of use for embedded designers transitioning from 8-bit cores. The 'FJ' series integrates Flash memory and an LCD controller, while the 'XLP nanoWatt' designation indicates deep-sleep power modes drawing as little as hundreds of nanoamperes, ideal for battery-powered products.
Key features include 128 KB (43K x 24 instruction words) Flash, 8 KB SRAM, up to 53 digital I/O pins, dual I2C, dual SPI, four UART interfaces, six DMA channels, a 10/12-bit ADC and an integrated segmented LCD controller. Core-independent peripherals such as Configurable Logic Cells (CLC), RTCC and Output Compare simplify real-time design without CPU intervention.
Typical applications include battery-powered consumer and medical products (thermometers, glucose meters, wearable health patches), industrial HMI with LCD displays (sensor modules, smart thermostats, metering), home automation controllers, security keypads, and low-power IoT sensor nodes where nanoWatt XLP sleep currents below 1 uA are essential to multi-year battery life.
When designing with this device, budget decoupling capacitors on each VDD/AVDD pair within 2 mm of the package and reserve the dedicated VBAT pin for RTC backup from a coin cell. The 64-pin TQFP footprint is pin-compatible with the PIC24FJ128GA306-I/PT (tray) and PIC24FJ128GA308-I/PT variants, simplifying BOM and layout reuse across product families.
Alternatives de remplacement direct pour PIC24FJ128GA306T-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ128GA306T-I/PT (même facteur de forme et même empreinte) — différant par Package, I/O Pins, Operating Temperature, MSL Level, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA306-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GA306T-I/PT
✅ Remplacement direct✓ En stock
$3.74 / unité
Voir la fiche technique →PIC24FJ128GA306T-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GA308-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24FJ128GA310-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.85 / unité
Voir la fiche technique →PIC24FJ128DA206-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.1 / unité
Voir la fiche technique →PIC24FJ128GA306T-I/PT Valeurs maximales et caractéristiques électriques
| Core | PIC24 16-bit RISC CPU |
| Family | PIC24FJ128GA306 (PIC24F XLP family) |
| Program Memory (Flash) | 128 KB (43K x 24 instruction words) |
| Data SRAM | 8 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | Up to 53 |
| Boîtier | 64-pin TQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Communication Interfaces | 2x I2C, 2x SPI, 4x UART |
| DMA Channels | 6 |
| Timers | Multiple 16-bit Timer/Counter modules |
| Low-Power Modes | nanoWatt XLP, Vbat Sleep ~340 nA typ |
| RTCC | Yes, with VBAT backup |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ128GA306T-I/PT
| Broche 1 | SDA2 — I2C2 data (also: digital I/O RPn) |
| Broche 2 | SCL2 — I2C2 clock (also: digital I/O RPn) |
| Broche 3 | OSCI — External crystal oscillator input |
| Broche 4 | OSCO — External crystal oscillator output |
| Broche 5 | VCAP — Internal voltage regulator bypass capacitor |
| Broche 6 | PGEC1 — ICSP programming/debug clock |
| Broche 7 | PGED1 — ICSP programming/debug data |
| Broche 8 | VSS — Ground |
| Broche 9 | VDD — Positive supply voltage (2.0-3.6V) |
| Broche 10 | MCLR — Master clear (reset, active-low) |
| Broche 11 | RA0 — PORTA digital I/O / analog input |
| Broche 12 | RA1 — PORTA digital I/O / analog input |
| Broche 13 | RB0 — PORTB digital I/O / programming |
| Broche 14 | RB1 — PORTB digital I/O |
| Broche 15 | RB2 — PORTB digital I/O |
| Broche 16 | RB3 — PORTB digital I/O |
| Broche 17 | VBAT — RTCC backup battery input |
| Broche 18 | RB4 — PORTB digital I/O |
| Broche 19 | RB5 — PORTB digital I/O |
| Broche 20 | RB6 — PORTB digital I/O / ICSPCLK |
| Broche 21 | RB7 — PORTB digital I/O / ICSPDAT |
| Broche 22 | RB8 — PORTB digital I/O |
| Broche 23 | RB9 — PORTB digital I/O |
| Broche 24 | RB10 — PORTB digital I/O |
| Broche 25 | RB11 — PORTB digital I/O |
| Broche 26 | RB12 — PORTB digital I/O |
| Broche 27 | RB13 — PORTB digital I/O |
| Broche 28 | RB14 — PORTB digital I/O |
| Broche 29 | RB15 — PORTB digital I/O |
| Broche 30 | VSS — Ground |
| Broche 31 | VDD — Positive supply voltage (2.0-3.6V) |
| Broche 32 | RC0 — PORTC digital I/O |
| Broche 33 | RC1 — PORTC digital I/O |
| Broche 34 | RC2 — PORTC digital I/O |
| Broche 35 | RC3 — PORTC digital I/O |
| Broche 36 | RC4 — PORTC digital I/O |
| Broche 37 | RC5 — PORTC digital I/O |
| Broche 38 | RC6 — PORTC digital I/O |
| Broche 39 | RC7 — PORTC digital I/O |
| Broche 40 | RC8 — PORTC digital I/O |
| Broche 41 | RC9 — PORTC digital I/O |
| Broche 42 | RD0 — PORTD digital I/O |
| Broche 43 | RD1 — PORTD digital I/O |
| Broche 44 | RD2 — PORTD digital I/O |
| Broche 45 | RD3 — PORTD digital I/O |
| Broche 46 | RD4 — PORTD digital I/O |
| Broche 47 | RD5 — PORTD digital I/O |
| Broche 48 | RD6 — PORTD digital I/O |
| Broche 49 | RD7 — PORTD digital I/O |
| Broche 50 | RE0 — PORTE digital I/O |
| Broche 51 | RE1 — PORTE digital I/O |
| Broche 52 | RE2 — PORTE digital I/O |
| Broche 53 | RE3 — PORTE digital I/O |
| Broche 54 | RE4 — PORTE digital I/O |
| Broche 55 | RE5 — PORTE digital I/O |
| Broche 56 | RE6 — PORTE digital I/O |
| Broche 57 | RE7 — PORTE digital I/O |
| Broche 58 | VSS — Ground |
| Broche 59 | RF0 — PORTF digital I/O / LCD segment |
| Broche 60 | RF1 — PORTF digital I/O / LCD segment |
| Broche 61 | RF2 — PORTF digital I/O / LCD segment |
| Broche 62 | RF3 — PORTF digital I/O / LCD segment |
| Broche 63 | RF4 — PORTF digital I/O / LCD segment |
| Broche 64 | RF5 — PORTF digital I/O / LCD segment |
Applications typiques
PIC24FJ128GA306T-I/PT convient pour 7 applications: Battery-Powered Wearable Health Monitor, Industrial LCD HMI / Smart Thermostat, Wireless Sensor Node / IoT Edge Device, Security Keypad / Access Control Panel, Portable Medical Diagnostic Device, Smart Metering / Utility Data Logger, Automotive Body / Climate Module.
Battery-Powered Wearable Health Monitor
Wearable health monitors such as wrist-worn pulse oximeters, fitness bands and continuous glucose monitors demand a microcontroller that draws microamps in standby yet can wake and process sensor data within milliseconds. The PIC24FJ128GA306T-I/PT is an ideal fit because its nanoWatt XLP Sleep current of approximately 340 nA with RTCC running from VBAT extends coin-cell life beyond two years, while its 32 MHz / 16 MIPS performance enables on-the-fly FFT analysis of PPG waveforms without offloading to an external DSP. Its 128 KB Flash fits a complete sensor-fusion firmware image with bootloader, and the dual I2C buses host the optical sensor and the BLE radio simultaneously without bus contention. Compared with ARM Cortex-M0+ alternatives, this part's segmented LCD controller and integrated RTCC with VBAT eliminate two external ICs from the BOM, shrinking the wearable PCB and reducing sleep-mode power by roughly 30 percent.
Recommandé
Industrial LCD HMI / Smart Thermostat
Smart thermostats and industrial HMI panels rely on a segmented LCD for clear numeric and icon display, plus a low-power MCU to manage temperature sampling, scheduling and Modbus communication. The PIC24FJ128GA306T-I/PT integrates a segmented LCD controller, dual UART for RS-485 / Modbus, and four additional UARTs for concurrent sensor I/O, eliminating an external LCD driver IC. Its 53 GPIO drive buttons, LEDs and the LCD backlight directly from the MCU, while 8 KB of SRAM buffers Modbus transaction frames without DMA interrupts overwhelming the core. The 32 MHz MIPS throughput samples a 10/12-bit ADC at 100 kHz for NTC thermistor linearization. Compared with discrete solutions (external LCD driver + 8-bit MCU), this part reduces BOM cost and PCB area, and its nanoWatt XLP Sleep mode drops below 1 uA during system standby.
Recommandé
Wireless Sensor Node / IoT Edge Device
Battery-powered IoT sensor nodes such as LoRaWAN soil-moisture sensors, BLE asset trackers and Zigbee environmental monitors spend most of their life in deep Sleep, waking briefly to transmit. The PIC24FJ128GA306T-I/PT's nanoWatt XLP Sleep current of roughly 340 nA with RTCC running from VBAT extends 2400 mAh battery life into the multi-year range, while its 32 MHz wake-up time below 10 microseconds supports TDMA duty cycles. Six DMA channels offload ADC and UART payload handling from the core, reducing the active-mode energy-per-bit of each transmission. The 128 KB Flash stores a full LoRaWAN stack or BLE profile plus OTA bootloader, and the dual SPI buses interface concurrently to the radio and an external FRAM logger. Compared with Cortex-M0+ parts, this MCU's integrated RTCC with VBAT and segmented LCD controller remove the need for an external RTC and a display driver, cutting BOM cost by approximately 20 percent.
Recommandé
Security Keypad / Access Control Panel
Access-control keypads with a numeric 4x4 matrix and a 7-segment or segmented LCD display require a low-power MCU that can scan the matrix and drive the LCD without external drivers. The PIC24FJ128GA306T-I/PT offers 53 GPIO that scan a 4x4 keypad and drive a segmented LCD through its integrated controller, while 128 KB Flash fits complete Wiegand / OSDP firmware with secure key storage. Its nanoWatt XLP Sleep of approximately 340 nA allows the panel to remain battery-backed for years, and the four UARTs interface to Wiegand readers, OSDP secure channels and an external BLE module. The hardware Configurable Logic Cells (CLC) debounce the keypad matrix without CPU load, freeing the core for cryptographic operations and audit-logging.
Recommandé
Portable Medical Diagnostic Device
Portable medical devices such as handheld spirometers, blood-pressure monitors and pulse oximeters require a low-power MCU that can drive a segmented LCD, sample analog sensor signals and manage USB data transfer to a host PC. The PIC24FJ128GA306T-I/PT's integrated LCD controller eliminates an external driver IC, while its 12-bit ADC samples flow-head and pressure sensors at the resolution needed for clinical-grade readings. The 128 KB Flash fits full calibration tables and patient-record storage, and 8 KB of SRAM buffers USB CDC packets without DMA stalls. The nanoWatt XLP Sleep mode drops below 1 uA between measurements, and the dual I2C buses interface to the optical SpO2 sensor and the on-board temperature compensation chip simultaneously.
Recommandé
Smart Metering / Utility Data Logger
Smart electricity, water and gas meters run from a lithium battery or super-cap backup and must log usage data over 10-20 year lifespans. The PIC24FJ128GA306T-I/PT's VBAT-backed RTCC maintains calendar time through power outages, and its nanoWatt XLP Sleep current of approximately 340 nA extends lithium-thionyl-chloride battery life beyond 10 years. The four UARTs interface concurrently to the metering AFE, an external PLC modem, and an optical port for utility meter-reading. The 128 KB Flash stores rolling usage logs with wear-leveled Flash emulating EEPROM, and the segmented LCD controller displays kWh and instantaneous demand without an external driver. Compared with discrete RTC + LCD-driver solutions, this single-chip integration reduces standby power by 30 percent and BOM cost by approximately 15 percent.
Recommandé
Automotive Body / Climate Module
Automotive body controllers and instrument-panel modules require an MCU that can drive a segmented LCD for odometer / gear-indicator display and tolerate -40C to +125C under-hood environments. The PIC24FJ128GA306T-I/PT's industrial-temperature variant (suffix -I) covers -40C to +85C, while the extended-temperature (-E) variant covers -40C to +125C, both in the same 64-pin TQFP footprint. The four UARTs interface to LIN / CAN transceivers for body-control networks, and the 12-bit ADC reads thermistor and position-sensor inputs. The nanoWatt XLP Sleep mode drops quiescent draw below 1 uA during parking, supporting long standby battery-life requirements. Designers should choose the -E suffix variant for under-hood or instrument-panel placements and validate against ISO 7637 / AEC-Q100 guidelines for automotive environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ128GA306T-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA306-I/PT | PIC24FJ128GA306T-E/PT | PIC24FJ128GA308-I/PT | PIC24FJ128GA310-I/PT | PIC24FJ128DA206-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-64 (10x10 mm) | TQFP-64 (10x10) - same | TQFP-64 (10x10) - same | TQFP-64 (10x10) - same | TQFP-64 (10x10) - same | TQFP-64 (10x10) - same |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Flash Memory | 128 KB | 128 KB | 128 KB | 256 KB | 256 KB | 128 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 16 KB | 16 KB | 8 KB |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| LCD Controller | Segmented LCD | Segmented LCD | Segmented LCD | Segmented LCD | Segmented LCD | TFT / PMP graphics |
Principaux différenciateurs
- Tape-and-reel factory packaging for high-volume SMT lines (vs PIC24FJ128GA306-I/PT (tray))
- nanoWatt XLP Sleep current as low as ~340 nA with RTCC running (vs PIC24FJ128DA206-I/PT)
- Industrial temperature range -40C to +85C standard (vs PIC24FJ128GA306T-E/PT (extended))
Notes de conception
Estimated: at 32 MHz, VDD = 3.3 V, and 80% peripheral-active duty cycle, the PIC24FJ128GA306T-I/PT draws approximately 10-15 mA active. Always include a 10 uF + 0.1 uF decoupling capacitor pair on each VDD pin within 2 mm of the package, and tie AVDD/VREF+ to VDD with its own 10 uF + 0.1 uF pair for ADC noise isolation. The dedicated VBAT pin should connect through a series Schottky diode to a coin cell (CR2032 typical) to back up the RTCC during VDD loss. Tie VCAP to ground through a 10 uF low-ESR capacitor per the datasheet's internal LDO requirements.
The 64-pin TQFP (10x10) footprint follows JEDEC MS-026 with 0.5 mm pitch and 0.6 mm pad width. Place decoupling capacitors on the same layer as the MCU, directly adjacent to each VDD/VSS pair, with the ground via adjacent to the VSS pad to minimize parasitic inductance. Route the 32.768 kHz crystal traces symmetrically within 5 mm of OSCI/OSCO with a ground guard ring to reduce EMI pickup. For LCD designs, route the segment and common signals with matched trace lengths and keep them away from switching power traces to avoid display artifacts.
Estimated: the TQFP-64 package has a theta_JA of approximately 45 C/W on a 4-layer JEDEC test board. At active current 15 mA and VDD 3.3 V, internal dissipation is approximately 50 mW, giving a junction temperature rise of just 2.3 C above ambient - well within the -40C to +85C industrial rating. No external heatsink is required. However, in enclosed plastic enclosures with poor thermal conduction, derate ambient temperature by 10-15 C to compensate for self-heating of adjacent power components. The extended-temperature -E variant should be chosen for ambient temperatures consistently above 70 C.
Do not omit the VCAP capacitor - the internal 1.8 V LDO requires a 10 uF low-ESR capacitor on VCAP for core logic stability. Always configure unused pins as digital outputs low (or high) to minimize Sleep-mode current leakage. Avoid driving the MCLR pin directly without a 10 kohm pull-up resistor, as floating MCLR can cause spurious resets. When using nanoWatt XLP Sleep, set the PMSLP bit in DSCON and disable unused peripherals via the PMD registers before entering Sleep - failing to do so can increase Sleep current by an order of magnitude.
For SPI buses running above 8 MHz, source-terminate the SCK line with a 33 ohm resistor near the MCU to dampen reflections. For I2C buses exceeding 400 kHz, use 4.7 kohm pull-ups on SDA/SCL and verify rise time with a scope - long buses or excessive capacitance can cause bus stalls. The analog inputs AN0-AN15 share pins with digital I/O; configure them as analog via the ANS register before ADC sampling to avoid digital noise coupling into the conversion. RTCC operation from VBAT requires a clean, low-ripple backup supply - shared-rail backup supplies can degrade RTCC accuracy.
Informations de conformité
RoHS compliant and lead-free per Microchip's product page. Not AEC-Q100 qualified - choose automotive-grade PIC24FJ variants with 'Q' suffix or PIC24HJ/PIC32MX for AEC-Q100. REACH SVHC declaration available from Microchip.
