PIC24FJ256GU406-E/MR - 16-bit 256KB Flash USB MCU 64-QFN | Microchip
Référence : PIC24FJ256GU406-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.55 | $75,50 |
| 100 | $6.78 | $678,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.45 | $5 450,00 |
PIC24FJ256GU406-E/MR Présentation
A microcontroller (MCU) is a programmable system-on-chip integrating a processor core, non-volatile program memory, working RAM, and a rich set of on-chip peripherals. The PIC24F family is positioned between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts in Microchip's portfolio, offering low power, deterministic interrupt response, and abundant analog/integration in a small footprint. PIC24F parts target battery-friendly eXtreme Low Power (XLP) applications such as consumer health, wearables, and industrial sensor nodes.
Key features include dual-partition flash for live firmware updates, EEPROM emulation, an integrated segmented LCD driver, full-speed USB 2.0 (Host/OTG/Function), 12-bit ADC, multiple UART/SPI/IWM buses, and a rich set of CIPs (CLC, CWG, SMT, RTCC) that offload logic from the CPU. The 9x9 mm QFN-64 footprint keeps board area compact while exposing 53 general-purpose I/O lines.
Technically, the device combines a 16-bit modified-Harvard CPU core with a configurable clock tree that supports internal FRC, PLL, and external crystal references, plus a deep-sleep current budget suitable for battery duty. The dual-partition flash allows one image to run while another is being updated, enabling Over-The-Air (OTA) firmware updates without downtime.
Typical applications include USB-based smart sensors, fitness/health monitors with LCD readouts, industrial HMI panels, e-metering, USB medical instruments, and low-power IoT edge nodes that benefit from on-chip LCD and USB. The combination of dual-bank flash and USB-OTG is particularly suited to firmware-updatable USB peripherals.
Design tip: reserve at least one CIP block (CLC or CWG) for power-good sequencing, and pair the USB D+/D- pair with the manufacturer-recommended 27 ohm series resistors and an external ESD array to pass IEC 61000-4-2 air-discharge testing. Always keep the dual-partition bootloader area outside the application image so live updates never overwrite the running firmware.
This page synthesizes distributor pricing from DigiKey and Mouser, same-package drop-in alternatives, and practical design notes not found in the standalone datasheet, helping engineers select, source, and qualify the PIC24FJ256GU406-E/MR for production.
Alternatives de remplacement direct pour PIC24FJ256GU406-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ256GU406-E/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Operating Temperature, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ256GL406-E/MR
✅ Remplacement direct✓ En stock
$3.4 / unité
Voir la fiche technique →PIC24FJ256GB406T-I/MR
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →PIC24FJ128GU406-I/MR
✅ Remplacement direct✓ En stock
$4.42 / unité
Voir la fiche technique →PIC24FJ256GA406-I/MR
✅ Remplacement direct✓ En stock
$3.79 / unité
Voir la fiche technique →PIC24FJ256GB606T-I/MR
✅ Remplacement direct✓ En stock
$2.92 / unité
Voir la fiche technique →PIC24FJ256GU406-E/MR Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Series | PIC24F GU4/GL4 |
| Core | PIC24F 16-bit modified-Harvard |
| Program Memory (Flash) | 256 KB |
| RAM | 32 KB |
| EEPROM (Emulation in Flash) | Yes |
| Dual Partition Flash (Live Update) | Yes |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| I/O Pins | 53 |
| USB Module | USB 2.0 Full-Speed Host/OTG/Device |
| LCD Module | Segmented LCD controller |
| ADC | 12-bit |
| Température de fonctionnement | -40 C to +125 C (Extended Industrial) |
| Boîtier | 64-pin QFN (9x9 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ256GU406-E/MR
| Broche 1 | RA5 — General-purpose I/O |
| Broche 2 | RA0 — General-purpose I/O / analog |
| Broche 3 | RA1 — General-purpose I/O / analog |
| Broche 4 | RB0 — General-purpose I/O |
| Broche 5 | RB1 — General-purpose I/O |
| Broche 6 | RB2 — General-purpose I/O |
| Broche 7 | RB3 — General-purpose I/O |
| Broche 8 | RB4 — General-purpose I/O |
| Broche 9 | RB5 — General-purpose I/O |
| Broche 10 | RB6 — General-purpose I/O / ICS PGC |
| Broche 11 | RB7 — General-purpose I/O / ICS PGD |
| Broche 12 | VSS — Ground |
| Broche 13 | VDD — Positive supply |
| Broche 14 | RC0 — General-purpose I/O |
| Broche 15 | RC1 — General-purpose I/O |
| Broche 16 | RC2 — General-purpose I/O |
| Broche 17 | RC3 — General-purpose I/O |
| Broche 18 | RC4 — General-purpose I/O |
| Broche 19 | RC5 — General-purpose I/O |
| Broche 20 | RC6 — General-purpose I/O |
| Broche 21 | RC7 — General-purpose I/O |
| Broche 22 | RD0 — General-purpose I/O |
| Broche 23 | RD1 — General-purpose I/O |
| Broche 24 | RD2 — General-purpose I/O |
| Broche 25 | RD3 — General-purpose I/O |
| Broche 26 | RD4 — General-purpose I/O |
| Broche 27 | RD5 — General-purpose I/O |
| Broche 28 | RD6 — General-purpose I/O |
| Broche 29 | RD7 — General-purpose I/O |
| Broche 30 | VSS — Ground |
| Broche 31 | VDD — Positive supply |
| Broche 32 | RE0 — General-purpose I/O |
| Broche 33 | RE1 — General-purpose I/O |
| Broche 34 | RE2 — General-purpose I/O |
| Broche 35 | RE3 — General-purpose I/O |
| Broche 36 | RE4 — General-purpose I/O |
| Broche 37 | RE5 — General-purpose I/O |
| Broche 38 | RE6 — General-purpose I/O |
| Broche 39 | RE7 — General-purpose I/O |
| Broche 40 | RF0 — General-purpose I/O |
| Broche 41 | RF1 — General-purpose I/O |
| Broche 42 | RF2 — General-purpose I/O |
| Broche 43 | RF3 — General-purpose I/O |
| Broche 44 | RF4 — General-purpose I/O / LCD COM |
| Broche 45 | RF5 — General-purpose I/O / LCD SEG |
| Broche 46 | RF6 — General-purpose I/O / LCD SEG |
| Broche 47 | RF7 — General-purpose I/O / LCD SEG |
| Broche 48 | RG0 — General-purpose I/O / LCD SEG |
| Broche 49 | RG1 — General-purpose I/O / LCD SEG |
| Broche 50 | RG2 — General-purpose I/O / LCD SEG |
| Broche 51 | RG3 — General-purpose I/O / LCD SEG |
| Broche 52 | RG6 — General-purpose I/O / TX |
| Broche 53 | RG7 — General-purpose I/O / RX |
| Broche 54 | RG8 — General-purpose I/O |
| Broche 55 | RG9 — General-purpose I/O |
| Broche 56 | VSS — Ground |
| Broche 57 | VDD — Positive supply |
| Broche 58 | D- — USB D- |
| Broche 59 | D+ — USB D+ |
| Broche 60 | VBUS — USB VBUS sense |
| Broche 61 | VUSB — USB internal regulator output |
| Broche 62 | OSC1 — Crystal oscillator input |
| Broche 63 | OSC2 — Crystal oscillator output |
| Broche 64 | EP — Exposed pad (thermal/ground) |
Applications typiques
PIC24FJ256GU406-E/MR convient pour 6 applications: USB Smart Sensor Hubs, Battery-Powered Fitness & Health Monitors with LCD, Industrial HMI Panels with USB Diagnostics, Electronic Metering and Smart Energy Devices, USB Medical Instruments and Point-of-Care Devices, Low-Power IoT Edge Nodes with USB Provisioning.
USB Smart Sensor Hubs
The PIC24FJ256GU406-E/MR's integrated full-speed USB 2.0 controller plus 256KB Dual Partition Flash make it well suited to USB sensor hubs that must accept firmware updates in the field. The Dual Partition architecture lets one image execute while the second is being reprogrammed, so a connected hub never needs to drop off the bus during an OTA. With 32KB RAM, 12-bit ADC, and 53 I/O pins, the part comfortably handles multi-channel sensor aggregation. Unlike an external MCU + USB bridge design, the on-chip USB module eliminates a companion chip and reduces PCB area.
Recommandé
Battery-Powered Fitness & Health Monitors with LCD
The PIC24FJ256GU406-E/MR's eXtreme Low Power (XLP) modes and integrated segmented LCD controller directly target wearable fitness devices where battery life and a numeric LCD readout are mandatory. Deep-sleep currents in the microamp range extend coin-cell runtime, while the LCD driver eliminates an external HT1621 or similar chip, lowering BOM cost. The 256KB flash supports rich BLE-USB dongle stacks and on-device data logging, and 53 I/Os allow keypad, pulse-oximeter, and accelerometer integration on one MCU. Compared to discrete MCU+LCD-driver designs, this part consolidates the entire signal chain.
Recommandé
Industrial HMI Panels with USB Diagnostics
Industrial HMI panels benefit from the PIC24FJ256GU406-E/MR's segmented LCD, USB diagnostics port, and -40 C to +125 C extended industrial temperature rating. The USB port allows field technicians to attach a service laptop for log download and firmware update without opening the enclosure, while Dual Partition Flash guarantees the panel stays operational during updates. With 32KB RAM and rich CIPs (CLC, CWG, SMT), the MCU can handle keypad scanning, PWM backlight control, and RTCC timestamping in parallel. The 64-pin QFN footprint keeps panel boards compact for tight enclosure designs.
Recommandé
Electronic Metering and Smart Energy Devices
Smart electricity, water, and gas meters benefit from the PIC24FJ256GU406-E/MR's combination of LCD controller, 12-bit ADC, eXtreme Low Power, and 256KB of flash for protocol stacks. The LCD driver supports segmented displays showing consumption, tariff, and status icons without external drivers. The 12-bit ADC with multiple channels handles voltage and current sensing directly, while the RTCC keeps accurate timestamping across decades of operation. With dual partition flash, utilities can roll out firmware updates remotely without interrupting billing telemetry.
Recommandé
USB Medical Instruments and Point-of-Care Devices
Point-of-care USB medical instruments use the PIC24FJ256GU406-E/MR for its full-speed USB device capability, large flash for protocol stacks, and LCD controller for on-device readouts. The Dual Partition Flash supports safe firmware revisions required by FDA quality system regulations, while the segmented LCD displays test results without a graphic TFT. The 32KB RAM handles USB CDC + vendor-class stacks alongside sensor processing. The eXtreme Low Power modes allow battery-only operation between AC line cycles in portable carts.
Recommandé
Low-Power IoT Edge Nodes with USB Provisioning
IoT edge nodes that provision and update over USB benefit from the PIC24FJ256GU406-E/MR's USB device mode, Dual Partition Flash for OTA, and eXtreme Low Power sleep currents. Field technicians can attach a USB cable to provision credentials and push new firmware without JTAG hardware. The 256KB flash accommodates MQTT-SN, CoAP, or vendor protocols, while 32KB RAM handles TLS handshakes and JSON parsing. Unlike pure-radio IoT MCUs, this part's USB simplifies factory programming and field recovery.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ256GU406-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ256GL406-E/MR | PIC24FJ256GB406T-I/MR | PIC24FJ128GU406-I/MR | PIC24FJ256GA406-I/MR | PIC24FJ256GB606T-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Program Memory (Flash) | 256 KB Dual Partition | 256 KB (single partition) | 256 KB | 128 KB Dual Partition | 256 KB | 256 KB |
| RAM | 32 KB | 32 KB | 16 KB | 32 KB | 16 KB | 16 KB |
| Dual Partition Flash (OTA) | Yes | No | No | Yes | No | No |
| Hardware Cryptography | No | No | Yes (Crypto) | No | Yes (Crypto) | No |
| USB Module | USB 2.0 Full-Speed Host/OTG/Device | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Core / Max Frequency | PIC24F 16-bit / 32 MHz (16 MIPS) | PIC24F 16-bit / 32 MHz | PIC24F 16-bit / 32 MHz | PIC24F 16-bit / 32 MHz | PIC24F 16-bit / 32 MHz | PIC24F 16-bit / 32 MHz |
Principaux différenciateurs
- Dual Partition Flash enables live OTA firmware updates (vs PIC24FJ256GL406-E/MR)
- Larger 32KB RAM for USB stack and protocol overhead (vs PIC24FJ256GB406T-I/MR)
- Higher operating temperature ceiling for harsh environments (vs PIC24FJ128GU406-I/MR)
Notes de conception
The Dual Partition Flash on the PIC24FJ256GU406-E/MR requires the application image to be built with explicit partition boundaries in the linker script; placing the application across both partitions silently disables live OTA updates. Confirm the linker file reserves the alternate partition for the bootloader or secondary image, and never place the live image vector table outside the active partition. Use the Microchip MCC 'OTA Bootloader' project template to avoid misconfiguration.
The USB D+ and D- pair must be routed as a 90-ohm differential pair with 27-ohm series resistors placed within 5 mm of the MCU pins, and the VUSB decoupling capacitor (4.7 uF typical) must be located adjacent to the VUSB pin. Failure to keep the D+/D- pair short and matched can cause USB compliance test failures and intermittent enumeration. Reference the Microchip USB design checklist for the recommended ESD protection array on D+/D-/VBUS.
The segmented LCD controller on the PIC24FJ256GU406-E/MR draws significant current when driving many segments at high bias; for battery applications, use charge-pump mode with low-bias configuration and enable the LCD charge-pump only during display refresh cycles. The eXtreme Low Power sleep modes (Deep Sleep, Sleep) can disable the LCD peripheral entirely to drop quiescent current into the microamp range - critical for coin-cell-powered designs.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -E/MR suffix denotes extended industrial temperature range but is not AEC-Q100 qualified - for automotive applications select a Q-graded variant if available.
