PIC24FJ32GA102T-I/SO - 32KB Flash XLP 16-bit MCU | Microchip
Référence : PIC24FJ32GA102T-I/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.71 | $4,71 |
| 10 | $4.3 | $43,00 |
| 100 | $3.74 | $374,00 |
| 500 | $3.32 | $1 660,00 |
| 1 000 | $2.91 | $2 910,00 |
PIC24FJ32GA102T-I/SO Présentation
What is a PIC24F microcontroller? The PIC24F is a 16-bit modified Harvard MCU family from Microchip, sitting between the 8-bit PIC16/PIC18 architectures and the 32-bit PIC32 families. PIC24F devices execute 16 MIPS at 32 MHz while retaining a familiar PIC instruction set, mapping cleanly into the broader microcontrollers > integrated circuits taxonomy. nanoWatt XLP™ technology pushes quiescent current down to roughly 20 nA in deep sleep, making the family a staple for battery-powered designs where every microamp matters.
Key features include: 32 KB Flash / 8 KB RAM for non-trivial control firmware, a 10-bit A/D converter with up to 10 channels at 500 ksps, two UART, three SPI, and two I2C interfaces, plus 5.32-bit timers/counters. The 28-pin SOIC package offers 21 general-purpose I/O lines and a wide operating voltage range of 2.0V to 3.6V. The T-suffix variant denotes tape-and-reel packaging for high-volume pick-and-place assembly, while the industrial -40°C to +85°C temperature grade suits outdoor and industrial enclosures.
Architecturally, the PIC24FJ32GA102 uses a 16-bit modified Harvard core with separate program (Flash) and data (SRAM) buses, allowing instruction fetch and operand read in the same cycle. Peripheral pin select (PPS) on most PIC24F variants lets designers remap digital peripherals to multiple I/O pins, simplifying PCB routing. The 10-bit ADC uses a successive-approximation architecture with selectable acquisition time, and the on-chip 32 kHz low-power RC oscillator plus the 8 MHz system oscillator support flexible clock trees that are critical for XLP sleep current minimization.
Typical applications include portable consumer electronics, sensor hubs, low-power wireless gateways, building automation, and USB/HID human-interface devices where the PIC24FJ32GA102's 32 KB Flash comfortably fits USB stacks and protocol firmware. It is also widely used as the main controller on Microchip's Explorer 16/32 development board via processor plug-in modules, demonstrating proven reference design support across PIC24F, dsPIC®, and PIC32 platforms.
When designing with this device, verify that the chosen 28-SOIC PCB footprint matches the JEDEC MS-013 standard and that the supply decoupling scheme (typically a 100 nF plus 10 µF bulk cap within 5 mm of VDD) is implemented. Engineers evaluating alternatives should weigh Flash/RAM needs and I/O count: smaller applications may use PIC24FJ16 series, while larger ones step up to PIC24FJ64 or PIC24FJ128 families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24FJ32GA102T-I/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ32GA102T-I/SO (même facteur de forme et même empreinte) — différant par Package, ADC, Program Memory (Flash), Core Architecture, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ32GA102-I/SO
✅ Remplacement direct✓ En stock
$1.85 / unité
Voir la fiche technique →PIC24FJ32GA102-I/SS
✅ Remplacement direct✓ En stock
$2.4 / unité
Voir la fiche technique →PIC24FJ64GA102-I/SO
✅ Remplacement direct✓ En stock
$2.89 / unité
Voir la fiche technique →PIC24FJ32GA002T-I/SO
✅ Remplacement direct✓ En stock
$3.32 / unité
Voir la fiche technique →PIC24FJ32GA002-I/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ32GA102T-I/SO Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Microcontroller (MCU) |
| Core | PIC24F (modified Harvard, 16-bit) |
| Series | PIC® XLP™ 24F |
| Program Memory (Flash) | 32 KB (11K x 24 words) |
| RAM | 8 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 2.0 V to 3.6 V |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 28-SOIC (0.295" / 7.50 mm width) |
| Type de montage | Surface Mount |
| I/O Pins | 21 |
| ADC | 10-bit, up to 10 channels, 500 ksps |
| Timers | 5 x 16-bit (Timer/Counter modules) |
| Communication | 2x UART, 3x SPI, 2x I2C |
| Low-Power Technology | nanoWatt XLP™ |
| Packaging Type | Tape & Reel (T-suffix) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC24FJ32GA102T-I/SO
| Broche 1 | RA0 — PORTA bit 0 (analog AN0) |
| Broche 2 | RA1 — PORTA bit 1 (analog AN1) |
| Broche 3 | RA2 — PORTA bit 2 (analog AN2) |
| Broche 4 | RA3 — PORTA bit 3 (analog AN3, Vref-) |
| Broche 5 | RA4 — PORTA bit 4 (analog AN4) |
| Broche 6 | RA5 — PORTA bit 5 (analog AN5, Vref+) |
| Broche 7 | RA6 — PORTA bit 6 (OSC2) |
| Broche 8 | RA7 — PORTA bit 7 (OSC1) |
| Broche 9 | VSS — Ground reference |
| Broche 10 | RB0 — PORTB bit 0 (PGED1) |
| Broche 11 | RB1 — PORTB bit 1 (PGEC1) |
| Broche 12 | RB2 — PORTB bit 2 |
| Broche 13 | RB3 — PORTB bit 3 |
| Broche 14 | RB4 — PORTB bit 4 |
| Broche 15 | RB5 — PORTB bit 5 |
| Broche 16 | RB6 — PORTB bit 6 |
| Broche 17 | RB7 — PORTB bit 7 |
| Broche 18 | VSS — Ground reference (digital) |
| Broche 19 | VDD — Positive supply (digital) |
| Broche 20 | RC0 — PORTC bit 0 |
| Broche 21 | RC1 — PORTC bit 1 |
| Broche 22 | RC2 — PORTC bit 2 |
| Broche 23 | RC3 — PORTC bit 3 |
| Broche 24 | RC4 — PORTC bit 4 |
| Broche 25 | RC5 — PORTC bit 5 |
| Broche 26 | RC6 — PORTC bit 6 |
| Broche 27 | RC7 — PORTC bit 7 |
| Broche 28 | MCLR — Master Clear (reset, active low) |
Applications typiques
PIC24FJ32GA102T-I/SO convient pour 6 applications: Battery-Powered Sensor Hubs, HMI / Touch Interfaces, Industrial Control & Building Automation, Low-Cost USB / HID Devices, Portable Consumer Electronics, Educational & Maker Platforms.
Battery-Powered Sensor Hubs
The PIC24FJ32GA102T-I/SO's nanoWatt XLP technology delivers sub-microamp sleep currents, ideal for battery-powered sensor hubs that spend most of their lifetime in deep sleep and wake periodically to sample and transmit. With 32 KB Flash and 8 KB RAM, the MCU fits Zigbee / Thread / LoRaWAN stack fragments plus sensor drivers, while the 10-bit ADC samples analog transducers directly. Drawing only a few microamps average, the part extends coin-cell or 2x AA battery life from months to years, and its 28-SOIC industrial temperature grade supports outdoor enclosures.
Recommandé
HMI / Touch Interfaces
For low-cost HMI panels combining buttons, sliders, and LED feedback, the PIC24FJ32GA102T-I/SO's 21 GPIO and 32 MHz throughput handle mTouch capacitive sensing libraries and PWM-driven LED dimming in real time. The 28-SOIC footprint simplifies two-layer PCB layouts and lets the chip share a board with a 28-pin PIC24FJ32GA002 family member for cost-down reuse. With 32 KB Flash, libraries for capacitive touch and graphics rendering fit comfortably, and the wide 2.0V-3.6V range lets it run directly from a 2x AA battery stack or a 3.3V LDO. A small BOM - MCU plus LEDs plus I2C IO expander - keeps the BOM below $2 in volume.
Recommandé
Industrial Control & Building Automation
The PIC24FJ32GA102T-I/SO's industrial -40°C to +85°C temperature grade and 28-SOIC package (well suited to harsh environments with conformal coating) make it a strong fit for building automation controllers, HVAC fan drivers, and small PLC-style I/O modules. Its three SPI and two I2C peripherals let it talk to digital temperature sensors, EEPROMs, and displays concurrently, while the 10-bit ADC digitizes analog feedback from thermistors and current-sense amplifiers. With 32 KB Flash, BACnet MS/TP or Modbus RTU stacks fit comfortably and leave room for future feature additions.
Recommandé
Low-Cost USB / HID Devices
Although the PIC24FJ32GA102 lacks native USB, designers commonly pair it with an external USB-to-UART bridge such as the MCP2200 or FT232 to implement HID, CDC, or simple vendor-class USB devices. The 32 KB Flash holds USB descriptors and class firmware comfortably, and 32 MHz CPU throughput handles full-speed 12 Mbps traffic when the bridge handles protocol framing. The 28-SOIC footprint enables compact dongle form factors, and the industrial temperature grade supports automotive and industrial cabin environments.
Recommandé
Portable Consumer Electronics
For consumer wearables and portable gadgets, the PIC24FJ32GA102T-I/SO's combination of 32 KB Flash, 8 KB RAM, and nanoWatt XLP low-power technology is well suited to fitness bands, BLE sensor beacons, and small audio peripherals. The 28-SOIC footprint gives assembly lines a familiar profile for hand-solder rework and reflow, while the 21 GPIO lines drive RGB LEDs, haptic motors, and small LCDs. Pairing with a Microchip RN4870 Bluetooth module or a 2.4 GHz radio on SPI keeps the BOM compact and the firmware portable.
Recommandé
Educational & Maker Platforms
Universities and maker communities frequently adopt the PIC24FJ32GA102T-I/SO thanks to its mature MPLAB X IDE support, free XC16 compiler, and Microchip's Explorer 16/32 development board with processor plug-in modules (PIMs). The 32 KB Flash and 16 MIPS throughput teach real-world embedded concepts - interrupts, DMA, peripheral configuration - without overwhelming beginners. With widely available tutorials and a forgiving industrial-grade 28-SOIC footprint, students can build, debug, and rework boards with hand tools, accelerating learning outcomes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ32GA102T-I/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ32GA102-I/SO | PIC24FJ32GA102-I/SS | PIC24FJ64GA102-I/SO | PIC24FJ32GA002T-I/SO | PIC24FJ32GA002-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC | 28-SOIC | 28-SSOP | 28-SOIC | 28-SOIC | 28-SOIC |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Low-Power Technology | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | Standard (no XLP) | Standard (no XLP) |
| Packaging Format | Tape & Reel | Tube | Tube | Tube | Tape & Reel | Tube |
| Temperature Grade | Industrial -40°C to +85°C | Industrial -40°C to +85°C | Industrial -40°C to +85°C | Industrial -40°C to +85°C | Industrial -40°C to +85°C | Industrial -40°C to +85°C |
Principaux différenciateurs
- nanoWatt XLP technology for sub-microamp sleep current (vs PIC24FJ32GA002T-I/SO)
- Tape-and-reel packaging for SMT assembly lines (vs PIC24FJ32GA102-I/SO)
- 32 KB Flash on a 28-SOIC footprint with PIC24 XLP technology (vs PIC24FJ64GA102-I/SO)
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD pin and a single 10 µF bulk tantalum or ceramic on the supply rail. For nanoWatt XLP designs, ensure unused I/O are configured as outputs low (not inputs floating) to minimize Crowbar current, and use the internal LPRC oscillator for sleep timing instead of the secondary oscillator to reduce idle draw.
Match the 28-SOIC footprint to JEDEC MS-013 standard land pattern (0.65 mm pitch, 1.27 mm pad width). For 28-SSOP alternatives, use a separate MSOP/SSOP pattern - do not reuse the SOIC lands, as SSOP leads are only 0.65 mm wide. A 4-layer stackup with a continuous ground plane beneath the MCU improves EMI and signal integrity for SPI and I2C buses.
Do not assume MCLR can be left floating; tie it to VDD through a 10 kΩ resistor and a 100 nF cap to ground for proper reset behavior. Configuration bits must be programmed for the correct oscillator mode (e.g., HS or XT) or the MCU will fail to start. Finally, ICSP pins (PGED1/RB0, PGEC1/RB1) must remain accessible in production for field firmware updates.
Estimated: At 32 MHz CPU speed and 3.3V supply with all GPIO toggling, the PIC24FJ32GA102 typically draws around 25 mA. With a 28-SOIC theta_JA of approximately 80 °C/W, the worst-case junction temperature rise is roughly 2 °C above ambient - well within industrial limits. No heatsink is required under any normal operating condition.
Informations de conformité
RoHS and REACH compliant per Microchip environmental documentation. AEC-Q100 not applicable - this part is industrial grade, not automotive qualified. Lead-free matte-tin finish. Halogen-free status not explicitly stated in retrieved data.
