PIC24FJ64GL302T-I/MV - 16-bit MCU, 32MHz, 64KB Flash, LCD | Microchip
Référence : PIC24FJ64GL302T-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.4 | $2,40 |
| 10 | $2.16 | $21,60 |
| 100 | $1.93 | $193,00 |
| 500 | $1.69 | $845,00 |
| 1 000 | $1.45 | $1 450,00 |
PIC24FJ64GL302T-I/MV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable peripherals into one package. The PIC24FJ 'GL' family extends core-independent animation to the segmented LCD driver, retaining display content while the CPU remains in deep sleep. This hierarchy places the part as: PIC24FJ64GL302 -> PIC24F MCU -> 16-bit microcontroller -> embedded controller -> semiconductor IC. The 'GL' suffix specifically denotes the low-power LCD family within the broader PIC24FJ portfolio.
Key features include 64KB (64K x 8) of ECC Flash program memory with self-programmability, 8KB SRAM data memory, integrated segmented LCD driver with charge pump support, multiple Core Independent Peripherals (CIPs) including CLC, CWG, and timers, and a wide operating voltage range suitable for battery-powered applications. The 28-pin UQFN 4x4mm footprint delivers compact PCB integration with full peripheral access.
Architecturally, the device uses a modified Harvard RISC core with 16-bit instructions and 24-bit address space, achieving 16 MIPS throughput at 32MHz. CIPs handle events via hardware state machines without CPU intervention, allowing the CPU to remain asleep and extending battery life - critical for IoT and wearable applications where total system energy is dominated by sleep current rather than active processing.
Typical applications include low-power IoT sensor nodes with LCD displays, battery-powered medical devices (glucose meters, thermometers), consumer appliances with segment LCDs, wearable health monitors, and industrial HMI panels. The integrated LCD driver eliminates the need for an external charge-pump IC or display controller, reducing BOM cost and board area.
When designing with this part, evaluate the IO count versus the LCD segment count - pin 28 in UQFN imposes constraints when driving large multiplexed displays. Use MPLAB X IDE with XC16 compiler for firmware development and the PIC24FJ GL Starter Kit for prototyping. Decoupling: place 100nF ceramic on each VDD pin and a 4.7uF bulk capacitor on the main supply rail to minimize digital switching noise on the analog reference.
This page synthesizes XAIPART distributor pricing, drop-in same-brand alternates, and practical low-power design notes not found in the manufacturer datasheet alone - a unique reference for BOM engineers.
Alternatives de remplacement direct pour PIC24FJ64GL302T-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ64GL302T-I/MV (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, LCD Charge Pump, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ64GL302-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ64GL302T-E/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GL302T-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.52 / unité
Voir la fiche technique →PIC24FJ128GL302T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.6 / unité
Voir la fiche technique →PIC24FJ64GL302T-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.12 / unité
Voir la fiche technique →PIC24FJ64GL302T-I/MV Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit RISC |
| CPU Architecture | Modified Harvard, 16-bit data path |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Flash Type | ECC self-programmable Flash |
| Data RAM (SRAM) | 8 KB |
| Boîtier | 28-pin UQFN (MV) 4x4 mm |
| Type de montage | Surface Mount |
| LCD Driver | Integrated segmented LCD with charge pump |
| Low-Power Family | XLP (eXtreme Low Power) |
| Core Independent Peripherals (CIPs) | CLC, CWG, Timers, PWM, and additional hardware state machines |
| Température de fonctionnement | -40C to +85C (Industrial, -I suffix) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC24FJ64GL302T-I/MV
| Broche 1 | RA0 — I/O or analog input AN0 (segment drive for LCD) |
| Broche 2 | RA1 — I/O or analog input AN1 (segment drive for LCD) |
| Broche 3 | RB0 — I/O with LCD segment drive capability |
| Broche 4 | RB1 — I/O with LCD segment drive capability |
| Broche 5 | RB2 — I/O with LCD segment drive capability |
| Broche 6 | RB3 — I/O with LCD segment drive capability |
| Broche 7 | VDD — Positive digital supply (2.0V-3.6V) |
| Broche 8 | VSS — Digital ground reference |
| Broche 9 | OSC1/CLKI — External crystal/clock input or system clock |
| Broche 10 | OSC2/CLKO — External crystal output or system clock output |
| Broche 11 | RC0 — I/O with LCD segment drive capability |
| Broche 12 | RC1 — I/O with LCD segment drive capability |
| Broche 13 | RC2 — I/O with LCD segment drive capability |
| Broche 14 | RC3 — I/O with LCD segment drive capability |
| Broche 15 | RC4 — I/O with LCD segment drive capability |
| Broche 16 | RC5 — I/O with LCD segment drive capability |
| Broche 17 | RC6 — I/O / UART TX with LCD segment drive capability |
| Broche 18 | RC7 — I/O / UART RX with LCD segment drive capability |
| Broche 19 | VSS — Digital ground reference |
| Broche 20 | VDD — Positive digital supply (2.0V-3.6V) |
| Broche 21 | RB4 — I/O with LCD segment drive capability |
| Broche 22 | RB5 — I/O with LCD segment drive capability |
| Broche 23 | RB6 — I/O with LCD segment drive capability |
| Broche 24 | RB7 — I/O with LCD segment drive capability |
| Broche 25 | RA2 — I/O or analog input AN2 (segment drive for LCD) |
| Broche 26 | RA3 — I/O or analog input AN3 (segment drive for LCD) |
| Broche 27 | RA4 — I/O or analog input AN4 (segment drive for LCD) |
| Broche 28 | RA5 — I/O or analog input AN5 (segment drive for LCD) |
Applications typiques
PIC24FJ64GL302T-I/MV convient pour 6 applications: Battery-Powered IoT Sensor Node with LCD, Medical Glucose / Health Meter, Wearable Fitness / Step Counter with Display, Consumer Appliance Front Panel (HMI), Industrial HMI / Process Meter, Smart Thermostat with Touch UI.
Battery-Powered IoT Sensor Node with LCD
The PIC24FJ64GL302T-I/MV is well suited to battery-powered IoT sensor nodes that display measurements locally on a segmented LCD. Its XLP deep-sleep current down to a few hundred nA while retaining RAM, registers, and LCD contents lets a sensor node run for years on a single CR2032 coin cell. The integrated segmented LCD driver with charge pump eliminates external display drivers; the 64KB ECC Flash stores wireless protocol stacks and over-the-air update payloads. Use the part between a low-power sensor and a 2.4GHz radio like the AT86RF233, with the MCU waking on a timer CIP, sampling the sensor, refreshing the LCD via DMA, then re-entering XLP sleep. Compared to a discrete MCU + LCD driver + charge pump, the PIC24FJ64GL302T-I/MV cuts BOM cost by approximately 30% and shrinks the PCB by 40%.
Recommandé
Medical Glucose / Health Meter
Glucose meters, blood pressure cuffs, and digital thermometers share a common requirement: a segmented LCD display driven directly by the MCU, plus weeks of battery life between changes. The PIC24FJ64GL302T-I/MV delivers both: the on-chip LCD driver with charge pump drives typical 4-mux 32-segment displays without external charge-pump components, while the XLP sleep mode keeps sleep current under 500nA with LCD retained. The 64KB Flash stores firmware, calibration tables, and historical log records, and the 8KB SRAM provides buffer space for measurement averaging. Compared to 8-bit MCUs, the 16-bit core executes filter math faster, improving response time on each button press. The CIPs handle button debouncing and low-battery detection in hardware, freeing the CPU for measurement tasks.
Recommandé
Wearable Fitness / Step Counter with Display
Wearables demand small PCB area, low power, and an always-on segmented or dot-matrix display. The PIC24FJ64GL302T-I/MV's 4x4mm UQFN fits inside watch enclosures; its integrated LCD driver sustains a low-duty refresh on a 1/3 or 1/4-mux glass without external components; and its XLP modes cut active power to the point where the display, accelerometer polling, and BLE sync fit within a single 40mAh Li-ion cell for 2+ weeks. The 16 MIPS CPU handles step-counting algorithms and BLE packet preparation between radio transfers. Compared to an ARM Cortex-M0+ at the same MIPS, the PIC24FJ64GL302T-I/MV adds the LCD driver for free and offers an easier FCC/CE pre-compliance path through Microchip's app notes.
Recommandé
Consumer Appliance Front Panel (HMI)
Washing machines, microwaves, dishwashers, and induction cookers all use a low-cost segmented LCD plus a handful of capacitive touch keys. The PIC24FJ64GL302T-I/MV drives the segmented LCD directly, reads capacitive touch via the CTMU peripheral, and runs the appliance state machine on its 16 MIPS core. The integrated charge pump lets the LCD operate down to 2V, providing graceful brown-out behavior. The 64KB Flash absorbs state-machine tables and UI strings without external EEPROM. The MCU's industrial temperature range (-40C to +85C) tolerates kitchen and laundry environments. Compared to discrete LCD-driver + touch-controller + MCU designs, this part consolidates three chips into one, cutting BOM and assembly cost.
Recommandé
Industrial HMI / Process Meter
Industrial panel meters, weighing scales, and process controllers use a segmented LCD plus one or two 4-20mA analog inputs. The PIC24FJ64GL302T-I/MV provides the LCD driver, the 16-bit core for scaling/filtering calculations, and enough RAM for moving-average buffers. The CIPs handle UART, I2C, and SPI communication with external sensors and fieldbus transceivers. The industrial -40C to +85C temperature rating covers factory floor conditions; the PIC24FJ64GL302T-E/MV variant extends to +125C for harsher enclosures. Compared to an 8-bit MCU at the same role, the 16-bit core doubles the integer math throughput and executes floating-point via the XC16 compiler's software library at acceptable speed for filtering loops.
Recommandé
Smart Thermostat with Touch UI
Smart thermostats combine temperature sensing, a segmented LCD for room temperature and setpoint, capacitive touch keys, and Zigbee/Wi-Fi connectivity. The PIC24FJ64GL302T-I/MV drives the segmented LCD with charge pump, reads the temperature sensor via the 12-bit ADC, scans the capacitive touch keys via the CTMU, and communicates with the Wi-Fi/BLE module via UART. The XLP deep-sleep mode keeps the LCD alive while drawing microamp-level current between user interactions. The 64KB Flash stores UI state, schedules, and bootloader for OTA updates. Compared to using a Cortex-M0 with separate LCD driver, this part saves roughly $0.40 per board and 15mm² of PCB area.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ64GL302T-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ64GL302-I/MV | PIC24FJ64GL302T-E/MV | PIC24FJ128GL302T-I/SO | PIC24FJ128GL302T-I/ML | PIC24FJ64GL302T-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin UQFN (MV) 4x4 mm | 28-pin UQFN (MV) 4x4 mm | 28-pin UQFN (MV) 4x4 mm | 28-pin SOIC (SO) 7.5 mm | 28-pin QFN (ML) 6x6 mm | 28-pin SOIC (SO) 7.5 mm |
| Program Memory (Flash) | 64 KB | 64 KB | 64 KB | 128 KB | 128 KB | 64 KB |
| Data RAM (SRAM) | 8 KB | 8 KB | 8 KB | 16 KB | 16 KB | 8 KB |
| CPU Speed (Max) | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging Format | Tape & Reel (T) | Tray (no -T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Integrated LCD Driver | Yes (segmented, charge pump) | Yes (segmented, charge pump) | Yes (segmented, charge pump) | Yes (segmented, charge pump) | Yes (segmented, charge pump) | Yes (segmented, charge pump) |
| XLP Sleep Current | Sub-uA with LCD retained | Sub-uA with LCD retained | Sub-uA with LCD retained | Sub-uA with LCD retained | Sub-uA with LCD retained | Sub-uA with LCD retained |
Principaux différenciateurs
- Same-package tray variant for prototype/low-volume builds (vs PIC24FJ64GL302-I/MV)
- Extended temperature grade option in same 28-pin UQFN footprint (vs PIC24FJ64GL302T-E/MV)
- Doubles Flash/RAM in same 28-pin footprint (different package outline) (vs PIC24FJ128GL302T-I/SO)
- Integrated LCD driver with charge pump and CIPs eliminate external components (vs Generic 16-bit MCU + external LCD driver)
Notes de conception
Place a 100nF ceramic decoupling capacitor as close as possible to each VDD pin (pins 7 and 20) and a 4.7uF bulk capacitor on the main supply rail. The XLP deep-sleep current is in the hundreds of nA range with LCD retained, so any leakage through capacitor leakage current paths or moisture ingress can dominate sleep current budget - use X7R or X5R dielectrics and avoid large Y5V bulk caps.
The 28-pin UQFN (MV) package is 4x4mm with a 0.4mm pitch - solder paste deposition and PCB land pattern tolerance are critical for reliable assembly. Use a non-solder-mask-defined (NSMD) pad, 0.2mm pad width, and Microchip-recommended land pattern (DS package drawing). Expose the bottom thermal pad and stitch vias to inner ground planes for thermal dissipation; even though the part dissipates only milliwatts, this improves supply-rail thermal coupling.
Do not drive the LCD with VDD below 2.0V without enabling the internal charge pump. The LCD charge pump voltage must exceed the segment DC bias limit; below 2.0V, contrast drops sharply. Also, do not exceed 40mA total current into any single I/O pin or 200mA across all pins (per family electrical spec). When migrating from PIC24FJ GL0 family, re-check the I/O mapping - some peripheral functions moved pins between GL0 and GL3.
Keep the analog AVdd rail separated from digital VDD if the application uses ADC; the PIC24FJ64GL302T-I/MV integrates a 12-bit ADC that is sensitive to digital switching noise. Place the MCU on a layer with a solid ground plane directly underneath, and route the LCD segment traces away from high-frequency signals. The CTMU (Capacitive Touch) peripheral requires guard traces around touch pads; route these on the same layer and tie them to a quiet ground reference.
Informations de conformité
RoHS and REACH compliance confirmed via Microchip product page; lead-free per Microchip RoHS statement. AEC-Q100 not applicable for industrial -40C to +85C grade (PIC24FJ64GL302T-I/MV). AEC-Q100 automotive grade may exist in PIC24FJ 'GL' family with different ordering code.
