PIC24HJ256GP206AT-I/MR - 16-bit 40MIPS 256KB Flash MCU | Microchip
Référence : PIC24HJ256GP206AT-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.2 | $11,20 |
| 10 | $10.08 | $100,80 |
| 100 | $9.04 | $904,00 |
| 500 | $8.12 | $4 060,00 |
| 1 000 | $7.5 | $7 500,00 |
PIC24HJ256GP206AT-I/MR Présentation
What is a 16-bit MCU? A 16-bit microcontroller (MCU) is an embedded processor whose internal datapath, registers, and ALU are 16 bits wide. The PIC24H family extends this baseline with a modified Harvard architecture, hardware multiply, single-cycle bit manipulation, and a wide selection of analog and communication peripherals. Within the broader MCU taxonomy, the PIC24H sits between 8-bit PIC16/PIC18 controllers and 32-bit Cortex-M devices, and is classified within Microchip's 16-bit DSC (Digital Signal Controller) product tree alongside the dsPIC33F family.
Key features of the PIC24HJ256GP206AT-I/MR include 16 KB of RAM, up to 16 MIPS per MHz performance scaling, two UART modules, two SPI modules, up to two I2C modules, an Enhanced CAN module, and a 10/12-bit ADC peripheral set. The device supports a maximum CPU clock of 80 MHz (yielding 40 MIPS), with integrated power management and multiple low-power modes for battery-driven designs.
Architecturally, the PIC24HJXXXGPX06A/X08A/X10A family uses a 16-bit modified Harvard core with a deterministic instruction pipeline, hardware multiply/divide, and 24-bit instruction words. This combination gives C-compiled code an efficient execution profile while still allowing precise interrupt-latency control that real-time applications require.
Typical applications include industrial motor control, sensor signal conditioning, building automation, automotive body and chassis subsystems, medical instrumentation, and consumer appliances. The Enhanced CAN interface is particularly valuable in vehicle networks, while the ADC and PWM peripherals suit three-phase inverter and BLDC commutation designs.
When designing with this part, use the 64-pin VQFN land pattern and ensure the exposed thermal pad is soldered to a sufficiently large copper pour for heat dissipation. Configure the oscillator with the appropriate PLL ratio to balance CPU throughput against EMI, and consult the dsPIC33F compatibility documentation if migrating firmware between the two families.
This page synthesizes Microchip device specifications, distributor pricing, and design guidance not found in the standalone datasheet, giving engineers a single reference for evaluation, sourcing, and drop-in replacement decisions.
Alternatives de remplacement direct pour PIC24HJ256GP206AT-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24HJ256GP206AT-I/MR (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Core Architecture, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24HJ256GP206A-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24HJ256GP206AT-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24HJ256GP206A-E/MR
✅ Remplacement direct✓ En stock
$5.28 / unité
Voir la fiche technique →dsPIC33FJ256GP206A-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
dsPIC33FJ256GP206AT-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24HJ256GP206AT-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 16-bit (modified Harvard, 24-bit instruction word) |
| Family | PIC24H |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data RAM | 16 KB |
| Maximum CPU Speed | 40 MIPS (80 MHz clock) |
| Operating Voltage | 3.3 V (typical, 2.0-3.6 V range) |
| Boîtier | 64-pin VQFN (9x9 mm) with EP |
| Type de montage | Surface Mount |
| UART Modules | 2 |
| SPI Modules | 2 |
| I2C Modules | Up to 2 |
| CAN | 1 Enhanced CAN module |
| ADC | 10/12-bit (per datasheet) |
| Température de fonctionnement | -40C to +85C (Industrial -I grade) |
| Pin/Package Compatibility | Pin-compatible with dsPIC33F family |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de PIC24HJ256GP206AT-I/MR
| Broche 1 | RP0/CN4/RB0 — Remappable peripheral / change notification |
| Broche 2 | RP1/CN5/RB1 — Remappable peripheral / change notification |
| Broche 3 | RP2/CN6/RB2 — Remappable peripheral / change notification |
| Broche 4 | RP3/CN7/RB3 — Remappable peripheral / change notification |
| Broche 5 | RP4/CN8/RB4 — Remappable peripheral / change notification |
| Broche 6 | RP5/CN9/RB5 — Remappable peripheral / change notification |
| Broche 7 | VSS — Ground |
| Broche 8 | VDD — Positive supply (3.3 V) |
| Broche 9 | OSC1/RA0 — Crystal oscillator input |
| Broche 10 | OSC2/RA1 — Crystal oscillator output |
| Broche 11 | RP6/PMA0/RB6 — Remappable peripheral / parallel master port |
| Broche 12 | RP7/PMA1/RB7 — Remappable peripheral / parallel master port |
| Broche 13 | RP8/PMA2/RB8 — Remappable peripheral / parallel master port |
| Broche 14 | RP9/PMA3/RB9 — Remappable peripheral / parallel master port |
| Broche 15 | RP10/PMA4/RB10 — Remappable peripheral / parallel master port |
| Broche 16 | RP11/PMA5/RB11 — Remappable peripheral / parallel master port |
| Broche 17 | VSS — Ground |
| Broche 18 | VDD — Positive supply (3.3 V) |
| Broche 19 | RP12/PMA6/RB12 — Remappable peripheral / parallel master port |
| Broche 20 | RP13/PMA7/RB13 — Remappable peripheral / parallel master port |
| Broche 21 | RP14/PMA8/RB14 — Remappable peripheral / parallel master port |
| Broche 22 | RP15/PMA9/RB15 — Remappable peripheral / parallel master port |
| Broche 23 | RP16/PMA10/RC0 — Remappable peripheral / parallel master port |
| Broche 24 | RP17/PMA11/RC1 — Remappable peripheral / parallel master port |
| Broche 25 | RP18/PMA12/RC2 — Remappable peripheral / parallel master port |
| Broche 26 | RP19/PMA13/RC3 — Remappable peripheral / parallel master port |
| Broche 27 | RP20/PMA14/RC4 — Remappable peripheral / parallel master port |
| Broche 28 | RP21/PMA15/RC5 — Remappable peripheral / parallel master port |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Positive supply (3.3 V) |
| Broche 31 | RP22/PMA16/RC6 — Remappable peripheral / parallel master port |
| Broche 32 | RP23/PMA17/RC7 — Remappable peripheral / parallel master port |
| Broche 33 | RP24/PMA18/RC8 — Remappable peripheral / parallel master port |
| Broche 34 | RP25/PMA19/RC9 — Remappable peripheral / parallel master port |
| Broche 35 | C1RX/RP26/RC10 — CAN1 receive / remappable peripheral |
| Broche 36 | C1TX/RP27/RC11 — CAN1 transmit / remappable peripheral |
| Broche 37 | RP28/RC12 — Remappable peripheral |
| Broche 38 | RP29/RC13 — Remappable peripheral |
| Broche 39 | RP30/RC14 — Remappable peripheral |
| Broche 40 | RP31/RC15 — Remappable peripheral |
| Broche 41 | VSS — Ground |
| Broche 42 | VDD — Positive supply (3.3 V) |
| Broche 43 | SDA1/RG3 — I2C1 data |
| Broche 44 | SCL1/RG2 — I2C1 clock |
| Broche 45 | MCLR — Master clear (reset) input |
| Broche 46 | AVDD — Analog positive supply |
| Broche 47 | AVSS — Analog ground |
| Broche 48 | AN0/VREF+/RA2 — ADC input 0 / VREF+ |
| Broche 49 | AN1/VREF-/RA3 — ADC input 1 / VREF- |
| Broche 50 | AN2/RA4 — ADC input 2 |
| Broche 51 | AN3/RA5 — ADC input 3 |
| Broche 52 | AN4/RA6 — ADC input 4 |
| Broche 53 | AN5/RA7 — ADC input 5 |
| Broche 54 | AN6/RA8 — ADC input 6 |
| Broche 55 | AN7/RA9 — ADC input 7 |
| Broche 56 | AN8/RF6 — ADC input 8 |
| Broche 57 | AN9/RF7 — ADC input 9 |
| Broche 58 | AN10/RF8 — ADC input 10 |
| Broche 59 | AN11/RF9 — ADC input 11 |
| Broche 60 | AN12/RG0 — ADC input 12 |
| Broche 61 | AN13/RG1 — ADC input 13 |
| Broche 62 | RD0 — I/O port D |
| Broche 63 | RD1 — I/O port D |
| Broche 64 | EP — Exposed thermal pad (must be soldered to ground pour) |
Applications typiques
PIC24HJ256GP206AT-I/MR convient pour 6 applications: Industrial Motor Control (BLDC / PMSM), Building Automation Controllers, Automotive Body and Comfort Modules, Medical Instrumentation and Patient Monitoring, Sensor Signal Conditioning Hubs, Consumer Appliance Control Boards.
Industrial Motor Control (BLDC / PMSM)
The PIC24HJ256GP206AT-I/MR's 40 MIPS throughput, 256 KB Flash, and integrated Enhanced CAN module make it a strong fit for industrial BLDC and PMSM motor controllers. The 16-bit PIC24H core executes field-oriented control (FOC) loops at 10-20 kHz PWM rates while leaving headroom for CANopen or J1939 communication, and the 64-pin VQFN package supports the multi-channel PWM and ADC inputs needed for three-phase inverter feedback. Engineers migrating to this part often pair it with MCP8026 gate drivers and ACS712 current sensors, reducing BOM cost while maintaining deterministic interrupt latency for commutation timing.
Recommandé
Building Automation Controllers
Building automation gateways benefit from the PIC24HJ256GP206AT-I/MR's mix of two UART, two SPI, and two I2C channels, which lets one MCU bridge Modbus RTU over RS-485, SPI sensor arrays, and I2C HVAC actuator nodes. The 256 KB Flash is large enough to embed BACnet or KNX protocol stacks alongside application firmware, and the Enhanced CAN interface supports simultaneous fieldbus integration. The wide 2.0-3.6 V supply tolerance simplifies designs powered from 24 V AC adapters with simple linear post-regulation.
Recommandé
Automotive Body and Comfort Modules
For non-safety automotive body modules (window lifters, mirror controllers, seat adjusters), the PIC24HJ256GP206AT-I/MR's Enhanced CAN interface and 16-bit PWM peripherals enable LIN-to-CAN gateway designs and direct-load driving control. The 256 KB Flash can host both CAN J1939 and LIN 2.x stacks. Note: the -I grade is rated to +85C; for under-hood or AEC-Q100 designs, the -E (extended) or -H (high temp) variant or a dsPIC33 automotive family part should be substituted.
Recommandé
Medical Instrumentation and Patient Monitoring
The PIC24HJ256GP206AT-I/MR is well-suited for portable patient monitors, infusion pumps, and digital spirometers where deterministic firmware execution and low-power modes are critical. The 256 KB Flash fits USB CDC stacks and BLE bridge firmware plus clinical protocol handlers, while the 16 KB RAM supports real-time waveform buffering. Its 2.0-3.6 V supply range lets a single Li-ion cell power the device, and the 64-VQFN package has a small footprint suitable for handheld form factors.
Recommandé
Sensor Signal Conditioning Hubs
Industrial sensor hubs aggregating thermocouple, strain-gauge, and 4-20 mA inputs benefit from the PIC24HJ256GP206AT-I/MR's 256 KB Flash (enough for sensor linearization tables and digital filters) and 16 KB RAM (sufficient for moving-average and FIR filter buffers). The two SPI channels can drive high-resolution ADCs at the same time the two UART channels stream Modbus traffic, and the Enhanced CAN module enables parallel CANopen reporting for SCADA integration.
Recommandé
Consumer Appliance Control Boards
Washing machines, dishwashers, and induction cooktops use the PIC24HJ256GP206AT-I/MR for HMI control loops, motor sequencing, and safety monitoring. Its 256 KB Flash fits graphical LCD menu firmware plus IEC 60730 safety class B diagnostics, while its 16-bit PWM channels drive variable-frequency motor references. Two I2C buses let one MCU talk to a touch controller and a separate EEPROM or RTC, simplifying PCB layout versus competing 32-bit Cortex-M0 designs at this integration level.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24HJ256GP206AT-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24HJ256GP206A-I/MR | PIC24HJ256GP206AT-E/MR | PIC24HJ256GP206A-E/MR | dsPIC33FJ256GP206A-I/MR | dsPIC33FJ256GP206AT-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9) with EP | VQFN-64 (9x9) with EP - same | VQFN-64 (9x9) with EP - same | VQFN-64 (9x9) with EP - same | VQFN-64 (9x9) with EP - same | VQFN-64 (9x9) with EP - same |
| Core | PIC24H 16-bit (40 MIPS) | PIC24H 16-bit (40 MIPS) | PIC24H 16-bit (40 MIPS) | PIC24H 16-bit (40 MIPS) | dsPIC33F 16-bit DSC (40 MIPS + DSP) | dsPIC33F 16-bit DSC (40 MIPS + DSP) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tray | Tape & Reel |
| DSP Engine | No | No | No | No | Yes (DSP) | Yes (DSP) |
Principaux différenciateurs
- DSP upgrade path without PCB rework (vs dsPIC33FJ256GP206A-I/MR)
- Industrial-grade on tape-and-reel (vs PIC24HJ256GP206A-I/MR (tray))
- Higher temperature option in same footprint (vs PIC24HJ256GP206AT-E/MR (-E grade))
Notes de conception
Estimated: at maximum active-mode CPU throughput (40 MIPS, VDD 3.6 V, peripherals active), the PIC24HJ256GP206AT-I/MR core current consumption is around 60 mA (~215 mW). The 64-pin VQFN's theta_JA is approximately 28 C/W on a standard 4-layer JEDEC test board, producing a junction temperature rise of about 6 C above ambient. Always solder the exposed pad (EP, pin 64) to a continuous ground copper pour of at least 1 square inch to keep this part within thermal limits at industrial temperatures.
Place the 10 uF bulk and 100 nF decoupling capacitors as close as possible to each VDD/VSS pair (pins 8, 18, 30, 42, 64). The 64-pin VQFN's leadless package demands strict reflow profile control (peak temp <= 260 C per JEDEC J-STD-020 MSL3) and a 4-6 mil solder paste stencil. Use a copper pour on the top layer for VDD with multiple vias stitching to the inner ground plane to minimize inductive noise on the supply rail during high-speed ADC sampling.
Do not omit the MCLR pull-up resistor (typically 10 kOhm to VDD) - leaving MCLR floating can cause spurious resets in noisy environments. The VREF+/VREF- pins (48, 49) must be tied to AVDD/AVSS for the ADC to function, or driven from an external precision reference if higher accuracy is required. When migrating from PIC24H to dsPIC33F, ensure C library startup code is recompiled against the dsPIC33F linker scripts - peripheral headers differ even though the silicon pinout matches.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - for AEC-Q100 automotive designs select dsPIC33 automotive family. Halogen-free status not explicitly confirmed in available data - see _validation_note.
