PIC32MK0512GPE064T-I/MR - 120MHz 32-bit MCU | Microchip
Référence : PIC32MK0512GPE064T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.84 | $5,84 |
| 10 | $5.27 | $52,70 |
| 100 | $4.65 | $465,00 |
| 500 | $4.18 | $2 090,00 |
| 1 000 | $3.72 | $3 720,00 |
PIC32MK0512GPE064T-I/MR Présentation
A 32-bit MCU (microcontroller unit) is an integrated circuit containing a 32-bit processor core, program memory (Flash), data memory (SRAM), and configurable peripherals on a single die. Within the taxonomy, the PIC32MK sits under MCU -> microcontroller -> embedded processor -> semiconductor. The microAptiv core adds DSP extensions and a single-precision floating-point unit (FPU), enabling efficient execution of control loops and signal-processing tasks in motor-drive and industrial systems.
Key features of this part include 120 MHz core speed, 512 KB self-programmable Flash with ECC, 128 KB SRAM, 4 KB EEPROM, 12-bit 3.5 MSPS ADC with up to 32 channels, six UART/SPI, four I2C, six I2S, USB 2.0 Full-Speed with PHY, two CAN 2.0B modules, motor-control PWMs, and quadrature encoder interfaces. The 64-QFN package offers a compact 9x9 mm footprint with an exposed pad for thermal dissipation, and operates over -40C to +85C industrial temperature range.
Architecturally, the device pairs the microAptiv core with a high-bandwidth bus matrix, dual DMA engines, and dedicated motor-control peripherals including PWM, QEI, and op-amp interfaces, making it a single-chip solution for Field-Oriented Control (FOC) algorithms and industrial feedback loops. Compared with smaller PIC32MX parts, the PIC32MK family doubles peripheral integration and adds CAN-FD and DSP instructions.
Typical applications include BLDC/PMSM motor drives, industrial servo control, PLC I/O modules, and Industrial IoT gateways with USB or CAN connectivity. When designing with this MCU, ensure the exposed pad is soldered to a sufficient copper pour (>=1 sq inch) and place decoupling capacitors within 3 mm of each power pin to meet the 3.5 MSPS ADC noise floor.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet, helping engineers quickly evaluate the PIC32MK0512GPE064T-I/MR for time-to-market motor-control and industrial designs.
Alternatives de remplacement direct pour PIC32MK0512GPE064T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MK0512GPE064T-I/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Operating Temperature, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MK0512GPK064T-I/MR
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →PIC32MK0512GPE064T-E/MR
✅ Remplacement direct✓ En stock
$3.65 / unité
Voir la fiche technique →PIC32MK1024GPE064T-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK0512GPD064T-I/MR
✅ Remplacement direct✓ En stock
$3.81 / unité
Voir la fiche technique →PIC32MK0512GPE064T-E/PT
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MK0512GPE064T-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (32-bit, FPU, DSP) |
| Maximum CPU Frequency | 120 MHz |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| EEPROM | 4 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 12-bit, up to 32 channels, 3.5 MSPS |
| UART/SPI | 6 |
| I2C | 4 |
| I2S | 6 |
| USB | USB 2.0 Full-Speed with on-chip PHY |
| CAN | 2 x CAN 2.0B |
| Motor-Control PWM | Yes (multi-phase) |
| Quadrature Encoder Interface (QEI) | Yes |
| DMA Channels | Dual DMA engines |
| Boîtier | 64-QFN (9x9 mm) with exposed pad |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MK0512GPE064T-I/MR
| Broche 1 | OSC1/RA0 — Oscillator input or GPIO |
| Broche 2 | OSC2/RA1 — Oscillator output or GPIO |
| Broche 3 | VDD — Positive supply (2.3-3.6 V) |
| Broche 4 | VSS — Ground |
| Broche 5 | RB0/AN0 — GPIO/Analog input 0 |
| Broche 6 | RB1/AN1 — GPIO/Analog input 1 |
| Broche 7 | RB2/AN2 — GPIO/Analog input 2 |
| Broche 8 | RB3/AN3 — GPIO/Analog input 3 |
| Broche 9 | RB4/AN4 — GPIO/Analog input 4 |
| Broche 10 | RB5/AN5 — GPIO/Analog input 5 |
| Broche 11 | RB6/AN6/PGC — GPIO/Analog/ICSP clock |
| Broche 12 | RB7/AN7/PGD — GPIO/Analog/ICSP data |
| Broche 13 | VSS — Ground |
| Broche 14 | RC0 — GPIO |
| Broche 15 | RC1 — GPIO |
| Broche 16 | RC2 — GPIO |
| Broche 17 | RC3 — GPIO |
| Broche 18 | RC4 — GPIO |
| Broche 19 | RC5 — GPIO |
| Broche 20 | RC6 — GPIO |
| Broche 21 | RC7 — GPIO |
| Broche 22 | VSS — Ground |
| Broche 23 | RD0 — GPIO |
| Broche 24 | RD1 — GPIO |
| Broche 25 | RD2 — GPIO |
| Broche 26 | RD3 — GPIO |
| Broche 27 | RD4 — GPIO |
| Broche 28 | RD5 — GPIO |
| Broche 29 | RD6 — GPIO |
| Broche 30 | RD7 — GPIO |
| Broche 31 | VSS — Ground |
| Broche 32 | RE0 — GPIO |
| Broche 33 | RE1 — GPIO |
| Broche 34 | RE2 — GPIO |
| Broche 35 | RE3 — GPIO |
| Broche 36 | RE4 — GPIO |
| Broche 37 | RE5 — GPIO |
| Broche 38 | RE6 — GPIO |
| Broche 39 | RE7 — GPIO |
| Broche 40 | RF0 — GPIO |
| Broche 41 | RF1 — GPIO |
| Broche 42 | VDD — Positive supply (2.3-3.6 V) |
| Broche 43 | RF2 — GPIO |
| Broche 44 | RF3 — GPIO |
| Broche 45 | RF4 — GPIO |
| Broche 46 | RF5 — GPIO |
| Broche 47 | RF6 — GPIO |
| Broche 48 | RF7 — GPIO |
| Broche 49 | RG0 — GPIO |
| Broche 50 | RG1 — GPIO |
| Broche 51 | RG2 — GPIO |
| Broche 52 | RG3 — GPIO |
| Broche 53 | RG6 — GPIO |
| Broche 54 | RG7 — GPIO |
| Broche 55 | RG8 — GPIO |
| Broche 56 | RG9 — GPIO |
| Broche 57 | VSS — Ground |
| Broche 58 | RH0 — GPIO |
| Broche 59 | RH1 — GPIO |
| Broche 60 | RH2 — GPIO |
| Broche 61 | RH3 — GPIO |
| Broche 62 | RH4 — GPIO |
| Broche 63 | RH5 — GPIO |
| Broche 64 | RH6 — GPIO |
| Broche EP | EP — Exposed thermal pad - must be soldered to ground plane for thermal dissipation |
Applications typiques
PIC32MK0512GPE064T-I/MR convient pour 6 applications: BLDC and PMSM Motor Drive, Industrial Servo and Robotics Controller, PLC I/O and Industrial Automation Modules, Industrial IoT Gateway with USB/CAN, Solar Inverter and Power Conversion Control, Automotive Body and Comfort Modules.
BLDC and PMSM Motor Drive
The PIC32MK0512GPE064T-I/MR's 120 MHz microAptiv FPU core and dedicated motor-control peripherals make it ideal for BLDC and PMSM motor drives running Field-Oriented Control (FOC) algorithms. The integrated 12-bit 3.5 MSPS ADC with up to 32 channels supports simultaneous sampling of three-phase currents and DC-bus voltage, enabling single-shunt or three-shunt current sensing topologies. The on-chip op-amps condition Hall or shunt-resistor signals without external amplifiers, reducing BOM count. With 128 KB SRAM, the device can execute sensorless FOC with sliding-mode observers in real time at 20 kHz PWM rates, matching industrial servo bandwidth requirements.
Recommandé
Industrial Servo and Robotics Controller
The PIC32MK0512GPE064T-I/MR serves as a multi-axis servo controller in industrial robotics, leveraging its dual CAN 2.0B interfaces for CANopen or DeviceNet communication with supervisory PLCs. The QEI interfaces accept signals from incremental encoders on each axis for closed-loop position control, while the high-resolution PWM outputs drive servo amplifiers with microsecond dead-band control. The 120 MHz core executes multi-axis PID loops with cycle times under 1 ms, and the 512 KB Flash holds real-time operating systems such as FreeRTOS or MQX. The -40C to +85C industrial temperature range supports factory-floor deployment.
Recommandé
PLC I/O and Industrial Automation Modules
The PIC32MK0512GPE064T-I/MR powers PLC I/O expansion modules, where its six UART/SPI, four I2C, six I2S, and USB Full-Speed interfaces provide multi-protocol connectivity to sensors and field devices. Industrial automation requires deterministic response; the device's DMA engines offload serial transfers so the 120 MHz core can service control logic in real time. The two CAN modules support CANopen slave operation, and the 4 KB EEPROM stores configuration and calibration parameters. The 64-QFN package's small 9x9 mm footprint fits dense PLC backplane designs with multiple modules per board.
Recommandé
Industrial IoT Gateway with USB/CAN
The PIC32MK0512GPE064T-I/MR acts as an Industrial IoT gateway node aggregating sensor data over CAN, UART, and I2C, then forwarding it via the integrated USB Full-Speed PHY to a host controller or edge gateway. The microAptiv DSP extensions accelerate FFT and signal pre-processing on vibration or acoustic sensors, while 512 KB Flash holds TLS/DTLS stacks or MQTT clients. The 128 KB SRAM accommodates network buffers, and the 12-bit ADC digitizes analog sensor inputs. Industrial -40C to +85C temperature and dual CAN 2.0B interfaces make it suited to ruggedized IIoT nodes mounted on factory equipment.
Recommandé
Solar Inverter and Power Conversion Control
The PIC32MK0512GPE064T-I/MR is well-suited to solar inverter MPPT and grid-tie control loops, where its 120 MHz FPU executes predictive control and PLL algorithms in real time. The high-resolution PWMs and 12-bit 3.5 MSPS ADC enable precise IGBT/MOSFET gate timing and feedback sampling at switching frequencies up to 100 kHz. The 512 KB Flash holds grid-synchronization firmware (e.g. IEEE 1547 anti-islanding), and the 128 KB SRAM supports waveform tables and state-machine buffers. Dual CAN modules allow integration with inverter-cluster management systems common in commercial-scale solar arrays.
Recommandé
Automotive Body and Comfort Modules
The PIC32MK0512GPE064T-I/MR -E temperature-grade variant supports AEC-Q100 qualified automotive body and comfort modules, including HVAC controls, seat controllers, and lighting modules. The microAptiv core and DSP extensions process sensor fusion data from LIN-bus nodes, while the on-chip CAN 2.0B enables body-network connectivity. The motor-control PWMs and QEI interfaces handle small DC motor positioning, and the USB Full-Speed interface supports diagnostics or media connectivity. The 64-QFN 9x9 mm package fits space-constrained instrument-panel PCAs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MK0512GPE064T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MK0512GPK064T-I/MR | PIC32MK0512GPE064T-E/MR | PIC32MK1024GPE064T-I/MR | PIC32MK0512GPD064T-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Core Speed | 120 MHz | 120 MHz | 80 MHz (AEC-Q100 variant) | 120 MHz | 120 MHz |
| Flash | 512 KB | 1 MB | 512 KB | 1 MB | 512 KB |
| SRAM | 128 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +85 C |
| AEC-Q100 Qualified | No | No | Yes (AEC-Q100) | No | No |
| CAN 2.0B Modules | 2 | 2 | 2 | 2 | 2 |
| Motor-Control PWM | Yes (Enhanced) | Yes (Enhanced) | Yes (Enhanced) | Yes (Enhanced) | Reduced (GPD variant) |
Principaux différenciateurs
- Twice the Flash of standard GPD variant (vs PIC32MK0512GPD064T-I/MR)
- AEC-Q100 qualified temperature variant available (vs PIC32MK0512GPE064T-E/MR)
- 1 MB Flash superset option for memory-intensive designs (vs PIC32MK1024GPE064T-I/MR)
- On-chip USB Full-Speed PHY (vs PIC32MK0512GPK064T-I/MR)
Notes de conception
The 64-QFN package has an exposed thermal pad (EP) that MUST be soldered to the ground plane for proper thermal dissipation. Estimated: at 120 MHz full CPU load with all peripherals active, typical power dissipation is ~250 mW. For thermal headroom in enclosed industrial enclosures, allocate at least 1 square inch of top-layer copper connected to the EP, plus thermal vias (0.3 mm pitch) to inner ground planes. Without EP soldering, junction temperature can rise 30-40 C above the rated industrial range.
Place a 100 nF decoupling capacitor within 3 mm of every VDD pin and a 4.7 uF bulk capacitor at the package. For analog ADC accuracy, isolate AVdd/AVss from digital Vdd/Vss with a ferrite bead or pi-filter. Keep ADC traces away from PWM switching signals. The USB Full-Speed D+/D- traces should be routed as a 90-ohm differential pair with matching length to within 2 mm to meet USB 2.0 signal-integrity requirements.
Do not exceed VDD = 3.6 V (this part is 3.3 V-only, not 5 V tolerant on most pins). When migrating from PIC32MX, verify peripheral libraries - PIC32MK has different register maps for ADC, PWM, and QEI modules. The ICSP programming pins (PGECx/PGEDx) are shared with GPIO and must be released by firmware before in-circuit debugging works. For AEC-Q100 applications, ensure you select the -E/MR variant, not the -I/MR (industrial only).
When using the 12-bit ADC at the maximum 3.5 MSPS sample rate, place anti-aliasing filters (typically 100 kHz to 1 MHz) at each analog input. Use the device's internal ADC calibration routines at startup to correct for offset and gain errors. Avoid switching PWM outputs simultaneously with ADC sampling windows to prevent digital-coupling noise; use the device's hardware trigger synchronization between PWM and ADC to ensure deterministic sampling.
Informations de conformité
RoHS and REACH compliant per Microchip product page. -I/MR industrial grade is NOT AEC-Q100 qualified - select -E/MR variant for automotive. Halogen-free per Microchip environmental compliance documentation.
