PIC32MM0016GPL036T-I/MV - 32-bit 25MHz MCU, 16KB Flash | Microchip
Référence : PIC32MM0016GPL036T-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.27 | $227,00 |
| 500 | $2.05 | $1 025,00 |
| 1 000 | $1.82 | $1 820,00 |
PIC32MM0016GPL036T-I/MV Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripherals such as ADC, timers, communication interfaces, and GPIO. The PIC32MM family is Microchip's lowest-power and most cost-effective 32-bit PIC32 line, sitting in the taxonomy: 32-bit microcontroller -> embedded MCU -> semiconductor. It employs the MIPS32 microAptiv core, giving designers a familiar RISC instruction set while remaining compatible with the broader PIC ecosystem of MPLAB X IDE, MPLAB Harmony, and XC32 compilers.
Key features include eXtreme Low Power (XLP) sleep currents down to 500 nA, multiple ADC channels, I2S, PWM, SPI (x2), and UART peripherals, plus Core Independent Peripherals (CIP) such as CLC, MCCP, and PWM that offload tasks from the CPU. The 40-UQFN (5x5) package enables compact designs down to 4x4 mm board footprints. The 25 MHz core delivers approximately 34 DMIPS of performance at very low active current.
Typical applications include consumer IoT sensor nodes, low-cost touch interfaces, battery-powered wearables, home automation controllers, and industrial control sub-modules where low sleep current and small PCB area are critical. The "T" suffix confirms Tape & Reel packaging suitable for high-volume SMT assembly.
When designing with this device, prioritize sleep-mode usage to maximize battery life: route wake-up sources through the device's multiple interrupt-on-change (IOC) and peripheral event paths to keep the CPU dormant. Use MPLAB X IDE and the MPLAB Harmony Configurator (MHC) for clock tree and peripheral setup to minimize register-level errors.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MM family, and practical low-power design notes not found in the manufacturer datasheet alone, providing decision-ready information for cost-sensitive embedded engineers.
Alternatives de remplacement direct pour PIC32MM0016GPL036T-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MM0016GPL036T-I/MV (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Timers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MM0016GPL036-I/MV
✅ Remplacement direct✓ En stock
$1.8 / unité
Voir la fiche technique →PIC32MM0016GPL036T-I/M2
✅ Remplacement direct✓ En stock
$0.65 / unité
Voir la fiche technique →PIC32MM0064GPL036
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MM0016GPL028T-I/SS
✅ Remplacement direct✓ En stock
$0.5588 / unité
Voir la fiche technique →PIC32MM0016GPL028T-I/SO
✅ Remplacement direct✓ En stock
$0.5773 / unité
Voir la fiche technique →PIC32MM0016GPL036T-I/MV Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MM GPL |
| CPU | 32-bit |
| Maximum CPU Clock | 25 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data SRAM | 4 KB |
| Boîtier | 40-UQFN (5x5 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Sleep Current (XLP) | 500 nA (typical, per family datasheet) |
| Peripherals | ADC, I2S, PWM, SPI, SPI x2, UART |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MM0016GPL036T-I/MV 40-uqfn (5x5 mm)
Configuration des broches du PIC32MM0016GPL036T-I/MV (boîtier 40-uqfn (5x5 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MM0016GPL036T-I/MV.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MM0016GPL036T-I/MV convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health & Fitness Devices, Home Automation & Touch Control Panels, Low-Cost Industrial Control Sub-Modules, Consumer Remote Controls & Wireless HID, LED Lighting & Signage Controllers.
Battery-Powered IoT Sensor Nodes
The PIC32MM0016GPL036T-I/MV is well-suited for battery-powered IoT sensor nodes thanks to its XLP sleep current of 500 nA (typical) and Core Independent Peripherals such as CLC, MCCP, and PWM that operate without waking the CPU. Combined with the 25 MHz MIPS32 microAptiv core and 16 KB Flash, it can run sensor-fusion algorithms on-demand while spending most of its life in deep sleep. Place the device on a 2-layer PCB with a 32.768 kHz crystal on SOSC for RTC-based wake-up duty cycling; expect coin-cell battery life of 2-5 years at 1% duty cycle in typical temperature-sensor applications.
Recommandé
Wearable Health & Fitness Devices
The PIC32MM0016GPL036T-I/MV's compact 5x5 mm 40-UQFN footprint, low 500 nA sleep current, and integrated peripherals (ADC, I2S, PWM, SPI x2, UART) make it a strong fit for wearable health and fitness devices such as fitness bands, heart-rate patches, and step-counter wristbands. The MIPS32 microAptiv core at 25 MHz handles BLE radio control, accelerometer DSP, and display driving in a single device. Use the I2S peripheral to interface a digital MEMS microphone for activity classification, and route the ADC to a PPG photodiode amplifier for optical heart-rate sensing.
Recommandé
Home Automation & Touch Control Panels
For home automation wall switches, dimmer controllers, and capacitive-touch panels, the PIC32MM0016GPL036T-I/MV offers the right balance of MIPS performance, low power, and integrated peripherals. Its ADC and PWM peripherals can drive LED dimming or motor control, while the UART/SPI interfaces connect to wireless modules (e.g., Sub-GHz or BLE transceivers). The 16 KB Flash accommodates mTouch capacitive-touch firmware plus Zigbee/BLE stack shims. Use the integrated Core Independent Peripherals to debounce and time-stamp touch events without CPU wake-ups.
Recommandé
Low-Cost Industrial Control Sub-Modules
The PIC32MM0016GPL036T-I/MV serves well as the controller inside small industrial sub-modules such as sensor interface boards, fan controllers, or 4-20 mA loop-powered modules. Its industrial -40C to +85C temperature grade suits factory-floor environments, and the 25 MHz MIPS32 core easily handles Modbus RTU over UART or simple PID loops over PWM. The 40-UQFN (5x5) package fits in DIN-rail mounted sub-modules where PCB area is constrained. Use the ADC for analog sensor inputs and the PWM for proportional valve or fan-speed control.
Recommandé
Consumer Remote Controls & Wireless HID
The PIC32MM0016GPL036T-I/MV is an excellent choice for low-cost consumer remote controls and wireless HID devices such as presentation clickers, air-mouse dongles, and BLE game controllers. The 500 nA sleep current extends battery life across years of standby, and the integrated peripherals (UART, SPI x2, PWM) provide direct interfaces to RF transceivers or BLE modules. Use the Core Independent Peripherals (CLC) to implement button-matrix scanning without CPU intervention, freeing the MCU to remain in sleep until a wake event is asserted.
Recommandé
LED Lighting & Signage Controllers
For addressable LED strips, decorative lighting, and small-format signage controllers, the PIC32MM0016GPL036T-I/MV delivers sufficient performance to drive WS2812B / APA102 LED strings via SPI/PWM while maintaining a low overall BOM cost. The 5x5 mm 40-UQFN package fits in slim aluminum-channel LED controllers. The 16 KB Flash accommodates LED-effect libraries and simple DMX-512 or Art-Net parsing over UART. Use DMA-assisted SPI transfers to update long LED chains with minimal CPU overhead, leaving cycles for animation logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MM0016GPL036T-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MM0016GPL036-I/MV | PIC32MM0016GPL036T-I/M2 | PIC32MM0064GPL036 | PIC32MM0016GPL028T-I/SS | PIC32MM0016GPL028T-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit | MIPS32 microAptiv 32-bit |
| Max CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 64 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 8 KB | 4 KB | 4 KB |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tray / T&R variants | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Tape & Reel packaging format for production SMT (vs PIC32MM0016GPL036-I/MV)
- Same 40-UQFN footprint with upgradable Flash density (vs PIC32MM0064GPL036)
- 500 nA XLP sleep current - lowest in PIC32 portfolio (vs PIC32MM0016GPL028T-I/SS)
Notes de conception
Take advantage of the PIC32MM family's XLP (eXtreme Low Power) modes. Estimated: the device can achieve approximately 500 nA in deep sleep with the 32.768 kHz SOSC running for RTC and the FRC disabled. To preserve battery life, route all wake-up sources (IOC, ADC, RTCC alarm, comparators) to wake the CPU only when needed, and keep active-mode duty cycle below 1% in duty-cycled IoT applications.
The 40-UQFN (5x5 mm) package has an exposed thermal pad (EP) that must be soldered to a ground copper pour for electrical grounding and thermal dissipation. Place a 3x3 mm EP land on the top layer with at least 8 thermal vias to the inner ground plane. Decoupling: 100 nF X7R as close as possible to each VDD pin and a bulk 4.7 uF ceramic on the main supply rail.
Avoid confusing the PIC32MM GPL family with the PIC32MX or PIC32MZ families - they use different core variants and peripheral mappings. When porting code, re-validate the configuration bits against the PIC32MM GPL header file in MPLAB Harmony. Also, the 16 KB Flash variant requires careful bootloader sizing - reserve at least 4 KB for the bootloader region if in-field firmware updates are needed.
Informations de conformité
RoHS and lead-free per Microchip product page. AEC-Q100 not applicable - this is a general-purpose industrial MCU; not qualified for automotive safety-critical applications.
