PIC32MX110F016DT-I/ML - 32-bit 40MHz MCU 16KB Flash | Microchip
Référence : PIC32MX110F016DT-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.15 | $315,00 |
| 500 | $2.78 | $1 390,00 |
| 1 000 | $2.45 | $2 450,00 |
PIC32MX110F016DT-I/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals on one die. The PIC32MX110F016D specifically combines a 32-bit MIPS core (M4K) with the cost-effective peripheral set typical of Microchip's PIC32 entry-level portfolio. Within the broader taxonomy, this part sits in the hierarchy: PIC32MX1XX -> PIC32MX family -> PIC32 -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The M4K core executes most instructions in a single cycle and supports the standard MIPS32 instruction set, giving it noticeably higher throughput than 8-bit or 16-bit alternatives at similar clock rates.
Key features include an operating voltage range of 2.3V to 3.6V (3.3V typical), industrial-grade -40C to +105C temperature range, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) for graphics interfaces, two I2S/SPI modules for audio codec connectivity, a Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing, and up to 32 KB of Flash in the family. The device also integrates separate PLLs for CPU and USB clocks, two UART and I2C modules, and multiple low-power modes with less than 0.5 mA/MHz active current consumption.
The architecture uses a 5-stage pipeline with hardware multiply/divide and a deterministic interrupt controller, making the M4K core well suited to real-time control. On-chip DMA (up to 4 channels with automatic data size detection) offloads data movement from the CPU, freeing bandwidth for application code. USB 2.0 full-speed device capability is supported through the dedicated USB PLL, removing the need for an external clock source in many designs.
Typical applications include consumer electronics with USB connectivity, audio playback and processing (using I2S), low-cost graphics user interfaces via PMP, capacitive touch button or slider panels using CTMU, and general-purpose 32-bit embedded control upgrades for legacy PIC24 or PIC16 designs. The PIC32MX110F016DT-I/ML ships in tape and reel packaging for high-volume assembly.
Designers should verify pin assignment against the specific 44-QFN variant - the 'ML' suffix denotes the 8x8 mm QFN package, whereas the 'PT' suffix denotes TQFP-44. The 'T' character in the MPN indicates tape-and-reel delivery, and the 'I' indicates the -40C to +105C industrial temperature grade. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not all available in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX110F016DT-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX110F016DT-I/ML (même facteur de forme et même empreinte) — différant par MSL Level, Operating Temperature Range, Package, Core Architecture, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX110F016BT-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX110F016CT-I/TL
✅ Remplacement direct✓ En stock
$1.84 / unité
Voir la fiche technique →PIC32MX210F016DT-I/ML
✅ Remplacement direct✓ En stock
$2.78 / unité
Voir la fiche technique →PIC32MX110F016D-I/PT
✅ Remplacement direct✓ En stock
$1.84 / unité
Voir la fiche technique →PIC32MX110F016DT-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| CPU Bit Width | 32-bit |
| Maximum CPU Clock | 40 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +105 C (Industrial) |
| Boîtier | 44-pin QFN (8x8 mm) with exposed pad |
| USB | USB 2.0 Full-Speed Device (with dedicated PLL) |
| UART Modules | 2 |
| I2C Modules | 2 |
| SPI Modules | 2 (I2S/SPI capable) |
| PMP (Parallel Master Port) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| DMA Channels | Up to 4 |
| CTMU (Capacitive Touch) | Yes (mTouch support) |
| Active Current Consumption | Less than 0.5 mA/MHz |
| Type de montage | Surface Mount |
| Niveau MSL | 1 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX110F016DT-I/ML
| Broche 1 | RP5/RD5 — Remappable I/O / port D bit 5 |
| Broche 2 | RP6/RD6 — Remappable I/O / port D bit 6 |
| Broche 3 | RP7/RD7 — Remappable I/O / port D bit 7 |
| Broche 4 | RP8/RD8 — Remappable I/O / port D bit 8 |
| Broche 5 | VSS — Ground reference |
| Broche 6 | OSC1/RC12 — Crystal oscillator input or remappable I/O |
| Broche 7 | OSC2/RC13 — Crystal oscillator output or remappable I/O |
| Broche 8 | SOSCO/RC14 — Secondary oscillator or remappable I/O |
| Broche 9 | SOSCI/RC15 — Secondary oscillator input or remappable I/O |
| Broche 10 | VSS — Ground reference |
| Broche 11 | VDD — Positive supply (2.3-3.6 V) |
| Broche 12 | RP15/RB15 — Remappable I/O / port B bit 15 |
| Broche 13 | RB14 — Port B bit 14 (PPS-capable on this family) |
| Broche 14 | RB13 — Port B bit 13 |
| Broche 15 | RB12 — Port B bit 12 |
| Broche 16 | RB11 — Port B bit 11 |
| Broche 17 | RB10 — Port B bit 10 |
| Broche 18 | RB9 — Port B bit 9 |
| Broche 19 | RB8 — Port B bit 8 |
| Broche 20 | RB7 — Port B bit 7 |
| Broche 21 | RB6 — Port B bit 6 |
| Broche 22 | RB5 — Port B bit 5 |
| Broche 23 | RB4 — Port B bit 4 |
| Broche 24 | RB3 — Port B bit 3 |
| Broche 25 | RB2 — Port B bit 2 |
| Broche 26 | RB1 — Port B bit 1 |
| Broche 27 | RB0 — Port B bit 0 |
| Broche 28 | RA15 — Port A bit 15 |
| Broche 29 | RA14 — Port A bit 14 |
| Broche 30 | RA9 — Port A bit 9 |
| Broche 31 | VSS — Ground reference |
| Broche 32 | VDD — Positive supply (2.3-3.6 V) |
| Broche 33 | RA0 — Port A bit 0 |
| Broche 34 | RA1 — Port A bit 1 |
| Broche 35 | RA2 — Port A bit 2 |
| Broche 36 | RA3 — Port A bit 3 |
| Broche 37 | RA4 — Port A bit 4 |
| Broche 38 | RA5 — Port A bit 5 |
| Broche 39 | RA6 — Port A bit 6 |
| Broche 40 | RA7 — Port A bit 7 |
| Broche 41 | D+/RG2 — USB D+ line or remappable I/O |
| Broche 42 | D-/RG3 — USB D- line or remappable I/O |
| Broche 43 | VUSB — USB transceiver supply |
| Broche 44 | VSS — Ground reference |
| Broche EP | EP — Exposed thermal pad - must be soldered to PCB ground for thermal/electrical performance |
Applications typiques
PIC32MX110F016DT-I/ML convient pour 6 applications: USB HID / CDC Consumer Devices, Audio Playback / I2S DAC Front-End, Capacitive Touch Panels with mTouch, Low-Cost Graphics HMI via PMP, Industrial Sensor Hub with USB/UART, Migration Path from PIC24 / PIC16 Designs.
USB HID / CDC Consumer Devices
The PIC32MX110F016DT-I/ML is well matched to USB HID, CDC, or vendor-class consumer peripherals because the on-chip USB 2.0 full-speed device controller with a dedicated USB PLL removes the need for an external oscillator or transceiver. Its 40 MHz MIPS32 M4K core has sufficient bandwidth to run the USB stack plus application code simultaneously, while 16 KB Flash holds the MPLAB Harmony USB CDC or HID firmware with room for product-specific extensions. The 4 KB SRAM supports HID report buffering or CDC line-state handling without DMA pressure. Placed as the system MCU between a USB connector and application-specific sensors, it converts USB traffic into local control signals with deterministic interrupt latency under 100 ns, far better than emulated USB on 8-bit cores.
Recommandé
Audio Playback / I2S DAC Front-End
The PIC32MX110F016DT-I/ML drives an external I2S DAC via its two I2S/SPI modules, making it suitable for low-cost network audio players, Bluetooth audio sink controllers, or simple MP3 playback boards. The DMA controller (up to 4 channels) offloads I2S sample streaming from the CPU, freeing the 40 MHz M4K core for decoding, volume control, and user-interface logic. With 4 KB SRAM, the part buffers roughly 23 ms of 44.1 kHz 16-bit stereo audio directly from DMA, and Flash holds the codec plus a small filesystem layer. Operating from 2.3-3.6 V lets it share the same LDO rail as the I2S DAC, simplifying the BOM.
Recommandé
Capacitive Touch Panels with mTouch
The PIC32MX110F016DT-I/ML integrates a Charge Time Measurement Unit (CTMU) and supports Microchip's mTouch capacitive touch library, enabling touch buttons, sliders, and proximity sensors without an external touch IC. The CTMU measures capacitance changes at the I/O pins, and the M4K core resolves the delta to detect touch events. Industrial-grade -40C to +105C operation means the touch panel works across automotive and appliance temperature ranges. With 16 KB Flash and DMA, the part simultaneously scans 10-20 touch electrodes and runs the host communication stack (UART, I2C, or USB) on the same die.
Recommandé
Low-Cost Graphics HMI via PMP
The Parallel Master Port (PMP) on the PIC32MX110F016DT-I/ML drives small parallel TFT or OLED panels directly, enabling graphical HMIs on appliances, instruments, and consumer products without a dedicated graphics controller. PMP supports 8/16-bit interfaces with a typical 40 MHz throughput that matches small 320x240 QVGA panels. The 16 KB Flash accommodates the Microchip Graphics Library plus a UI, while the 4 KB SRAM holds the framebuffer line or tile buffer. Compared with SPI-display solutions, PMP at 40 MHz refreshes the screen 5-10x faster, eliminating visible flicker during animations.
Recommandé
Industrial Sensor Hub with USB/UART
The PIC32MX110F016DT-I/ML acts as a multi-sensor hub in industrial monitoring: it aggregates I2C sensors (temperature, pressure, accelerometer) over its two I2C ports, buffers data in 4 KB SRAM, and streams it via USB CDC or UART to a host PC or PLC. Its -40C to +105C industrial temperature rating supports factory-floor and outdoor enclosures. The DMA controller offloads I2C reads, freeing the 40 MHz core for calibration and protocol overhead. 16 KB Flash holds USB CDC firmware plus custom protocol layers, while PPS remaps I2S, UART, or SPI to multiple pins to avoid PCB routing conflicts.
Recommandé
Migration Path from PIC24 / PIC16 Designs
The PIC32MX110F016DT-I/ML is a natural migration target for legacy PIC24 or PIC16 designs that have outgrown 8/16-bit performance or memory limits. It shares the MPLAB X IDE, XC32 toolchain, and Harmony framework with the broader PIC32 family, while preserving the peripheral programming model familiar to PIC24/16 developers. 16 KB Flash and 4 KB SRAM deliver 2-4x the memory of mid-range PIC24F parts, and the 40 MHz M4K core offers 1.25 DMIPS/MHz class performance. The 44-QFN ML package fits the same board area as many PIC24 TQFP-44 designs with simple footprint adaptation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX110F016DT-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX110F016BT-I/ML | PIC32MX110F016CT-I/TL | PIC32MX210F016DT-I/ML | PIC32MX110F016D-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) with EP | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-TQFP (10x10 mm) - different footprint |
| Core | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit |
| Max CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | Up to 16 KB | 4 KB |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) |
| USB | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device + more peripherals | USB 2.0 FS Device |
Principaux différenciateurs
- On-chip USB 2.0 full-speed with dedicated PLL (vs PIC32MX110F016D-I/PT)
- Cost-optimized entry point of PIC32MX1XX/2XX family (vs PIC32MX210F016DT-I/ML)
- Industrial -40C to +105C temperature grade standard (vs PIC32MX110F016BT-I/ML (rev B silicon))
Notes de conception
The 44-QFN (8x8 mm) package relies on the exposed pad (EP) for thermal and electrical conduction. The EP must be soldered to a PCB copper pad with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch) connecting to an internal ground plane. Without proper EP soldering, junction-to-ambient thermal resistance rises and the part may throttle or fail under sustained USB or PMP bus activity at industrial temperatures. Estimated theta_JA of the package is approximately 28 C/W when EP is soldered to a 1 square inch copper pour; the figure exceeds 60 C/W without EP soldering.
Decouple the VDD pins with a 100 nF ceramic capacitor placed within 3 mm of each VDD pin, plus a bulk 4.7 uF or 10 uF tantalum/ceramic capacitor on the main 3.3 V rail. The PIC32MX1XX/2XX datasheet specifies that VDD rise time must be monotonic between 0.3 V and 2.3 V; a slow rise can trigger the brown-out reset unpredictably. Tie the MCLR pin to VDD through a 10 kohm pull-up and to ground through a 10 nF capacitor for hardware reset stability.
Place the 40 MHz crystal or resonator within 5 mm of the OSC1/OSC2 pins, with ground guards on both sides of the traces to reduce EMI pickup. Route USB D+ and D+ lines as a 90 ohm differential pair with length matching within 2 mm, and place the VUSB decoupling capacitor (typically 0.1 uF) within 2 mm of the VUSB pin. Avoid routing noisy digital signals across the QFN EP pad area to prevent ground-bounce coupling into the analog reference.
Do not assume any two PIC32MX110 silicon revisions (B, C, D, E) share identical errata - always check the silicon errata document for the specific device revision marked on the package before finalizing firmware. When migrating firmware from a TQFP-44 (PT) prototype to a QFN-44 (ML) production board, verify that the EP pad is fully soldered and that the QFN ground pin count matches your PCB ground plane stitching.
USB 2.0 full-speed signalling requires the D+/D- trace impedance to be 90 ohms differential with reference to the ground plane. On a 4-layer FR4 stackup, this is typically achievable with 0.20 mm wide traces over a 0.20 mm core. Place a ferrite bead on the VUSB supply to filter high-frequency noise from the USB cable. Keep total D+/D- trace length under 50 mm to meet USB signal-integrity requirements.
Informations de conformité
RoHS and lead-free compliant per Microchip product page. Halogen-free status not stated in provided web data. AEC-Q100 not applicable - this is a general-purpose MCU; Microchip PIC32MX variants with '-e' suffix typically target automotive grades.
