PIC32MX130F064D-V/TL - 40MHz 32-bit MCU 64KB Flash | Microchip
Référence : PIC32MX130F064D-V/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.92 | $3,92 |
| 10 | $3.53 | $35,30 |
| 100 | $3.13 | $313,00 |
| 500 | $2.81 | $1 405,00 |
| 1 000 | $2.55 | $2 550,00 |
PIC32MX130F064D-V/TL Présentation
A 32-bit microcontroller (MCU) is an integrated processing core that combines a CPU, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single die. The PIC32MX130F064D belongs to the PIC32MX1xx/2xx family, which sits in the PIC32 -> 32-bit MCU -> microcontroller -> embedded processor hierarchy. These devices target cost-sensitive embedded applications that need MIPS-class computational throughput without the overhead of higher-tier application processors.
Key features include the Peripheral Pin Select (PPS) function that remaps digital peripherals to any remappable I/O pin, two I2S/SPI modules for codec and serial communication, a Parallel Master Port (PMP) for graphics interfaces, and support for mTouch capacitive touch buttons and sliders via the on-chip Charge Time Measurement Unit (CTMU). The 5 general-purpose 16-bit timers and a 1 ns high-resolution time measurement block make the device well suited to motor control, switching power conversion, and precision timing tasks.
Architecturally, the device uses the MIPS32 M4K core with single-cycle multiply, hardware multiply-accumulate, and a 5-stage pipeline that delivers 1.56 DMIPS/MHz. Five parallel ports provide up to 34 general-purpose I/O lines, and on-chip peripherals include a 10-bit 1 Msps ADC, comparators, and an integrated temperature sensor. The device also supports USB 2.0 full-speed device/host/OTG on select family members and DMA for peripheral-cycle-stealing transfers.
Typical applications include automotive body and infotainment subsystems (instrument clusters, HVAC, lighting controllers), industrial HMI panels with graphics, USB consumer devices, capacitive touch user interfaces, and low-cost audio peripherals. The wide temperature grade and AEC-Q100 qualification also make it a fit for chassis and sensor-interface ECUs.
When designing with this MCU, allocate the exposed pad (EP) as a top-side copper pour stitched with thermal vias to the ground plane to keep junction temperature below 125 C under full peripheral load. Decouple each VDD/VSS pair with a 100 nF X7R placed within 3 mm of the pin, and add a bulk 4.7 uF tantalum or ceramic capacitor adjacent to the highest-current supply pin.
This page synthesizes distributor pricing, drop-in alternatives sourced from Microchip's PIC32MX family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers shorten selection and bring-up time for cost-sensitive 32-bit embedded designs.
Alternatives de remplacement direct pour PIC32MX130F064D-V/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX130F064D-V/TL (même facteur de forme et même empreinte) — différant par ADC, DMA Channels, Package, Operating Temperature, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX130F064DT-V/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX130F064C-I/TL
✅ Remplacement direct✓ En stock
$1.82 / unité
Voir la fiche technique →PIC32MX130F064CT-I/TL
✅ Remplacement direct✓ En stock
$3.2 / unité
Voir la fiche technique →PIC32MX120F064H-V/MR
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC32MX120F032D-V/TL
✅ Remplacement direct✓ En stock
$1.85 / unité
Voir la fiche technique →PIC32MX120F032DT-V/TL
✅ Remplacement direct✓ En stock
$2.66 / unité
Voir la fiche technique →PIC32MX130F064D-V/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 40 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Data Memory (SRAM) | 16 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Active Current | < 0.5 mA/MHz |
| I/O Pins (max) | 21 to 34 (family dependent) |
| Boîtier | 44-VTLA (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +105 C (automotive V grade) |
| Automotive Qualification | AEC-Q100 |
| Communication Interfaces | I2C, IrDA, LINbus, PMP, SPI, UART/USART, I2S |
| ADC | 10-bit, up to 1 Msps (per family datasheet) |
| Timers | 5 x 16-bit general purpose + 1 ns resolution CTMU |
| Peripheral Pin Select | Yes (PPS) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC32MX130F064D-V/TL
| Broche 1 | RPB0/AN0 — Remappable I/O, analog input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, analog input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, analog input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, analog input 3 |
| Broche 5 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 6 | VSS — Ground reference |
| Broche 7 | RPB4/AN4 — Remappable I/O, analog input 4 |
| Broche 8 | RPB5/AN5 — Remappable I/O, analog input 5 |
| Broche 9 | RPB6/AN6 — Remappable I/O, analog input 6 |
| Broche 10 | RPB7/AN7 — Remappable I/O, analog input 7 |
| Broche 11 | VSS — Ground reference |
| Broche 12 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 13 | RPA0 — Remappable I/O port A bit 0 |
| Broche 14 | RPA1 — Remappable I/O port A bit 1 |
| Broche 15 | RPA2 — Remappable I/O port A bit 2 |
| Broche 16 | RPA3 — Remappable I/O port A bit 3 |
| Broche 17 | RPB8 — Remappable I/O port B bit 8 |
| Broche 18 | RPB9 — Remappable I/O port B bit 9 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 21 | RPB10 — Remappable I/O port B bit 10 |
| Broche 22 | RPB11 — Remappable I/O port B bit 11 |
| Broche 23 | RPB12 — Remappable I/O port B bit 12 |
| Broche 24 | RPB13 — Remappable I/O port B bit 13 |
| Broche 25 | RPB14 — Remappable I/O port B bit 14 |
| Broche 26 | RPB15 — Remappable I/O port B bit 15 |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 29 | RPC0 — Remappable I/O port C bit 0 |
| Broche 30 | RPC1 — Remappable I/O port C bit 1 |
| Broche 31 | RPC2 — Remappable I/O port C bit 2 |
| Broche 32 | RPC3 — Remappable I/O port C bit 3 |
| Broche 33 | RPC4 — Remappable I/O port C bit 4 |
| Broche 34 | RPC5 — Remappable I/O port C bit 5 |
| Broche 35 | RPC6 — Remappable I/O port C bit 6 |
| Broche 36 | RPC7 — Remappable I/O port C bit 7 |
| Broche 37 | RPC8 — Remappable I/O port C bit 8 |
| Broche 38 | RPC9 — Remappable I/O port C bit 9 |
| Broche 39 | VSS — Ground reference |
| Broche 40 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 41 | OSC1/CLKI — External oscillator input or system clock input |
| Broche 42 | OSC2/CLKO — External oscillator output or system clock output |
| Broche 43 | MCLR — Master clear reset (active-low) |
| Broche 44 | PGED1 — Programming/debug data line 1 |
| Broche EP | EP — Exposed thermal pad - must be soldered to ground plane |
Applications typiques
PIC32MX130F064D-V/TL convient pour 7 applications: Automotive Body Control Module, Industrial HMI with Graphics Display, USB Audio Dongle / Headset Controller, Capacitive Touch User Interface, Sensor Hub / IoT Edge Node, Battery Charger / Power Conversion Controller, Medical Patient Monitoring Accessory.
Automotive Body Control Module
The PIC32MX130F064D-V/TL fits automotive body ECUs because of its AEC-Q100 qualification, -40 C to +105 C V temperature grade, and 16 KB SRAM that comfortably holds a LIN stack plus body-control state machine. Its 21 I/O and Peripheral Pin Select (PPS) simplify PCB routing when the same MCU drives window lifts, mirror folds, lighting FETs, and a LINbus master concurrently. The 40 MHz MIPS32 M4K core delivers 1.56 DMIPS/MHz, enough to debounce contacts, drive PWM lighting at 200 Hz, and serve a UDS diagnostic stack without external memory. Designers should allocate the 44-VTLA exposed pad as a continuous copper pour stitched with thermal vias to the chassis ground, and pair each VDD/VSS pair with a 100 nF X7R placed within 3 mm of the pin. CAN/LIN transceivers such as the MCP2551 and TJA1027 are typical companion parts on the same PCB.
Recommandé
Industrial HMI with Graphics Display
The PIC32MX130F064D-V/TL is well matched to entry-level industrial HMIs thanks to its Parallel Master Port (PMP) that drives TFT panels directly and its 5 general-purpose 16-bit timers for backlight PWM and touch-sensing. The 64 KB Flash stores graphic assets and an emWin or Microchip Harmony menu stack, while the 16 KB SRAM holds two full framebuffers for a small QVGA display. The 1 ns resolution CTMU enables reliable mTouch capacitive button scanning even through 3 mm glass, and PPS lets the designer remap SPI to any spare pin to bring out a Wi-Fi or BLE module. Typical reference designs pair the part with a 2.4 inch QVGA TFT, an AT25F081 flash for assets, and a TI ISO1050 isolated CAN transceiver for industrial networking. The exposed-pad 44-VTLA footprint keeps the PCB compact enough for panel-mount bezels as small as 70 mm.
Recommandé
USB Audio Dongle / Headset Controller
The PIC32MX130F064D-V/TL can serve as the main controller of a USB audio dongle by combining its 40 MHz MIPS32 M4K core, two I2S/SPI modules for codec interfacing, and USB 2.0 full-speed device support on the same die. The 16 KB SRAM buffers USB isochronous packets and runs a software-based 48 kHz/16-bit stereo path with headroom for volume control and basic EQ. I2S feeds an external DAC such as the PCM5102A while the UART serves headphone-button HID reports. Its compact 44-VTLA 6x6 mm package and < 0.5 mA/MHz active current let designers ship a dongle under 10 mA average draw, satisfying bus-powered USB specs. A 3.3 V LDO such as the MCP1700 and an ESD array such as the USBLC6-2SC6 are typical companion parts.
Recommandé
Capacitive Touch User Interface
The PIC32MX130F064D-V/TL leverages the on-chip Charge Time Measurement Unit (CTMU) to implement mTouch capacitive touch buttons, sliders, and proximity sensors with 1 ns time resolution. Up to 21 I/O can serve as touch channels directly without an external touch IC, dramatically reducing BOM cost for appliances, lighting controls, and consumer devices. The 40 MHz core handles scanning a 12-button keypad plus a 100-step slider in well under 5 ms, leaving the rest of the cycle for application logic. Designers pair the MCU with the MCP1700 3.3 V LDO and a TI TPD2E001 ESD diode, while a small SPI flash stores GUI assets and slider calibration. The 44-VTLA footprint keeps the front-panel PCB under 25 x 25 mm, suitable for white-goods control boards.
Recommandé
Sensor Hub / IoT Edge Node
The PIC32MX130F064D-V/TL fits battery-powered IoT edge nodes because of its < 0.5 mA/MHz active current, sleep modes that drop draw below 50 uA, and 40 MHz core that lets the device wake, sample, and return to sleep quickly to maximize battery life. The 16 KB SRAM buffers sensor data from SPI or I2C sensors, and the 64 KB Flash stores a small TLS client plus a publish/subscribe MQTT stack. The two I2S/SPI blocks can simultaneously drive an SPI MEMS accelerometer and an I2C environmental sensor, while PPS remaps the UART to drive an external Wi-Fi or LoRa module. The AEC-Q100 qualification also lets the same firmware run in automotive telematics nodes. Typical companions include the Bosch BMI270 IMU, the Sensirion SHT31 humidity sensor, and the TI CC3100 Wi-Fi processor.
Recommandé
Battery Charger / Power Conversion Controller
The PIC32MX130F064D-V/TL fits digital control loops for switch-mode power supplies and battery chargers because of its 1 ns resolution CTMU for high-resolution duty-cycle measurement, 5 general-purpose 16-bit timers for PWM generation, and 40 MHz MIPS32 M4K core that runs a 10 kHz control loop with margin for adaptive algorithms. The 10-bit 1 Msps ADC samples current and voltage feedback, while the 21 I/O drive synchronous-rectifier FETs, fan control, and an I2C battery monitor such as the BQ27520. The PIC32 can implement CC/CV charge profiles for 1- to 4-cell Li-Ion packs or a peak-power-tracking MPPT for small solar chargers. The AEC-Q100 grade and -40 C to +105 C operation also support under-the-hood and industrial charger deployments. The 44-VTLA footprint keeps the power board compact enough for 50 W adapters.
Recommandé
Medical Patient Monitoring Accessory
The PIC32MX130F064D-V/TL supports medical accessory designs such as portable pulse oximeters, bedside display interfaces, and patient entertainment peripherals where reliability and a compact footprint are critical. Its 16 KB SRAM buffers filtered PPG or ECG waveforms and runs the heart-rate algorithm, while 64 KB Flash stores calibration tables and the USB HID stack. The 40 MHz MIPS32 M4K core achieves 1.56 DMIPS/MHz, leaving headroom for SpO2 or respiration-rate extraction without an external DSP. AEC-Q100 qualification gives confidence in long-term reliability, even when the design is IEC 60601-1 compliant at the system level. Designers typically pair it with an AFE such as the AFE4400 for SpO2, an OLED display driven via PMP, and a TI ISO3082 isolated UART for bedside-monitor tethering.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX130F064D-V/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Prefer the PIC32MX130F064DT-V/TL if you need the same silicon in tape-and-reel packing for high-volume SMT lines. Choose the PIC32MX130F064C-I/TL when 8 KB SRAM is enough and you can accept industrial -40 C to +85 C, saving cost in non-automotive designs. Reach for the PIC32MX120F064H-V/MR or PIC32MX120F032D-V/TL only when you must second-source across PIC32MX1xx/2xx generations, keeping in mind the 120-series has a slightly reduced peripheral set. The PIC32MX130F064B-V/ML is NOT a drop-in substitute because it ships in a different package.
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX130F064DT-V/TL | PIC32MX130F064C-I/TL | PIC32MX130F064CT-I/TL | PIC32MX120F064H-V/MR | PIC32MX120F032D-V/TL | PIC32MX120F032DT-V/TL |
|---|---|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| SRAM | 16 KB | 16 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Maximum Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Temperature Grade | -40 C to +105 C (V, AEC-Q100) | -40 C to +105 C (V, AEC-Q100) | -40 C to +85 C (I, industrial) | -40 C to +85 C (I, industrial) | -40 C to +105 C (V, AEC-Q100) | -40 C to +105 C (V, AEC-Q100) | -40 C to +105 C (V, AEC-Q100) |
| Packing Format | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tray | Tape & Reel |
| AEC-Q100 Qualified | Yes | Yes | No (industrial grade) | No (industrial grade) | Yes | Yes | Yes |
Principaux différenciateurs
- True drop-in 44-VTLA 6x6 mm automotive-grade variant with 16 KB SRAM (vs PIC32MX130F064B-V/ML)
- Highest SRAM density in the 64 KB Flash PIC32MX130 V/TL family (vs PIC32MX130F064C-I/TL)
- Maximum Flash headroom in the 44-VTLA 6x6 mm PIC32 footprint (vs PIC32MX120F032D-V/TL)
Notes de conception
The 44-VTLA package dissipates heat primarily through the exposed pad (EP) on the bottom of the die. Estimated: at 40 MHz with all peripherals active and 16 KB SRAM write traffic, junction-to-ambient thermal resistance (theta_JA) is approximately 28 C/W on a 4-layer JEDEC EIA/JESD51 test board with a 25 x 25 mm EP copper pour. Designers must connect the EP to a continuous ground plane and stitch it with a 3 x 3 array of 0.3 mm thermal vias on 1.2 mm pitch. Without the EP copper, junction temperature can exceed 125 C under full peripheral load, triggering thermal-shutdown and reducing long-term reliability. For high-power applications, increase the EP copper area to at least 100 mm^2 and add airflow if the enclosure permits.
Decoupling on the PIC32MX130F064D-V/TL must be placed within 3 mm of every VDD/VSS pair on the 44-VTLA package. Recommended: a 100 nF X7R 0402 or 0603 ceramic on each of the six VDD pins (1, 5, 12, 20, 28, 40) plus a single 4.7 uF X5R bulk capacitor adjacent to the highest-current VDD pin. Place a 10 uF tantalum or ceramic at the regulator output and a ferrite bead in series with analog VDD if the design uses the internal 1.8 V regulator. Keep clock traces (OSC1/OSC2) shorter than 10 mm and guard them with a ground ring to limit radiated emissions below EN 55022 class B limits.
When using Peripheral Pin Select (PPS), map high-frequency peripherals (SPI SCK, I2S BCLK) to pins adjacent to a quiet ground reference and route them over a continuous ground plane. Avoid placing PPS signals adjacent to the ADC analog inputs (AN0-AN7) to limit digital crosstalk below the 10-bit ADC noise floor. For USB designs, route the D+/D- pair as a 90 ohm differential with no more than two via transitions, and place the 27 ohm series-termination resistors within 4 mm of the MCU pins. The MCLR pin requires a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for in-circuit serial programming (ICSP) reliability.
Do not assume that all 44-pin PIC32 variants are drop-in compatible - the PIC32MX130F064B-V/ML uses a 44-VQFN 8x8 mm package with a different pinout even though it is a similar Flash/SRAM size, so re-spinning the PCB would be required. Likewise, the PIC32MX130F064D-I/PT is in a 44-TQFP package, not a 44-VTLA. Always verify both the datasheet pinout drawing and the land-pattern dimensions before placing a second-source part. For PPS remapping, do not remap the same peripheral function to two pins simultaneously - this causes bus contention and undefined behavior. Finally, when migrating from -I (industrial) to -V (automotive) variants, double-check that your application firmware enables the higher-temperature brown-out reset threshold.
The PIC32MX130F064D-V/TL has multiple power-saving modes that can drop active current from approximately 20 mA (full active at 40 MHz) to under 50 uA in sleep with the RTCC running. For battery-powered designs, use the on-chip Low-Power Sleep mode and wake on a CTMU touch event or a UART edge to maximize battery life. The internal 1.8 V regulator requires a 10 uF tantalum or ceramic capacitor on the VCAP pin for stability - using a smaller value causes core voltage droop and resets. If the design must run continuously at 40 MHz, derate VDD to 3.0 V to limit active current to approximately 18 mA and reduce internal switching losses.
Informations de conformité
AEC-Q100 qualified per Microchip product page for automotive V temperature grade (-40 C to +105 C). RoHS and lead-free compliant. Halogen-free status not stated in verified data - marked unknown. Conflict-minerals reporting compliant per Microchip's standard CMRT filings.
