PIC32MX170F256B-50I/ML - 50MHz, 256KB Flash 32-bit MCU | Microchip
Référence : PIC32MX170F256B-50I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.4 | $5,40 |
| 10 | $4.86 | $48,60 |
| 100 | $4.32 | $432,00 |
| 500 | $3.89 | $1 945,00 |
| 1 000 | $3.46 | $3 460,00 |
PIC32MX170F256B-50I/ML Présentation
A 32-bit microcontroller (MCU) is an integrated processor core, program memory (Flash), data memory (SRAM), and a configurable set of peripherals (ADC, timers, communication interfaces, I/O) on a single die. Within the broader taxonomy, the PIC32MX170 sits as: MCU -> 32-bit MCU -> MIPS M4K MCU -> PIC32MX1xx/2xx family. This family targets cost-sensitive embedded applications that need higher performance than 8/16-bit MCUs but with simpler toolchains and lower cost than Cortex-M4 designs.
Key features of this part include 0.5 mA/MHz typical core current consumption, Peripheral Pin Select (PPS) for flexible peripheral-to-pin mapping, mTouch capacitive touch sensing support, 1 ns high-resolution time measurement (via Input Capture), on-chip temperature measurement diode, and an operating voltage range of 2.3V to 3.6V. The 28-QFN package provides a small 6x6 mm footprint suitable for space-constrained designs.
Architecturally, the PIC32MX170 uses the MIPS32 M4K Harvard core with 5-stage pipeline, separate 16 KB instruction and 4 KB data caches, hardware multiply/divide, and a single-cycle 32-bit ALU. Code execution is linear across 256 KB Flash; SRAM is 64 KB, sufficient for USB stacks, audio buffers, and graphical user interfaces. The 50 MHz core delivers 83 DMIPS, placing it well above 8-bit PIC16/PIC18 devices for DSP-style filtering or audio decoding workloads.
Typical applications include USB peripherals (HID, CDC, mass storage), audio playback with I2S codecs, low-cost graphical HMI panels using PMP and an LCD, capacitive touch user interfaces, and consumer/industrial control with on-board ADC monitoring. The on-chip temperature sensor also suits environmental monitoring nodes.
When designing with this part, ensure 2.3V-3.6V rail regulation with adequate bulk and decoupling (100 nF near every VDD pin plus 10 uF bulk). For USB, the internal transceiver needs the proper 90 ohm differential impedance on D+/D-. The PPS remap registers must be unlocked and configured before first peripheral use, otherwise peripherals stay on default pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with parametric data anchored to Microchip datasheet DS60001168L.
Alternatives de remplacement direct pour PIC32MX170F256B-50I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX170F256B-50I/ML (même facteur de forme et même empreinte) — différant par ADC, Package, USB, Operating Voltage, Flash Program Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX170F256B-I/ML
✅ Remplacement direct✓ En stock
$3.25 / unité
Voir la fiche technique →PIC32MX170F256B-50I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Core Frequency | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 10-bit, up to 28 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG/Device/Host |
| I2S / SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Supported |
| On-chip Temperature Sensor | Yes |
| Typical Core Current | 0.5 mA/MHz |
| Operating Temperature (Industrial) | -40C to +85C |
| Boîtier | 28-QFN (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC32MX170F256B-50I/ML
| Broche 1 | VDD — Positive supply voltage (2.3V to 3.6V) |
| Broche 2 | RA0 — I/O port A bit 0 / AN0 / VREF+ |
| Broche 3 | RA1 — I/O port A bit 1 / AN1 / VREF- |
| Broche 4 | RB0 — I/O port B bit 0 / PGED1 / AN2 |
| Broche 5 | RB1 — I/O port B bit 1 / PGEC1 / AN3 |
| Broche 6 | RB2 — I/O port B bit 2 / AN4 |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RB3 — I/O port B bit 3 / AN5 |
| Broche 9 | RB4 — I/O port B bit 4 / AN6 |
| Broche 10 | RB5 — I/O port B bit 5 / AN7 |
| Broche 11 | RB6 — I/O port B bit 6 / AN8 / OC1 |
| Broche 12 | RB7 — I/O port B bit 7 / AN9 / OC2 |
| Broche 13 | VSS — Ground reference |
| Broche 14 | VDD — Positive supply voltage |
| Broche 15 | RB8 — I/O port B bit 8 / AN10 |
| Broche 16 | RB9 — I/O port B bit 9 / AN11 |
| Broche 17 | RC0 — I/O port C bit 0 |
| Broche 18 | RC1 — I/O port C bit 1 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | RC2 — I/O port C bit 2 |
| Broche 21 | RC3 — I/O port C bit 3 |
| Broche 22 | RC4 — I/O port C bit 4 |
| Broche 23 | RC5 — I/O port C bit 5 |
| Broche 24 | D- — USB D- differential data line |
| Broche 25 | D+ — USB D+ differential data line |
| Broche 26 | RC6 — I/O port C bit 6 |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply voltage |
| Broche 29 | EP — Exposed thermal pad - connect to VSS for thermal dissipation |
Applications typiques
PIC32MX170F256B-50I/ML convient pour 6 applications: USB Human Interface Device (HID), Audio Playback with I2S Codec, Low-Cost Graphical HMI with PMP, Capacitive Touch User Interface, Industrial Sensor Monitoring Node, USB Audio Device (Headset / VoIP).
USB Human Interface Device (HID)
The PIC32MX170F256B-50I/ML is an excellent fit for USB HID peripherals such as custom keyboards, mice, game controllers, and joysticks. Its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver eliminates the need for an external PHY, while 256 KB Flash accommodates USB stacks (HID, CDC, or vendor-class) plus application code, and 64 KB SRAM provides HID report buffers and protocol scratch space. The 50 MHz MIPS32 M4K core delivers 83 DMIPS - ample headroom for HID descriptor parsing, LED animation, and matrix-scan debouncing in real time. Designers should pay attention to the 90 ohm differential impedance requirement on D+/D- and provide proper ESD protection (TVS array) on the USB connector lines, since the PIC32MX170's USB pins have limited ESD rating without external protection.
Recommandé
Audio Playback with I2S Codec
The PIC32MX170F256B-50I/ML fits well for low-cost audio playback or recording appliances using external I2S codecs. It provides two dedicated I2S/SPI modules, which support standard audio sample rates (8 kHz to 48 kHz at 16-bit) when clocked from the on-chip Reference Clock Output (REFO) or an external master clock. The 64 KB SRAM can hold stereo buffers of approximately 1.5 seconds at 16-bit/44.1 kHz, enough for click-track buffers, voice prompts, or short effect tails. The 83 DMIPS core runs MP3 or ADPCM decoding from SPI Flash in real time. Designers should use DMA on the I2S module to free the CPU for codec control, and ensure MCLK is a low-jitter source (the internal PLL with proper FRC tuning is acceptable for cost-sensitive designs).
Recommandé
Low-Cost Graphical HMI with PMP
For graphical HMI panels with small TFT or OLED displays, the PIC32MX170F256B-50I/ML integrates a Parallel Master Port (PMP) that can drive 8-bit parallel interfaces to common displays (ST7735, ILI9341, SSD1963) at reasonable refresh rates. Combined with 64 KB SRAM for framebuffers and 83 DMIPS compute, it can run LVGL or Microchip's MLA graphics library to render menus, gauges, and simple animations. The 50 MHz core also handles button/slider input via the mTouch capacitive touch peripheral and ADC, enabling single-chip HMI designs. Designers should reserve one PMP chip-select pin for the display and configure PPS to remap touch-sensing inputs away from PMP data lines to avoid contention.
Recommandé
Capacitive Touch User Interface
The PIC32MX170F256B-50I/ML supports Microchip's mTouch capacitive touch sensing through the on-chip Charge Time Measurement Unit (CTMU), enabling touch buttons, sliders, and wheels with no external touch IC. Up to 28 ADC channels can serve as touch sensors directly, simplifying PCB layout for appliances, white goods, and consumer products. The 256 KB Flash holds touch libraries plus application logic, while 83 DMIPS guarantees fast touch-scan cycles (<5 ms for a 16-button panel). Designers should follow Microchip AN1250 (mTouch Layout Guidelines) for sensor trace routing, guard ring placement, and use the dedicated CTMU calibration routine at startup to compensate for temperature drift.
Recommandé
Industrial Sensor Monitoring Node
The PIC32MX170F256B-50I/ML is well suited for industrial sensor monitoring nodes that read multiple analog signals and communicate results over USB, UART, or SPI. Its 10-bit 1 Msps ADC with up to 28 channels enables direct connection to current shunts, thermistors, RTDs, and 4-20 mA loop signals via external signal conditioning. The on-chip temperature sensor provides local MCU temperature monitoring, useful for cold-junction compensation in thermocouple front-ends. With 50 MHz compute, the MCU can run digital filtering (IIR/FIR) on each ADC channel without taxing CPU headroom. Designers should add external input protection (TVS + RC filter) on analog inputs and use the ADC's dedicated AVdd pin with its own low-noise LDO to achieve rated 10-bit performance.
Recommandé
USB Audio Device (Headset / VoIP)
The PIC32MX170F256B-50I/ML can implement a USB Audio Class 1.0 device, streaming stereo 16-bit/48 kHz audio to/from a host PC. The integrated USB Full-Speed controller and two I2S modules handle the USB-to-I2S bridge, while 64 KB SRAM accommodates double-buffered audio packets at 1 ms USB frame intervals. The 83 DMIPS MIPS M4K core easily runs USB Audio Class descriptors, sample rate conversion, and basic volume control. This combination enables USB headsets, USB microphones, and VoIP adapters at BOM cost under $5. Designers must enable USB bus-powered mode, provide 5V-to-3.3V regulation for VBUS, and ensure the I2S MCLK is locked to the USB SOF for low-jitter audio playback.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX170F256B-50I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX170F256B-I/ML | PIC32MX170F256B-50I/SO | PIC32MX170F256B-50I/SP | PIC32MX170F256B-50I/SS | PIC32MX154F128B-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-SOIC | 28-SPDIP | 28-SSOP | 28-SOIC |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 50 MHz | 40 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | Yes |
| Operating Voltage | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Unit Price (qty-1) | $5.40 USD | $4.95 USD | $5.20 USD | $5.30 USD | $5.25 USD | $4.10 USD |
Principaux différenciateurs
- Same QFN-28 footprint as lower-speed variant, simple frequency upgrade path (vs PIC32MX170F256B-I/ML)
- Higher Flash density than lower-tier 154 family (vs PIC32MX154F128B-I/SO)
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX130F256B-50I/ML)
Notes de conception
Estimated: Decoupling per Microchip datasheet DS60001168L section 2.4 - place a 100 nF ceramic capacitor (X7R, 10V or higher) within 3 mm of every VDD pin (pins 1, 14, 28) and VSS pin (pins 7, 13, 19, 27). Add one 10 uF bulk ceramic or tantalum capacitor near the MCU. For USB applications, route VBUS through a separate low-dropout regulator (e.g., TPS73633) rather than powering the MCU directly from VBUS, so suspend current stays within USB spec.
For USB 2.0 Full-Speed, route D+ and D- (pins 24 and 25) as a 90 ohm differential pair with traces of matched length (<2 mm mismatch) and continuous ground reference plane beneath. Avoid splitting the ground plane under the USB traces. Keep the traces short (<50 mm total) and place the ESD protection array (e.g., USBLC6-2SC6) within 5 mm of the USB connector. The exposed thermal pad (EP) MUST be soldered to a 1:1 ground pour with at least 8 thermal vias to the inner ground plane for proper heat dissipation.
Per Microchip datasheet DS60001168L section 26 (Special Features), the Peripheral Pin Select (PPS) registers are locked after reset and must be unlocked with the SYSKEY sequence before any remapping. A common bug is configuring PPS for I2C or SPI without unlocking first - peripherals stay on default pins and the application silently fails. Also, the Configuration Words (DEVCFG0/1/2/3) must be programmed BEFORE code execution; using ICSP requires matching the PGECx/PGEDx pin assignments to your programming header.
Estimated: At 50 MHz with typical 0.5 mA/MHz core current, the MCU draws approximately 25 mA from VDD (3.3V), yielding 82.5 mW core power dissipation. In the 28-QFN package with the EP soldered to a 1 square inch ground pour, thermal resistance theta_JA is approximately 35 C/W, giving a junction temperature rise of about 2.9C above ambient - well within the 85C industrial limit. Without the EP soldered, theta_JA can exceed 80 C/W and the same power would cause a 6.6C rise - still acceptable but less design margin.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C (I-suffix). Not AEC-Q100 qualified - choose PIC32MX170F256B-50I/ML automotive variant for automotive applications. Halogen-free status not explicitly stated in verified web data.
