PIC32MX210F016BT-I/SO - 32-bit MCU 16KB Flash 28-SOIC | Microchip
Référence : PIC32MX210F016BT-I/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.05 | $4,05 |
| 10 | $3.71 | $37,10 |
| 100 | $3.18 | $318,00 |
| 500 | $2.72 | $1 360,00 |
| 1 000 | $2.38 | $2 380,00 |
PIC32MX210F016BT-I/SO Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals on a single die. The PIC32MX2xx family uses the MIPS32 M4K RISC architecture - a 32-bit load-store architecture - and sits within Microchip's PIC32MX hierarchy: PIC32MX2xx -> PIC32MX1xx/2xx series -> PIC32MX family -> 32-bit PIC microcontrollers -> microcontroller -> embedded processor. This hierarchy matters for code portability, toolchain reuse, and ecosystem familiarity.
Key features of the PIC32MX210F016BT-I/SO include 16KB (16K x 8) Flash program memory, 4KB SRAM, an internal oscillator, Peripheral Pin Select (PPS) for flexible peripheral-to-pin mapping, up to 4 hardware DMA channels with automatic data size detection, two UART modules, two I2C modules, and separate PLLs for the CPU and USB clocks. The "BT" suffix indicates the tape-and-reel packaging option, while "-I" denotes the industrial temperature grade.
Architecturally, the device pairs a 32-bit MIPS M4K core with on-chip Flash and SRAM, an 8-channel 10-bit ADC, and parallel master port support for external memory or graphics interfaces. The 40 MHz core clock delivers up to 52 DMIPS of processing throughput while consuming modest power, and the PPS block allows remapping of digital peripherals to most I/O pins to simplify board routing.
Typical applications include USB device peripherals, low-cost graphics interfaces, audio processing front-ends, sensor hubs, and general-purpose embedded control nodes. The combination of USB, multiple UART/I2C channels, and DMA makes the PIC32MX210F016BT-I/SO well suited to connected-device designs.
A practical design consideration: the 28-SOIC package limits PCB layout density compared with QFN alternatives in the same family, but it allows hand-soldering and visual inspection - a real advantage for prototypes and low-volume builds. Always honor the VDD/VSS decoupling network recommended in the datasheet and place the 8 MHz external crystal (when used) within 1 cm of the OSC1/OSC2 pins.
Alternatives de remplacement direct pour PIC32MX210F016BT-I/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX210F016BT-I/SO (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, USB, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX210F016B-I/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX210F016B-I/SP
✅ Remplacement direct✓ En stock
$2.1 / unité
Voir la fiche technique →PIC32MX220F016B-I/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX230F064B-I/SO
✅ Remplacement direct✓ En stock
$3.1 / unité
Voir la fiche technique →PIC32MX170F256BT-I/SO
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →PIC32MX150F128BT-I/SO
✅ Remplacement direct✓ En stock
$3.53 / unité
Voir la fiche technique →PIC32MX210F016BT-I/SO Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 40 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (RAM) | 4 KB (4K x 8) |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +105 C (Industrial) |
| Number of I/O Pins | 19 |
| Boîtier | 28-SOIC (SO) |
| Type de montage | Surface Mount |
| Oscillator | Internal |
| DMA Channels | Up to 4 |
| UART Modules | 2 |
| I2C Modules | 2 |
| ADC | 10-bit, up to 13 input channels |
| Peripheral Pin Select (PPS) | Yes |
| USB | Full-Speed USB 2.0 Device |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Packaging | Tape & Reel ("BT" suffix) |
Configuration des broches de PIC32MX210F016BT-I/SO
| Broche 1 | RPB0/RPD0/AN0 — Remappable I/O, analog input 0 |
| Broche 2 | RPB1/RPD1/AN1 — Remappable I/O, analog input 1 |
| Broche 3 | RPB2/RPD2/AN2/C1IN- — Remappable I/O, analog input 2 |
| Broche 4 | RPB3/RPD3/AN3/C1IN+ — Remappable I/O, analog input 3 |
| Broche 5 | VSS — Ground |
| Broche 6 | RA0/VREF+/CVREF+/AN4 — Analog input / voltage reference |
| Broche 7 | RA1/VREF-/CVREF-/AN5 — Analog input / voltage reference |
| Broche 8 | RB4/RPD4/AN6 — Remappable I/O, analog input 6 |
| Broche 9 | RB5/RPD5/AN7 — Remappable I/O, analog input 7 |
| Broche 10 | RB6/RPD6/PGC — Remappable I/O / ICSP clock |
| Broche 11 | RB7/RPD7/PGD — Remappable I/O / ICSP data |
| Broche 12 | VSS — Ground |
| Broche 13 | VDD — Positive supply (2.3-3.6 V) |
| Broche 14 | RB8/RPD8/AN8 — Remappable I/O, analog input 8 |
| Broche 15 | RB9/RPD9/AN9 — Remappable I/O, analog input 9 |
| Broche 16 | RB10/RPD10/AN10/CVREFOUT — Remappable I/O, CVref out |
| Broche 17 | RB11/RPD11/AN11 — Remappable I/O, analog input 11 |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — Positive supply (2.3-3.6 V) |
| Broche 20 | RB12/RPD12/AN12 — Remappable I/O, analog input 12 |
| Broche 21 | RB13/RPD13/AN13 — Remappable I/O, analog input 13 |
| Broche 22 | RB14/RPD14 — Remappable I/O |
| Broche 23 | RB15/RPD15 — Remappable I/O |
| Broche 24 | SOSCI/RPC0 — Secondary oscillator or remappable I/O |
| Broche 25 | SOSCO/RPC1 — Secondary oscillator or remappable I/O |
| Broche 26 | D+/RPC2 — USB D+ data line |
| Broche 27 | D-/RPC3 — USB D- data line |
| Broche 28 | VUSB — USB internal transceiver supply |
Applications typiques
PIC32MX210F016BT-I/SO convient pour 7 applications: USB Device Peripherals, Sensor Hub / Data Logger, Industrial Control Nodes, Low-Cost Graphics HMI, Audio Processing Front-End, Connected Consumer Devices, Educational / Maker Platforms.
USB Device Peripherals
The PIC32MX210F016BT-I/SO integrates a Full-Speed USB 2.0 device controller with on-chip transceiver and dedicated PLL, eliminating external USB PHY cost in HID, CDC-ACM, and custom-USB designs. At 40 MHz the MIPS32 M4K core delivers enough headroom for USB protocol stacks, vendor-class bulk transfers, and the upper-half application code. Place a 90.9 ohm 1% USB DP/DM series-termination pair as close to D+/D- as possible. The 28-SOIC footprint is widely accepted for USB firmware development kits where SOIC ease-of-rework is preferred over QFN density.
Recommandé
Sensor Hub / Data Logger
With 4 hardware DMA channels, two UART, two I2C, and a 10-bit ADC up to 13 channels, the PIC32MX210F016BT-I/SO can aggregate multiple sensor streams into a coherent logging pipeline. DMA offloads sensor I/O from the CPU, leaving MIPS for local filtering, calibration, or storage compression. The industrial -40 C to +105 C temperature range suits outdoor and factory deployments. Consider pairing with an external SPI NOR Flash (e.g., 25Q series) for non-volatile buffering; the PPS block lets the SPI peripheral land on convenient GPIO pins.
Recommandé
Industrial Control Nodes
The 2.3 V to 3.6 V supply and -40 C to +105 C industrial grade make the PIC32MX210F016BT-I/SO a strong fit for factory-floor controllers, small PLC-style I/O modules, and Modbus-RTU slaves. The two UART channels can serve RS-485 and a debug console, while the I2C bus talks to digital IO expanders and EEPROMs. Watchdog timer and PPS routing reduce BOM cost by replacing external logic. For intrinsically safe environments, the SOIC package's lead geometry simplifies conformal-coating processes versus QFN.
Recommandé
Low-Cost Graphics HMI
The PIC32MX210F016BT-I/SO's parallel master port can drive small 320x240 TFT panels via external controller or directly through bit-banged GPIO. At 40 MHz the core is fast enough to render text, simple icons, and frame-buffer updates for low-frame-rate HMIs in appliance control panels. The 19 GPIO pins comfortably accommodate TFT data, control signals, and a resistive touch interface. Pair with a PIC32MX230F064B-I/SO when larger frame buffers or anti-aliased fonts are needed.
Recommandé
Audio Processing Front-End
The PIC32MX210F016BT-I/SO can serve as a USB-audio class device, a low-latency mixer, or a digital filter pre-processor. DMA plus I2S support lets audio samples flow without CPU intervention; the MIPS headroom can implement biquad filtering, dynamics compression, or simple reverb at 48 kHz. The 28-SOIC package is friendly to mixed-signal PCBs where audio op-amps are typically SOIC as well, easing assembly. Add external CODEC such as a Microchip MCP4921 DAC for analog output stage.
Recommandé
Connected Consumer Devices
Use the PIC32MX210F016BT-I/SO as the local controller in connected-home and consumer IoT appliances that don't need Wi-Fi but require USB for setup, OTA firmware download, or diagnostic tethering. The on-chip USB device port enables smartphone-tethered configuration without an extra bridge chip, reducing BOM. The peripheral pin select gives PCB designers freedom to route USB DP/DM on adjacent pins without remapping internal peripherals. With 16 KB Flash, code must be modular; migrating to PIC32MX230F064B-I/SO headroom makes future-proofing easy.
Recommandé
Educational / Maker Platforms
The 28-SOIC's hand-solder-friendly leads make the PIC32MX210F016BT-I/SO popular in academic curricula, training kits, and open-source maker boards. Students can mount the part on breakout boards, hand-replace it, and use a PICkit 4 or MPLAB Snap for in-circuit programming and debugging. Free MPLAB X IDE and Harmony code-configurator support lowers the learning barrier. Pin-compatible variants in QFN/SSOP enable migration from breadboard to production PCB without code changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX210F016BT-I/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX210F016B-I/SO | PIC32MX220F016B-I/SO | PIC32MX230F064B-I/SO | PIC32MX170F256BT-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Flash Memory | 16 KB | 16 KB (same) | 16 KB (same) | 64 KB (+300%) | 256 KB (+1500%) |
| RAM | 4 KB | 4 KB (same) | 8 KB (+100%) | 16 KB (+300%) | 64 KB (+1500%) |
| Maximum CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| USB Hardware | Yes (USB 2.0 FS) | Yes | Yes | Yes | No |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| GPIO Pins | 19 | 19 | 19 | 19 | 19 |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed device hardware (vs PIC32MX170F256BT-I/SO)
- More RAM than baseline MX110/MX150 family members (vs PIC32MX110F016B-I/SO)
- Industrial temperature range -40 C to +105 C (vs PIC32MX210F016B-I/SP)
- Peripheral Pin Select (PPS) flexibility (vs PIC32MX230F064B-I/SO)
Notes de conception
Decouple VDD/VSS with one 100 nF X7R ceramic per VDD pin placed within 3 mm of the pin, plus a single 4.7 uF bulk capacitor within 1 cm of the package. The VUSB pin (pin 28) requires its own local decoupling when USB is enabled; a 100 nF cap at VUSB keeps the USB transceiver supply stable. Failing to decouple VUSB causes USB compliance failures and intermittent device-reset glitches.
Route USB DP/DM as a 90 ohm differential pair on the top layer, length-matched within 150 mil. Add 90.9 ohm 1% series resistors on DP and DM as close to the part as possible, per the Microchip MX2xx hardware design checklist. The 28-SOIC package has long internal bond-wire stubs, so keeping DP/DM traces short (under 25 mm) minimizes reflections and improves USB eye-diagram margin.
Do not exceed 3.6 V on any VDD pin; the part is not 5 V tolerant. When using the on-chip voltage regulator, ensure the VDD/VSS pair is decoupled per datasheet; missing or undersized bulk capacitors trigger brown-out resets under USB bus-power conditions. PPS remapping must be configured before the peripheral is enabled; mis-ordered PPS writes lock peripherals to default pins unexpectedly.
The 28-SOIC package has lead inductance of approximately 1.5 nH per pin, so high-speed signals (USB, SPI > 20 MHz) may need small damping series resistors (22-33 ohm) at the source pin. ADC inputs benefit from 100 ohm source-impedance anti-alias resistors and a small RC filter (1 nF + 100 ohm) when the source impedance exceeds 1 kohm, per the Microchip ADC reference design. AIN-cap ratios and S&H timing must match the configured ADC clock divider.
Estimated: at 40 MHz and 3.3 V with all peripherals active, core current is roughly 25 mA (typical) per the Microchip datasheet DC characteristics. Total power is approximately 0.083 W. The 28-SOIC package's theta_JA of approximately 70 C/W yields a self-heating rise of only 5-6 C above ambient - no heatsink or thermal relief is required even in enclosed industrial housings.
Informations de conformité
Microchip PIC32MX2xx family is RoHS-compliant and lead-free per the manufacturer product page. AEC-Q100 not applicable - this is a general-purpose MCU, not automotive-qualified. Use PIC32MX2xx-V (extended temperature) variants for harsh-environment applications.
