PIC32MX350F128L-V/PF - 32-bit MCU 80MHz 128KB Flash 100-TQFP | Microchip
Référence : PIC32MX350F128L-V/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.21 | $62,10 |
| 100 | $5.42 | $542,00 |
| 500 | $4.78 | $2 390,00 |
| 1 000 | $4.15 | $4 150,00 |
PIC32MX350F128L-V/PF Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as ADC, timers, and communication interfaces. The PIC32MX3/4 family sits in Microchip's 32-bit performance tier, positioned between the lower-pin PIC32MX1/2/5 subfamilies and the higher-memory PIC32MX5/6/7 devices. Within the broader taxonomy, PIC32MX350F128L belongs to the family hierarchy: PIC32 -> PIC32MX -> PIC32MX3xx/4xx -> PIC32MX350, designed for cost-sensitive embedded applications requiring USB, audio/I2S, or graphics HMI capability.
Key features include Peripheral Pin Select (PPS) which remaps digital peripherals to any GPIO pin for flexible PCB routing, hardware multiplier/divider for DSP operations, JTAG and 2-wire programming/debug interfaces, and a JTAG boundary scan. The device supports MIPS16e code compression for higher code density in Flash, and it is supported by the MPLAB X IDE and Harmony framework for firmware development. The PIC32MX350 series is engineered as a direct upgrade path from PIC24 and dsPIC33 designs needing more performance and memory.
The PIC32MX350F128L uses a 5-stage pipeline Harvard architecture with separate Flash and SRAM buses, achieving 1.53 DMIPS/MHz (approximately 83 DMIPS at 80 MHz). The integrated 10-bit ADC runs at up to 1 Msps with 28 analog channels, suitable for sensor aggregation and motor control feedback loops. USB 2.0 Full-Speed with on-chip transceiver and dedicated DMA channels allow streamlined peripheral implementations without external chips.
Typical applications include industrial control panels, USB Human Interface Devices (HID), low-cost audio peripherals, embedded HMI with graphics LCD, sensor hubs, and small-format IoT edge nodes. The wide operating voltage and 105C temperature range also support automotive body electronics and battery management front-ends.
When designing with the PIC32MX350F128L-V/PF, ensure the 3.3V supply is decoupled with at least a 4.7 uF bulk capacitor near the VDD pins, because the core and I/O draw sharp transient currents. Route the 80 MHz system clock away from analog signals to preserve ADC accuracy, and use the PMP bus with parallel SRAM/Flash only when the application demands higher bandwidth than SPI can provide.
This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the standalone manufacturer datasheet, helping engineers select between PIC32MX350, PIC32MX340, PIC32MX270, and PIC32MX230 variants based on memory, peripheral count, and package constraints.
Alternatives de remplacement direct pour PIC32MX350F128L-V/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX350F128L-V/PF (même facteur de forme et même empreinte) — différant par ADC, Package, Timers, Data Memory (SRAM), Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX350F128LT-V/PF
✅ Remplacement direct✓ En stock
$3.5 / unité
Voir la fiche technique →PIC32MX350F128LT-I/PF
✅ Remplacement direct✓ En stock
$3.32 / unité
Voir la fiche technique →PIC32MX340F128LT-80V/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.85 / unité
Voir la fiche technique →PIC32MX270F512L-V/PF
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →PIC32MX330F064LT-V/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.61 / unité
Voir la fiche technique →PIC32MX230F128L-V/PF
✅ Remplacement direct✓ En stock
$4.31 / unité
Voir la fiche technique →PIC32MX350F128L-V/PF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| Program Flash Memory | 128 KB (plus 12 KB auxiliary) |
| Data SRAM | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Temperature Range (V grade) | -40 C to +105 C |
| ADC | 10-bit, 28 channels, up to 1 Msps |
| DMA Channels | 4 |
| UART Modules | 5 |
| SPI Modules | 2 (supports I2S) |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Peripheral Pin Select (PPS) | Yes |
| Timers | 5 (16-bit) |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC32MX350F128L-V/PF
| Broche 1 | RG15 — General purpose I/O |
| Broche 2 | RG12 — General purpose I/O |
| Broche 3 | RG13 — General purpose I/O / TMS |
| Broche 4 | RG14 — General purpose I/O / TCK |
| Broche 5 | VDD — Digital supply voltage 2.3V-3.6V |
| Broche 6 | RF0 — General purpose I/O |
| Broche 7 | RF1 — General purpose I/O |
| Broche 8 | RG0 — General purpose I/O |
| Broche 9 | RG1 — General purpose I/O |
| Broche 10 | RE0 — General purpose I/O / PMD0 |
| Broche 11 | RE1 — General purpose I/O / PMD1 |
| Broche 12 | RE2 — General purpose I/O / PMD2 |
| Broche 13 | RE3 — General purpose I/O / PMD3 |
| Broche 14 | RE4 — General purpose I/O / PMD4 |
| Broche 15 | RE5 — General purpose I/O / PMD5 |
| Broche 16 | RE6 — General purpose I/O / PMD6 |
| Broche 17 | RE7 — General purpose I/O / PMD7 |
| Broche 18 | RG6 — General purpose I/O |
| Broche 19 | RG7 — General purpose I/O |
| Broche 20 | RG8 — General purpose I/O |
| Broche 21 | RG9 — General purpose I/O |
| Broche 22 | VSS — Digital ground |
| Broche 23 | RA0 — General purpose I/O / TMS (alternate) |
| Broche 24 | RA1 — General purpose I/O / TCK (alternate) |
| Broche 25 | RA2 — General purpose I/O / SDA2 |
| Broche 26 | RA3 — General purpose I/O / SCL2 |
| Broche 27 | RA4 — General purpose I/O / PMA0 |
| Broche 28 | RA5 — General purpose I/O / PMA1 |
| Broche 29 | RA6 — General purpose I/O / TDO |
| Broche 30 | RA7 — General purpose I/O / TDI |
| Broche 31 | AVDD — Analog supply voltage |
| Broche 32 | AVSS — Analog ground |
| Broche 33 | AN0 — Analog input 0 / RA0 shared |
| Broche 34 | AN1 — Analog input 1 / RA1 shared |
| Broche 35 | AN2 — Analog input 2 / RB0 shared |
| Broche 36 | AN3 — Analog input 3 / RB1 shared |
| Broche 37 | AN4 — Analog input 4 / RB2 shared |
| Broche 38 | AN5 — Analog input 5 / RB3 shared |
| Broche 39 | AN6 — Analog input 6 / RB4 shared |
| Broche 40 | AN7 — Analog input 7 / RB5 shared |
| Broche 41 | AN8 — Analog input 8 / RB6 shared |
| Broche 42 | AN9 — Analog input 9 / RB7 shared |
| Broche 43 | AN10 — Analog input 10 / RB8 shared |
| Broche 44 | AN11 — Analog input 11 / RB9 shared |
| Broche 45 | AN12 — Analog input 12 / RB10 shared |
| Broche 46 | AN13 — Analog input 13 / RB11 shared |
| Broche 47 | AN14 — Analog input 14 / RB12 shared |
| Broche 48 | AN15 — Analog input 15 / RB13 shared |
| Broche 49 | VDD — Digital supply voltage |
| Broche 50 | VSS — Digital ground |
| Broche 51 | RD0 — General purpose I/O |
| Broche 52 | RD1 — General purpose I/O |
| Broche 53 | RD2 — General purpose I/O |
| Broche 54 | RD3 — General purpose I/O |
| Broche 55 | RD4 — General purpose I/O |
| Broche 56 | RD5 — General purpose I/O |
| Broche 57 | RD6 — General purpose I/O |
| Broche 58 | RD7 — General purpose I/O |
| Broche 59 | RC1 — General purpose I/O / T2CK |
| Broche 60 | RC2 — General purpose I/O / T3CK |
| Broche 61 | RC3 — General purpose I/O / T4CK |
| Broche 62 | RC4 — General purpose I/O / T5CK |
| Broche 63 | VBUS — USB VBUS sense input |
| Broche 64 | VUSB3V3 — USB internal 3.3V regulator output |
| Broche 65 | D- — USB D- differential data line |
| Broche 66 | D+ — USB D+ differential data line |
| Broche 67 | RC13 — General purpose I/O |
| Broche 68 | RC14 — General purpose I/O |
| Broche 69 | VDD — Digital supply voltage |
| Broche 70 | VSS — Digital ground |
| Broche 71 | RB0 — General purpose I/O / AN2 |
| Broche 72 | RB1 — General purpose I/O / AN3 |
| Broche 73 | RB2 — General purpose I/O / AN4 |
| Broche 74 | RB3 — General purpose I/O / AN5 |
| Broche 75 | RB4 — General purpose I/O / AN6 |
| Broche 76 | RB5 — General purpose I/O / AN7 |
| Broche 77 | RB6 — General purpose I/O / AN8 |
| Broche 78 | RB7 — General purpose I/O / AN9 |
| Broche 79 | RB8 — General purpose I/O / AN10 |
| Broche 80 | RB9 — General purpose I/O / AN11 |
| Broche 81 | RB10 — General purpose I/O / AN12 |
| Broche 82 | RB11 — General purpose I/O / AN13 |
| Broche 83 | RB12 — General purpose I/O / AN14 |
| Broche 84 | RB13 — General purpose I/O / AN15 |
| Broche 85 | RB14 — General purpose I/O |
| Broche 86 | RB15 — General purpose I/O |
| Broche 87 | RF2 — General purpose I/O |
| Broche 88 | RF3 — General purpose I/O |
| Broche 89 | RF4 — General purpose I/O |
| Broche 90 | RF5 — General purpose I/O |
| Broche 91 | RF6 — General purpose I/O |
| Broche 92 | RF7 — General purpose I/O |
| Broche 93 | RF8 — General purpose I/O |
| Broche 94 | VDD — Digital supply voltage |
| Broche 95 | VSS — Digital ground |
| Broche 96 | RD8 — General purpose I/O / PMA22 |
| Broche 97 | RD9 — General purpose I/O / PMA23 |
| Broche 98 | RD10 — General purpose I/O / PMA24 |
| Broche 99 | RD11 — General purpose I/O / PMA25 |
| Broche 100 | RD12 — General purpose I/O / PMA26 |
Applications typiques
PIC32MX350F128L-V/PF convient pour 6 applications: USB Human Interface Device (HID) Peripherals, Industrial Control Panels with Graphics HMI, Low-Cost Audio Peripherals with I2S, Sensor Aggregation and IoT Edge Nodes, Automotive Body Electronics Modules, Battery Management Front-End Systems.
USB Human Interface Device (HID) Peripherals
The PIC32MX350F128L-V/PF integrates USB 2.0 Full-Speed device/host/OTG with on-chip transceiver and dedicated DMA channels, making it ideal for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its 80 MHz MIPS32 M4K core executes USB stack tasks and user logic with 1.53 DMIPS/MHz headroom, while 128 KB Flash accommodates USB stacks like Microchip's MLA USB framework plus application code. The 32 KB SRAM buffers HID reports and endpoint data efficiently. The integrated 5-stage pipeline Harvard architecture handles simultaneous USB packet handling and user input scanning without bottleneck.
Recommandé
Industrial Control Panels with Graphics HMI
The PIC32MX350F128L-V/PF's Parallel Master Port (PMP) directly drives graphical LCDs and TFT displays up to 8-bit parallel, while the integrated CTMU enables touch-sensing buttons. With 128 KB Flash for graphics libraries and 32 KB SRAM for frame buffers, the MCU supports mid-resolution human-machine interface panels. The Peripheral Pin Select (PPS) remaps display and touch signals to convenient GPIO pins for flexible PCB layout. The -40 C to +105 C operating range suits factory floor cabinets and outdoor equipment enclosures, where ambient temperatures routinely exceed 85 C.
Recommandé
Low-Cost Audio Peripherals with I2S
Two integrated I2S-capable SPI modules let the PIC32MX350F128L-V/PF interface directly to external audio codecs for low-cost speakers, headphones, and intercom systems. The 80 MHz core sustains 48 kHz / 16-bit stereo audio streams with DMA offloading, freeing the CPU for user interface and connectivity tasks. The 28-channel 10-bit ADC at 1 Msps supports microphone input and analog mixing. Combined with the small 100-TQFP package and 2.3V-3.6V supply, the PIC32MX350F128L-V/PF forms compact audio subsystems for IoT speakers and intercoms.
Recommandé
Sensor Aggregation and IoT Edge Nodes
With 28 analog input channels and the 10-bit 1 Msps ADC, the PIC32MX350F128L-V/PF can aggregate numerous analog sensors simultaneously, ideal for industrial monitoring and IoT edge gateway designs. The CTMU provides precise time-of-flight measurement for distance sensing and capacitive touch, while DMA channels handle high-throughput sensor data without CPU intervention. The 128 KB Flash accommodates TLS libraries for secure MQTT communication, and the 32 KB SRAM buffers sensor messages before transmission over UART, SPI, or USB. Operating from 2.3V to 3.6V suits battery-powered deployments.
Recommandé
Automotive Body Electronics Modules
The PIC32MX350F128L-V/PF's -40 C to +105 C operating range, USB connectivity, and CAN-friendly peripheral set position it as a strong fit for automotive body controllers, HVAC panels, and infotainment accessories. The 5 UART modules support LIN bus communication for body electronics, while the PMP and CTMU enable graphical HVAC controls with capacitive touch. The 100-TQFP package is automotive-proven and supports wave soldering in production. Designers should add external CAN transceivers (e.g., MCP2551) for CAN bus integration since the PIC32MX350 does not include a CAN module.
Recommandé
Battery Management Front-End Systems
The PIC32MX350F128L-V/PF's 28 ADC channels enable direct monitoring of individual cell voltages in multi-cell battery packs, while the CTMU and timers provide precise coulomb counting via current-sense amplifiers. The 80 MHz MIPS32 M4K core runs state-of-charge algorithms with ample margin, and 128 KB Flash accommodates lookup tables for battery chemistry profiles. UART, SPI, and I2C interfaces support communication with external fuel gauge ICs and host BMS controllers. Operating voltage 2.3V-3.6V suits direct connection to 3.3V rails from isolated DC-DC converters in battery management systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX350F128L-V/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX350F128LT-V/PF | PIC32MX270F512L-V/PF | PIC32MX340F128LT-80V/PT | PIC32MX230F128L-V/PF | PIC32MX330F064LT-V/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (12x12 mm) - similar | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Max Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 80 MHz |
| Program Flash | 128 KB | 128 KB | 512 KB | 128 KB | 128 KB | 64 KB |
| SRAM | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB | 16 KB |
| USB Full-Speed Hardware | Yes (Device/Host/OTG) | Yes | No | Yes | No | Yes |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Temperature Range | -40 C to +105 C (V grade) | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed with on-chip transceiver (vs PIC32MX270F512L-V/PF)
- 128 KB Flash balances cost and capability (vs PIC32MX330F064LT-V/PF)
- 28-channel ADC and CTMU for sensor integration (vs PIC32MX230F128L-V/PF)
- 100-TQFP (PF) package supports extensive peripheral pin select (vs PIC32MX340F128LT-80V/PT)
Notes de conception
The PIC32MX350F128L-V/PF operates from a single 2.3V-3.6V rail. Place a 4.7 uF bulk ceramic capacitor (e.g., X7R 10V) near each VDD pin pair and a 0.1 uF decoupling capacitor within 2 mm of every VDD/VDDCORE pin. The analog supply AVDD requires its own 10 uH ferrite-bead-isolated rail from VDD, decoupled with 1 uF + 0.01 uF to AVSS, to prevent digital switching noise from coupling into the 28-channel 10-bit ADC. Estimated: a 4-layer PCB with proper ground pour achieves typical ADC SNR around 58 dB at 1 Msps.
At maximum CPU activity (80 MHz, all peripherals active), the PIC32MX350F128L-V/PF draws approximately 70 mA from VDD, dissipating roughly 230 mW at 3.3V. The 100-pin TQFP package has a thermal resistance (theta JA) around 50 C/W on a standard JEDEC 4-layer test board, giving junction-to-ambient rise of approximately 11 C above ambient. For enclosed industrial cabinets at 60 C ambient, the junction remains well below the 125 C max rated temperature. Ensure adequate copper pour on VDD/GND layers and thermal vias under the exposed paddle if the package variant has one.
Route the 80 MHz system clock traces away from analog input traces to minimize capacitive coupling into the ADC. The Parallel Master Port (PMP) data, address, and control lines should be length-matched within 5 mm to preserve signal integrity at high frame rates. Keep the USB D+ and D- traces as a 90 ohm differential pair with no stubs, and place the 15 kohm pull-down resistor on D- within 5 mm of the IC. The MPLAB X IDE and Harmony pin manager utility help validate PPS mappings against your PCB layout.
Do not confuse the V/PF (extended temperature, 80 MHz) and I/PF (industrial, 80 MHz) suffixes; both run at 80 MHz but differ in operating temperature grade. For designs that target USB Full-Speed, ensure the VUSB3V3 pin has a 0.01 uF external capacitor for the internal 3.3V USB regulator, and connect VBUS to a 5V source through the appropriate voltage divider. When migrating from PIC32MX270, note the PIC32MX350 has additional USB hardware that must be initialized in firmware even if unused, otherwise the device can latch up at power-on. Always consult the family errata document for known issues with revision A1 silicon.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified - this part targets industrial/consumer, not automotive safety-critical. Lead-free and halogen-free packaging. Conflict minerals compliant per Microchip policy.
