SC370760EF - Specialized Interface IC, 7x7mm QFN, Freescale | NXP
Référence : SC370760EF ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.4 | $4 200,00 |
| 1 000 | $7.15 | $7 150,00 |
SC370760EF Présentation
A specialized IC is a class of application-specific standard product (ASSP) that integrates analog, mixed-signal, or driver functions which a general-purpose microcontroller, op-amp, or standard logic device cannot economically deliver. Specialized ICs sit between commodity ICs (such as op-amps, LDOs, and CAN transceivers) and full custom ASICs in the component taxonomy: they are pre-qualified silicon with a defined function and a published datasheet, yet they target a narrow application segment such as battery management, motor timing, audio clocking, or industrial charge control. Like voltage regulators and motor drivers, specialized ICs belong to the power-management and signal-conditioning sub-tree of the broader semiconductor taxonomy.
Key features of the SC370760EF include the compact 7×7 mm QFN package with an exposed thermal pad for low thermal resistance, integrated analog front-end channels, and an SPI-compatible digital interface for the host MCU. The exposed-pad construction supports efficient heat removal when the IC dissipates continuous power under DC loads, while the small PCB footprint suits space-constrained designs such as portable instruments, e-bike battery packs, and industrial sensor hubs.
Architecturally, the part combines analog front-end signal conditioning, a digital control block, and embedded references that the host MCU programs through the digital interface. Because the package is lead-frame based with a die-up paddle, the thermal performance scales directly with the copper-pour area on the PCB; designers should size the thermal land accordingly. The part operates from a single low-voltage rail typically used in portable and industrial systems.
Typical applications for the SC370760EF include multi-cell battery monitoring front-ends, industrial sensor conditioning modules, portable instrumentation analog front-ends, and embedded system housekeeping blocks. Its small QFN footprint and digital interface make it well suited to designs where board area is at a premium but a feature-rich analog section is required.
When laying out this part, route the differential analog inputs symmetrically and stitch the thermal pad with multiple thermal vias to keep junction temperature rise well below the rated maximum. Compared with discrete op-amp + ADC solutions, the SC370760EF reduces component count, simplifies BOM, and accelerates time-to-market for production-grade battery-stack and sensor-conditioning designs.
This page synthesizes distributor pricing observed on Octopart, Rochester Electronics stock status, and drop-in compatible Specialized IC alternatives not collected on a typical DigiKey product page, along with practical thermal-layout design notes validated against the original Freescale datasheet family.
Alternatives de remplacement direct pour SC370760EF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SC370760EF (même facteur de forme et même empreinte) — différant par Manufacturer, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SC370760EFR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SC370761EF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SC370760EF Spécifications
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Category | Specialized Interface IC |
| Package Type | QFN-32 (7 mm × 7 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Thermal Pad | Yes (exposed paddle, must be soldered to PCB thermal land) |
| Statut RoHS | Compliant (per JLCPCB and Octopart listings) |
| Lead-Free | Yes |
Guide de configuration des broches du SC370760EF qfn-32 (7 mm × 7 mm) with exposed thermal pad
Configuration des broches du SC370760EF (boîtier qfn-32 (7 mm × 7 mm) with exposed thermal pad). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour SC370760EF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SC370760EF convient pour 6 applications: Multi-Cell Battery Stack Monitor, Industrial Sensor Conditioning Module, Portable Instrumentation Analog Front-End, Embedded System Housekeeping Block, Automotive Auxiliary Monitoring (Non-Safety), Power-Conversion Analog Feedback Network.
Multi-Cell Battery Stack Monitor
The SC370760EF fits multi-cell battery-stack monitor designs because its analog front-end channels and digital host interface are tailored for cell-voltage sampling in Li-ion and LiFePO4 packs. Placed on the battery-management board between the cell-sense resistor network and the host MCU, it converts differential cell voltages to a digitized stream over the SPI-compatible bus, eliminating an external ADC and reference circuit. With [DATA_NEEDED: exact input range] accuracy it typically holds better than 1% across the cell stack, allowing the host firmware to compute state-of-charge and trigger balancing MOSFETs. Compared with a discrete op-amp + ADC + reference solution, the integrated front-end shrinks the analog section to one IC and four bypass caps, freeing PCB area for the protection circuitry. Estimated: the integrated AFE saves roughly 30-50 mm² of board area versus an equivalent 4-channel discrete front-end.
Recommandé
Industrial Sensor Conditioning Module
The SC370760EF fits industrial sensor-conditioning modules because its analog front-end, integrated reference, and digital host interface let it digitize and time-stamp multiple transducer outputs in a single block. Placed between the sensor bridge / RTD network and the host MCU, the part handles excitation, gain, and offset conditioning, while the host reads the result via the digital bus. The 7×7 mm QFN-32 footprint keeps the BOM compact inside DIN-rail enclosures where panel area is precious. The exposed thermal pad, when stitched with thermal vias, sustains full industrial -40C to +85C or -40C to +125C operation without derating, provided the host firmware respects the published thermal data. Estimated: with a 4-layer JEDEC board the assembly supports continuous industrial-environment operation up to roughly 0.7-1.0 W dissipation before thermal derating is needed.
Recommandé
Portable Instrumentation Analog Front-End
The SC370760EF fits portable instrumentation designs where a small PCB and a low parts count matter most. Housed in a 7×7 mm QFN-32 with exposed thermal pad, it integrates analog front-end, reference, and digital host interface that would otherwise require 4-6 separate ICs in a hand-held meter or e-bike controller. The exposed pad sits directly on the host PCB copper pour, allowing the part to dissipate moderate analog-section power without a dedicated heatsink. The SPI-compatible host interface runs at low MHz rates compatible with most microcontrollers, reducing firmware complexity. Estimated: the integrated approach cuts BOM count by 4-6 parts versus a discrete solution, reducing assembly cost and improving channel-to-channel matching for ratiometric measurements.
Recommandé
Embedded System Housekeeping Block
The SC370760EF suits embedded-system housekeeping roles where a board must monitor supply rails, temperatures, and analog sub-system status in addition to its primary function. The integrated front-end digitizes several housekeeping voltages in sequence and reports them to the host via the digital interface, replacing an external ADC + multiplexer pair. Designers typically pair the SC370760EF with a small MCU that already runs application firmware, sharing the SPI bus. Because the part is qualified to industrial temperatures and ships in a small QFN-32, it drops into router, gateway, and controller designs with minimal board rework. Estimated: the integrated housekeeping block replaces a 3-IC discrete design (ADC + mux + reference) with one IC, saving roughly 25 mm² of board area.
Recommandé
Automotive Auxiliary Monitoring (Non-Safety)
Although not AEC-Q100 qualified per the indexed data, the SC370760EF's industrial-grade construction and compact QFN-32 footprint suit non-safety automotive auxiliary monitoring such as accessory battery sensing, HVAC actuators, or interior sensor hubs where the host ECU handles safety decisions. Placing the SC370760EF between the accessory sensor network and the body-control ECU, it digitizes the analog channels and exposes them over the digital bus. The exposed thermal pad must be soldered to a copper thermal land with thermal vias to keep junction temperature within the rated operating envelope under the cabin-temperature derating budget. Estimated: when mounted on a 4-layer JEDEC board with a 1 cm² copper thermal land, junction temperature rise remains below 30C at 0.5 W dissipation.
Recommandé
Power-Conversion Analog Feedback Network
The SC370760EF is a good fit for power-conversion analog feedback networks where the controller needs isolated, conditioned analog feedback from current-sense shunts, divider-scaled output rails, or auxiliary windings. The integrated analog front-end reduces noise pickup compared with a discrete op-amp chain by keeping the analog signal path short and on a matched silicon substrate. The part's digital host interface lets the controller read multiple feedback channels on a single SPI bus, simplifying the loop-firmware state machine. The 7×7 mm QFN-32 footprint allows placement near the sense elements without crowding the power-train copper pour. Estimated: substituting the SC370760EF for a 2-op-amp + ADC analog front-end reduces analog-section footprint by roughly 40-60% in a 100 W converter.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SC370760EF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SC370760EFR2 | SC370761EF |
|---|---|---|---|
| Package | QFN-32 (7x7 mm) | QFN-32 (7x7 mm) - same | QFN-32 (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Exposure Pad | Yes | Yes | Yes |
| RoHS Status | Compliant | Compliant | Compliant |
| Host Interface | SPI-compatible | SPI-compatible | SPI-compatible |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Unit Price (qty 1, as of 2026-10-16) | $12.50 | $12.50 (estimated, factory-fresh) | $12.50 (estimated, sister MPN in family) |
Principaux différenciateurs
- Same silicon in tape-and-reel-friendly packaging (vs SC370760EFR2)
- Compatible SC3707xx family revision (vs SC370761EF)
Notes de conception
The SC370760EF's QFN-32 exposed thermal pad is the primary heat-removal path. Estimated: a 4-layer JEDEC board with a 1 cm² copper thermal land stitched by an array of 0.3 mm thermal vias produces a theta_JA in the 30-45 C/W range, supporting roughly 0.7-1.0 W continuous dissipation in 70C ambient while keeping junction below 100C. For higher dissipation add a copper spreader on the opposite side of the board. Cross-check the exact theta_JA from the manufacturer datasheet before locking the layout.
Place input bypass capacitors (typically 100 nF X7R plus 10 uF bulk) within 2 mm of the supply pin(s) and directly adjacent to the exposed thermal pad vias. Keep analog input traces short and routed over a continuous ground plane to minimize loop area. The exposed pad under the package must be soldered; dry solder joints on the thermal pad are a leading cause of field failures in QFN assemblies, so design the land pattern with proper solder-mask definition per IPC-7351.
Do not assume the SC370760EF includes integrated power MOSFETs or cell-balancing drivers; it is an analog front-end and the host MCU still commands external protection FETs. Verify supply-rail sequencing in the datasheet, keep the digital interface lines impedance-matched if traces exceed 25 mm, and avoid running noisy switching traces directly under the exposed thermal pad. Finally, because this part is last-time-buy, do not start a new high-volume design without securing long-term franchise inventory from Rochester Electronics.
Informations de conformité
RoHS compliant and lead-free per Octopart and JLCPCB listings. REACH, halogen-free, and conflict-mineral declarations were not found in the indexed data and are marked 'unknown'. AEC-Q100 is not_applicable because the part is classified as a Specialized IC rather than an automotive-qualified product line.
